Multi-hole mini-LED membrane die cutting tool
By designing a porous mini-LED diaphragm die cutting tool, the cooling of the grinding wheel in the semiconductor chip scriber and the cleaning of the wafer surface is achieved by using knobs, inner sleeve rods and other components, which solves the problem of debris adhesion and improves the cutting quality and Production efficiency.
Patent Information
- Application Number
- CN202420415737.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-05
- Publication Date
- 2024-12-06
- Estimated Expiration
- 2034-03-05
AI Technical Summary
During the cutting process of existing semiconductor chip scribers, silicon crystal debris and metal debris adhere to the wafer surface and blade, resulting in a decrease in cutting quality and the cooling device cannot effectively clean the wafer surface.
A porous mini-LED diaphragm die cutting tool is designed, including moving sliders, grinding wheels, water supply blocks, side nozzles and main nozzles, through a combination of knobs, inner sleeve rods, adjustment nozzles, adjustment windows, slide grooves and sliders , realize the cooling of the grinding wheel and the cleaning of the wafer surface to prevent debris from adhering.
Effectively prevent the grinding wheel from overheating, extending service life, improving cutting quality and efficiency, ensuring clean wafer surface, avoiding pollution, and improving production efficiency and product quality.
Smart Images
Figure CN222114636U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field related to chip production and manufacturing, and specifically relates to a porous mini-LED membrane die-cutting tool. Background Art
[0002] With the development of society, the application of semiconductor chips is becoming more and more extensive. Semiconductor chips are semiconductor devices that can realize certain functions by etching and wiring on semiconductor sheets. Semiconductor chips are arranged inside the grinding wheel dicing machine, and the use of semiconductor chips makes the application of grinding wheel dicing machine more convenient and quick, and increases the demand for grinding wheel dicing machine. The grinding wheel cutting process of semiconductor mini-LED is a commonly used technology, which is used to cut small-sized mini-LED chips into the required size and shape. The grinding wheel cutting process is crucial to the manufacture of mini-LED, which can ensure the precise size and shape of the chip, thereby improving the display effect and product quality.
[0003] However, during the operation of the existing dicing machine, some silicon crystal fragments and metal fragments are generated and attached to the wafer surface and the blade. The water spray hood device for cooling the blade arranged near the grinding wheel cannot clean the wafer surface during the wafer cutting process, thus affecting the cutting quality. Utility Model Content
[0004] The purpose of the utility model is to provide a porous mini-LED film die-cutting tool to solve the problem raised in the above background technology that during the operation of the existing dicing machine, some silicon crystal debris and metal debris will be generated and attached to the wafer surface and the blade, while the water spray cover device for cooling the blade arranged near the grinding wheel cannot clean the wafer surface during the wafer cutting process, thereby affecting the cutting quality.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a porous mini-LED film die-cutting tool, comprising a movable slider and a grinding wheel arranged at the bottom of the movable slider;
[0006] Mounting feet are respectively provided on both sides above the movable slider, a tooling is provided on the movable slider, a water supply block is provided on the left side of the tooling, two water pipe plugs are provided on the side of the water supply block, a splash plate is provided on the left side of the water supply block, two side nozzles are provided at the bottom of the water supply block, a sensor bracket is provided on the tooling, and an adjusting bolt and a fastening bolt are respectively provided on the sensor bracket, and a main nozzle is provided below the tooling;
[0007] The side nozzle is provided with a plurality of spray holes, an adjustment window is provided on one side of the side nozzle, an inner sleeve rod is provided inside the side nozzle, a knob is provided in front of the inner sleeve rod, an adjustment nozzle is provided on the inner sleeve rod, a slide groove is provided on the outer side of the inner sleeve rod, and a slider is provided on the inner wall of the side nozzle.
[0008] Preferably, the side nozzle is plugged into the water supply block, the side nozzle is sleeved with the inner sleeve rod, the slider is integrally connected with the side nozzle, and the slider is clamped with the slide groove.
