Wafer carrier device with warp correction functionality and method of use thereof

Abstract

The application provides a wafer bearing device with a warping correction function and a use method thereof, relates to the field of wafer production, and comprises a correction disc, a detection assembly, a fixing frame, a rotating disc, an arc-shaped pipe, a supporting assembly and a correction assembly. The correction disc, the rotating disc and the inner side of the fixing frame form a first negative pressure cavity. The arc-shaped pipe is communicated with the first negative pressure cavity. The supporting assembly is used for adjusting the position of the wafer and controlling the on-off state of the arc-shaped pipe and the first negative pressure cavity. The correction assembly can drive the supporting assembly to rotate. The correction assembly comprises an attracting part and a communication ring. The top of the attracting part is provided with a second negative pressure cavity. The communication ring can push the attracting part to slide up and down. Through the above components, the wafer can be corrected under different pressures, the internal stress of the wafer is effectively released, the wafer deflection caused in the transfer process after detection is avoided, and the problem that the wafer is deformed due to the influence of air flow in the detection process is solved.

Description

Technical Field

[0001] This invention relates to the field of wafer manufacturing technology, and in particular to a wafer carrier device with warp correction function and its usage method. Background Technology

[0002] In semiconductor manufacturing, the wafer, as the basic substrate carrying integrated circuits, has a flatness that is a decisive factor in determining the accuracy and yield of subsequent key processes such as photolithography, thin film deposition, and etching. However, wafers often warp, either overall or locally, during production, handling, or after certain heat treatment processes. This leads to difficulties in photolithography focusing, exposure defects, and may also cause problems such as uneven film thickness and stress concentration, severely restricting the development of advanced process technologies. To correct wafer warpage, the industry commonly uses vacuum adsorption flattening. Specifically, the warped wafer is placed on a flat support platform. After applying negative pressure, the wafer is adsorbed and adhered to the platform surface and held for a certain period of time, hoping to use continuous and uniform adsorption force to force the wafer to return to flatness.

[0003] However, this traditional uniform negative pressure adsorption correction method has significant limitations: its correction capability is highly dependent on the initial degree of warpage. For wafers with large warpage or complex stress distributions, this method often fails.

[0004] Traditional methods apply a uniform, constant negative pressure across the entire wafer. This uniform force cannot differentiate the release of non-uniform residual stress distribution within the wafer, resulting in poor correction effects. For severely warped areas, a larger local force is needed to overcome the yield stress and induce micro-plastic deformation or more sufficient stress relaxation, but uniform adsorption cannot meet this requirement. The correction process is usually separated from the warp detection process. Multiple handling not only increases time costs and introduces risks of contamination and breakage, but the separation of detection and correction may also lead to positional errors, affecting the targeted nature of the correction. Airflow leakage from some vias may disturb local positions on the wafer, causing micro-vibrations, leading to distorted detection data and affecting the judgment of the true warp state and correction effect.

[0005] Therefore, there is an urgent need in the field for a wafer carrier device with warp correction function and its usage method to solve the above problems. Summary of the Invention

[0006] The purpose of this invention is to provide a wafer carrier device with warp correction function and a method of using it, so as to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a wafer carrier device with warpage correction function, comprising a correction disk and a detection component disposed on one side of the correction disk, further comprising: a fixing frame, which is sleeved on the outside of the correction disk and fixedly connected to the correction disk, a rotating disk being rotatably connected to the middle of the fixing frame, the correction disk, the rotating disk and the inner side of the fixing frame forming a first negative pressure cavity; an arc-shaped tube, which is fixedly connected to the lower end of the rotating disk and can communicate with the first negative pressure cavity; and a support component, which is placed in the middle of the fixing frame and whose upper end can pass through... The wafer slides up and down through the correction disk. The support assembly is placed inside the arc-shaped tube to adjust the position of the wafer relative to the correction disk and control the on / off state of the arc-shaped tube and the first negative pressure chamber. The correction assembly has a central portion that passes through the rotating disk and can drive the support assembly to rotate. The correction assembly includes a suction part, which is placed inside the first negative pressure chamber. A second negative pressure chamber is opened at the top of the suction part. The suction part can drive the support assembly to slide up and down. A connecting ring is slidably connected to the outside of the arc-shaped tube and communicates with the second negative pressure chamber. The connecting ring can push the suction part to slide up and down.

[0008] Preferably, the correction component further includes: a connecting section that passes through the rotating disk and is fixedly connected to the connecting ring, the connecting section connecting the second negative pressure chamber to the inner side of the connecting ring; multiple suction parts are arranged circumferentially along the axis of the correction disk, and each suction part is provided with a pushing component at one end near the support component; a connecting sleeve that is rotatably fitted on the outside of the arc-shaped tube, with its upper end placed inside the connecting ring, and a second pneumatic interface connected to the bottom of the connecting sleeve.

