Butterfly laser and semiconductor device

Abstract

The utility model relates to the technical field of semiconductor packaging, and discloses a butterfly-shaped laser and semiconductor equipment, the butterfly-shaped laser comprises a laser tube shell, a chip and a fixed enclosure, the laser tube shell is provided with an accommodating cavity with an opening, one end of the laser tube shell is provided with an optical fiber, a semiconductor cooler is arranged in the accommodating cavity, and the chip is arranged in the semiconductor cooler. The chip is arranged on the semiconductor cooler, the fixed enclosure is arranged between the chip and the side wall of the laser tube shell and surrounds and abuts against the chip, and a light incident port is formed in the side, facing the optical fiber, of the fixed enclosure. According to the technical scheme of the utility model, when the chip is installed on the semiconductor cooler, the peripheral wall of the chip is abutted against the fixed enclosure so as to position the chip, and the chip can be accurately installed at an ideal position through the positioning of the fixed enclosure. Therefore, the light emitting direction of the chip is accurately aligned with the direction of the optical fiber tail tube, and subsequent optical fiber coupling is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a butterfly laser and a semiconductor device. Background Art

[0002] The butterfly laser is a common semiconductor device with a butterfly-shaped structure. The butterfly laser has the characteristics of compact structure and high integration, which can achieve high-speed optical signal transmission. It activates the semiconductor material through current injection to generate laser radiation. The output light wave of the butterfly laser is focused into the optical fiber and transmitted to the receiving end for signal transmission.

[0003] During the packaging process of butterfly lasers, the chip's light emission direction needs to be aligned with the fiber tail tube as much as possible to facilitate subsequent fiber coupling. Currently, manual or visual recognition is commonly used to align the direction, but manual alignment has low yield and insufficient accuracy, while visual recognition requires the design of an automated device for the packaging structure, which is costly. Utility Model Content

[0004] The main purpose of the utility model is to provide a butterfly laser, aiming to provide a butterfly laser capable of ensuring faster and more accurate installation of chips.

[0005] To achieve the above-mentioned purpose, the butterfly laser proposed in the utility model comprises:

[0006] A laser tube shell, wherein the laser tube shell is provided with a receiving cavity having an opening, an optical fiber is provided at one end of the laser tube shell, and a semiconductor refrigerator is provided in the receiving cavity;

[0007] A chip, wherein the chip is arranged in the semiconductor refrigerator; and

[0008] A fixed enclosure is arranged between the chip and the side wall of the laser tube shell and surrounds and abuts against the chip. A light incident port is formed on a side of the fixed enclosure facing the optical fiber.

[0009] In one embodiment of the present utility model, the fixed enclosure includes three enclosure plates, and the three enclosure plates and the semiconductor refrigerator are together enclosed to form an installation space, and the chip is arranged in the installation space.

[0010] In an embodiment of the present invention, one side of each of the baffle plates abuts against the outer peripheral wall of the chip.

[0011] In an embodiment of the present utility model, the butterfly laser further comprises a mounting base, the mounting base is arranged on the semiconductor cooler, and the chip is arranged on the mounting base.

[0012] In an embodiment of the present invention, the mounting base is a copper base plate.

[0013] In one embodiment of the present invention, the chip is connected to the mounting base by welding; and / or

[0014] The mounting base is connected to the semiconductor refrigerator by welding.

[0015] In an embodiment of the present invention, the laser tube housing further comprises powered fins, and the powered fins are arranged on both sides of the laser tube housing and located on both sides of the light incident direction.

[0016] In an embodiment of the present invention, mounting bosses are respectively provided on both sides of the laser tube shell, and the powered fins are provided on the mounting bosses.

[0017] In an embodiment of the present invention, the baffle plate is made of insulating material.