[0009] Preferably, the inner sleeve rod is welded to the knob, and the inner sleeve rod is a hollow rod-shaped structure, and water can flow out through the regulating nozzle.
[0010] Preferably, the angle of the cross-sectional arc of the regulating window is less than degrees, and the regulating window can make the water flow spray out from the regulating nozzle.
[0011] Preferably, a stopper is provided inside the side nozzle, the stopper is an annular structure, the stopper is welded to the inner wall of the side nozzle, and the cooperation between the stopper and the slide block can limit the inner sleeve rod.
[0012] Preferably, a sealing gasket is provided between the stopper and the inner sleeve rod, and the sealing gasket can seal the internal gap of the side nozzle to prevent the internal water flow from seeping out.
[0013] Preferably, the main nozzle is installed at the bottom of the tooling via a rotating shaft, and the main nozzle can be rotated via the rotating shaft to adjust the water spraying angle of the main nozzle.
[0014] Compared with the prior art, the utility model provides a porous mini-LED film die-cutting tool, which has the following beneficial effects:
[0015] By setting the knob, inner sleeve rod, adjustment nozzle, adjustment window, slide groove and slider, and by adjusting the position of the nozzle, the direction and intensity of the water spray can be controlled to achieve cooling of the grinding wheel and cleaning of the wafer, which helps to prevent the grinding wheel from overheating and extend the service life of the grinding wheel. It can also prevent silicon crystal debris and metal debris from adhering to the wafer surface and blade, thereby improving the quality and efficiency of cutting. The water flow is sprayed through the side nozzle, which can timely cool the side of the grinding wheel, reduce friction and heat during the cutting process, and protect the grinding wheel from being easily damaged. At the same time, the sprayed water flow directly cleans the wafer surface, ensuring that the wafer surface remains clean during the cutting process, avoiding pollution and debris from affecting product quality. The clamping design of the slider and the slide groove can make the rotation of the knob and the inner sleeve rod inside the side nozzle smoother. Through the setting of this device, the grinding wheel can perform cutting work more efficiently, protect equipment and products, improve production efficiency and product quality, and also improve the operator's work experience and convenience of operation.
[0016] The inner sleeve rod can be effectively fixed inside the side nozzle by the cooperation of the block and the slider, ensuring that the inner sleeve rod remains stable during the rotation process. This design can reduce the shaking and friction of parts during operation, improve the stability and reliability of the equipment, thereby ensuring the accuracy and efficiency of the cutting process. The sealing gasket can seal the internal water flow to prevent water leakage, which can ensure that the water flow is effectively guided to the required position, maintain the stability and water pressure of the water flow, thereby ensuring the effect of adjusting the nozzle to spray water and the cleaning effect on the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model.
[0018] Figure 2 This is a schematic diagram of the side nozzle structure of the utility model.
[0019] Figure 3 It is a schematic diagram of the internal structure of the side nozzle of the utility model.
[0020] Figure 4 For the utility model Figure 3 Schematic diagram of the local structure.
