Design method and device for heat dissipation structure of intelligent processor

Abstract

The application provides a heat dissipation structure design method of an intelligent processor, comprising the following steps: a model reconstruction step, combining a design process of a structure design software and a thermal simulation software, reconstructing models according to modeling results of the two design processes, and obtaining temperature results of the two design processes; an error calculation step, the thermal simulation software calculating error parameters of the two design processes according to the temperature results of the two design processes; and an equivalent transformation step, the structure design software performing equivalent transformation design according to the error parameters. The application also provides a heat dissipation structure design device of an intelligent processor, a storage medium and an electronic device. Therefore, the application fully utilizes the advantages of the two heat dissipation structure design methods, simplifies the process, reduces the design cost, and improves the design efficiency.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to a method, apparatus, storage medium, and electronic device for designing a heat dissipation structure for an intelligent processor. Background Technology

[0002] The heat dissipation of intelligent processors relies on heat conduction and heat convection. Low- to medium-cost solutions include: metal plate cooling, metal plate + fin cooling, metal plate + fin + fan cooling, and metal plate + fin + fan + heat pipe cooling.

[0003] Metal plate heat dissipation is a fundamental method for cooling intelligent processors. The intelligent processor acts as a heat source, and the metal plate conducts heat away through the contact surface and diffuses it outwards. To increase the heat exchange area between the heatsink and the environment, a portion of the metal plate thickness is converted into fins. This method reduces the weight of the heatsink while simultaneously increasing the heat exchange area between the cooling structure and the external environment. Since natural convection is often insufficient for chip requirements, a metal plate + fin + fan cooling method is introduced to improve heat dissipation efficiency. This method further enhances the overall heat dissipation capacity of the cooling structure through forced convection. However, this solution still cannot meet cooling requirements at high ambient temperatures. A metal plate + fin + fan + heat pipe cooling solution that incorporates heat pipes can accelerate heat conduction in the intelligent processor chip, enabling the intelligent processor to meet operating requirements even in high-temperature environments.

[0004] There are generally two approaches to the thermal design process for intelligent processors:

[0005] Process 1: Initial modeling using thermal simulation software → Simulation results calculation using simulation software → Optimization of one or more parameters to obtain an optimized structure within the software's capabilities. However, thermal simulation software has limited modeling capabilities and the ability to represent structural components.

[0006] Process 2: Structural design software modeling → Import the results as third-party software into thermal simulation software → Calculate simulation results → Adjust modeling parameters in structural design software → Import the calculation results from simulation software until the design goal is achieved.

[0007] The trade-off between these two approaches in multi-factor design can lead to longer design cycles and higher costs.

[0008] In conclusion, the existing technology obviously has inconveniences and defects in practical use, so it is necessary to improve it. Summary of the Invention

[0009] To address the aforementioned shortcomings, the present invention aims to provide a heat dissipation structure design method, apparatus, storage medium, and electronic device for intelligent processors, which fully leverages the advantages of two heat dissipation structure design methods, simplifies the process, reduces design costs, and improves design efficiency.

[0010] To solve the above-mentioned technical problems, the present invention is implemented as follows:

[0011] In a first aspect, embodiments of the present invention provide a method for designing a heat dissipation structure for an intelligent processor, comprising the following steps:

[0012] The model reconstruction step combines the design processes of structural design software and thermal simulation software, reconstructs the model based on the modeling results of the two design processes, and obtains the temperature results of the two design processes.

[0013] In the error calculation step, the thermal simulation software calculates the error parameters of the two design processes based on the temperature results of the two design processes.

[0014] The equivalent transformation step involves the structural design software performing an equivalent transformation design based on the error parameters.

[0015] According to the heat dissipation structure design method for the intelligent processor of the present invention, the model reconstruction step further includes:

[0016] The structural design software performs initial modeling to establish the first heat dissipation structure model of the intelligent processor.

[0017] The thermal simulation software performs heat dissipation calculations on the first heat dissipation structure model to obtain a first initial result;

[0018] The thermal simulation software reconstructs the first heat dissipation structure model to obtain the second heat dissipation structure model.

