Wafer continuous production automatic film coating device

Abstract

The application provides a wafer continuous production automatic film covering device, and relates to the field of wafer production.The wafer continuous production automatic film covering device comprises a film covering table and a film cutting assembly.The film covering table is corresponding to the film cutting assembly, is used for fixing a wafer, and is used for cutting a film by the film cutting assembly.The wafer continuous production automatic film covering device further comprises a film pressing assembly, a detection part and a film stripping assembly.The film pressing assembly is used for pasting the film on the wafer; the detection part is used for detecting whether the film covering is qualified; and the film stripping assembly is used for cleaning the film after cutting and unqualified film covering.The film stripping assembly comprises a clamping part and a film tearing part.The film passes through the clamping part and the film tearing part, the clamping part and the film tearing part are close to each other, the film can be clamped and tensioned, and the film tearing part can separate the unqualified film from the wafer.The wafer continuous production automatic film covering device effectively avoids the film wrinkle problem, achieves the purpose of removing unqualified film covering, and improves the film stripping effect.

Description

Technical Field

[0001] This invention relates to the field of wafer manufacturing technology, and in particular to an automated coating apparatus for continuous wafer production. Background Technology

[0002] In the semiconductor chip manufacturing process, the wafer, as the core substrate, directly determines the performance and yield of subsequent chips due to its surface quality. After multiple pre-processing steps such as grinding, polishing, and slicing, the surface of the wafer is extremely prone to scratches and contamination. Therefore, before subsequent processes such as wafer dicing and handling, a coating treatment is required on its surface to protect the wafer surface and ensure the chip dicing accuracy and integrity.

[0003] Traditional lamination equipment typically employs a continuous lamination method, using pressure rollers to bond the film to the wafer surface. However, in practice, factors such as uneven film tension, insufficient wafer surface cleanliness, or improper bonding angles often lead to incomplete film bonding, air bubbles, or wrinkles, severely impacting lamination quality and the reliability of subsequent processes.

[0004] In existing technologies, lamination equipment mostly relies on fixed peeling components, whose main function is only to peel off the release layer supporting the film after lamination, without being able to detect and correct the lamination quality in real time. When the lamination is substandard, manual intervention is usually required, leading to reduced production efficiency. In addition, existing devices often have difficulty effectively controlling the initial angle between the film and the wafer during the lamination process, resulting in insufficient gas expulsion during the pressing process. This leaves air bubbles at the film-wafer interface, affecting the bonding strength and uniformity.

[0005] Although some devices have attempted to introduce detection modules to identify film defects, these are mostly limited to alarm prompts and lack automated defect correction mechanisms. Especially for wafers with localized poor bonding, existing devices cannot selectively remove the surface film and re-attach it, often requiring complete rework, increasing process complexity and time costs.

[0006] Therefore, there is an urgent need for an automated coating device for continuous wafer production that can adjust the film angle during the coating process to eliminate air bubbles, and automatically peel off the defective film and re-attach it when a defective coating is detected, thereby significantly improving the automation level, yield and material utilization of the coating process. Summary of the Invention

[0007] The purpose of this invention is to provide an automated wafer coating apparatus for continuous wafer production, so as to solve the problems mentioned in the background art.

[0008] To achieve the above objectives, the present invention provides the following technical solution: an automatic coating device for continuous wafer production, comprising a coating stage and a cutting assembly, wherein the coating stage corresponds to the cutting assembly and is used to fix the wafer and cut the film by the cutting assembly; further comprising: a pressing assembly, which can slide relative to the coating stage, through which the film passes to coat the film onto the wafer; a detection unit, which is fixedly connected to the middle of the cutting assembly and is used to detect whether the coating is qualified; and a peeling assembly, which corresponds to the pressing assembly and can slide relative to the coating stage, for cleaning the cut film and the film with unqualified coating, wherein the peeling assembly comprises: a clamping part and a tearing part, through which the film passes, and the clamping part and the tearing part are close to each other to clamp the film and tension the film; the tearing part can separate the unqualified film from the wafer.

[0009] Preferably, it also includes: a worktable, a film-coating table located in the middle of the worktable, a film-laying assembly on one side of the worktable and a film-receiving assembly at the other end, the film-laying assembly and the film-receiving assembly being used to control the film conveying distance; the film sequentially passes through the film-laying assembly, the film-pressing assembly, the film-peeling assembly and the film-receiving assembly.

[0010] Preferably, the film peeling assembly further includes: a sliding frame, which is slidably mounted in the middle of the worktable and can pass over the coating stage; a lifting frame, which is placed above the sliding frame, and a pushing part is provided between the lifting frame and the sliding frame. The pushing part is used to adjust the relative height between the sliding frame and the lifting frame. The clamping part and the film peeling part are both placed inside the lifting frame. The pushing part adjusts the height of the clamping part and the film peeling part relative to the coating stage through the lifting frame, thereby adjusting the relative angle between the film and the wafer; a linear push rod, which is fixedly connected to the middle of the lifting frame and whose output end is fixedly connected to the clamping part, for adjusting the relative distance between the clamping part and the film peeling part; and a guide rod, which is rotatably connected to the middle of the lifting frame and placed above the film peeling part, for guiding the film.

[0011] Preferably, the clamping part includes: a support rod with limiting platforms fixedly connected to both ends, the limiting platforms being fixedly connected to the output end of the linear push rod; a clamping roller movably mounted on both ends of the support rod for guiding the film; and a fixing roller fixedly connected to the middle of the support rod and positioned between the two support rods.