[0009] Preferably, the arc-shaped tube includes an arc-shaped section and a vertical section, the inner diameter of the arc-shaped section is larger than the inner diameter of the vertical section; the lower end of the vertical section is connected to a first pneumatic interface.

[0010] Preferably, the support assembly includes: a lifting tube, which is slidably disposed inside the arc-shaped tube and can rotate synchronously with the arc-shaped tube; the upper end of the lifting tube has multiple suction holes that communicate with the inner side of the lifting tube; a horn tube, which is fixedly connected to the lower end of the lifting tube; a guide bracket is fixedly connected to its inner wall to ensure that the lifting tube can only slide in the vertical direction; the outer side of the horn tube can block the vertical section of the arc-shaped tube and cut off the communication between the arc-shaped tube and the first negative pressure chamber.

[0011] Preferably, it further includes: a fixed ring, which is fixedly connected to the outside of the lifting pipe; a sliding ring, which is slidably sleeved on the outside of the lifting pipe and placed at the lower end of the fixed ring; the outer sides of both the fixed ring and the sliding ring are arc-shaped.

[0012] Preferably, the pushing component includes: a movable pin, which is slidably connected to the lower end of the suction part and has an inclined end, the inclined section of the movable pin being able to be inserted between the sliding ring and the fixed ring and drive the lifting tube to slide up and down; and an elastic element, which is disposed at the lower end of the suction part and is used to push the movable pin to slide towards the side closer to the fixed ring.

[0013] Preferably, it further includes: a guide rod, which is fixedly connected to the vertical section of the arc-shaped tube and has its upper end passing through the middle of the guide bracket; and a lower limit ring, which is fixedly connected to the middle of the guide rod and is used to limit the lower limit position of the lifting tube.

[0014] Preferably, the correction assembly further includes: a synchronization ring, which is fixedly connected to the lower end of the connecting ring and has an annular groove in the middle; a push rod, which is fixedly connected to the bottom of the fixing frame and has a push slider fixedly connected to its output end. The push slider is placed in the annular groove of the synchronization ring and can slide along the annular groove to drive the connecting ring to slide up and down; a drive ring, which is fixedly connected to the outside of the connecting ring; and a drive part, which is fixedly connected to the output end of the push rod. The output end of the drive part cooperates with the drive ring to drive the connecting ring to rotate.

[0015] Preferably, it further includes: a translation component, which is fixedly installed on one side of the mounting bracket and is capable of sliding horizontally relative to the wafer, and the detection component is installed on the upper end of the translation component for adjusting the position of the detection component.

[0016] This invention also discloses a method for correcting warped wafers, comprising the following steps: Step 1: Place the wafer. A mechanical gripper places the wafer on the upper part of the support assembly, and the support assembly fixes the wafer in place. Step 2, Warpage Detection: The translation component adjusts the detection component to the edge of the wafer, and the support component drives the wafer to rotate to complete the warpage detection. Step 3: Initial judgment. The data detected by the detection component is compared with the set data. If the detection is qualified, the mechanical gripper removes the wafer, and Step 1 is executed again. If the detection is unqualified, the detection component is adjusted to a position away from the wafer by the translation component. Step 4: First correction. The support assembly descends, and the first negative pressure chamber generates negative pressure, causing the wafer to adhere to the top of the correction disk. After the correction is completed, the negative pressure in the first negative pressure chamber is eliminated, the support assembly rises, and Step 2 is executed. Step 5: Secondary inspection. Adjust the position of the inspection components and rotate the wafer to perform a secondary inspection. Step Six: Secondary Judgment. The data detected by the detection component is compared with the set data. If the detection is qualified, the mechanical gripper removes the wafer, and Step One is executed again. If the detection is unqualified, the detection component is adjusted to a position away from the wafer by the translation component. Step 7: Secondary correction. The support assembly descends, generating negative pressure in the first negative pressure chamber, causing the wafer to adhere to the top of the correction disk. Simultaneously, the second negative pressure chamber is adjusted to contact the bottom of the correction disk, generating a second negative pressure within it. The suction unit rotates relative to the wafer, completing the secondary correction. Subsequently, the negative pressure in the first and second negative pressure chambers is eliminated, the support assembly rises, and the mechanical gripper transfers the wafer to the defective area.

[0017] This invention provides a wafer carrier device with warp correction function and its usage method, which has the following beneficial effects: 1. This invention, by setting up a rotating disk, a first negative pressure chamber, an attraction part, and a second negative pressure chamber, effectively achieves the purpose of calibrating wafers under different pressures. During calibration, the lifting tube is adjusted downward by pushing the rod. When the lower end of the horn tube enters the arc section of the arc tube, the arc tube connects with the first negative pressure chamber. The through hole of the calibration disk simultaneously generates the first negative pressure to attract the wafer, causing the wafer to adhere to the upper end of the calibration disk. Atmospheric pressure is used to press the wafer, completing the calibration. At the same time, the second negative pressure chamber can attract the wafer through the corresponding through hole, and the driving part makes the second negative pressure chamber rotate relative to the wafer, attracting different positions of the wafer. Since the pressure in the second negative pressure chamber is lower than that in the first negative pressure chamber, the purpose of further calibrating the wafer is achieved, effectively releasing the internal stress of the wafer and improving the calibration effect.

