Display module and manufacturing method thereof

Abstract

A display module and a manufacturing method thereof are provided. The display module includes a circuit board, a plurality of pixel structures, and a capsule. The pixel structures are disposed on the circuit board. Each of the pixel structures includes a plurality of light emitting diode wafers. The plurality of light emitting diode wafers are disposed on the circuit board. The capsule is disposed on the circuit board and separates the pixel structures from each other.

Description

Technical Field

[0001] This invention relates to a display module and its manufacturing method, and more particularly to a display module using light-emitting diode chips and its manufacturing method. Background Technology

[0002] In recent years, direct-view LED (DVLED) displays have been developed, which use the light-emitting diodes themselves to create the image. Compared to traditional LCD displays, DVLED displays can provide larger, brighter, and higher-contrast images. Generally, a DVLED display consists of multiple small LED panels. Each panel may contain hundreds of thousands or even millions of LED chips. The spaces between these LED chips need to be blackened with adhesive to form a light-blocking layer for an aesthetically pleasing effect. If adhesive is accidentally applied to some LED chips, it can be removed using methods such as plasma. However, if too many chips are covered, the entire panel must be scrapped.

[0003] However, LED chips are extremely small, with a nominal height typically only 80–85 micrometers (μm). Furthermore, even within the same manufacturer and model, LED chips of different colors may have different standard dimensions due to variations in manufacturing processes. Moreover, the nominal tolerance range for chips is often as high as ±10μm to ±15μm, and the actual error of the obtained chips can even reach ±20μm to ±30μm. This means that the actual height of the LED chips placed on the LED board can vary considerably. Under these circumstances, misapplied adhesive is difficult to avoid, product yield is difficult to improve, and production costs are difficult to reduce.

[0004] Therefore, it is necessary to design a new type of display module and its manufacturing method to overcome the above-mentioned defects. Summary of the Invention

[0005] The purpose of this invention is to provide a display module and its manufacturing method, which can replace black glue with a capsule to avoid the situation where black glue is accidentally applied to the light-emitting diode chip, which would require further processing or even scrap the lamp board, thereby improving the yield and reducing the production cost.

[0006] To achieve the above objectives, the present invention provides a display module, comprising: a circuit board; a plurality of pixel structures disposed on the circuit board, each of the plurality of pixel structures comprising: a plurality of light-emitting diode chips disposed on the circuit board; and a capsule disposed on the circuit board and separating the plurality of pixel structures from each other.

[0007] Preferably, each of the plurality of pixel structures comprises a plurality of light-emitting diode chips consisting of a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip.

[0008] Preferably, at least two of the plurality of light-emitting diode chips in at least one of the plurality of pixel structures have different heights.

[0009] Preferably, at least two of the plurality of light-emitting diode chips in at least one of the plurality of pixel structures have different lateral dimensions.

[0010] Preferably, the plurality of light-emitting diode chips of each of the plurality of pixel structures are provided individually or in a package.

[0011] Preferably, the capsule is filled with at least one of air, a gas lighter than air, a curable colloid, or a porous material.

[0012] Preferably, the capsule has a mesh-like cross-section on a plane parallel to the upper surface of the circuit board.

[0013] Preferably, the capsule has a rectangular, arc-shaped, or mushroom-shaped cross-section on a plane perpendicular to the upper surface of the circuit board.

[0014] Preferably, it also includes: a surface protective adhesive covering the multiple pixel structures and the capsule.

[0015] The present invention also provides a method for manufacturing a display module, comprising: providing a plurality of light-emitting diode chips with a plurality of pixel structures onto a circuit board; attaching a capsule to the circuit board; and inflating the capsule to separate the plurality of pixel structures from each other through the capsule.

[0016] Compared with existing technologies, the present invention provides a display module and its manufacturing method. The display module includes a circuit board, multiple pixel structures, and a capsule. The pixel structures are disposed on the circuit board, and each pixel structure includes multiple light-emitting diode (LED) chips. The LED chips are disposed on the circuit board, and the capsule is disposed on the circuit board, separating the pixel structures from each other. By using a capsule instead of black glue, the situation where black glue is accidentally applied to the LED chips, requiring further processing or even scrapping the LED board, can be avoided, thereby improving yield and reducing production costs. Attached Figure Description

[0017] Figure 1 This is a top view schematic diagram of the display module of the present invention.