[0012] Preferably, the film-tearing section includes: a support roller, with support end caps threadedly connected to both ends, the support end caps being rotatably connected to the lifting frame; a sliding roller, which is slidably fitted on the outside of the support roller and corresponds to the clamping roller, a threaded slider is fixedly connected to the inside of the sliding roller, the threaded slider passing through the side wall of the support roller and slidingly engaging with the support roller; a bidirectional screw, which is rotatably connected to the middle of the support roller, and its two ends are threadedly engaged with the corresponding threaded sliders; and an eccentric roller, with two symmetrically arranged conical springs fixedly connected to its inside, the other end of the conical springs being rotatably connected to the support roller, and an adhesive tape fitted on the outside of the eccentric roller, the adhesive tape enabling the eccentric roller to be eccentric relative to the support roller.

[0013] Preferably, one end of the bidirectional screw passes through the lifting frame, and the other end is fixedly connected to a meshing part; a first driving part is fixedly connected to the middle of the lifting frame, and the output end of the first driving part is connected to the bidirectional screw through a transmission structure to drive the bidirectional screw to rotate; an electromagnetic push rod is fixedly connected inside the lifting frame, the electromagnetic push rod corresponds to the meshing part, and the output end of the electromagnetic push rod is rotatably connected to a synchronous disk, the synchronous disk is rotatably connected to the support roller, and the synchronous disk can mesh with the meshing part to make the support roller and the bidirectional screw rotate synchronously.

[0014] Preferably, a locking part is fixedly connected to the outer side of the output end of the electromagnetic push rod; a locking disc is fixedly connected to the inner side of the end cap corresponding to the locking part, and the locking disc can engage with the locking part.

[0015] Preferably, the film-tearing section further includes: a glue-dispensing roller and a glue-receiving roller, which are rotatably connected to the middle of the lifting frame, and the glue-dispensing roller and the glue-receiving roller are respectively corresponding to the eccentric roller; the adhesive tape passes through the glue-dispensing roller, the eccentric roller and the glue-receiving roller in sequence; a second drive unit, which is fixedly connected to the side wall of the lifting frame and is respectively corresponding to the glue-dispensing roller and the glue-receiving roller, and the output end of each second drive unit is fixedly connected to the corresponding glue-dispensing roller and the glue-receiving roller, for controlling the tension of the adhesive tape.

[0016] Preferably, the film pressing assembly includes: a movable frame slidably connected to the upper end of the worktable and capable of passing over the film coating table; a pressing part fixedly connected to the upper end of the movable frame; and a pressing roller rotatably connected to the output end of the pressing part and slidably connected to the middle of the movable frame for pressing the film.

[0017] Preferably, the film cutting assembly includes: a cutting section, which is positioned above the film covering table and is capable of sliding up and down relative to the film covering table; and a ring cutting frame, which is rotatably connected to the lower end of the cutting section and has a cutter fixedly connected to its end.

[0018] This invention provides an automated coating apparatus for continuous wafer production, which has the following advantages: 1. By setting up a clamping part and a film-tearing part, the present invention effectively avoids the problem of film wrinkling. During the resetting process of the film peeling assembly, when the clamping roller and the sliding roller move to the two quadrant points where the film is cut with circular holes, the linear push rod pushes the clamping part to reset. The clamping roller and the sliding roller clamp the film. When the sliding frame returns to the initial position, the sliding roller is adjusted to move away from each other by a bidirectional screw to open the film, thus avoiding film wrinkling and improving the yield of coating.

[0019] 2. By setting up a film pressing assembly and a detection unit, the present invention adds the function of detecting coating defects. In use, the film is attached to the wafer through the film pressing assembly, and the film is detected by the detection unit to determine whether the coating is qualified. The subsequent process is changed based on the judgment result.

[0020] 3. This invention achieves the purpose of removing defective films by setting a film-tearing part. During use, the adhesive tape is loosened so that it can contact and stick to the film on the wafer. Then, during the movement of the sliding frame, the adhesive roller and the adhesive take-up roller rotate synchronously to tear off the defective film at the top of the wafer and wrap it around the outside of the adhesive take-up roller. Finally, the adhesive tape is used to make the eccentric roller and the support roller eccentric.

[0021] 4. This invention improves the film peeling effect by setting up a support roller, a sliding roller, and a threaded slider. During operation, the synchronous disk engages with the end face teeth of the meshing part, and then the sliding frame slides towards the coating stage and over the coating stage. During this process, the support roller and the bidirectional screw are locked and rotate synchronously to ensure stable peeling of waste film, avoid damage to qualified coated wafers, and avoid the influence of the film contacting the sliding roller, which would cause the sliding roller to slide along the support roller and cause relative sliding between the sliding roller and the wafer. By locking the position of the sliding roller, friction on the wafer is avoided, improving the yield rate. Furthermore, the pressure of the sliding roller separates the film attached to the wafer from the waste film. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall invention.

[0023] Figure 2 This is a front view of the overall structure of the present invention.

[0024] Figure 3 This is a schematic diagram of the tilted state of the thin film of the present invention.

[0025] Figure 4 This is a schematic diagram showing the relative positions of the film cutting assembly, the film pressing assembly, and the film peeling assembly in this invention.

[0026] Figure 5 This is a schematic diagram of the film peeling assembly in this invention.

[0027] Figure 6This is a schematic diagram of the eccentric state of the support roller and the eccentric roller in this invention.