[0018] 2. By setting up a detection component, a support component, and a correction component, this invention effectively avoids wafer deflection during the transfer process after detection. The wafer is rotated by a lifting tube so that the most severely warped position corresponds to the attraction part. When the second negative pressure generator is activated, the second negative pressure chamber attracts the wafer through the corresponding through hole, thereby enabling priority correction of the severely warped part and driving the release of internal stress.

[0019] 3. By setting up an arc-shaped segment, a vertical segment, and a support component, this invention effectively avoids wafer deformation caused by airflow during the testing process. When the support component pushes the wafer above the correction disk without contacting it, the horn tube cuts off the connection between the first negative pressure chamber and the first pneumatic interface, so that no negative pressure is generated in the first negative pressure chamber, and no airflow is generated in the through hole in the middle of the correction disk. This avoids wafer deformation caused by airflow during wafer testing and improves the accuracy of the testing. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the detection state of the present invention.

[0021] Figure 2 This is a schematic diagram of the overall structure of the present invention.

[0022] Figure 3 This is a cross-sectional view of the overall structure of the present invention.

[0023] Figure 4 This is a cross-sectional view of the front view of the present invention.

[0024] Figure 5 This is a schematic diagram of the correction state of the present invention.

[0025] Figure 6 This is a cross-sectional view of the correction component in this invention.

[0026] Figure 7 This is a cross-sectional view of the support component in this invention.

[0027] Figure 8 For the present invention Figure 6 A magnified view of a portion of region A in the middle.

[0028] Figure 9 This is a schematic diagram of the structure of the driving component in this invention.

[0029] Figure 10 This is a schematic diagram of the internal structure of the present invention.

[0030] In the picture: 1. Correction disc; 2. Detection assembly; 3. Fixing frame; 4. Rotating disc; 5. First negative pressure chamber; 6. Arc-shaped tube; 601. Arc-shaped segment; 602. Vertical segment; 7. Support assembly; 701. Lifting tube; 702. Suction hole; 703. Horn tube; 704. Guide bracket; 8. Correction assembly; 801. Suction part; 802. Second negative pressure chamber; 803. Connecting ring; 804. Connecting segment; 805. Pushing assembly; 8051. Movable pin; 8052. Elastic element; 806. Connecting sleeve; 807. Second pneumatic interface; 808. Synchronization ring; 809. Annular groove; 810. Push rod; 811. Push slider; 812. Drive ring; 813. Drive part; 9. First pneumatic interface; 10. Fixing ring; 11. Sliding ring; 12. Guide rod; 13. Lower limit ring; 14. Translation assembly. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] Example 1 This invention provides, for example Figures 1 to 10The wafer carrier device with warp correction function shown includes a correction disk 1 and a detection component 2 disposed on one side of the correction disk 1. The detection component 2 is prior art; in this embodiment, an optical detection method is described. This is only an example and does not specifically limit the detection method. It also includes a fixing frame 3, which is sleeved on the outside of the correction disk 1 and fixedly connected to it. The correction disk 1 is placed on the upper end of the fixing frame 3. The top of the fixing frame 3 is annular, and the bottom is provided with a support, and it is fixedly installed in an appropriate position. A rotating disk 4 is rotatably connected to the middle of the fixed frame 3. The rotating disk 4 and the fixed frame 3 are in a sealed rotatable fit. The straightening disk 1, the rotating disk 4, and the inner side of the fixed frame 3 form a first negative pressure cavity 5. It should be noted that the middle of the straightening disk 1 has multiple through holes for adsorbing the wafer and fitting it to the straightening disk 1. The top surface of the straightening disk is a smooth plane. An arc-shaped tube 6 is fixedly connected to the lower end of the rotating disk and can communicate with the first negative pressure cavity 5. The arc-shaped tube 6 includes an arc-shaped section 601 and a vertical section 602. The arc-shaped section 601... 1. The inner diameter is larger than the inner diameter of the vertical section 602; the lower end of the vertical section 602 is connected to the first pneumatic interface 9. The vertical section 602 is divided into upper and lower parts, and the arc section 601 is placed between the upper and lower vertical sections 602; the first pneumatic interface 9 is connected to the first negative pressure generator through a pipe to generate the first negative pressure value; the support component 7 is placed in the middle of the fixed frame 3, and its upper end can pass through the correction disk 1 and slide up and down. The support component 7 is placed in the arc tube 6 to adjust the position of the wafer relative to the correction disk 1, that is, to adjust the height of the wafer relative to the correction disk 1, and to control the on / off state of the arc tube 6 and the first negative pressure chamber 5. When the support component 7 pushes the wafer to be placed above the correction disk 1 and does not contact the correction disk 1, the first negative pressure chamber 5 is disconnected from the arc tube 6, and the through hole in the middle of the correction disk 1 does not attract air, so as to avoid the wafer deformation caused by the airflow during the wafer detection process, which affects the detection results; the correction component 8 has its middle part passing through the rotating disk, and can drive the support component 7 to rotate through the rotating disk.