[0019] The thermal simulation software performs heat dissipation calculations on the second heat dissipation structure model to obtain a second initial result;

[0020] The thermal simulation software performs error estimation on the first initial result and the second initial result to obtain a first error value;

[0021] The thermal simulation software optimizes the second heat dissipation structure model to obtain a first optimization result and several first intermediate results;

[0022] The structural design software reconstructs the model based on the first optimization result and the first intermediate result to obtain the third heat dissipation structure model.

[0023] The thermal simulation software optimizes the third heat dissipation structure model to obtain a second optimization result and several second intermediate results;

[0024] The thermal simulation software estimates the error between the second optimization result and the second intermediate result to obtain a second error value.

[0025] The error calculation step further includes:

[0026] The thermal simulation software calculates the error parameters for the two design processes based on the first error value and the second error value.

[0027] The equivalent transformation step further includes:

[0028] The structural design software performs an equivalent transformation design based on the first optimization result and the error parameters.

[0029] According to the heat dissipation structure design method of the intelligent processor of the present invention, the first heat dissipation structure model, the second heat dissipation structure model, and the third heat dissipation structure model include at least one heat dissipation element, the heat dissipation element including a metal plate, fins, a fan and / or a heat pipe.

[0030] According to the heat dissipation structure design method for the intelligent processor of the present invention, the step of reconstructing the first heat dissipation structure model to obtain the second heat dissipation structure model by the thermal simulation software further includes:

[0031] The thermal simulation software reconstructs the first heat dissipation structure model using native software components to obtain the second heat dissipation structure model.

[0032] According to the heat dissipation structure design method for the intelligent processor of the present invention, the step of obtaining a first error value by performing error estimation on the first initial result and the second initial result using thermal simulation software further includes:

[0033] The thermal simulation software obtains the first temperature index of the first initial result and the second temperature index of the second initial result, respectively.

[0034] The thermal simulation software estimates the error based on the first temperature index and the second temperature index to obtain the first error value.

[0035] According to the heat dissipation structure design method for the intelligent processor of the present invention, the step of optimizing the second heat dissipation structure model with thermal simulation software to obtain a first optimization result and several first intermediate results further includes:

[0036] The thermal simulation software optimizes the second heat dissipation structure model to obtain the first optimization result and the corresponding first optimization element parameters, as well as several first intermediate results and the corresponding first intermediate element parameters.

[0037] The step of the structural design software reconstructing the model based on the first optimization result and the first intermediate result to obtain the third heat dissipation structure model further includes:

[0038] The structural design software reconstructs the model based on the first optimization result, the first optimization element parameters, the first intermediate result, and the first intermediate element parameters to obtain the third heat dissipation structure model.

[0039] According to the heat dissipation structure design method for the intelligent processor of the present invention, the step of optimizing the third heat dissipation structure model by the thermal simulation software to obtain a second optimization result and several second intermediate results further includes:

[0040] The thermal simulation software optimizes the third heat dissipation structure model to obtain the second optimization result and the corresponding second optimization element parameters, as well as several second intermediate results and the corresponding second intermediate element parameters.

[0041] The step of the thermal simulation software estimating the error between the second optimization result and the second intermediate result to obtain the second error value further includes:

[0042] The thermal simulation software performs error estimation on the second optimization result, the second optimization element parameters, the second intermediate result, and the second intermediate element parameters to obtain the second error value.

[0043] Secondly, embodiments of the present invention provide a heat dissipation structure design device for an intelligent processor constructed based on any one of the methods described in the present invention, the device comprising:

[0044] The model reconstruction module is used to combine the design processes of structural design software and thermal simulation software, reconstruct the model based on the modeling results of the two design processes, and obtain the temperature results of the two design processes.

[0045] The error calculation module is used by the thermal simulation software to calculate the error parameters of the two design processes based on the temperature results of the two design processes.

[0046] The equivalent transformation module is used by the structural design software to perform equivalent transformation design based on the error parameters.