[0028] Figure 7 This is a cross-sectional view of the film-tearing section in this invention.

[0029] Figure 8 This is a schematic diagram of the disassembly of the film-tearing part in this invention.

[0030] Figure 9 This is a schematic diagram of the meshing state between the meshing part and the synchronization disk in this invention.

[0031] Figure 10 This is a schematic diagram showing the engagement state of the locking part and the locking disc in this invention.

[0032] Figure 11 This is a schematic diagram of the relaxed state of the adhesive tape in this invention.

[0033] In the picture: 1. Film coating table; 2. Film cutting assembly; 21. Cutting section; 22. Ring cutting frame; 23. Cutter; 3. Film pressing assembly; 31. Moving frame; 32. Pressing section; 33. Pressing roller; 4. Detection section; 5. Film peeling assembly; 51. Clamping section; 5101. Support rod; 5102. Limiting platform; 5103. Clamping roller; 5104. Fixed roller; 52. Film peeling section; 5201. Support roller; 5202. Support end cap; 5203. Sliding roller; 5204. Threaded slider; 5205. Bidirectional screw 5206. Eccentric roller; 5207. Conical spring; 5208. Adhesive tape; 5209. Engaging part; 5210. First drive part; 5211. Electromagnetic push rod; 5212. Synchronous disc; 5213. Locking part; 5214. Locking disc; 5215. Dispensing roller; 5216. Retracting roller; 5217. Second drive part; 53. Sliding frame; 54. Lifting frame; 55. Pushing part; 56. Linear push rod; 57. Guide rod; 6. Worktable; 7. Film dispensing assembly; 8. Film retracting assembly. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] This invention provides, for example Figures 1 to 11An automated wafer continuous production coating apparatus is shown, comprising a coating stage 1 and a cutting assembly 2. The coating stage 1 corresponds to the cutting assembly and is used to fix the wafer and cut the film by the cutting assembly. The coating stage 1 is used to place the wafer to be coated and has a negative pressure suction device at its bottom, which is prior art and is not shown in the figure. The cutting assembly is used to cut the film, so that the part of the film not covered on the wafer is separated from the wafer. It also includes: a pressing assembly 3, which can slide relative to the coating stage 1. The film passes through the pressing assembly 3 and is used to attach the film to the wafer; a detection unit 4, which is fixedly connected to the middle of the cutting assembly and is used to detect whether the coating is qualified. The detection unit 4 uses an image acquisition component such as a camera to take pictures of the coated wafer and detect whether there are defects such as bubbles on the film above the wafer in the picture through an image processing device; and a peeling assembly 5, which corresponds to the pressing assembly 3 and can slide relative to the coating stage 1, and is used to clean the cut film and the unqualified film. The peeling assembly 5 is located downstream of the coating stage 1 on the film conveying path. The film peeling assembly 5 is used to remove the defective film layer already attached to the wafer when the inspection unit 4 detects a non-conforming film. It is also used to clamp and remove the waste film edge material around the wafer after normal film cutting. The worktable 6 has the film coating stage 1 located in the middle. The worktable 6 has a rectangular plate structure to provide a mounting base. A film feeding assembly 7 is provided on one side of the worktable 6. The film is initially wound around the outside of the film feeding assembly 7. A film receiving assembly 8 is provided at the other end. The residual film after coating is collected by the film receiving assembly 8. The film feeding assembly 7 and the film receiving assembly 8 are respectively equipped with motors and other components for driving the film to slide relative to the film coating stage 1. These are existing technologies and will not be described in detail here. The film feeding assembly 7 and the film receiving assembly 8 are respectively set on both sides of the worktable 6 along the film conveying direction. The film feeding assembly 7 and the film receiving assembly 8 are used to control the film conveying distance. The film passes through the film feeding assembly 7, the film pressing assembly 3, the film peeling assembly 5 and the film receiving assembly 8 in sequence. The film feeding assembly 7 and the film receiving assembly 8 can also control the tension of the film.

[0036] It should be noted that the bottoms of both the film peeling assembly 5 and the film pressing assembly 3 are connected to the worktable 6 via components such as electric push rods or linear motors that enable linear sliding, thereby adjusting the position of the film peeling assembly 5 and the film pressing assembly 3 relative to the film covering table 1. The electric push rods or linear motors are existing technologies and will not be described in detail here, nor are they shown in the figure.

[0037] Specifically, the film peeling assembly 5 includes: a clamping part 51 and a film-tearing part 52, the film passing between the clamping part 51 and the film-tearing part 52, the clamping part 51 and the film-tearing part 52 being able to slide relative to each other, and being able to clamp and tension the film when they come close to each other; the film-tearing part 52 is able to separate defective films from the wafer; a sliding frame 53, which is slidably installed in the middle of the worktable 6 and can slide over the coating table 1; a lifting frame 54, which is placed at the upper end of the sliding frame 53, the lifting frame 54 having a gantry structure, having high strength, and ensuring that both sides can slide synchronously towards the coating table 1. A set of linear guide rails is provided between the lower part of the frame 53 and the worktable 6, so that the sliding frame 53 can slide in a direction parallel to the film conveying direction. The sliding frame 53 is actively slid relative to the film coating table 1 by a linear motor or electric push rod. A pushing part 55 is provided between the lifting frame 54 and the sliding frame 53. The pushing part 55 is a component that can realize linear motion, such as an electric push rod or a linear motor. This is existing technology and will not be described in detail here. In use, it is electrically connected to the corresponding controller. The relative height between the sliding frame 53 and the lifting frame 54 is adjusted by the pushing part 55 to achieve the purpose of adjusting the film tilt.