[0021] In the figure: 1. Grinding wheel; 2. Main nozzle; 3. Side nozzle; 4. Splash plate; 5. Water pipe plug; 6. Water supply block; 7. Adjusting bolt; 8. Moving slider; 9. Fastening bolt; 10. Sensor bracket; 11. Mounting foot; 12. Spray hole; 13. Adjusting nozzle; 14. Adjusting window; 15. Knob; 16. Inner sleeve rod; 17. Stop block; 18. Sealing gasket; 19. Slide; 20. Slider; 21. Tooling. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0023] The utility model provides Figure 1-4 A porous mini-LED film die-cutting tool shown includes a movable slider 8 and a grinding wheel 1 arranged at the bottom of the movable slider 8;
[0024] Mounting feet 11 are respectively provided on both sides above the movable slider 8, a tooling 21 is provided on the movable slider 8, a water supply block 6 is provided on the left side of the tooling 21, two water pipe plugs 5 are provided on the side of the water supply block 6, a splash plate 4 is provided on the left side of the water supply block 6, two side nozzles 3 are provided at the bottom of the water supply block 6, a sensor bracket 10 is provided on the tooling 21, and an adjusting bolt 7 and a fastening bolt 9 are respectively provided on the sensor bracket 10, and a main nozzle 2 is provided below the tooling 21;
[0025] A plurality of spray holes 12 are arranged on the side nozzle 3, an adjustment window 14 is arranged on one side of the side nozzle 3, an inner sleeve rod 16 is arranged inside the side nozzle 3, a knob 15 is arranged in front of the inner sleeve rod 16, an adjustment nozzle 13 is arranged on the inner sleeve rod 16, a slide groove 19 is arranged on the outer side of the inner sleeve rod 16, and a slider 20 is arranged on the inner wall of the side nozzle 3.
[0026] In this embodiment, the Mini-LED chip dicing machine can efficiently cut large LED chips into small pieces through precise positioning and cutting operations, making it suitable for the LED chip production and processing industry. The method of using the Mini-LED chip dicing machine is as follows: first, place the large LED chip on the workbench of the dicing machine, and then accurately locate the position of the chip through the positioning system, and the operator sets the cutting parameters such as cutting speed, tool pressure, etc. according to the size and shape to be cut, and then starts the dicing machine. At this time, the grinding wheel 1 starts to cut along a preset path driven by the moving slider 8, cutting the large LED chip into small pieces, and in the process of the grinding wheel 1 cutting the chip, the main nozzle 2 and the side nozzle 3 will spray cooling water to the grinding wheel 1 to prevent the grinding wheel 1 from generating high temperature during the cutting process, thereby deforming the chip and the grinding wheel 1. At the same time, the splash plate 4 can effectively block the water flow to prevent water from splashing inside the dicing machine. Finally, after the cutting is completed, the chip quality is inspected and the debris and debris generated by the cutting are removed.
[0027] like Figure 1 and Figure 2 As shown, the side nozzle 3 is plugged into the water supply block 6, the side nozzle 3 is sleeved with the inner sleeve rod 16, the slider 20 is integrally connected to the side nozzle 3, the slider 20 is clamped with the slide groove 19, the inner sleeve rod 16 is welded with the knob 15, the inner sleeve rod 16 is a hollow rod-shaped structure, the water flow can flow outward through the adjustment nozzle 13, the angle of the cross-sectional arc of the adjustment window 14 is less than 180°, and the adjustment window 14 can make the water flow spray out from the adjustment nozzle 13.
[0028] Preferably, through the arrangement of the knob 15, the inner sleeve rod 16, the adjustment nozzle 13, the adjustment window 14, the slide groove 19 and the slider 20, the operator can rotate the adjustment nozzle 13 to the position of the adjustment window 14 by rotating the knob 15 before the slicer processing, and then continue to rotate the adjustment nozzle 13 to align the adjustment nozzle 13 with the platform for cutting of the grinding wheel 1, and then insert the water pipe into the water pipe plug 5 on the water supply block 8, and then start the dicing machine. At this time, water flows out through the spray hole 12 on the side nozzle 3 to cool the side of the grinding wheel 1 to prevent the grinding wheel 1 from overheating. When the water flows out from the adjustment nozzle 13, the sprayed water will directly clean the wafer on the platform to prevent some silicon crystal debris and metal debris generated during the cutting of the grinding wheel 1 from adhering to the wafer surface and the blade, thereby ensuring the cutting quality. The clamping connection between the slider 20 and the slide groove 19 can make the rotation of the knob 15 and the inner sleeve rod 16 inside the side nozzle 3 smoother.