[0047] Thirdly, embodiments of the present invention provide a storage medium for storing a computer program for performing any of the methods described herein.

[0048] Fourthly, embodiments of the present invention provide an electronic device, including a storage medium, a processor, and a computer program stored on the storage medium and executable on the processor, wherein the processor executes the computer program to implement any of the methods described above.

[0049] Therefore, the heat dissipation structure design technology for intelligent processors of this invention includes: combining the design processes of structural design software and thermal simulation software; reconstructing the model based on the modeling results of the two design processes to obtain the temperature results of the two design processes; calculating the error parameters of the two design processes based on the temperature results using the thermal simulation software; and performing equivalent transformation design using the error parameters using the structural design software. Thus, this invention fully leverages the advantages of two heat dissipation structure design methods, quantifies existing design processes, and establishes a connection between two independent methods, thereby simplifying the process, reducing design costs, and improving design efficiency. Attached Figure Description

[0050] Figure 1 This is a flowchart illustrating the heat dissipation structure design method for an intelligent processor provided in Embodiment 1 of the present invention;

[0051] Figure 2 This is a flowchart illustrating the heat dissipation structure design method for an intelligent processor provided in Embodiment 2 of the present invention;

[0052] Figure 3 This is a schematic diagram of the heat dissipation structure design device for the intelligent processor provided in Embodiment 3 of the present invention;

[0053] Figure 4 This is a schematic diagram of the structure of the electronic device provided in Embodiment 4 of the present invention. Detailed Implementation

[0054] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0055] It should be noted that references to "an embodiment," "embodiment," "example embodiment," etc., in this specification refer to the described embodiment including specific features, structures, or characteristics, but not every embodiment must include these specific features, structures, or characteristics. Furthermore, such expressions do not refer to the same embodiment. Moreover, when describing specific features, structures, or characteristics in conjunction with embodiments, whether or not explicitly described, it is indicated that incorporating such features, structures, or characteristics into other embodiments is within the knowledge of those skilled in the art.

[0056] Furthermore, certain terms are used in the specification and subsequent claims to refer to specific components or parts. Those skilled in the art will understand that manufacturers may use different names or terms to refer to the same component or part. This specification and subsequent claims do not distinguish components or parts by differences in name, but rather by differences in function. The terms "comprising" and "including" used throughout the specification and subsequent claims are open-ended and should be interpreted as "including but not limited to." Additionally, the term "connection" here includes any direct and indirect electrical connection means. Indirect electrical connection means include connections made through other means.

[0057] The heat dissipation structure design method for the intelligent processor provided by the present invention will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0058] Figure 1 This is a flowchart illustrating the heat dissipation structure design method for an intelligent processor according to Embodiment 1 of the present invention. The method includes the following steps:

[0059] Step S101, model reconstruction step, combines the design processes of structural design software and thermal simulation software, reconstructs the model based on the modeling results of the two design processes, and obtains the temperature results of the two design processes.

[0060] Step S102, error calculation step: The thermal simulation software calculates the error parameters of the two design processes based on the temperature results of the two design processes.

[0061] Step S103, equivalent transformation step: the structural design software performs equivalent transformation design based on the error parameters.

[0062] This invention's intelligent processor heat dissipation structure design method combines two processes and introduces error estimation. By reconstructing the two processes, the degree of error in the temperature results caused by changes in various model elements under each process is obtained. Based on the degree of error, an equivalent design is performed on the optimization results of process one.

[0063] Key Point 1: The intelligent processor heat dissipation structure design method of this invention combines two traditional processes and uses the two modeling results as mutual guides. This leverages the advantages of both design methods and establishes a connection between the two independent approaches.

[0064] Key Point 2: Introducing Error Estimation into the Results of Two Design Processes. By reconstructing the two processes, the temperature results resulting from changes in various model elements under each process are obtained, and the degree of error in the temperature results of the two processes is compared. This allows for the quantification of the existing design process.