[0033] Specifically, the correction component 8 includes a suction part 801, which is placed inside the first negative pressure chamber 5. A second negative pressure chamber 802 is opened at the top of the suction part 801. When the second negative pressure chamber 802 contacts the correction disc 1, the corresponding through hole of the correction disc 1 generates a second negative pressure. It should be noted that the pressure value of the second negative pressure is less than the pressure value of the first negative pressure (e.g., if the first negative pressure is -5 kPa, then the second negative pressure value is -6 kPa or less), that is, the attraction force generated by the second negative pressure is stronger. The suction part 801 can drive the support component 7 to slide up and down. A connecting ring 803 is slidably connected to the outside of the arc-shaped tube 6 and communicates with the second negative pressure chamber 802. The connecting ring 803 can push the suction part 801 to slide up and down. The connecting ring 803 and the arc-shaped tube 6 can only slide relative to each other. When the connecting ring 803 rotates, it can drive the arc-shaped tube 6 to rotate synchronously. A connecting section 804 passes through the rotating disc and is fixedly connected to the connecting ring 803. The connecting section 804 connects the second negative pressure chamber 802 with the connecting ring 803. The inner side of the through ring 803 is connected, and the connecting section 804 is slidably connected to the rotating disk in a sealed manner. The upper end of the connecting section 804 is connected to the rotating disk by bolts to ensure that it can be installed. Multiple suction parts 801 are arranged circumferentially along the axis of the straightening disk 1. Each suction part 801 is provided with a pushing component 805 at one end near the support component 7. The connecting sleeve 806 is rotatably fitted on the outside of the arc-shaped tube 6, and its upper end is placed inside the connecting ring 803. The bottom of the connecting sleeve 806 is connected to a second pneumatic interface 807. The second pneumatic interface 807 is connected to a second negative pressure generator through a pipe. The negative pressure generator is existing technology and will not be described in detail here. The connecting sleeve 806 and the connecting ring 803 are relatively sealed. The connecting sleeve 806 and the connecting ring 803 can rotate and slide relative to each other. The connecting sleeve 806 is fixedly connected to the bottom of the fixing frame 3 to ensure that the pipe connecting the connecting ring 803 to the second pneumatic interface 807 will not become entangled during the rotation of the connecting ring 803.

[0034] It should be noted that when the upper end of the suction part 801 is not in contact with the correction disk 1 and the wafer is in contact with the correction disk 1, the first negative pressure generator is turned on, and all the through holes of the correction disk 1 only generate the attraction of the first negative pressure value on the wafer to correct the wafer; when the upper end of the suction part 801 is in contact with the lower end face of the correction disk 1, the second negative pressure generator is activated, and the through holes of the corresponding second negative pressure chamber 802 generate the attraction of the second negative pressure value relative to the wafer, increasing the downward attraction on the wafer and improving the correction effect. At the same time, the rotating disk is rotated, and the attraction is increased at different positions of the wafer during the rotation of the suction part 801 to complete further correction. At the same time, repeatedly attracting the wafer downward can also reduce the internal stress of the wafer and prevent the wafer from recovering its deformation after the attraction disappears.

[0035] More specifically, the support component 7 includes: a lifting tube 701, which is slidably disposed inside the arc-shaped tube 6 and can rotate synchronously with the arc-shaped tube 6; the upper end of the lifting tube 701 is provided with multiple suction holes 702, which are connected to the inner side of the lifting tube 701 and the lifting tube 701 is connected to the arc-shaped tube 6; a horn tube 703, which is fixedly connected to the lower end of the lifting tube 701, and a guide bracket 704 is fixedly connected to its inner wall to ensure that the lifting tube 701 can only slide in the vertical direction; the outer side of the horn tube 703 can block the vertical section 602 of the arc-shaped tube 6 and cut off the connection between the arc-shaped tube 6 and the first negative pressure chamber 5.

[0036] It should be noted that when the lower end of the horn tube 703 is placed inside the arc section 601 of the arc tube 6, the suction hole 702 is connected to the first negative pressure chamber 5, and both can maintain the same first negative pressure value. When the lifting tube 701 rises, the outer wall of the horn tube 703 passes through the arc section 601 and enters the vertical section 602. At this time, the horn tube 703 cuts off the connection between the first negative pressure chamber 5 and the first pneumatic interface 9, so that no negative pressure is generated in the first negative pressure chamber 5. At this time, the first negative pressure generator can generate negative pressure in the suction hole 702 and attract and fix the wafer, preventing the wafer from falling off when the lifting assembly adjusts the wafer position.

