A heat dissipation device for a circuit board and a circuit board

Abstract

This invention relates to the field of circuit board heat dissipation technology, specifically to a circuit board heat dissipation device and circuit board. The device includes a fan with a sealing cover at the fan's air inlet. The sealing cover has several first air inlets communicating with the fan's air ducts. Each first air inlet is connected to a heat-conducting module via a delivery pipe. Several heat-conducting modules are used to contact different heat-generating areas of the circuit board to achieve heat exchange, and the heat is dissipated through the fan and delivery pipes. Each heat-conducting module includes a primary heat-conducting unit and several secondary heat-conducting units, each unit being interconnected to form a unified chamber. It can conduct heat to multiple heat-generating areas of the circuit board through multiple heat-conducting modules and dissipate heat through a single fan. The fan has low maintenance costs and produces minimal noise and vibration. Each heat-conducting module can be assembled with an appropriate number of heat-conducting units according to the heat generation range to form a heat-conducting module of suitable volume, achieving appropriate heat conduction and dissipation effects.

Description

Technical Field

[0001] This invention relates to the field of circuit board heat dissipation technology, and more specifically, to a circuit board heat dissipation device and a circuit board. Background Technology

[0002] Circuit boards house various electronic components. For example, the circuit boards inside a device's main unit contain components such as the CPU, memory, external storage, and graphics card. The higher the power consumption, the more severe the heat generation. Thermal imaging can reveal multiple areas of severe heat generation on the circuit board. The most common circuit board heat dissipation structure is an air-cooled heatsink, which includes an integrated heat-conducting base and a fan. The heat-conducting base contacts the heat-generating area for heat exchange. The fan is connected to the circuit board with fasteners to prevent loosening and excessive vibration. The fan dissipates the heat from the heat-conducting base to the circuit board area, achieving heat dissipation. However, heat still accumulates inside the main unit, so the main unit's chassis also needs to have fans to expel the internal heat.

[0003] Existing heat sinks can only dissipate heat from one heat-generating area. Using multiple heat sinks with multiple fans presents several problems: First, multiple fans are too expensive and cumbersome to maintain. Second, installation is problematic; not every heat-generating area can be drilled to connect to a fan, and the fans are significantly larger than electronic components, occupying considerable space. Third, multiple fans generate more noise and vibration, affecting the user experience. Fourth, there is redundant heat dissipation, as not every heat-generating area requires the full cooling capacity of a single fan, resulting in wasted power. Therefore, existing heat sinks cannot effectively provide adaptive cooling to every heat-generating area on the circuit board. Summary of the Invention

[0004] The present invention provides a circuit board heat dissipation device and circuit board, which can overcome the shortcomings of existing heat sinks that cannot effectively dissipate heat to each heat-generating area on the circuit board.

[0005] According to a circuit board heat dissipation device of the present invention, it includes a fan for installation at the host of the device, and a sealing cover for sealing the air inlet end of the fan; the sealing cover is provided with a plurality of first air inlets communicating with the air duct of the fan; the first air inlets are connected to heat conduction modules through delivery pipes; the plurality of heat conduction modules are used to contact different heat-generating areas of the circuit board to achieve heat exchange, and to exhaust heat through the fan and delivery pipes. The heat-conducting module includes one primary heat-conducting unit and several secondary heat-conducting units, which can be interconnected to form an integral chamber.

[0006] With the fan, sealing cover, multiple first air inlets, and multiple heat conduction modules of this invention, multiple heat conduction modules can conduct heat to multiple heat-generating areas of the circuit board, and a single fan can dissipate heat. The maintenance cost of a single fan is low, and the noise and vibration are small. The number of heat conduction units in each heat conduction module can also be freely set. According to the heat generation range, an appropriate number of heat conduction units can be spliced ​​together to form a heat conduction module of appropriate size, so as to achieve appropriate heat conduction and heat dissipation effects.