[0065] Key Point 3: Based on the degree of error, and building upon the optimized results of Process 1, use structural design software to perform equivalent design or further improve the design. This allows us to move beyond the traditional process at this stage, simplifying the workflow and improving efficiency.

[0066] Figure 2 This is a flowchart illustrating the heat dissipation structure design method for an intelligent processor according to Embodiment 2 of the present invention. The method includes the following steps:

[0067] Step S201: Initial modeling using structural design software to establish the first heat dissipation structure model of the intelligent processor.

[0068] Preferably, the first heat dissipation structure model includes at least one heat dissipation element, which includes a metal plate, fins, a fan, and / or a heat pipe, etc.

[0069] Step S202: Thermal simulation software performs heat dissipation calculations on the first heat dissipation structure model to obtain the first initial result.

[0070] Step S203: The thermal simulation software reconstructs the first heat dissipation structure model to obtain the second heat dissipation structure model.

[0071] Preferably, the second heat dissipation structure model includes at least one heat dissipation element, which includes a metal plate, fins, a fan, and / or a heat pipe, etc.

[0072] Preferably, the thermal simulation software reconstructs the first heat dissipation structure model using native software components to obtain the second heat dissipation structure model.

[0073] Step S204: The thermal simulation software performs heat dissipation calculations on the second heat dissipation structure model to obtain the second initial result.

[0074] In step S205, the thermal simulation software estimates the error between the first initial result and the second initial result to obtain the first error value.

[0075] Preferably, the thermal simulation software obtains a first important temperature index from the first initial result and a second important temperature index from the second initial result. The thermal simulation software performs error estimation based on the first and second temperature indices, that is, it estimates the error of the results generated by the two modeling processes to obtain a first error value.

[0076] In step S206, the thermal simulation software optimizes the second heat dissipation structure model to obtain the first optimization result and several first intermediate results.

[0077] Preferably, the thermal simulation software optimizes the second heat dissipation structure model to obtain a first optimization result and corresponding first optimization element parameters, as well as several first intermediate results and corresponding first intermediate element parameters.

[0078] Preferably, heat dissipation elements such as heat pipes, fins, and fans are set in the thermal simulation software, along with the parameter range of the dimensions of the heat dissipation elements, to obtain a first optimization result and the corresponding structural dimensions of the heat dissipation elements, and to obtain several first intermediate results and the corresponding structural dimensions of the heat dissipation elements.

[0079] In step S207, the structural design software reconstructs the model based on the first optimization result and the first intermediate result to obtain the third heat dissipation structure model.

[0080] Preferably, the third heat dissipation structure model includes at least one heat dissipation element, which includes a metal plate, fins, a fan, and / or a heat pipe, etc.

[0081] Preferably, the structural design software reconstructs the model based on the first optimization result, the first optimization element parameters, the first intermediate result, and the first intermediate element parameters to obtain the third heat dissipation structure model.

[0082] In step S208, the thermal simulation software optimizes the third heat dissipation structure model to obtain the second optimization result and several second intermediate results.

[0083] Preferably, the thermal simulation software optimizes the third heat dissipation structure model to obtain a second optimization result and corresponding second optimization element parameters, as well as several second intermediate results and corresponding second intermediate element parameters.

[0084] In step S209, the thermal simulation software estimates the error of the second optimization result and the second intermediate result to obtain a set of second error values ​​for the second optimization result and the second intermediate result.

[0085] Preferably, the thermal simulation software performs error estimation on the second optimization result, the second optimization element parameters, the second intermediate result, and the second intermediate element parameters to obtain a second error value.

[0086] In step S210, the thermal simulation software calculates the error parameters of the two design processes based on the first error value and the second error value.

[0087] Preferably, the error parameters can be used to determine the degree of error of the parameters of each heat dissipation element in the two design software programs.

[0088] Step S211: The structural design software performs equivalent transformation design based on the first optimization result and error parameters.

[0089] For example, a long heat pipe can be replaced with two curved heat pipes, while reducing the structural area, increasing the thickness, and changing the fan speed.