[0018] The utility model also provides a semiconductor device, the semiconductor device comprising a butterfly laser, the butterfly laser comprising:

[0019] A laser tube shell, wherein the laser tube shell is provided with a receiving cavity having an opening, an optical fiber is provided at one end of the laser tube shell, and a semiconductor refrigerator is provided in the receiving cavity;

[0020] A chip, wherein the chip is arranged in the semiconductor refrigerator; and

[0021] A fixed enclosure is arranged between the chip and the side wall of the laser tube shell and surrounds and abuts against the chip. A light incident port is formed on a side of the fixed enclosure facing the optical fiber.

[0022] In the technical scheme of the utility model, a butterfly laser and a semiconductor device are proposed, wherein the butterfly laser includes a laser tube shell, a chip and a fixed enclosure, the laser tube shell is formed with a containing cavity, a semiconductor refrigerator is arranged in the containing cavity, the chip is fixedly mounted on the semiconductor refrigerator, the fixed enclosure is arranged between the chip and the side wall of the laser tube shell and surrounds the chip, when the chip is mounted on the semiconductor refrigerator, the outer peripheral wall of the chip will abut against the fixed enclosure to position the chip, through the positioning of the fixed enclosure, it can be ensured that the chip is accurately installed in the ideal position, thereby ensuring that the light emitting direction of the chip is accurately aligned with the direction of the optical fiber tail tube, which is convenient for subsequent optical fiber coupling. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0024] Figure 1 A schematic diagram of the three-dimensional structure of an embodiment of the butterfly laser provided by the utility model;

[0025] Figure 2 A cross-sectional view of a butterfly laser at one angle;

[0026] Figure 3 This is a cross-sectional view of the butterfly laser from another angle.

[0027] Description of Figure Numbers:

[0028] Label name Label name 1000 Butterfly laser 2 Semiconductor Refrigerator 1 Laser tube shell 3 chip 11 Overlapping parts 4 Fixed enclosure 12 Powered fins 41 Fence board 13 Mounting boss 4a Installation space 1a Accommodation cavity 5 Mounting Base 1b Fiber Optic Interface 6 optical fiber

[0029] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0032] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0033] The butterfly laser is a common semiconductor device with a butterfly-shaped structure. The butterfly laser has the characteristics of compact structure and high integration, which can achieve high-speed optical signal transmission. It activates the semiconductor material through current injection to generate laser radiation. The output light wave of the butterfly laser is focused into the optical fiber and transmitted to the receiving end for signal transmission.

[0034] During the packaging process of butterfly lasers, the chip's light emission direction needs to be aligned with the fiber tail tube as much as possible to facilitate subsequent fiber coupling. Currently, manual or visual recognition is commonly used to align the direction, but manual alignment has low yield and insufficient accuracy, while visual recognition requires the design of an automated device for the packaging structure, which is costly.

[0035] In order to solve the above problems, the utility model proposes a butterfly laser, which aims to provide a butterfly laser that can ensure faster and more accurate installation of chips. Figures 1 to 3 The figure is a schematic structural diagram of an embodiment of the butterfly laser provided by the utility model.

[0036] Please refer to Figures 1 to 3 The utility model proposes a butterfly laser 1000, including a laser tube shell 1, a chip 3 and a fixed enclosure 4. The laser tube shell 1 is provided with a accommodating cavity 1a with an opening, an optical fiber is provided at one end of the laser tube shell 1, a semiconductor refrigerator 2 is provided in the accommodating cavity 1a, the chip 3 is provided in the semiconductor refrigerator 2, the fixed enclosure 4 is provided between the chip 3 and the side wall of the laser tube shell 1 and surrounds and abuts the chip 3, and a light incident port is formed on the side of the fixed enclosure 4 facing the optical fiber.