[0007] Preferably, both the primary heat-conducting unit and the secondary heat-conducting unit are provided with the same base; the base is a hollow rectangle with an open top, and the hollow part forms a cavity; a second air inlet is provided on each of the four sides of the base, which communicates with the cavity; a heat-conducting element is provided inside the cavity of the base, and the heat-conducting element extends to the bottom of the base to contact the heat-generating area of ​​the circuit board. The base of the primary heat-conducting unit is provided with a first cover plate connected to the top; the base of the secondary heat-conducting unit is provided with a second cover plate connected to the top.

[0008] In this invention, the arrangement of the base, heat-conducting element and cover plate enables the heat-conducting element to exchange heat with the heat-generating area of ​​the circuit board, and the heat to exchange heat with the air in the chamber. Each heat-conducting unit forms an integral chamber, and the fan can draw out the hot air from each chamber to achieve heat dissipation.

[0009] Preferably, the heat-conducting element includes a base plate disposed at the bottom of the chamber of the base; the bottom of the base plate is provided with a contact block extending through to the bottom surface of the base; the top of the base plate is provided with a flow guide; the flow guide is used to achieve heat exchange with the base plate and the airflow in the chamber, and can also extend the path of the airflow in the chamber.

[0010] In this invention, by setting the flow guide, the flow guide itself becomes a heat-conducting medium to increase the surface area, while also extending the flow path and time of the airflow in the cavity. This allows the airflow to pass through the position of each flow guide and contact the surface of the flow guide to carry away heat to the greatest extent, thereby achieving a highly efficient heat dissipation effect.

[0011] Preferably, the air guide includes four first air guide vanes that are vertically arranged on the top of the base plate and close to the second air inlet; the first air guide vanes are arc-shaped and their convex surfaces face the center of the second air inlet to divide the airflow into two paths and guide it to both ends. Arc-shaped second guide vanes are respectively provided at both ends of the first guide vane; the two second guide vanes form a figure-eight shape with each other, and together with the first guide vane, they form a discontinuous W shape; The top of the base plate is provided with four third guide vanes arranged in a circular array; the third guide vanes are arc-shaped; two adjacent third guide vanes form a figure-eight shape with the smaller end of the figure-eight opening facing the concave surface of the first guide vane; the concave surface of the third guide vane is used to receive the airflow guided by the convex surface of the first guide vane and the concave surface of the second guide vane, and guide the airflow to the concave surface of the first guide vane at the adjacent second air inlet.

[0012] In this invention, by setting up the first guide vane, the second guide vane and the third guide vane, when the airflow enters from any number of second air inlets and exits from any number of inlets, the airflow can be guided by multiple guide vanes so that the airflow can contact most of the guide vanes, thereby carrying away the heat from the surface of most of the guide vanes.

[0013] Preferably, the top of the base plate is provided with a plurality of spaced heat-conducting columns, which are located at the center of an array of four third guide vanes; ventilation holes are provided at the third guide vanes; the ventilation holes form a direct current channel between two opposing second air inlets, and the heat-conducting columns are located within the direct current channel.

[0014] In this invention, by setting up heat-conducting columns and ventilation holes, airflow can enter the location of the heat-conducting columns through the ventilation holes. Setting up multiple heat-conducting columns increases the heat dissipation area while ensuring the heat dissipation effect, thereby further improving the heat dissipation capacity of the device.

[0015] Preferably, the main heating unit is provided with a connector mechanism for connecting the delivery pipe to the chamber; the connector mechanism includes a protrusion on the first cover plate; the protrusion has an air outlet that communicates with the chamber; the air outlet has an air duct for inserting and engaging with one end of the delivery pipe; the air duct has an air volume regulating mechanism inside; the air volume regulating mechanism includes a lower grille plate fixed to the air outlet; the lower grille plate is used to block the air outlet and has multiple fan-shaped openings arranged in a ring array; the top surface of the lower grille plate abuts against an upper grille plate with the same structure, and the surfaces of the two grilles face each other; the upper grille plate is provided with a large gear.