[0090] Preferably, the temperature of the intelligent processor after structural adjustment can be estimated by combining the second intermediate result and the second error value.

[0091] It should be noted that the heat dissipation structure design method for an intelligent processor provided in this embodiment of the invention can be executed by an electronic device, an apparatus, or a control module within that apparatus for executing the method. This embodiment of the invention uses an apparatus executing the method as an example to illustrate the heat dissipation structure design apparatus for an intelligent processor provided in this embodiment of the invention.

[0092] Figure 3 This is a schematic diagram of the heat dissipation structure design device for an intelligent processor provided in Embodiment 3 of the present invention. The device 100 includes a model reconstruction module 10, an error calculation module 20, and an equivalent transformation module 30, wherein:

[0093] The model reconstruction module 10 is used to combine the design processes of structural design software and thermal simulation software, reconstruct the model based on the modeling results of the two design processes, and obtain the temperature results of the two design processes.

[0094] The error calculation module 20 is used by thermal simulation software to calculate the error parameters of the two design processes based on the temperature results of the two design processes.

[0095] The equivalent transformation module 30 is used by the structural design software to perform equivalent transformation design based on error parameters.

[0096] Preferably, the model reconstruction module 10 performs the following actions:

[0097] Action 101: Initial modeling using structural design software to establish the first heat dissipation structure model of the intelligent processor.

[0098] Preferably, the first heat dissipation structure model includes at least one heat dissipation element, which includes a metal plate, fins, a fan, and / or a heat pipe, etc.

[0099] Action 102: The thermal simulation software performs heat dissipation calculations on the first heat dissipation structure model to obtain the first initial result.

[0100] Action 103: The thermal simulation software reconstructs the first heat dissipation structure model to obtain the second heat dissipation structure model.

[0101] Preferably, the second heat dissipation structure model includes at least one heat dissipation element, which includes a metal plate, fins, a fan, and / or a heat pipe, etc.

[0102] Preferably, the thermal simulation software reconstructs the first heat dissipation structure model using native software components to obtain the second heat dissipation structure model.

[0103] Action 104: The thermal simulation software performs heat dissipation calculations on the second heat dissipation structure model to obtain the second initial result.

[0104] Action 105: The thermal simulation software estimates the error between the first initial result and the second initial result to obtain the first error value.

[0105] Preferably, the thermal simulation software obtains a first temperature index of the first initial result and a second temperature index of the second initial result, respectively. The thermal simulation software performs an error estimation based on the first and second temperature indices to obtain a first error value.

[0106] Action 106: The thermal simulation software optimizes the second heat dissipation structure model to obtain the first optimization result and several first intermediate results.

[0107] Preferably, the thermal simulation software optimizes the second heat dissipation structure model to obtain a first optimization result and corresponding first optimization element parameters, as well as several first intermediate results and corresponding first intermediate element parameters.

[0108] Action 107: The structural design software reconstructs the model based on the first optimization result and the first intermediate result to obtain the third heat dissipation structure model.

[0109] Preferably, the third heat dissipation structure model includes at least one heat dissipation element, which includes a metal plate, fins, a fan, and / or a heat pipe, etc.

[0110] Preferably, the structural design software reconstructs the model based on the first optimization result, the first optimization element parameters, the first intermediate result, and the first intermediate element parameters to obtain the third heat dissipation structure model.

[0111] Action 108: The thermal simulation software optimizes the third heat dissipation structure model to obtain the second optimization result and several second intermediate results.

[0112] Preferably, the thermal simulation software optimizes the third heat dissipation structure model to obtain a second optimization result and corresponding second optimization element parameters, as well as several second intermediate results and corresponding second intermediate element parameters.

[0113] Action 109: The thermal simulation software estimates the error of the second optimization result and the second intermediate result to obtain the second error value.

[0114] Preferably, the thermal simulation software performs error estimation on the second optimization result, the second optimization element parameters, the second intermediate result, and the second intermediate element parameters to obtain a second error value.

[0115] Action 110: The thermal simulation software calculates the error parameters for the two design processes based on the first and second error values.