[0037] Specifically, it also includes: a fixed ring 10, which is fixedly connected to the outside of the lifting tube 701; a sliding ring 11, which is slidably sleeved on the outside of the lifting tube 701 and placed at the lower end of the fixed ring 10, with a gap between the fixed ring 10 and the sliding ring 11, and a protrusion provided on the lifting tube 701 at the lower limit position of the sliding ring 11 to prevent the sliding ring 11 from detaching; the outer sides of both the fixed ring 10 and the sliding ring 11 are arc-shaped, and the outer diameter of the side end face of the fixed ring 10 and the sliding ring 11 that are close to each other is larger than the outer diameter of the other side, ensuring that the outer sides of the fixed ring 10 and the sliding ring 11 are inclined or arc-shaped.

[0038] More specifically, the pushing component 805 includes: a movable pin 8051, which is slidably connected to the lower end of the suction part 801, and the end is inclined, with the inclined surface positioned near the side of the sliding ring 11. The inclined section of the movable pin 8051 can be inserted between the sliding ring 11 and the fixed ring 10, and drive the lifting tube 701 to slide up and down; an elastic element 8052, which is disposed at the lower end of the suction part 801, for pushing the movable pin 8051 to slide towards the side near the fixed ring 10. The elastic element 8052 can be a spring or an elastic sheet. The suction part 801 has mounting holes corresponding to the positions of the elastic element 8052 and the movable pin 8051, so that the movable pin 8051 can slide along the extension direction of the mounting hole.

[0039] It should be noted that when the movable pin 8051 is placed between the fixed ring 10 and the sliding ring 11, during the upward movement of the suction part 801, the movable pin 8051 pushes the lifting tube 701 to rise synchronously through the fixed ring 10. When the suction part 801 descends, the lifting tube 701 resets. When the lifting tube 701 descends to its limit position, the suction part 801 drives the movable pin 8051 to continue downward. During this process, the top of the sliding ring 11 slides relative to the suction part 801 through the inclined surface of the movable pin 8051, and the elastic element 8052 is compressed and contracted. As the suction part 801 continues to descend, the movable pin 8051 will pass over the sliding ring 11 and reach the lower end of the sliding ring 11.

[0040] At this time, the rising suction part 801 causes the movable pin 8051 to compress the elastic element 8052 due to the influence of the outer arc surface of the sliding ring 11 and the fixed ring 10. The movable pin 8051 pushes the sliding ring 11 upward to contact the fixed ring 10. As the movable pin 8051 continues to rise, the elastic element 8052 pushes the movable pin 8051 to reach the upper end of the fixed ring 10. At this time, the rising suction part 801 will no longer push the lifting tube 701 upward. When the suction part 801 descends to contact the fixed ring 10, the elastic element 8052 will retract again due to the influence of the arc surface of the fixed ring 10 and the inclined surface of the movable pin 8051. After the movable pin 8051 enters between the fixed ring 10 and the sliding ring 11, the elastic element 8052 pushes the movable pin 8051 to reset, so that the movable pin 8051 is inserted between the fixed ring 10 and the sliding ring 11 again.

[0041] Specifically, it also includes: a guide rod 12, which is fixedly connected inside the vertical section 602 of the arc-shaped tube 6, and its upper end passes through the middle of the guide bracket 704. The lower end of the guide rod 12 is hollowed out to ensure air circulation inside the arc-shaped tube 6; a lower limit ring 13, which is fixedly connected to the middle of the guide rod 12 and is used to limit the lower limit position of the lifting tube 701. The horn tube 703 slides down to make the guide bracket 704 move down synchronously. When the guide bracket 704 contacts the lower limit ring 13, the lifting tube 701 reaches the lower limit position.

[0042] It should be noted that the guide rod 12 has a polygonal shape to ensure that the guide rod 12 can make the lifting tube 701 rotate synchronously through the guide bracket 704 during the rotation of the arc tube 6.

[0043] More specifically, the correction component 8 also includes: a synchronization ring 808, which is fixedly connected to the lower end of the connecting ring 803 and has an annular groove in the middle; and a push rod 810, which is fixedly connected to the bottom of the fixing frame 3. The push rod 810 is a component that can achieve precise linear sliding, such as a linear motor or a lead screw motor. The output end is fixedly connected to a push slider 811, which is placed in the annular groove of the synchronization ring 808 and can slide along the annular groove to drive the connecting ring 803 to slide up and down. The push rod 810 is evenly distributed relative to the axis of the synchronization ring 808. There are at least two components that cause tilting during the pushing of the connecting ring 803. The push rod 810 and the push slider 811 correspond one-to-one. The drive ring 812 is fixedly connected to the outside of the connecting ring 803. The drive part 813 is fixedly connected to the output end of the push rod 810. The output end of the drive part 813 cooperates with the drive ring 812 to drive the connecting ring 803 to rotate. The drive part 813 adopts a stepper motor or servo motor or other components that can control the rotation angle. The drive part 813 and the drive ring 812 can cooperate through gear transmission or chain transmission.