[0038] Both the clamping part 51 and the film-tearing part 52 are placed inside the lifting frame 54. The pushing part 55 adjusts the height of the clamping part 51 and the film-tearing part 52 relative to the coating stage 1 through the lifting frame 54, thereby adjusting the relative angle between the film and the wafer. When there is a certain angle between the film and the wafer, the generation of bubbles can be effectively reduced during the coating process. The linear push rod 56 is fixedly connected to the middle of the lifting frame 54, and its output end is fixedly connected to the clamping part 51. It is used to adjust the relative distance between the clamping part 51 and the film-tearing part 52. The guide rod 57 is rotatably connected to the middle of the lifting frame 54 and is placed above the film-tearing part 52. It is used to guide the film. The linear push rod 56 is an electric push rod. Its cylinder is horizontally fixedly connected to the middle crossbeam of the lifting frame 54. The linear push rod 56 is existing technology and is electrically connected to a corresponding controller during use.

[0039] It should be noted that after the film passes through the gap between the clamping part 51 and the tearing part 52, it enters the film receiving assembly 8 through the outside of the guide rod 57. The guide rod 57 can prevent the sliding frame 53 from sliding relative to the coating table 1 and causing the film to wrap.

[0040] More specifically, the clamping part 51 includes: a support rod 5101, with limiting platforms 5102 fixedly connected to both ends of the support rod 5101, the support rod 5101 being a round rod, and the limiting platforms 5102 being fixedly connected to the output end of the linear push rod 56; a clamping roller 5103, which is movably fitted onto both ends of the support rod 5101 for guiding the film, the clamping roller 5103 being able to rotate relative to the support rod 5101 and slide along the support rod 5101; and a fixed roller 5104, which is fixedly connected to the middle of the support rod 5101 and placed between the two support rods 5101 to prevent the support rods 5101 on both sides from colliding.

[0041] Specifically, the film-tearing section 52 includes: a support roller 5201, with support end caps 5202 threadedly connected to both ends of the roller. A locking pin is provided between the support end caps 5202 and the support roller 5201. When the support end caps 5202 are installed at both ends of the support roller 5201, they are fixed relative to each other by the corresponding locking pins to prevent the threads from loosening and causing the support end caps 5202 to fall off. The support end caps 5202 are rotatably connected to the lifting frame 54. The support roller 5201 has a hollow cylindrical tube structure. A sliding roller 5203 is slidably fitted on the outside of the support roller 5201 and corresponds to the clamping roller 5103. When the clamping roller... When the holding part 51 contacts the film-tearing part 52, the clamping roller 5103 and the sliding roller 5203 will clamp the film. A threaded slider 5204 is fixedly connected to the inner side of the sliding roller 5203. The threaded slider 5204 passes through the side wall of the support roller 5201 and slides with the support roller 5201. The support end cover 5202 is rotatably connected to the side plate of the lifting frame 54 through a bearing, so that the support roller 5201 can rotate relative to the lifting frame 54. The threaded slider 5204 passes through the elongated through hole opened on the tube wall of the support roller 5201 and extends into its inner cavity, and slides with the elongated through hole; the bidirectional screw 520 5. It is rotatably connected to the middle of the support roller 5201, and the threads at both ends are respectively threaded with the corresponding threaded sliders 5204. When the bidirectional screw 5205 rotates, it can drive the two threaded sliders 5204 and the connected sliding rollers 5203 to move closer or further apart along the axial direction of the support roller 5201, thereby adjusting the distance between the two sliding rollers 5203. When the clamping part 51 and the film-tearing part 52 clamp the film, the two sliding rollers 5203 move away from each other to tighten the clamped film and prevent the film from wrinkling; the eccentric roller 5206 has two symmetrically arranged conical rollers fixedly connected to its inner side. Spring 5207, the other end of the conical spring 5207 is rotatably connected to the support roller 5201. In its natural state, the conical spring 5207 makes the central axis of the eccentric roller 5206 coaxial with the central axis of the support roller 5201, and ensures that the eccentric roller 5206 can rotate relative to the support roller 5201. An adhesive tape 5208 is sleeved on the outer side of the eccentric roller 5206. The adhesive tape 5208 can make the eccentric roller 5206 eccentric relative to the support roller 5201. The outer side of the adhesive tape 5208 is sticky and can stick to the film on the top of the wafer for peeling off the film that is not up to standard.

[0042] It should be noted that during use, the film passes around the gap between the clamping roller 5103 and the sliding roller 5203.

[0043] It should be noted that, under normal working conditions, when the clamping roller 5103 and the sliding roller 5203 move to the two quadrant points where the film is cut, the clamping roller 5103 and the sliding roller 5203 clamp the film, and the sliding roller 5203 can be adjusted to move away from each other through the bidirectional screw 5205 to open the film and avoid film wrinkles.