[0116] Action 111: The structural design software performs equivalent transformation design based on the first optimization result and error parameters.

[0117] The heat dissipation structure design device for the intelligent processor provided in this embodiment of the invention can achieve... Figures 1-2 The various processes implemented in the embodiment of the heat dissipation structure design method for the intelligent processor shown will not be repeated here to avoid repetition.

[0118] The present invention also provides a storage medium for storing, for example, Figures 1-2 A computer program for the heat dissipation structure design method of any of the aforementioned intelligent processors. For example, computer program instructions, when executed by a computer, can invoke or provide the methods and / or technical solutions according to the present invention through the operation of the computer, achieving the same technical effect. To avoid repetition, these will not be elaborated further here. The program instructions for invoking the methods of the present invention may be stored in a fixed or removable storage medium, and / or transmitted via data streams in broadcast or other signal carrying media, and / or stored in the storage medium of a computer device operating according to the program instructions.

[0119] According to one embodiment of the present invention, the present invention also provides such a Figure 4 The illustrated electronic device 400 may optionally include a storage medium 200 for storing computer programs and a processor 300 for executing the computer programs. When the computer program is executed by the processor 300, it implements any of the aforementioned intelligent processor heat dissipation structure design methods, triggering the electronic device 400 to execute methods and / or technical solutions based on the foregoing embodiments, achieving the same technical effect. To avoid repetition, these will not be elaborated further here. It should be noted that the electronic devices in this embodiment include mobile electronic devices and non-mobile electronic devices. For example, mobile electronic devices may be mobile phones, tablets, laptops, handheld computers, in-vehicle electronic devices, wearable devices, super mobile personal computers, netbooks, or personal digital assistants, etc., while non-mobile electronic devices may be servers, network-attached storage (NAS), personal computers (PCs), televisions (TVs), ATMs, or self-service machines, etc. This embodiment does not specifically limit the scope of the invention.

[0120] It should be noted that the present invention can be implemented in software and / or a combination of software and hardware, for example, using an application-specific integrated circuit (ASIC), a general-purpose computer, or any other similar hardware device. In one embodiment, the software program of the present invention can be executed by a processor to implement the steps or functions described above. Similarly, the software program of the present invention (including associated data structures) can be stored in a computer-readable recording medium, such as RAM memory, a magnetic or optical drive, a floppy disk, or similar devices. Furthermore, some steps or functions of the present invention can be implemented in hardware, for example, as circuitry that works with a processor to perform the various steps or functions.

[0121] This invention can be implemented on a computer as a computer-based method, or in dedicated hardware, or a combination of both. Executable code or portions thereof for the method according to the invention can be stored on a computer program product. Examples of computer program products include memory devices, optical storage devices, integrated circuits, servers, online software, etc. Optionally, the computer program product includes non-transitory program code components stored on a computer-readable medium so as to execute the method according to the invention when the program product is executed on a computer.

[0122] In an optional embodiment, the computer program includes computer program code components adapted to perform all the steps of the method according to the invention when the computer program is run on a computer. Optionally, the computer program is embodied on a computer-readable medium.

[0123] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of the present invention is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0124] Of course, the present invention may have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the appended claims.

Claims

1. A heat dissipation structure design method for an intelligent processor, characterized in that, Includes the following steps: The model reconstruction step combines the design processes of structural design software and thermal simulation software, reconstructs the model based on the modeling results of the two design processes, and obtains the temperature results of the two design processes. In the error calculation step, the thermal simulation software calculates the error parameters of the two design processes based on the temperature results of the two design processes. The equivalent transformation step involves the structural design software performing an equivalent transformation design based on the error parameters.