[0044] It should be noted that the push rod 810 drives the connecting ring 803 to slide up and down through the synchronous ring 808. At the same time, the push rod 810 causes the drive unit 813 to slide synchronously with the connecting ring 803. During this process, the drive unit 813 causes the connecting ring 803 to rotate through the drive ring 812, pushing the slider 811 to slide along the annular groove 809.

[0045] Specifically, it also includes: a translation component 14, which is fixedly installed on one side of the mounting bracket 3 and can slide horizontally relative to the wafer; the detection component 2 is installed on the upper end of the translation component 14 and is used to adjust the position of the detection component 2; the translation component 14 uses a linear motor and a guide rail to adjust the position of the detection component 2 relative to the correction disk 1.

[0046] In summary, during use, ensure that the movable pin 8051 is positioned between the fixed ring 10 and the sliding ring 11. Drive the connecting ring 803 upward by the push rod 810 and the synchronous ring 808. During the upward movement of the suction part 801, the movable pin 8051 pushes the lifting tube 701 upward synchronously through the fixed ring 10, and makes the end of the lifting tube 701 higher than the correction plate 1. At this time, the horn tube 703 cuts off the connection between the first negative pressure chamber 5 and the first pneumatic interface 9, so that no negative pressure is generated in the first negative pressure chamber 5. Then, the mechanical gripper places the wafer on the upper end of the lifting tube 701, and at the same time, the first negative pressure generator is activated to generate negative pressure in the suction hole 702 and attract and fix the wafer.

[0047] Subsequently, the detection component 2 is adjusted to the edge of the wafer by the translation component 14. At this time, the support component 7 places the wafer above the correction disk 1 without contacting it. The first negative pressure chamber 5 is disconnected from the arc tube 6. The through hole in the middle of the correction disk 1 does not attract air, thus avoiding wafer deformation caused by airflow during wafer detection and affecting the detection results. Then, the drive unit 813 is activated, and the drive ring 812 causes the connecting ring 803 to rotate. At the same time, the arc tube 6 rotates synchronously with the lifting tube 701 through the fixing ring 10 and the guide bracket 704. At this time, the edge of the wafer rotates relative to the detection component 2. The degree of bending of the wafer is measured by the detection component 2 and judged against the initially set error value. If it meets the set standard, it indicates that the wafer is qualified and has not been deformed, so no correction is required. Then, it can be transferred to the subsequent process equipment by the mechanical gripper. If it does not meet the standard, the detection component 2 is slid away from the wafer by the translation component 14 so that the detection component 2 does not overlap with the wafer.

[0048] During the correction process, the lifting tube 701 is adjusted downward by pushing the rod 810. When the lower end of the horn tube 703 enters the arc section 601 of the arc tube 6, the arc tube 6 connects with the first negative pressure chamber 5. At the same time, the through hole of the correction disk 1 generates the first negative pressure to attract the wafer, causing the wafer to adhere to the upper end of the correction disk 1. The wafer is then pressed by atmospheric pressure to complete the correction. After the correction is completed, the lifting tube 701 is slid upward again, and the position of the detection component 2 is adjusted to monitor the wafer and determine whether it meets the requirements. If it does, the wafer can be transferred to the subsequent process equipment by the mechanical gripper. If it does not meet the requirements, it needs to be corrected again, and the atmospheric pressure on the wafer is increased.

[0049] During forceful correction, the wafer is first rotated by the lifting tube 701, aligning the most warped position with the suction part 801. Then, the lifting tube 701 is adjusted downwards to its limit position via the push rod 810, disengaging the upper end of the lifting tube 701 from the wafer. At this point, the suction hole 702 no longer attracts the wafer; instead, the wafer is attracted through the through-hole of the correction disk 1, fixing its position. The suction part 801 drives the movable pin 8051 downwards, compressing and contracting the elastic element 8052. As the suction part 801 continues to descend, the movable pin 8051 passes the sliding ring 11 and reaches its lower end. Then, the suction part 801 is adjusted to slide upwards, and the movable pin 8051 is subjected to pressure from the sliding ring 11 and the fixed ring. The outer arc surface of the ring 10 will compress the elastic element 8052 and cause the movable pin 8051 to continue rising until it reaches the upper end of the fixed ring 10. At this time, the rising suction part 801 will no longer push the lifting tube 701 to rise. Then, the upper end of the suction part 801 is adjusted to contact the bottom of the correction plate 1, and then the second negative pressure generator is activated. The second negative pressure chamber 802 attracts the wafer through the corresponding through hole. Then, the driving part 813 makes the second negative pressure chamber 802 rotate relative to the wafer, attracting different positions of the wafer. Since the pressure inside the second negative pressure chamber 802 is less than that inside the first negative pressure chamber 5, the purpose of further correcting the wafer is achieved. And through the movement of the second negative pressure chamber 802, the internal stress of the wafer is released, improving the correction effect.