[0044] More specifically, one end of the bidirectional screw 5205 passes through the lifting frame 54, and the other end is fixedly connected to a meshing part 5209. The meshing part 5209 has a planar helical tooth structure, which can realize the effect of a clutch. A first drive part 5210 is fixedly connected to the middle of the lifting frame 54. The first drive part 5210 adopts a motor or other components that can rotate. When in use, it is electrically connected to a corresponding controller. The output end of the first drive part 5210 is connected to the bidirectional screw 5205 through a transmission structure to drive the bidirectional screw 5205 to rotate. The transmission structure can be a gear drive, chain drive, or belt drive. The mechanism provides power for the rotation of the bidirectional screw 5205. An electromagnetic push rod 5211 is fixedly connected inside the lifting frame 54. The electromagnetic push rod 5211 is electrically connected to a controller during use. The electromagnetic push rod 5211 corresponds to the meshing part 5209. The output end of the electromagnetic push rod 5211 is rotatably connected to a synchronous disc 5212. The disc surface of the synchronous disc 5212 has end face teeth that match the meshing part 5209. The synchronous disc 5212 is rotatably connected to the support roller 5201. The synchronous disc 5212 can mesh with the meshing part 5209, so that the support roller 5201 and the bidirectional screw 5205 rotate synchronously.

[0045] It should be noted that when the electromagnetic push rod 5211 is pushed out, it pushes the synchronous disk 5212 to engage with the end face teeth of the meshing part 5209. At this time, the rotation of the bidirectional screw 5205 can be transmitted to the support roller 5201 through the meshing part 5209 and the synchronous disk 5212, so that the support roller 5201 and the bidirectional screw 5205 rotate synchronously.

[0046] When the electromagnetic push rod 5211 retracts, the synchronous disk 5212 disengages from the meshing part 5209, and the rotation of the support roller 5201 is decoupled from the bidirectional screw 5205.

[0047] Specifically, a locking part 5213 is fixedly connected to the outer side of the output end of the electromagnetic push rod 5211. The locking part 5213 has the same structure as the engaging part 5209 and is arranged in opposite directions. A locking disc 5214 is fixedly connected to the inner side of the end cap corresponding to the locking part 5213. The locking disc 5214 can engage with the locking part 5213. When the electromagnetic push rod 5211 is fully retracted, the end face teeth of the locking part 5213 engage with the end face teeth of the locking disc 5214. At this time, the rotation of the support roller 5201 relative to the lifting frame 54 can be locked. At this time, the bidirectional screw 5205 rotates to adjust the relative distance between the two sliding rollers 5203.

[0048] More specifically, the film-tearing section 52 also includes: a glue-dispensing roller 5215 and a glue-receiving roller 5216, which are rotatably connected to the middle of the lifting frame 54. Both the glue-dispensing roller 5215 and the glue-receiving roller 5216 correspond to the eccentric roller 5206. The glue-dispensing roller 5215 and the glue-receiving roller 5216 are rotatably connected to the lifting frame 54 via bearings and are located above the eccentric roller 5206. It should be noted that the glue-dispensing roller 5215 and the eccentric roller 5206 are at similar heights. The adhesive tape 5208 passes sequentially through the glue-dispensing roller 5215, the eccentric roller 5206, and the glue-receiving roller 5216. The adhesive tape 5208 is a continuous thin... The membrane structure includes a second drive unit 5217, which is fixedly connected to the side wall of the lifting frame 54 and corresponds to the dispensing roller 5215 and the take-up roller 5216 respectively. The output end of each second drive unit 5217 is fixedly connected to the corresponding dispensing roller 5215 and take-up roller 5216 to control the tension of the adhesive tape 5208. The second drive unit 5217 is a stepper motor used to drive the two to rotate, thereby releasing new adhesive tape 5208 or winding up used adhesive tape 5208, ensuring that the area of ​​adhesive tape 5208 in contact with the eccentric roller 5206 always has a clean adhesive surface.

[0049] It should be noted that when cleaning substandard films, the adhesive roller 5215 rotates first, and the adhesive tape 5208 is loosened. The eccentric roller 5206, influenced by the conical spring 5207, is coaxial with the support roller 5201, and the adhesive tape 5208 is partially loosened. Figure 11 As shown, this allows the film to contact and adhere to the wafer. During the subsequent movement of the sliding frame 53, the dispensing roller 5215 and the receiving roller 5216 rotate synchronously, tearing off any defective film from the top of the wafer and wrapping it around the outside of the receiving roller 5216. After completion, the dispensing roller 5215 stops rotating, while the receiving roller 5216 continues to rotate at a preset angle. The adhesive tape 5208 causes the eccentric roller 5206 to become eccentric with the support roller 5201. Since both the dispensing roller 5215 and the receiving roller 5216 are positioned above the eccentric roller 5206, the adhesive tape 5208 will not contact the coated wafer during normal operation.

[0050] It should be noted that the preset angle of rotation of the take-up roller 5216 is adjusted according to the diameter of the adhesive tape 5208 wrapped around its outer side. When the outer diameter of the take-up roller 5216 is small, its rotation angle is large, and vice versa. However, after it rotates to the preset angle, it can make the eccentric roller 5206 and the support roller 5201 not concentric, and will not affect the normal operation of other components.

[0051] Specifically, the film pressing assembly 3 includes: a movable frame 31, which is slidably connected to the upper end of the worktable 6 and can pass over the film coating table 1. The movable frame 31 is slidably connected to the linear guide rail provided on the worktable 6 via a slider. The movable frame 31 is actively slidable relative to the film coating table 1 via a linear motor or electric push rod; a pressing part 32, which is fixedly connected to the upper end of the movable frame 31. The pressing part 32 is a cylinder or electric push rod, and its cylinder body is fixedly connected to the upper end of the movable frame 31; and a pressing roller 33, which is rotatably connected to the output end of the pressing part 32 and slidably connected to the middle part of the movable frame 31 for pressing the film. The pressing roller 33 is a cylindrical roller, and its two ends are rotatably connected to a roller frame via bearings. The roller frame is slidably connected in the vertical groove in the middle part of the movable frame 31 and is fixedly connected to the piston rod output end of the pressing part 32.