[0016] In this invention, the ventilation volume between each heat-conducting module and the fan can be adjusted by setting the air volume adjustment mechanism. When the heat generation in the module area is large, the fan opening can be opened larger to obtain more ventilation volume, that is, to obtain higher heat dissipation. Since the total ventilation volume provided by the fan is fixed, the heat dissipation can be more reasonably distributed by adjusting the ventilation volume available to each module, so that the device can have a low-cost and high-efficiency heat dissipation effect.

[0017] Preferably, the air outlet duct is equipped with an adjusting component; the adjusting component includes an upper support plate fixed to the inner wall of the air outlet duct; a lower support plate is provided below the upper support plate and arranged in parallel; a knob is rotatably fitted on the upper support plate, the upper end of the knob is provided with an internal hexagonal groove for a wrench to engage; a limiting block is provided at the lower end of the knob; a small gear is provided at the lower end of the limiting block and rotatably fitted with the lower support plate and meshing with the large gear. The bottom of the upper support plate is provided with a first friction ring; the upper end of the limiting block is provided with a second friction ring for contacting the first friction ring; the bottom of the pinion is provided with a spring, which is used to keep the first friction ring and the second friction ring in a close fit.

[0018] In this invention, the adjustable component allows the user to adjust the size of the fan-shaped opening, i.e., the ventilation volume, using a hex wrench. Furthermore, the friction ring prevents the two grille plates from rotating due to vibration, and the increased friction provides a certain degree of damping, thus enabling precise control during rotation.

[0019] Preferably, splicing components are provided on all four sides of the base; the splicing components are used to enable each side of each base to be spliced ​​face to face, and to enable the second air inlets of the two spliced ​​sides to be connected through. The splicing assembly includes a fixing block fixed to the side of the base near the edge; the fixing block has a first slot and a second slot arranged vertically; the side of the base away from the fixing block has an insert block that can cooperate with the second slot of other bases, and a spring piece that cooperates with the first slot; the spring piece is deformable and has a locking block on its top surface; the top of the fixing block has a slot that passes through the first slot, and the slot is used to allow the locking block to extend into the spring piece after it deforms and inserts into the first slot.

[0020] In this invention, by setting up deformable springs and slots, when two heat-conducting units are spliced ​​face to face, the spring of one heat-conducting unit can be inserted into the first slot of the other heat-conducting unit after deformation. When the slot aligns with the slot, the spring will return to its original state, and the slot will cooperate with the slot. At this time, the spring cannot be pulled out, so as to realize the rapid splicing of the two heat-conducting units.

[0021] Preferably, a sealing cover with a sealing fit is provided at the first air inlet.

[0022] In this invention, by setting a sealing cover, the unused first air inlet can be sealed, thereby ensuring that the used first air inlets can obtain a complete ventilation volume, thus realizing the distribution of ventilation volume, i.e. heat dissipation volume.

[0023] A circuit board comprising any of the circuit board heat dissipation devices described above. Attached Figure Description

[0024] Figure 1This is a schematic diagram of the heat dissipation device body in Example 1; Figure 2 This is a schematic diagram of the heat-conducting module in Example 1; Figure 3 This is a schematic diagram of the main thermal unit in Example 1; Figure 4 This is a schematic diagram of the interior of the base in Example 1; Figure 5 This is a schematic diagram showing the breakdown of the main thermal unit in Example 1; Figure 6 This is a schematic cross-sectional view of the main thermal unit in Example 1; Figure 7 for Figure 6 Enlarged view of point A in the image; Figure 8 This is a schematic diagram showing the connection between multiple main heat dissipation units and the fan in Example 1. Detailed Implementation

[0025] To further understand the content of this invention, the invention will be described in detail with reference to the embodiments. It should be understood that the embodiments are merely illustrative and not limiting of the invention.