2. The heat dissipation structure design method for an intelligent processor according to claim 1, characterized in that, The model reconstruction step further includes: The structural design software performs initial modeling to establish the first heat dissipation structure model of the intelligent processor. The thermal simulation software performs heat dissipation calculations on the first heat dissipation structure model to obtain a first initial result; The thermal simulation software reconstructs the first heat dissipation structure model to obtain the second heat dissipation structure model. The thermal simulation software performs heat dissipation calculations on the second heat dissipation structure model to obtain a second initial result; The thermal simulation software performs error estimation on the first initial result and the second initial result to obtain a first error value; The thermal simulation software optimizes the second heat dissipation structure model to obtain a first optimization result and several first intermediate results; The structural design software reconstructs the model based on the first optimization result and the first intermediate result to obtain the third heat dissipation structure model. The thermal simulation software optimizes the third heat dissipation structure model to obtain a second optimization result and several second intermediate results; The thermal simulation software estimates the error between the second optimization result and the second intermediate result to obtain a second error value. The error calculation step further includes: The thermal simulation software calculates the error parameters for the two design processes based on the first error value and the second error value. The equivalent transformation step further includes: The structural design software performs an equivalent transformation design based on the first optimization result and the error parameters.

3. The heat dissipation structure design method for an intelligent processor according to claim 2, characterized in that, The first heat dissipation structure model, the second heat dissipation structure model, and the third heat dissipation structure model each contain at least one heat dissipation element, which includes a metal plate, fins, a fan, and / or a heat pipe.

4. The heat dissipation structure design method for an intelligent processor according to claim 2, characterized in that, The step of reconstructing the first heat dissipation structure model into a second heat dissipation structure model using the thermal simulation software further includes: The thermal simulation software reconstructs the first heat dissipation structure model using native software components to obtain the second heat dissipation structure model.

5. The heat dissipation structure design method for an intelligent processor according to claim 2, characterized in that, The step of the thermal simulation software estimating the error between the first initial result and the second initial result to obtain the first error value further includes: The thermal simulation software obtains the first temperature index of the first initial result and the second temperature index of the second initial result, respectively. The thermal simulation software estimates the error based on the first temperature index and the second temperature index to obtain the first error value.

6. The heat dissipation structure design method for an intelligent processor according to claim 2, characterized in that, The step of optimizing the second heat dissipation structure model using the thermal simulation software to obtain a first optimization result and several first intermediate results further includes: The thermal simulation software optimizes the second heat dissipation structure model to obtain the first optimization result and the corresponding first optimization element parameters, as well as several first intermediate results and the corresponding first intermediate element parameters. The step of the structural design software reconstructing the model based on the first optimization result and the first intermediate result to obtain the third heat dissipation structure model further includes: The structural design software reconstructs the model based on the first optimization result, the first optimization element parameters, the first intermediate result, and the first intermediate element parameters to obtain the third heat dissipation structure model.

7. The heat dissipation structure design method for an intelligent processor according to claim 2, characterized in that, The step of optimizing the third heat dissipation structure model using the thermal simulation software to obtain a second optimization result and several second intermediate results further includes: The thermal simulation software optimizes the third heat dissipation structure model to obtain the second optimization result and the corresponding second optimization element parameters, as well as several second intermediate results and the corresponding second intermediate element parameters. The step of the thermal simulation software estimating the error between the second optimization result and the second intermediate result to obtain the second error value further includes: The thermal simulation software performs error estimation on the second optimization result, the second optimization element parameters, the second intermediate result, and the second intermediate element parameters to obtain the second error value.

8. A heat dissipation structure design device for an intelligent processor constructed based on the method described in any one of claims 1 to 7, characterized in that, The device includes: The model reconstruction module is used to combine the design processes of structural design software and thermal simulation software, reconstruct the model based on the modeling results of the two design processes, and obtain the temperature results of the two design processes. The error calculation module is used by the thermal simulation software to calculate the error parameters of the two design processes based on the temperature results of the two design processes. The equivalent transformation module is used by the structural design software to perform equivalent transformation design based on the error parameters.

9. A storage medium, characterized in that, Used to store a computer program for performing the method according to any one of claims 1 to 7.

10. An electronic device comprising a storage medium, a processor, and a computer program stored on the storage medium and executable on the processor, characterized in that, When the processor executes the computer program, it implements the method of any one of claims 1 to 7.

Images