[0052] It should be noted that when the pressing part 32 is activated, it can drive the pressing roller 33 to move downward and press the film passing beneath it, so that it is applied to the wafer surface of the coating stage 1. The sliding of the moving frame 31 can drive the pressing roller 33 to complete the roll coating of the entire wafer surface.

[0053] More specifically, the film cutting assembly 2 includes: a cutting part 21, which is placed above the film covering table 1 and can slide up and down relative to the film covering table 1; a ring cutting frame 22, which is rotatably connected to the lower end of the cutting part 21 and has a cutter 23 fixedly connected to its end, with the cutting edge of the cutter 23 facing downward.

[0054] It should be noted that the cutting unit 21 is a vertically arranged cylinder or electric push rod, fixedly mounted on a gantry or cantilever, which can drive the lower end of the ring cleaving frame 22 to slide up and down. The ring cleaving frame 22 is a swing arm structure. A motor is fixedly mounted on the side of the ring cleaving frame 22 without the cutter 23, and the output shaft of the motor is fixedly connected to the ring cleaving frame 22. The distance between the connection position of the motor output shaft of the ring cleaving frame 22 and the cutter 23 should be greater than the wafer radius to prevent the cutter 23 from scratching the wafer. During use, the cutting unit 21 descends to align the cutter 23 with the thin film, and the rotation of the ring cleaving frame 22 causes the cutter 23 to cut the thin film around the wafer. Then, the cutting unit 21 rises.

[0055] The initial state of the invention is as follows Figure 3 As shown: the film peeling assembly 5 is located on the left side of the film coating platform 1, the film pressing assembly 3 is located on the right side, and the clamping roller 5103 and the sliding roller 5203 are higher than the film coating platform 1. At this time, the film on the top of the film coating platform 1 is in an inclined state, and the clamping part 51 and the film peeling part 52 are in a clamping state. At this time, the eccentric roller 5206 is in an eccentric state. Because the eccentric roller 5206 is in an eccentric state, the adhesive tape 5208 will not stick to the film.

[0056] In summary, the working process of this device is as follows: First, the first drive unit 5210 is controlled to work. The operation of the first drive unit 5210 will drive the bidirectional screw 5205 to rotate. The rotation of the bidirectional screw 5205 can drive the two sliding rollers 5203 to move away from each other along the axial direction of the support roller 5201, thereby adjusting the distance between the two sliding rollers 5203. This causes the clamping roller 5103 and the sliding roller 5203 to clamp the film and move it to both sides, so that the film opens up, avoids film wrinkles, and prepares for subsequent lamination.

[0057] Then, the film pressing assembly 3 is controlled to move from the right side of the film coating stage 1 to the left side of the film coating stage 1. When passing the film coating stage 1, the film is attached to the wafer. Since the film is taut at this time, the film coating will not have wrinkles, thereby improving the film coating quality and avoiding wrinkles. Then, the first drive unit 5210 is controlled to work, which will drive the bidirectional screw 5205 to rotate in the opposite direction. The rotation of the bidirectional screw 5205 can drive the two sliding rollers 5203 to move closer to each other along the axial direction of the support roller 5201, thereby causing the clamping roller 5103 and the sliding roller 5203 to clamp the film and move it towards the center for reset, so that the film changes from a taut state to a relaxed state, which is in preparation for the later film cutting. This avoids the waste film located on both sides of the wafer being easily pulled up during the film cutting process due to the film being too taut, which would cause adhesion and affect the later waste film cleaning.

[0058] Then, control the film pressing assembly 3 to move from the left side of the film coating stage 1 to the right side of the film coating stage 1 to the initial position; at the same time, control the film receiving assembly 8 to relax, and control the pushing part 55 to work, so that the lifting frame 54 is lowered until the clamping roller 5103 and the sliding roller 5203 are at the same height as the film coating stage 1, thereby further avoiding the situation where the waste film located on both sides of the wafer is easily pulled up during the subsequent film cutting process due to excessive film tension, resulting in adhesion and affecting the subsequent waste film cleaning.

[0059] Cutting and Inspection: After coating is completed, the cutting unit 21 of the cutting assembly 2 drives the ring cutter 22 to descend and rotate, and the cutter 23 cuts the thin film along the edge of the wafer. At the same time, the inspection unit 4 scans and inspects the surface of the coated wafer.

[0060] The electromagnetic push rod 5211 is extended, which pushes the teeth on the surface of the synchronous disk 5212 to engage with the teeth on the end face of the meshing part 5209. This allows the support roller 5201 and the bidirectional screw 5205 to rotate synchronously, thus preventing the waste film held by the clamping roller 5103 and the sliding roller 5203 from being pulled outward or inward due to rotational deviation between the support roller 5201 and the bidirectional screw 5205 during the waste film removal process. This would cause inconsistent winding of the film take-up assembly 8. Then, the entire film peeling assembly 5 is moved to the right side of the coating table 1, thereby separating the waste film from the coating table 1.

[0061] If the inspection is qualified, proceed to this process. When the peeling component 5 moves to the right side of the coating stage 1, the coated wafer is then removed by the mechanical gripper and a new wafer to be coated is placed. At the same time, the push unit 55 is controlled to work, so that the lifting frame 54 is raised to a position where the clamping roller 5103 and the sliding roller 5203 are higher than the height of the coating stage 1, that is, the height of the clamping roller 5103 and the sliding roller 5203 in the initial state.