[0026] Example 1 like Figure 1-8 As shown, this embodiment provides a circuit board heat dissipation device, which includes a fan 110 for installation on the host of the device. The air inlet end of the fan 110 is provided with a sealing cover 111 for sealing the air inlet end. The sealing cover 111 is provided with a plurality of first air inlets 112 communicating with the air duct of the fan 110. The first air inlets 112 are connected to heat conduction modules 120 through delivery pipes 115. The plurality of heat conduction modules 120 are used to contact different heat-generating areas of the circuit board to achieve heat exchange, and to exhaust heat through the fan 110 and delivery pipes 115. The heat conduction module 120 includes a primary heat conduction unit 121 and several secondary heat conduction units 122, and each unit can be interconnected to form an integral chamber.

[0027] Through the arrangement of the fan 110, sealing cover 111, multiple first air inlets 112, and multiple heat conduction modules 120 in this embodiment, multiple heat conduction modules 120 can conduct heat to multiple heat-generating areas of the circuit board, and a single fan 110 can dissipate heat. The maintenance cost of a single fan 110 is low, and the noise and vibration are small. The number of heat conduction units in each heat conduction module 120 can also be freely set. According to the heat generation range, an appropriate number of heat conduction units can be spliced ​​to form a heat conduction module 120 with a suitable volume and bottom area, so that the bottom area of ​​the module corresponds to the area of ​​the heat generation area, achieving a suitable heat conduction and heat dissipation effect. The fan 110 has a mounting hole 814, which can be installed on the outer casing of the device host. This heat dissipation device directly acts on the circuit board and directly exhausts heat from the device. The delivery pipe 115 can be a flexible hose.

[0028] In this embodiment, both the main heat-conducting unit 121 and the secondary heat-conducting unit 122 are provided with the same base 3211; the base 3211 is a hollow rectangle with an open top, and the hollow part forms a cavity; the four sides of the base 3211 are provided with a second air inlet 3215 that communicates with the cavity; a heat-conducting element 425 is provided inside the cavity of the base 3211, and the heat-conducting element 425 extends to the bottom of the base 3211 for contact with the heat-generating area of ​​the circuit board; The base 3211 of the primary heat conduction unit 121 is provided with a first cover plate 2210 connected to the top; the base 3211 of the secondary heat conduction unit 122 is provided with a second cover plate 2220 connected to the top.

[0029] Through the arrangement of the base 3211, the heat-conducting element 425 and the cover plate in this embodiment, the heat-conducting element 425 can exchange heat with the heat-generating area of ​​the circuit board, and the heat can exchange heat with the air in the chamber. Each heat-conducting unit forms an integral chamber, and the fan 110 can draw out the hot air from each chamber to achieve heat dissipation. The thermal conductive element 425 is connected and conducts heat to the contact surface of the heat-generating area by applying thermal grease, or by connecting a thermal pad; the thermal conductive element 425 is made of copper, while the base 3211 and the cover plate are made of plastic. The extended portion of the second air inlet 3215 can be made of rubber. When the two heat-conducting units are spliced ​​together, the two second air inlets 3215 are sealed together through the rubber portion.

[0030] In this embodiment, the heat-conducting element 425 includes a base plate 4250 disposed at the bottom of the chamber of the base 3211; the bottom of the base plate 4250 is provided with a contact block 6252 extending through to the bottom surface of the base 3211; the top of the base plate 4250 is provided with a flow guide 426; the flow guide 426 is used to achieve heat exchange with the base plate 4250 and the airflow in the chamber, and can also extend the path of the airflow in the chamber.

[0031] By configuring the flow guide 426 in this embodiment, the flow guide 426 itself acts as a heat-conducting medium to increase the surface area, while also extending the flow path and time of the airflow in the cavity. This allows the airflow to contact the surface of each flow guide 426 to the maximum extent, thus carrying away heat and achieving a highly efficient heat dissipation effect. The second cover plate 2220 of the secondary heat-conducting element 425 covers the top surface of the flow guide 426, allowing the airflow to flow only between the flow guides 426.