[0018] Figure 2 This is a cross-sectional schematic diagram of an embodiment of the display module of the present invention.

[0019] Figure 3 This is a cross-sectional schematic diagram of another embodiment of the display module of the present invention.

[0020] Figure 4 This is a cross-sectional schematic diagram of another embodiment of the display module of the present invention.

[0021] Figure 5 This is a cross-sectional schematic diagram of another embodiment of the display module of the present invention.

[0022] Figure 6 This is a cross-sectional schematic diagram of another embodiment of the display module of the present invention.

[0023] Figures 7A-7F This is a schematic diagram of different stages of an embodiment of the manufacturing method of the display module of the present invention.

[0024] Figures 8A-8C This is a schematic diagram of different stages of another embodiment of the manufacturing method of the display module of the present invention. Detailed Implementation

[0025] To provide a further understanding of the purpose, structure, features and functions of the present invention, detailed descriptions are provided below with reference to embodiments.

[0026] Various embodiments will be described in detail below with reference to the accompanying drawings. The description and accompanying drawings are provided for illustrative purposes only and are not intended to be limiting. For clarity, elements may not be drawn to scale. Furthermore, some elements and / or symbols may be omitted in some drawings. It is contemplated that elements and features in one embodiment can be advantageously incorporated into another embodiment without further explanation.

[0027] Please refer to Figure 1 This diagram shows a top view of the display module 10 of the present invention. The display module 10 includes a circuit board 100, a plurality of pixel structures 200, and a capsule 300. The pixel structures 200 are disposed on the circuit board 100. Each of the pixel structures 200 includes a plurality of light-emitting diode chips 210 (shown in...). Figures 2 to 6 The plurality of light-emitting diode chips 210 are disposed on the circuit board 100. The capsule 300 is disposed on the circuit board 100 and separates the pixel structures 200 from each other.

[0028] The structure of the display module 10 can have various different details. Figures 2 to 6 This illustrates the cross-sectional features of the display module 10 of the present invention according to different embodiments. For ease of distinction, [the following is a simplified description]. Figures 2 to 6 The display modules shown in the different embodiments are respectively referred to as display modules 10A to 10E, which correspond to... Figure 1The 1-1' line of the display module 10. It is understood that the details of each of the display modules 10A to 10E described below can be applied to the display module 10, and can also be applied to other embodiments of the display modules 10A to 10E without affecting the characteristics of other embodiments of the display modules 10A to 10E, which will not be elaborated on here.

[0029] Now we will refer to Figure 1 and Figure 2 Further details of the display module of the present invention are provided. Specifically, the circuit board 100 may be a printed circuit board. The circuitry and / or other related electronic devices required for the light-emitting diode chip 210 may be present on the circuit board. However, it is understood that the present invention is not limited thereto.

[0030] Each of the pixel structures 200 may include a plurality of light-emitting diode (LED) chips 210 of different colors. For example, each of the pixel structures 200 may consist of a red LED chip 210R, a green LED chip 210G, and a blue LED chip 210B. However, it is understood that the plurality of LED chips 210 of each of the pixel structures 200 may also be combinations of other numbers and / or colors of LED chips.

[0031] The size of the light-emitting diode chip 210 is, for example, less than or equal to 250 μm, that is, its length, width, and height are all less than or equal to 250 μm. At least two of the plurality of light-emitting diode chips 210 in the pixel structure 200 may have different heights. For example, in Figure 2 In the diagram, the LED chips 210 of the pixel structure 200 on the left are all shown to have the same height, while the LED chips 210 of the pixel structure 200 on the right are shown to have three different heights. At least two of the plurality of LED chips 210 in at least one of the pixel structures 200 may have different lateral dimensions, that is, they may have different lengths and / or different widths.

[0032] In one example, the dimensions of the red LED chip can be 93 (±15) μm × 150 (±15) μm × 80 (±10) μm, and the dimensions of the green and blue LED chips can be 89 (±15) μm × 150 (±15) μm × 80 (±10) μm. In another example, the dimensions of the red, green, and blue LED chips can all be 100 (±15) μm × 200 (±15) μm × 80 (±10) μm. In yet another example, the dimensions of the red LED chip can be 92 (±25) μm × 185 (±25) μm × 80 (±10) μm, and the dimensions of the green and blue LED chips can be 92 (±25) μm × 187 (±25) μm × 85 (±15) μm. In yet another example, the dimensions of the red LED chip can be 100 (±25) μm × 200 (±25) μm × 85 (±10) μm, and the dimensions of the green and blue LED chips can be 100 (±38) μm × 203 (±38) μm × 85 (±15) μm. However, it is understood that the invention is not limited thereto.