[0062] Then, the film peeling assembly 5 is controlled to move to the left. When the clamping roller 5103 and the sliding roller 5203 move to the two quadrant points where the film is cut with circular holes, the clamping roller 5103 and the sliding roller 5203 clamp the film and stop the sliding roller 5203 from rotating. Then, the sliding frame 53 continues to slide in the reset direction, while the film feeding assembly 7 and the film receiving assembly 8 adjust the film to move synchronously. When the sliding frame 53 returns to the initial position, the film feeding assembly 7 and the film receiving assembly 8 stop feeding the film and make the end face teeth of the locking part 5213 engage with the end face teeth of the locking disk 5214. At this time, the rotation of the support roller 5201 relative to the lifting frame 54 can be locked. The sliding rollers 5203 are adjusted to move away from each other by the bidirectional screw 5205 to open the film and avoid film wrinkles. Then, the next wafer is coated.

[0063] If the film coating is found to be substandard, this process is initiated. When the film peeling assembly 5 is placed on the right side of the film coating table 1, the clamping part 51 and the film peeling part 52 are adjusted to be relatively far apart by the linear push rod 56, so that the clamping roller 5103 and the sliding roller 5203 no longer clamp the film, preventing the film after later cutting from sticking to the adhesive tape 5208. The film is then tightened by the film take-up assembly 8. The second drive unit 5217 is controlled to relax the glue dispensing roller 5215 and the glue take-up roller 5216, so that the eccentric roller 5206 and the support roller 5201 are restored to concentricity, and the adhesive tape 5208 is partially relaxed, with the middle of the adhesive tape 5208 naturally drooping. Figure 11 As shown; then the sliding frame 53 is slid to the left to reset, and the adhesive tape 5208 is adhered to the film on the upper end of the wafer by the eccentric roller 5206. During this process, the adhesive tape 5208 can stick to the film. Then, as the sliding frame 53 moves, the glue-dispensing roller 5215 and the glue-receiving roller 5216 rotate synchronously to tear off the defective film on the upper end of the wafer and wrap it around the outside of the glue-receiving roller 5216.

[0064] After the film-peeling part 52 moves past the middle of the coating stage 1 and aligns the clamping part 51 with the quadrant point of the cut film hole, the lifting frame 54 slides upward by the pushing part 55, separating the remaining film on the coating stage 1 from the coating stage 1. Simultaneously, the film on the wafer is further peeled off due to the influence of the adhesive tape 5208. As the film-peeling assembly 5 continues to move to the left, the film-receiving assembly 8 and the film-releasing assembly 7 are coordinated to ensure that the film moving speed and the film-peeling assembly 5 moving speed are synchronized. During the process of the film-tearing section 52 moving to the left, the take-up roller 5216 rotates to wind up the defective film on the wafer onto the outside of the take-up roller 5216. After the take-up roller 5216 rotates and completely wraps the defective film on the wafer onto the outside of the take-up roller 5216, the release roller 5215 is controlled to stop rotating. The take-up roller 5216 continues to rotate at a preset angle. The adhesive tape 5208 makes the eccentric roller 5206 eccentric with the support roller 5201, and prevents the fixed roller 5104 from contacting the eccentric roller 5206.

[0065] When the film peeling assembly 5 slides to the initial position on the left, it stops conveying the film. Since the clamping part 51 corresponds to the quadrant point of the cut film hole, and the film receiving assembly 8 and the film releasing assembly 7 cooperate to make the film moving speed the same as the film peeling assembly 5, the clamping part 51 corresponds to the quadrant point of the cut film hole. Then, the clamping roller 5103 and the sliding roller 5203 clamp the film. The clamping position is at the position where the film is cut. At this time, a new section of film corresponds to the wafer. The sliding roller 5203 is adjusted to move away from each other by the bidirectional screw 5205 to open the film and avoid film wrinkles. Then, the current wafer is coated again.

[0066] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An automated wafer continuous production coating apparatus, comprising a coating stage (1) and a cutting assembly (2), wherein the coating stage (1) corresponds to the cutting assembly and is used to fix the wafer, and the cutting assembly cuts the film, characterized in that, Also includes: The film pressing assembly (3) is slidable relative to the coating stage (1), and the film passes through the film pressing assembly (3) to apply the film onto the wafer; The detection unit (4) is fixedly connected to the middle of the cutting assembly and is used to detect whether the coating is qualified; The film peeling assembly (5) corresponds to the film pressing assembly (3) and can slide relative to the film coating table (1). It is used to clean the cut film and the film that is not qualified for coating. The film peeling assembly (5) includes: a clamping part (51) and a tearing part (52). The film passes between the clamping part (51) and the tearing part (52). The clamping part (51) and the tearing part (52) are close to each other and can clamp the film and tighten the film. The film-tearing section (52) is capable of separating defective films from wafers.

2. The automated wafer continuous production coating apparatus according to claim 1, characterized in that, Also includes: The worktable (6) and the film coating table (1) are located in the middle of the worktable (6). The worktable (6) is provided with a film feeding assembly (7) on one side and a film receiving assembly (8) on the other side. The film feeding assembly (7) and the film receiving assembly (8) are used to control the film conveying distance. The film passes through the film feeding assembly (7), the film pressing assembly (3), the film peeling assembly (5), and the film receiving assembly (8) in sequence.