[0032] In this embodiment, the flow guide 426 includes four first flow guide plates 4260 that are vertically arranged on the top of the base plate 4250 and close to the second air inlet 3215 respectively; the first flow guide plate 4260 is arc-shaped and its convex surface faces the center of the second air inlet 3215 to divide the airflow into two paths and guide it to both ends. The first guide vane 4260 has arc-shaped second guide vanes 4262 at its two ends respectively; the two second guide vanes 4262 form a figure-eight shape with each other and together with the first guide vane 4260 form a discontinuous W shape. The top of the base plate 4250 is provided with four third guide vanes 4263 arranged in a ring array; the third guide vanes 4263 are arc-shaped; two adjacent third guide vanes 4263 form a figure-eight shape with the smaller end of the figure-eight opening facing the concave surface of the first guide vane 4260; the concave surface of the third guide vane 4263 is used to receive the airflow guided by the convex surface of the first guide vane 4260 and the concave surface of the second guide vane 4262, and guide the airflow to the concave surface of the first guide vane 4260 at the adjacent second air inlet 3215.

[0033] By setting the first guide vane 4260, the second guide vane 4262 and the third guide vane 4263 in this embodiment, when the airflow enters from any number of second air inlets 3215 and exits from any number of places, the airflow can be guided by multiple guide vanes so that the airflow can contact most of the guide vanes, thereby taking away the heat from the surface of most of the guide vanes. like Figure 4As shown, from this perspective, there are first guide vanes 4260 and two second guide vanes 4262 forming a W shape on all four sides. In the middle of these, there is a third guide vane 4263 arranged in a circular array, forming two V-shapes. If the airflow enters from the upper second air inlet 3215 and exits from the lower second air inlet 3215, most of the airflow will first be guided by the convex surface of the upper first guide vane 4260 and the concave surfaces of the two second guide vanes 4262 to the concave surfaces of the two V-shaped third guide vanes 4263, and then continue... The airflow is directed to the concave surfaces of the two first guide vanes 4260 on the left and right, and then continues to the concave surfaces of the two third guide vanes 4263 arranged in a V shape below. Finally, it flows from the gap between the two second guide vanes 4262 and the first guide vane 4260 to the second air inlet 3215 below. A portion of the airflow flows directly from the ventilation hole 4261 of the upper first guide vane 4260 to the ventilation hole 4261 of the lower first guide vane 4260, and during this process, it passes through the gap between several heat-conducting columns 4251 to carry away the heat of the heat-conducting columns 4251.

[0034] In this embodiment, a plurality of spaced heat-conducting columns 4251 are provided at the top of the base plate 4250, and the heat-conducting columns 4251 are located at the center of the array of four third guide vanes 4263; ventilation holes 4261 are provided at the third guide vanes 4263; the ventilation holes 4261 form a direct current channel between two opposing second air inlets 3215, and the heat-conducting columns 4251 are located within the direct current channel.

[0035] By setting up the heat-conducting column 4251 and the ventilation hole 4261 in this embodiment, airflow can enter the location of the heat-conducting column 4251 through the ventilation hole 4261. Setting up multiple heat-conducting columns 4251 can increase the heat dissipation area while ensuring the heat dissipation effect, thereby further improving the heat dissipation capacity of the device.

[0036] In this embodiment, the main heating unit 121 is provided with a connector mechanism 328 for connecting the conveying pipe 115 to the chamber; the connector mechanism 328 includes a protrusion 3212 provided on the first cover plate 2210; the protrusion 3212 is provided with an air outlet 3213 that communicates with the chamber; the air outlet 3213 is provided with an air outlet pipe 3214 for inserting and cooperating with one end of the conveying pipe 115; the air outlet pipe 3214 is provided with an air volume regulating mechanism 323; the air volume regulating mechanism 323 includes a lower grille plate 5230 fixed to the air outlet 3213; the lower grille plate 5230 is used to block the air outlet 3213 and has a plurality of fan-shaped openings 5232 arranged in a ring array; the top surface of the lower grille plate 5230 abuts against an upper grille plate 5231 with the same structure, and the surfaces of the two grille plates face each other; the upper grille plate 5231 is provided with a large gear 7276.