[0029] like Figure 3 and Figure 4 As shown, a block 17 is provided inside the side nozzle 3. The block 17 is a ring-shaped structure and is welded to the inner wall of the side nozzle 3. The cooperation of the block 17 and the slider 20 can limit the inner sleeve rod 16. A sealing gasket 18 is provided between the block 17 and the inner sleeve rod 16. The sealing gasket 18 can seal the internal gap of the side nozzle 3 to prevent the internal water from seeping out. The main nozzle 2 is installed at the bottom of the tooling 21 through the rotating shaft. The main nozzle 2 can be rotated through the rotating shaft to adjust the water spraying angle of the main nozzle 2.
[0030] Preferably, by setting the block 17 and the sealing gasket 18 and by the cooperation between the block 17 and the slider 20, the inner sleeve rod 16 can be fixed inside the side nozzle 3, so that the inner sleeve rod 16 can be ensured to remain stable during the rotation process. At the same time, the sealing gasket 18 can be set to seal the internal water flow to prevent the internal water flow from leaking, while also ensuring the water pressure of the water flow sprayed from the regulating nozzle 13 and the cleaning effect on the wafer.
[0031] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A multi-porous mini-LED film die-cutting tool, comprising a movable slider (8) and a grinding wheel (1) arranged at the bottom of the movable slider (8); Mounting feet (11) are respectively provided on both sides above the movable slider (8); a tooling (21) is provided on the movable slider (8); a water supply block (6) is provided on the left side of the tooling (21); two water pipe plugs (5) are provided on the side of the water supply block (6); a splash plate (4) is provided on the left side of the water supply block (6); two side nozzles (3) are provided at the bottom of the water supply block (6); a sensor bracket (10) is provided on the tooling (21); an adjusting bolt (7) and a fastening bolt (9) are respectively provided on the sensor bracket (10); and a main nozzle (2) is provided below the tooling (21); Features: The side nozzle (3) is provided with a plurality of spray holes (12), an adjustment window (14) is provided on one side of the side nozzle (3), an inner sleeve rod (16) is provided inside the side nozzle (3), a knob (15) is provided in front of the inner sleeve rod (16), an adjustment nozzle (13) is provided on the inner sleeve rod (16), a slide groove (19) is provided on the outer side of the inner sleeve rod (16), and a slider (20) is provided on the inner wall of the side nozzle (3).
2. The porous mini-LED film die-cutting tool according to claim 1, characterized in that: The side nozzle (3) is plugged into the water supply block (6), the side nozzle (3) is sleeved with the inner sleeve rod (16), the slider (20) is integrally connected with the side nozzle (3), and the slider (20) is snap-fitted with the slide groove (19).
3. The porous mini-LED film die-cutting tool according to claim 2, characterized in that: The inner sleeve rod (16) is welded to the knob (15); the inner sleeve rod (16) is a hollow rod-shaped structure, and water can flow outward through the regulating nozzle (13).
4. The porous mini-LED film die-cutting tool according to claim 3, characterized in that: The angle of the cross-sectional circular arc of the regulating window (14) is less than 180°, and the regulating window (14) can allow water to be sprayed out from the regulating nozzle (13).
5. The porous mini-LED film die-cutting tool according to claim 1, characterized in that: A stopper (17) is provided inside the side nozzle (3); the stopper (17) is an annular structure; the stopper (17) is welded to the inner wall of the side nozzle (3); the cooperation between the stopper (17) and the slider (20) can limit the position of the inner sleeve rod (16).
6. The porous mini-LED film die-cutting tool according to claim 5, characterized in that: A sealing gasket (18) is provided between the stopper (17) and the inner sleeve rod (16), and the sealing gasket (18) can seal the internal gap of the side nozzle (3) to prevent internal water from leaking out.
7. The porous mini-LED film die-cutting tool according to claim 1, characterized in that: The main nozzle (2) is mounted on the bottom of the tooling (21) via a rotating shaft, and the main nozzle (2) can be rotated via the rotating shaft, thereby adjusting the water spraying angle of the main nozzle (2).