[0050] Example 2 The present invention also provides a method for correcting warped wafers, comprising the following steps: Step 1: Place the wafer. The mechanical gripper places the wafer on the upper part of the support assembly 7, and the support assembly 7 fixes the wafer. The mechanical gripper adjusts the wafer to be coaxial with the support assembly 7. Step 2, warpage detection: The translation component 14 adjusts the detection component 2 to the edge of the wafer, and the support component 7 drives the wafer to rotate to complete the warpage detection. Step 3: First judgment. The data detected by the detection component 2 is compared with the set data. If the detection is qualified, the mechanical gripper removes the wafer and Step 1 is executed again. If the detection is unqualified, the detection component 2 is adjusted to a position away from the wafer by the translation component 14. Step 4: First correction. The support component 7 descends, and the first negative pressure chamber 5 generates negative pressure, causing the wafer to adhere to the top of the correction disk 1. After the correction is completed, the negative pressure in the first negative pressure chamber 5 is eliminated, and the support component 7 rises. Step 5: Secondary inspection. Adjust the position of inspection component 2 and rotate the wafer to perform secondary inspection on the wafer. Step 6: Secondary judgment. The data detected by detection component 2 is compared with the set data. If the detection is qualified, the mechanical gripper removes the wafer and Step 1 is executed again. If the detection is unqualified, the translation component 14 is used to adjust detection component 2 to a position away from the wafer. Step 7: Secondary correction. The support assembly 7 descends, and the first negative pressure chamber 5 generates negative pressure, causing the wafer to adhere to the top of the correction disk 1. At the same time, the second negative pressure chamber 802 is adjusted to contact the bottom of the correction disk 1, generating a second negative pressure in the second negative pressure chamber 802. The suction part 801 is rotated relative to the wafer to complete the secondary correction. Then, the negative pressure in the first negative pressure chamber 5 and the second negative pressure chamber 802 is eliminated, the support assembly 7 rises, and the mechanical gripper transfers the wafer to the defective area.

[0051] It should be noted that during the secondary correction, the location of the most severe warping detected by the secondary judgment can be matched with the suction part 801, and the location of the most severe warping can be corrected first.

[0052] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer carrier device with warp correction function, comprising a correction disk (1) and a detection component (2) disposed on one side of the correction disk (1), characterized in that, Also includes: The fixing frame (3) is sleeved on the outside of the correction plate (1) and fixedly connected to the correction plate (1). The middle part of the fixing frame (3) is rotatably connected to the rotating plate (4). The correction plate (1), the rotating plate (4) and the inner side of the fixing frame (3) form a first negative pressure cavity (5). The arc-shaped tube (6) is fixedly connected to the lower end of the rotating disk and can communicate with the first negative pressure chamber (5); The support assembly (7) is placed in the middle of the fixing frame (3), and its upper end can pass through the correction disk (1) and slide up and down. The support assembly (7) is placed in the arc tube (6) to adjust the position of the wafer relative to the correction disk (1) and control the on / off state of the arc tube (6) and the first negative pressure chamber (5). The corrective component (8) has a rotating disk passing through its middle part and is capable of driving the support component (7) to rotate; The correction component (8) includes a suction part (801) which is placed in the first negative pressure chamber (5), and a second negative pressure chamber (802) is opened at the top of the suction part (801). The suction part (801) can drive the support component (7) to slide up and down. The connecting ring (803) is slidably connected to the outside of the arc-shaped tube (6) and communicates with the second negative pressure chamber (802). The connecting ring (803) can push the suction part (801) to slide up and down.

2. The wafer carrier device with warp correction function according to claim 1, characterized in that, The corrective component (8) also includes: The connecting section (804) passes through the rotating disk and is fixedly connected to the connecting ring (803). The connecting section (804) connects the second negative pressure chamber (802) with the inner side of the connecting ring (803). The suction part (801) is provided in multiple circumferential directions along the axis of the correction disc (1), and each suction part (801) is provided with a pushing component (805) at one end near the support component (7). The connecting sleeve (806) is rotatably fitted on the outside of the arc-shaped tube (6), and its upper end is placed inside the connecting ring (803). The bottom of the connecting sleeve (806) is connected to the second pneumatic port (807).

3. The wafer carrier device with warp correction function according to claim 2, characterized in that, The arc-shaped tube (6) includes an arc-shaped section (601) and a vertical section (602), and the inner diameter of the arc-shaped section (601) is larger than the inner diameter of the vertical section (602); The lower end of the vertical section (602) is connected to the first pneumatic interface (9).