3. The automated wafer continuous production coating apparatus according to claim 2, characterized in that, The peeling assembly (5) also includes: The sliding frame (53) is slidably mounted in the middle of the worktable (6) and can pass over the film covering table (1). The lifting frame (54) is placed at the upper end of the sliding frame (53). A pushing part (55) is provided between the lifting frame (54) and the sliding frame (53). The pushing part (55) is used to adjust the relative height between the sliding frame (53) and the lifting frame (54). The clamping part (51) and the film-tearing part (52) are both placed inside the lifting frame (54). The pushing part (55) adjusts the height of the clamping part (51) and the film-tearing part (52) relative to the coating stage (1) through the lifting frame (54), thereby adjusting the relative angle between the film and the wafer. A linear push rod (56) is fixedly connected to the middle of the lifting frame (54), and its output end is fixedly connected to the clamping part (51) for adjusting the relative distance between the clamping part (51) and the film-tearing part (52). The guide rod (57) is rotatably connected to the middle of the lifting frame (54) and positioned above the film-tearing section (52) to guide the film.

4. The automated wafer continuous production coating apparatus according to claim 3, characterized in that, The clamping part (51) includes: The support rod (5101) has a limit stage (5102) fixedly connected to both ends, and the limit stage (5102) is fixedly connected to the output end of the linear push rod (56); Clamping rollers (5103), which are movably mounted on both ends of support rods (5101), are used to guide the film; The fixed roller (5104) is fixedly connected to the middle of the support rod (5101) and is placed between the two support rods (5101).

5. The automated wafer continuous production coating apparatus according to claim 4, characterized in that, The tear-off portion (52) includes: The support roller (5201) has a support end cap (5202) threaded to both ends, and the support end cap (5202) is rotatably connected to the lifting frame (54); The sliding roller (5203) is slidably fitted on the outside of the support roller (5201) and corresponds to the clamping roller (5103). A threaded slider (5204) is fixedly connected to the inside of the sliding roller (5203). The threaded slider (5204) passes through the side wall of the support roller (5201) and slides in cooperation with the support roller (5201). A bidirectional screw (5205) is rotatably connected to the middle of the support roller (5201), and the threads at both ends are respectively threaded into the corresponding threaded slider (5204); An eccentric roller (5206) has two symmetrically arranged conical springs (5207) fixedly connected to its inner side. The other end of the conical springs (5207) is rotatably connected to the support roller (5201). An adhesive tape (5208) is sleeved on the outer side of the eccentric roller (5206). The adhesive tape (5208) can make the eccentric roller (5206) eccentric relative to the support roller (5201).

6. The automated wafer continuous production coating apparatus according to claim 5, characterized in that, One end of the bidirectional screw (5205) passes through the lifting frame (54), and the other end is fixedly connected to the meshing part (5209). The lifting frame (54) is fixedly connected to the middle of a first driving unit (5210). The output end of the first driving unit (5210) is connected to a bidirectional screw (5205) through a transmission structure to drive the bidirectional screw (5205) to rotate. An electromagnetic push rod (5211) is fixedly connected inside the lifting frame (54). The electromagnetic push rod (5211) corresponds to the meshing part (5209). The output end of the electromagnetic push rod (5211) is rotatably connected to a synchronous disk (5212). The synchronous disk (5212) is rotatably connected to the support roller (5201). The synchronous disk (5212) can mesh with the meshing part (5209) so that the support roller (5201) and the bidirectional screw (5205) rotate synchronously.

7. The automated wafer continuous production coating apparatus according to claim 6, characterized in that, A locking part (5213) is fixedly connected to the outer side of the output end of the electromagnetic push rod (5211). A locking disc (5214) is fixedly connected to the inner side of the end cap corresponding to the locking part (5213), and the locking disc (5214) can engage with the locking part (5213).

8. The automated wafer continuous production coating apparatus according to claim 5, characterized in that, The tear-off portion (52) further includes: The dispensing roller (5215) and the receiving roller (5216) are rotatably connected to the middle of the lifting frame (54), and the dispensing roller (5215) and the receiving roller (5216) are both corresponding to the eccentric roller (5206); The adhesive tape (5208) passes through the glue-dispensing roller (5215), the eccentric roller (5206), and the glue-receiving roller (5216) in sequence. The second drive unit (5217) is fixedly connected to the side wall of the lifting frame (54) and corresponds to the glue-dispensing roller (5215) and the glue-receiving roller (5216) respectively. The output end of each second drive unit (5217) is fixedly connected to the corresponding glue-dispensing roller (5215) and glue-receiving roller (5216) to control the tension of the adhesive tape (5208).

9. The automated wafer continuous production coating apparatus according to claim 1, characterized in that, The pressure film assembly (3) includes: The movable frame (31) is slidably connected to the upper end of the worktable (6) and can pass over the film covering table (1). The pressing part (32) is fixedly connected to the upper end of the movable frame (31); The pressing roller (33) is rotatably connected to the output end of the pressing part (32) and slidably connected to the middle of the moving frame (31) for pressing the film.

10. The automated wafer continuous production coating apparatus according to claim 1, characterized in that, The film cutting assembly (2) includes: The cutting section (21) is positioned above the laminating table (1) and can slide up and down relative to the laminating table (1); A ring-cutting frame (22) is rotatably connected to the lower end of the cutting section (21), and a cutter (23) is fixedly connected to the end.

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