[0037] The airflow adjustment mechanism 323 in this embodiment allows for adjustment of the ventilation between each heat-conducting module 120 and the fan 110. When the heat generated in the module area is high, the fan-shaped opening 5232 can be opened wider to obtain more ventilation, thus achieving higher heat dissipation. Since the total ventilation provided by the fan 110 is fixed, the heat dissipation can be reasonably distributed by adjusting the opening size of the fan-shaped opening 5232 of each module. This allows the device to achieve low-cost and high-efficiency heat dissipation. The relationship between the opening size of the fan-shaped opening 5232 of each heat-conducting module 120 and the heat dissipation can be expressed as follows: S1:S2:…:S n =Q1:Q2:…:Q n Where S represents the opening size of the fan-shaped port 5232 of the module, Q represents the heat dissipation, and n represents the number of heat conduction modules 120 installed.

[0038] In this embodiment, an adjusting component 627 is provided inside the air outlet duct 3214; the adjusting component 627 includes an upper support plate 7270 fixed to the inner wall of the air outlet duct 3214; a lower support plate 7271 is provided below the upper support plate 7270 and arranged in parallel; a knob 7272 is rotatably fitted at the upper support plate 7270, the upper end of the knob 7272 is provided with an internal hexagonal groove 7273 for a wrench to engage; a limiting block 7274 is provided at the lower end of the knob 7272; a small gear 7275 is provided at the lower end of the limiting block 7274 and rotatably fitted with the lower support plate 7271 and meshing with the large gear 7276; The bottom of the upper support plate 7270 is provided with a first friction ring 7277; the upper end of the limiting block 7274 is provided with a second friction ring 7278 for contacting the first friction ring 7277; the bottom of the pinion 7275 is provided with a spring 7279, which is used to keep the first friction ring 7277 and the second friction ring 7278 in a close fit.

[0039] The adjustment component 627 in this embodiment allows the user to adjust the size of the fan-shaped opening 5232, i.e. the ventilation volume, using a hex wrench. The friction ring prevents the two grille plates from rotating due to vibration, and the increased friction provides a certain damping feel, thus allowing for precise control during rotation. The pinion 7275 is fitted with the lower support plate 7271 through a shaft hole, and the spring 7279 is sleeved on the shaft.

[0040] In this embodiment, splicing components 324 are provided on all four sides of the base 3211; the splicing components 324 are used to enable each side of each base 3211 to be spliced ​​face to face, and to enable the second air inlets 3215 of the two spliced ​​sides to be connected through. The splicing component 324 includes a fixing block 3240 fixed to the side of the base 3211 near the edge; the fixing block 3240 is provided with a first slot 3241 and a second slot 3242 arranged vertically; the side of the base 3211 away from the fixing block 3240 is provided with an insert block 3245 that can cooperate with the second slot 3242 of other bases 3211, and a spring piece 3247 that cooperates with the first slot 3241; the spring piece 3247 is deformable and has a locking block 3246 on its top surface; the top of the fixing block 3240 is provided with a slot 3243 that passes through the first slot 3241, and the slot 3243 is used to allow the locking block 3246 to extend into the spring piece 3247 after it deforms and inserts into the first slot 3241.

[0041] With the deformable spring piece 3247 and slot 3243 in this embodiment, when two heat conduction units are spliced ​​face to face, the spring piece 3247 of one heat conduction unit can be inserted into the first slot 3241 of the other heat conduction unit after deformation. When the slot 3246 corresponds to the slot 3243, the spring piece 3247 will return to its original state, and the slot 3246 will cooperate with the slot 3243. At this time, the spring piece 3247 cannot be pulled out, so as to realize the rapid splicing of the two heat conduction units. The spring 3247 is a deformable plastic sheet. The ends of the spring 3247 and the locking block 3246 are provided with guide surfaces. Through the design of the guide surfaces, when the two heat-conducting units are spliced, the insert block 3245 is aligned with the second slot 3242 and inserted. The spring 3247 can then automatically deform and enter the first slot 3241. Finally, the locking block 3246 and the slot 3243 cooperate to complete the quick splicing. When splicing, it is necessary to splice in a row-to-row manner, that is, first assemble each row, and then splice each row together. The same principle applies when disassembling. One side of the cover plate is provided with a guide tube 3244 located directly above the slot 3243. When disassembling, a cylindrical object can be placed into the guide tube 3244. When pressed, the spring piece 3247 will be pressed down to make the locking block 3246 disengage from the slot 3243, thus separating the two heat conduction units.