[0037] It is understandable that the chip 3 is a COC chip 3, and the COC chip 3 generally refers to Chip-On-Chip, that is, a chip 3 on a chip 3. This technology is to embed a chip 3 directly into another chip 3 to achieve higher integration and performance. The COC chip 3 can effectively reduce the overall size, reduce power consumption, and improve performance and reliability. In the butterfly laser 1000, the COC chip 3 may be used to realize the integration of laser diodes, modulators or other functions. By directly embedding multiple functional chips 3 into the same package, higher integration, smaller size and higher performance can be achieved. This design can improve the performance and reliability of the butterfly laser 1000, and is suitable for application fields such as optical communications.

[0038] In the technical solution of the utility model, a butterfly laser 1000 and a semiconductor device are proposed, wherein the butterfly laser 1000 includes a laser tube shell 1, a chip 3 and a fixed enclosure 4, the laser tube shell 1 is formed with a containing cavity 1a, a semiconductor refrigerator 2 is arranged in the containing cavity 1a, the chip 3 is fixedly mounted on the semiconductor refrigerator 2, the fixed enclosure 4 is arranged between the chip 3 and the side wall of the laser tube shell 1 and surrounds the chip 3, when the chip 3 is mounted on the semiconductor refrigerator 2, the outer peripheral wall of the chip 3 will abut against the fixed enclosure 4 to position the chip 3, and the positioning of the fixed enclosure 4 can ensure that the chip 3 is accurately installed in the ideal position, thereby ensuring that the light emitting direction of the chip 3 is accurately aligned with the direction of the optical fiber tail tube, which is convenient for subsequent optical fiber coupling.

[0039] In order to position the chip 3, the fixed enclosure 4 includes three enclosure plates 41. For details, please refer to Figure 1 The three baffle plates 41 are enclosed together to form a semi-enclosed space with an open end, that is, the installation space 4a for installing the chip 3. When installing the chip 3, the semiconductor cooler 2 is first fixed in the laser tube shell 1, and then three baffle plates 41 are inserted in the gap between the semiconductor cooler 2 and the inner side wall of the laser tube shell 1, and one side of each baffle plate 41 is abutted against the outer peripheral surface of the semiconductor cooler 2. After the installation is completed, solder is applied to the upper surface of the semiconductor cooler 2, and then the chip 3 is placed. The overall shape of the chip 3 is a quadrangular prism, and the lower bottom surface of the chip 3 is in contact with the solder. The other three side walls are respectively abutted against the three baffle plates 41, so that the chip 3 is completely positioned in the installation space 4a. At this time, the solder is heated and melted to fix the chip 3 on the semiconductor cooler 2. In this way, the chip 3 is in a centered position, which also ensures that the light emitting direction of the chip 3 is aligned with the direction of the optical fiber, which is convenient for subsequent optical fiber coupling.

[0040] It should be noted that the three baffle plates 41 can adopt a transition fit or a clearance fit in the gap between the semiconductor refrigerator 2 and the inner wall of the laser tube shell 1. The utility model does not limit this. In one embodiment of the utility model, the baffle plates 41 are installed in the gap between the semiconductor refrigerator 2 and the laser tube shell 1 by a clearance fit. In order to prevent the baffle plates 41 from shaking during the operation of the butterfly laser 1000 and affecting the working effect of the butterfly laser 1000, the baffle plates 41 are filled with a filler (not shown in the figure) on the side of the inner wall of the laser tube shell 1. After the baffle plates 41 are installed in place, the filler is filled into the gap between the laser tube shell 1 and the baffle plates 41 to fill the gap therebetween completely, thereby eliminating the shaking of the baffle plates 41.

[0041] Furthermore, due to the presence of the baffle plate 41, the excess solder overflowing during the welding process of the baffle plate 41 can also be blocked by the baffle plate 41, thereby preventing the solder from overflowing and adhering to the inner wall of the laser tube shell 1, thereby affecting the heat dissipation effect of the semiconductor heat sink. In order to prevent the baffle plate 41 from interfering with the internal electric field of the laser, the baffle plate 41 is made of an insulating material, which can be a quartz material, a ceramic material, or a plastic material. The utility model does not limit this. In one embodiment of the utility model, the baffle plate 41 is made of quartz material. Quartz has high heat resistance and can withstand high temperatures. Quartz is an insulating material that can effectively isolate current and prevent circuit short circuits or leakage.