4. The wafer carrier device with warp correction function according to claim 3, characterized in that, The support component (7) includes: The lifting tube (701) is slidably disposed inside the arc tube (6) and can rotate synchronously with the arc tube (6). The upper end of the lifting tube (701) is provided with multiple suction holes (702), and the suction holes (702) are connected to the inner side of the lifting tube (701). The horn tube (703) is fixedly connected to the lower end of the lifting tube (701), and a guide bracket (704) is fixedly connected to its inner wall to ensure that the lifting tube (701) can only slide in the vertical direction; The outer side of the horn tube (703) can block the vertical section (602) of the arc tube (6) and cut off the connection between the arc tube (6) and the first negative pressure chamber (5).

5. The wafer carrier device with warp correction function according to claim 4, characterized in that, Also includes: A fixing ring (10) is fixedly connected to the outside of the lifting pipe (701); The sliding ring (11) is slidably sleeved on the outside of the lifting tube (701) and placed at the lower end of the fixed ring (10); Both the outer sides of the fixed ring (10) and the sliding ring (11) are arc-shaped.

6. The wafer carrier device with warp correction function according to claim 5, characterized in that, The actuating component (805) includes: The movable pin (8051) is slidably connected to the lower end of the suction part (801) and the end is inclined. The inclined section of the movable pin (8051) can be inserted between the sliding ring (11) and the fixed ring (10) and drive the lifting tube (701) to slide up and down. An elastic element (8052) is provided at the lower end of the suction part (801) for pushing the movable pin (8051) to slide towards the side close to the fixed ring (10).

7. The wafer carrier device with warp correction function according to claim 3, characterized in that, Also includes: The guide rod (12) is fixedly connected in the vertical section (602) of the arc tube (6), and its upper end passes through the middle of the guide bracket (704); The lower limit ring (13) is fixedly connected to the middle of the guide rod (12) and is used to limit the lower limit position of the lifting tube (701).

8. The wafer carrier device with warp correction function according to claim 1, characterized in that, The corrective component (8) also includes: Synchronization ring (808) is fixedly connected to the lower end of connecting ring (803) and has an annular groove in the middle; The push rod (810) is fixedly connected to the bottom of the fixed frame (3), and the output end is fixedly connected to the push slider (811). The push slider (811) is placed in the annular groove of the synchronous ring (808) and can slide along the annular groove to drive the connecting ring (803) to slide up and down. A drive ring (812) is fixedly connected to the outside of a connecting ring (803); The drive unit (813) is fixedly connected to the output end of the push rod (810). The output end of the drive unit (813) cooperates with the drive ring (812) to drive the connecting ring (803) to rotate.

9. The wafer carrier device with warp correction function according to claim 1, characterized in that, Also includes: The translation component (14) is fixedly installed on one side of the mounting bracket (3) and can slide horizontally relative to the wafer. The detection component (2) is installed on the upper end of the translation component (14) and is used to adjust the position of the detection component (2).

10. A method for correcting warped wafers, applicable to the wafer carrier device with warp correction function as described in claims 1-9, characterized in that, Includes the following steps: Step 1: Place the wafer. The mechanical gripper places the wafer on the upper end of the support assembly (7), and the support assembly (7) fixes the wafer in place. Step 2, warpage detection: The translation component (14) adjusts the detection component (2) to the edge of the wafer, and the wafer is rotated by the support component (7) to complete the warpage detection; Step 3: First judgment. The data detected by the detection component (2) is compared with the set data. If the detection is qualified, the wafer is removed by the mechanical gripper and Step 1 is executed again. If the detection is unqualified, the detection component (2) is adjusted to a position away from the wafer by the translation component (14). Step 4: First correction, the support assembly (7) descends, the first negative pressure chamber (5) generates negative pressure, causing the wafer to adhere to the top of the correction disk (1). After the correction is completed, the negative pressure in the first negative pressure chamber (5) is eliminated, the support assembly (7) rises and steps 2 are executed. Step 5: Secondary inspection. Adjust the position of the inspection component (2) and rotate the wafer to perform secondary inspection on the wafer. Step 6: Secondary judgment. The data detected by the detection component (2) is compared with the set data. If the detection is qualified, the wafer is removed by the mechanical gripper and Step 1 is executed again. If the detection is unqualified, the detection component (2) is adjusted to a position away from the wafer by the translation component (14). Step 7: Secondary correction. The support assembly (7) descends, and the first negative pressure chamber (5) generates negative pressure, causing the wafer to adhere to the top of the correction disk (1). At the same time, the second negative pressure chamber (802) is adjusted to contact the bottom of the correction disk (1), so that a second negative pressure is generated in the second negative pressure chamber (802). The suction part (801) is rotated relative to the wafer to complete the secondary correction. Then, the negative pressure in the first negative pressure chamber (5) and the second negative pressure chamber (802) is eliminated, the support assembly (7) rises, and the wafer is transferred to the defective area by the mechanical gripper.

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