[0042] In this embodiment, a sealing cover 113 with a sealing fit is provided at the first air inlet 112.

[0043] By setting the sealing cover 113 in this embodiment, the unused first air inlet 112 can be sealed, thereby ensuring that the used first air inlets 112 can obtain complete ventilation, thus realizing the distribution of ventilation and heat dissipation.

[0044] A circuit board comprising any of the circuit board heat dissipation devices described above; The circuit board is a common motherboard used in industrial equipment.

[0045] It is readily understood that those skilled in the art can combine, split, or reorganize the embodiments provided in this application to obtain other embodiments, all of which do not exceed the protection scope of this application.

[0046] The present invention and its embodiments have been described above illustratively. This description is not restrictive, and the embodiments shown are only part of the embodiments of the present invention. The actual structure is not limited thereto. Therefore, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the spirit of the present invention, they should all fall within the protection scope of the present invention.

Claims

1. A circuit board heat dissipation device, characterized in that: Includes a fan (110) for installation on the host unit of the device, and a sealing cover (111) for sealing the air inlet end of the fan (110); the sealing cover (111) is provided with a number of first air inlets (112) connected to the air duct of the fan (110); the first air inlets (112) are connected to heat conduction modules (120) through delivery pipes (115); the number of heat conduction modules (120) are used to contact different heat-generating areas of the circuit board to achieve heat exchange, and the heat is discharged through the fan (110) and delivery pipes (115); The heat-conducting module (120) includes a primary heat-conducting unit (121) and several secondary heat-conducting units (122), and each unit can be interconnected to form an integral chamber.

2. The circuit board heat dissipation device according to claim 1, characterized in that: Both the primary heat-conducting unit (121) and the secondary heat-conducting unit (122) are provided with the same base (3211); the base (3211) is a hollow rectangle with an open top, and the hollow part forms a cavity; the four sides of the base (3211) are provided with a second air inlet (3215) that communicates with the cavity; the cavity of the base (3211) is provided with a heat-conducting element (425), and the heat-conducting element (425) extends to the bottom of the base (3211) to contact the heat-generating area of ​​the circuit board; The base (3211) of the main heat-conducting unit (121) is provided with a first cover plate (2210) connected to the top; the base (3211) of the secondary heat-conducting unit (122) is provided with a second cover plate (2220) connected to the top.

3. A circuit board heat dissipation device according to claim 2, characterized in that: The heat-conducting element (425) includes a base plate (4250) disposed at the bottom of the chamber of the base (3211); the bottom of the base plate (4250) is provided with a contact block (6252) extending through to the bottom surface of the base (3211); the top of the base plate (4250) is provided with a flow guide (426); the flow guide (426) is used to achieve heat exchange with the base plate (4250) and the airflow in the chamber, and can also extend the path of the airflow in the chamber.

4. A circuit board heat dissipation device according to claim 3, characterized in that: The air guide (426) includes four first air guide vanes (4260) that are vertically arranged on the top of the base plate (4250) and close to the second air inlet (3215); the first air guide vanes (4260) are arc-shaped and their convex surfaces face the center of the second air inlet (3215) to divide the airflow into two paths and guide it to both ends; The first guide vane (4260) has arc-shaped second guide vanes (4262) spaced apart at both ends; the two second guide vanes (4262) form a figure-eight shape with each other and together with the first guide vane (4260) form a discontinuous W shape; The top of the base plate (4250) is provided with four third guide vanes (4263) arranged in a ring array; the third guide vanes (4263) are arc-shaped; two adjacent third guide vanes (4263) form a figure-eight shape with the smaller end of the figure-eight opening facing the concave surface of the first guide vane (4260); the concave surface of the third guide vane (4263) is used to receive the airflow guided by the convex surface of the first guide vane (4260) and the concave surface of the second guide vane (4262), and guide the airflow to the concave surface of the first guide vane (4260) at the adjacent second air inlet (3215).