[0042] To ensure good heat dissipation effect of chip 3, chip 3 is welded on the upper surface of semiconductor refrigerator 2 through mounting base 5. The mounting base 5 is made of metal with good thermal conductivity. In one embodiment of the utility model, the mounting base 5 is made of copper, which has good thermal conductivity, so that the heat generated by chip 3 is directed to semiconductor radiator, thereby ensuring that it is always in good working condition.

[0043] Furthermore, the laser tube housing 1 is also provided with a plurality of powered fins 12. For details, please refer to Figure 1 , an electric field or current is applied to the laser tube shell 1 through the powered fins 12, so that the electrons in the energy level system jump from the low energy level to the high energy level, forming electronic excitation. When these excited electrons return to the low energy level, they release energy, which is converted into laser photons. In order to install the powered fins 12, mounting bosses 13 are provided on both sides of the outer wall of the laser tube shell 1. For details, please refer to Figure 3 The convex mounting boss 13 can be used to more conveniently and quickly weld the powered fin 12. In order to allow the optical fiber to pass through the laser tube shell 1, a fiber interface 1b is provided on one side of the laser tube shell 1. For details, please refer to Figure 1 The optical fiber passes through the optical fiber interface 1a, and a lap joint 11 is provided on the side of the optical fiber interface 1b facing away from the laser tube shell 1. The lap joint 11 can prevent the optical fiber from bending due to force, thereby protecting the optical fiber.

[0044] The utility model also proposes a semiconductor device, which includes a butterfly laser 1000. The specific structure of the butterfly laser 1000 refers to the above embodiment. Since the semiconductor device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0045] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A butterfly laser, It is characterized in that include: A laser tube shell, wherein the laser tube shell is provided with a receiving cavity having an opening, an optical fiber is provided at one end of the laser tube shell, and a semiconductor refrigerator is provided in the receiving cavity; A chip, wherein the chip is arranged in the semiconductor refrigerator; as well as A fixed enclosure is arranged between the chip and the side wall of the laser tube shell and surrounds and abuts against the chip. A light incident port is formed on a side of the fixed enclosure facing the optical fiber.

2. The butterfly laser as claimed in claim 1, It is characterized in that The fixed enclosure includes three enclosure plates, and the three enclosure plates and the semiconductor refrigerator are together enclosed to form an installation space, and the chip is arranged in the installation space.

3. The butterfly laser as claimed in claim 2, It is characterized in that One side of each of the baffle plates abuts against the outer peripheral wall of the chip.

4. The butterfly laser according to any one of claims 1 to 3, It is characterized in that The butterfly laser further comprises a mounting base, wherein the mounting base is arranged on the semiconductor cooler, and the chip is arranged on the mounting base.

5. The butterfly laser as claimed in claim 4, It is characterized in that The mounting base is a copper base plate.

6. The butterfly laser as claimed in claim 4, It is characterized in that The chip is connected to the mounting base by welding; and / or The mounting base is connected to the semiconductor refrigerator by welding.

7. The butterfly laser according to any one of claims 1 to 3, It is characterized in that The laser tube shell further comprises powered fins, which are arranged on two sides of the laser tube shell and located on two sides of the light incident direction.

8. The butterfly laser as claimed in claim 7, It is characterized in that Mounting bosses are respectively arranged on both sides of the laser tube shell, and the powered fins are arranged on the mounting bosses.

9. The butterfly laser as claimed in claim 2, It is characterized in that The baffle plate is made of insulating material.

10. A semiconductor device, It is characterized in that The butterfly laser comprises the butterfly laser according to any one of claims 1 to 9.

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