[0033] like Figure 2 As shown, the plurality of light-emitting diode chips 210 of each of the pixel structures 200 may be provided individually. However, the invention is not limited thereto. Please refer to Figure 3 In another embodiment of the display module 10B, the plurality of light-emitting diode chips 210 of each of the pixel structures 200B are provided in a package.

[0034] Please return to Figure 1 and Figure 2 The capsule 300 can be filled with a variety of suitable fillers. In one example, the capsule 300 can be filled with air or a lighter gas such as hydrogen or helium. Using a gas rather than a solid colloid or solid filler is beneficial for weight reduction, especially using a gas lighter than air, which can reduce weight even more. In another example, the capsule 300 can be filled with a colloid, such as a curable colloid. Curable colloids are traditionally used fillers that can provide shape support and fixation. In yet another example, the capsule 300 can be filled with a porous material such as foamed porous silicone. Porous materials not only provide shape support and fixation but also reduce weight to some extent. In yet another example, fillers may be used in combination.

[0035] By controlling the type and amount of filler, and filling process parameters (such as pressure), the shape and size of the capsule 300 can be adjusted and optimized. The capsule 300 has a mesh-like cross-section on a plane parallel to the upper surface of the circuit board 100, such as... Figure 1As shown. Furthermore, the capsule 300 can have various cross-sectional shapes on a plane perpendicular to the upper surface of the circuit board 100, including, but not limited to, rectangular, arc-shaped, and mushroom-shaped cross-sections. Figure 2 In the diagram, the capsule 300 is depicted as having a rectangular cross-section on a plane (i.e., the paper surface) perpendicular to the upper surface of the circuit board 100. Please refer to... Figure 4 The display module 10C's capsule 300C is shown as having an arc-shaped cross-section on a plane (i.e., the paper surface) perpendicular to the upper surface of the circuit board 100. Please refer to... Figure 5 The capsule 300D of the display module 10D is shown as having a mushroom-shaped cross-section on a plane (i.e., the paper surface) perpendicular to the upper surface of the circuit board 100.

[0036] As for the size of the 300 capsule, such as Figure 2 As shown, the height of the bladder 300 can be equal to or greater than the height of the LED chip 210. In this case, the bladder 300 can effectively prevent lateral light leakage, which is beneficial for the bladder 300 as a light-blocking layer of the pixel structure 200. In another embodiment (not shown), the height of the bladder 300 can be less than the height of the LED chip 210 to provide a wider viewing angle. Since the display module 10A emits light from the front, even if the height of the bladder 300 is less than the height of the LED chip 210, it will not have an extremely adverse effect due to lateral light leakage.

[0037] In addition to shape and size, the color and darkening of the capsule 300 can also be adjusted according to requirements.

[0038] Please refer to Figure 6 Optionally, the display module 10E may further include a surface protective adhesive 400 covering the pixel structure 200 and the capsule 300. The cured surface protective adhesive 400 helps ensure a consistent height in the finished product.

[0039] A method for manufacturing a display module according to the present invention will now be described. The method includes the following steps: First, a plurality of light-emitting diode chips with a plurality of pixel structures are provided onto a circuit board. Then, a capsule is attached to the circuit board. Furthermore, the capsule is expanded to separate the pixel structures from each other through the capsule.

[0040] Figures 7A-7F Different stages of an embodiment of the manufacturing method of the display module of the present invention are shown.

[0041] First, such as Figure 7A As shown, multiple light-emitting diode chips 210 (labeled in) provide multiple pixel structures 200. Figures 2 to 6 The light-emitting diode chip 210 is attached to the circuit board 100. The light-emitting diode chip 210 may be provided individually or in a package.

[0042] Then, as Figure 7B and Figure 7C As shown, the capsule 300 is attached to the circuit board 100.