5. A circuit board heat dissipation device according to claim 4, characterized in that: The top of the base plate (4250) is provided with a plurality of spaced heat-conducting columns (4251), which are located at the center of an array of four third guide vanes (4263); ventilation holes (4261) are provided at the third guide vanes (4263); the ventilation holes (4261) form a direct current channel between two opposite second air inlets (3215), and the heat-conducting columns (4251) are located within the direct current channel.

6. A circuit board heat dissipation device according to claim 1, characterized in that: The main heating unit (121) is provided with a connector mechanism (328) for connecting the delivery pipe (115) to the chamber; the connector mechanism (328) includes a protrusion (3212) provided on the first cover plate (2210); the protrusion (3212) is provided with an air outlet (3213) that communicates with the chamber; the air outlet (3213) is provided with an air outlet pipe (3214) for inserting and engaging with one end of the delivery pipe (115); the air outlet pipe (3214) is provided with an air volume. Adjustment mechanism (323); The air volume adjustment mechanism (323) includes a lower grille plate (5230) fixed at the air outlet (3213); The lower grille plate (5230) is used to block the air outlet (3213) and has a plurality of fan-shaped openings (5232) arranged in a ring array; The top surface of the lower grille plate (5230) abuts against an upper grille plate (5231) with the same structure, and the two grille plates face each other; A large gear (7276) is provided at the upper grille plate (5231).

7. A circuit board heat dissipation device according to claim 6, characterized in that: An adjusting component (627) is provided inside the air outlet pipe (3214); the adjusting component (627) includes an upper support plate (7270) fixed to the inner wall of the air outlet pipe (3214); a lower support plate (7271) is provided below the upper support plate (7270) in parallel; a knob (7272) is rotatably fitted at the upper support plate (7270), the upper end of the knob (7272) is provided with an internal hexagonal groove (7273) for a wrench to engage; a limiting block (7274) is provided at the lower end of the knob (7272); a small gear (7275) is provided at the lower end of the limiting block (7274) to rotatably engage with the lower support plate (7271) and mesh with the large gear (7276); The bottom of the upper support plate (7270) is provided with a first friction ring (7277); the upper end of the limiting block (7274) is provided with a second friction ring (7278) for contacting the first friction ring (7277); the bottom of the pinion (7275) is provided with a spring (7279), which is used to keep the first friction ring (7277) and the second friction ring (7278) in a close fit.

8. A circuit board heat dissipation device according to claim 2, characterized in that: The base (3211) is provided with splicing components (324) on all four sides; the splicing components (324) are used to enable each side of each base (3211) to be spliced ​​face to face, and to enable the second air inlets (3215) of the two spliced ​​sides to be connected through. The splicing assembly (324) includes a fixing block (3240) fixed to the side of the base (3211) near the edge; the fixing block (3240) is provided with a first slot (3241) and a second slot (3242) arranged vertically; the side of the base (3211) away from the fixing block (3240) is provided with an insert (3245) that can cooperate with the second slot (3242) of other bases (3211), and a spring piece (3247) that cooperates with the first slot (3241); the spring piece (3247) is deformable and has a locking block (3246) on its top surface; the top of the fixing block (3240) is provided with a slot (3243) that communicates with the first slot (3241), and the slot (3243) is used to allow the locking block (3246) to extend into the spring piece (3247) after it deforms and inserts into the first slot (3241).

9. A circuit board heat dissipation device according to claim 1, characterized in that: A sealing cover (113) with a sealing fit is provided at the first air inlet (112).

10. A circuit board comprising a heat dissipation device for a circuit board as described in any one of claims 1-9.

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