[0043] In this embodiment, the step of inflating the bladder 300 is performed after the step of attaching the bladder 300 to the circuit board 100. For example... Figure 7D As shown, the capsule 300 is inflated to separate the pixel structures 200 from each other. The step of inflating the capsule 300 includes filling the capsule 300 with a filler. The filler may include at least one of air, a gas lighter than air, a curable colloid, and a porous material. A filling device can be used to inject the filler into the capsule 300 to cause it to expand, and the filling pressure and the amount of filler can be controlled to ensure that the capsule 300 expands to a specified size. When the filler is a curable colloid, the step of inflating the capsule 300 may further include curing the colloid. Please refer to... Figure 7E As shown by arrow A, the colloid can be cured by heat curing or ultraviolet light curing.

[0044] Selectively, such as Figure 7F As shown, surface protective adhesive 400 can be applied to the circuit board 100. The surface protective adhesive 400 covers the pixel structure 200 and the capsule 300.

[0045] Figures 8A-8C Schematic diagrams showing different stages of another embodiment of the manufacturing method of the display module of the present invention.

[0046] Please refer to Figure 8A Multiple light-emitting diode chips 210 (labeled in) provide multiple pixel structures 200. Figures 2 to 6 ) onto a circuit board 100.

[0047] Then, attach the capsule 300 to the circuit board 100. For example... Figure 8B As shown, in this embodiment, the step of inflating the bladder 300 is performed before the step of attaching the bladder 300 to the circuit board 100. Then, the inflated bladder 300 is attached to the circuit board 100, as... Figure 8C As shown.

[0048] In summary, this invention provides a display module and its manufacturing method that can reduce the impact of misapplied black adhesive. In the display module of this invention, a capsule replaces the black adhesive, thus eliminating the need for post-treatment plasma desmearing, significantly improving yield and reducing costs. Furthermore, the shape and height of the capsule are easily controlled, and it can be filled with gas or porous materials to achieve weight reduction. Additionally, in the display module according to this invention, since black adhesive is not used, the influence of LED chip size is reduced. Therefore, additional sorting is unnecessary, reducing both procurement and manufacturing costs. Moreover, the size selection of the LED chips is more flexible, thereby increasing customization flexibility. Furthermore, LED chips can be provided individually or in a package, and the pixel pitch can be adjusted, all contributing to customization flexibility.

[0049] Although the invention has been described in conjunction with the accompanying drawings, the embodiments disclosed in the drawings are intended to illustrate preferred embodiments of the invention and should not be construed as limiting the invention. The scale in the schematic drawings does not represent the actual proportions of the components, in order to clearly describe the required parts.

[0050] The present invention has been described in the above-described embodiments; however, these embodiments are merely examples for implementing the present invention. It must be noted that the disclosed embodiments do not limit the scope of the present invention. Conversely, any modifications and refinements made without departing from the spirit and scope of the present invention are within the scope of patent protection of the present invention.

Claims

1. A display module, characterized by include: Circuit board; Multiple pixel structures are disposed on the circuit board, each of the multiple pixel structures comprising: Multiple light-emitting diode (LED) chips are mounted on this circuit board; as well as The capsule is set on the circuit board and the multiple pixel structures are separated from each other.

2. The display module of claim 1, wherein, Each of the multiple pixel structures consists of multiple light-emitting diode chips, including red light-emitting diode chips, green light-emitting diode chips, and blue light-emitting diode chips.

3. The display module of claim 1, wherein the display module is configured to be mounted on a display stand. At least two of the plurality of light-emitting diode (LED) chips in the plurality of pixel structures have different heights.

4. The display module of claim 1, wherein, At least two of the plurality of light-emitting diode chips in the plurality of pixel structures have different lateral dimensions.

5. The display module as described in claim 1, characterized in that, Each of the multiple pixel structures has multiple light-emitting diode chips provided individually or in a package.

6. The display module as described in claim 1, characterized in that, The capsule is filled with at least one of air, a gas lighter than air, a curable colloid, or a porous material.

7. The display module as described in claim 1, characterized in that, The capsule has a mesh-like cross-section on a plane parallel to the upper surface of the circuit board.

8. The display module as described in claim 1, characterized in that, The capsule has a rectangular, arc-shaped, or mushroom-shaped cross-section on a plane perpendicular to the upper surface of the circuit board.

9. The display module as described in claim 1, characterized in that, Also includes: A surface protective adhesive covers the multiple pixel structures and the capsule.

10. A method for manufacturing a display module, characterized in that, include: Multiple light-emitting diode chips with multiple pixel structures are provided on the circuit board; The capsule is attached to the circuit board; as well as The capsule is inflated to separate the multiple pixel structures from each other through the capsule.

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