Vacuum cleaning structure for plasma machine

The vacuum cleaning structure for plasma machines uses plasma generated from ionized gases to clean sensitive materials without damage, addressing the limitations of liquid-based cleaning methods and ensuring safe vacuum operation.

CN222132866UActive Publication Date: 2024-12-10DAGE TEST SYST (SUZHOU) CO LTD
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Patent Information

Application Number
CN202323512947.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-22
Publication Date
2024-12-10
Estimated Expiration
2033-12-22

AI Technical Summary

Technical Problem

Existing cleaning devices for plasma machines often use liquid media, which can damage sensitive materials like semiconductors and optical components, and operate under normal pressure, posing further risks.

Method used

A vacuum cleaning structure for plasma machines using a high-frequency power supply to ionize active gases into plasma, which bombards materials to remove impurities while maintaining a high vacuum environment, and a dual-probe pressure sensor to balance internal and external pressures.

Benefits of technology

The solution provides non-destructive cleaning of sensitive materials by plasma, reducing damage and ensuring safe operation by maintaining a controlled vacuum and balanced pressure.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a vacuum cleaning structure for a plasma machine, which relates to the technical field of equipment cleaning and comprises a cleaning box, a cavity is arranged in the cleaning box, electrode plates are fixedly connected to two inner side walls of the cavity of the cleaning box, a vacuum pump is fixedly connected to the center of the bottom end of the cleaning box, and a vacuum pump is fixedly connected to the bottom end of the cleaning box. And an air inlet is formed in the outer side wall of the cleaning box. Impurity gas in the cleaning box is cleaned up through the vacuum pump, a high vacuum environment is formed, sufficient active gas such as argon and nitrogen is introduced into the cleaning box through the gas inlet, a high-frequency power source is generated through the electrode plates, the gas is ionized and excited under the action of the high-frequency power source, and plasma is generated to bombard cleaned materials. Dirt or impurities on related materials are taken away, damage caused by mechanical cleaning in a traditional cleaning mode is avoided, and the effect of lossless cleaning of the materials is achieved.
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Description

Technical Field

[0001] The utility model relates to the technical field of equipment cleaning, in particular to a vacuum cleaning structure for a plasma machine. Background Art

[0002] The cleaning machine is used to flush and filter the pollutants generated or invaded during the manufacturing, assembly, use and maintenance of the hydraulic system; it can also be used for regular maintenance and filtration of working oil to improve cleanliness, avoid or reduce failures caused by contamination, thereby ensuring the high performance, high reliability and long life of hydraulic system equipment.

[0003] In the prior art, such as the plasma cleaning machine with patent publication number CN218424582U, it includes a substrate and an upper cavity, the substrate and the upper cavity together enclose a vacuum cavity, an isolation plate is arranged in the vacuum cavity, the isolation plate is connected to the inner wall surface of the upper cavity, the isolation plate separates the vacuum cavity into a first cavity and a second cavity, an air flow channel is arranged in the first cavity, the air flow channel is used to pass process gas, a cathode plate and a material placement track are arranged in sequence in the upper and lower directions in the second cavity, a cathode bracket for installing and fixing the cathode plate is arranged at the edge of the cathode plate, the cathode bracket is connected to the inner wall of the upper cavity, a plurality of air inlet holes are opened on one side of the cathode bracket, the air inlet holes connect the first cavity and the second cavity, and the air inlet holes face the material placement track.

[0004] However, in the prior art, existing cleaning devices generally clean materials through liquid media. When cleaning some semiconductor materials, the liquid media can easily damage the semiconductor materials. In addition, the cleaning devices generally operate under normal pressure, which can easily cause damage to sensitive materials such as optical components and semiconductors. Utility Model Content

[0005] The utility model mainly provides a plasma machine vacuum cleaning structure which is used for cleaning sensitive materials and preventing material damage.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a vacuum cleaning structure for a plasma machine, comprising a cleaning box, a chamber is provided inside the cleaning box, both inner side walls of the cleaning box chamber are fixedly connected with electrode plates, a vacuum pump is fixedly connected at the center position of the bottom end of the cleaning box, and an air inlet is provided on the outer side wall of the cleaning box.

[0007] Preferably, a sealing door is rotatably connected to one side of the cleaning box, and an observation window is provided on the sealing door. By providing the sealing door on one side of the cleaning box, the cleaning material enters the cleaning box through the sealing door, and closing the sealing door can create a vacuum environment for the cleaning box. The observation window on the sealing door is embedded with double-layer tempered glass, and the observation window can be used to monitor the cleaning progress of the cleaning box in a timely manner.

[0008] Preferably, a first material rack and a second material rack are respectively placed inside the chamber of the cleaning box, and both the first material rack and the second material rack are designed as frames for quickly installing sheet materials. Rectangular plush strips are designed on the frames of the first material rack and the second material rack, and the plush strips on both sides work together to stably position the sheet on the material rack, and are not prone to scratches on the surface of the sheet, thereby reducing damage to the sheet during the cleaning process. The first material rack and the second material rack can both hold six groups of materials for cleaning, and each vacuum cleaning structure operation can clean up to twelve groups of materials.

[0009] Preferably, the air inlet is located at a height of fifteen centimeters above the top of the first material stand. Since the interior of the cleaning box is a high vacuum environment after the action of the vacuum pump, the active gas is introduced from above the material to be cleaned. After the action of gravity, the active gas settles downward, so that the entire surface of the sheet can be bombarded by the plasma, thereby enhancing the cleaning effect on the material surface.

[0010] Preferably, a balancing valve port is provided on the outer wall of the cleaning box. The balancing valve port is a vent controlled by a valve. The balancing valve port is used after the material cleaning is completed. In actual use, after plasma cleaning, the valve of the balancing valve port is opened to allow outside air to enter the interior of the cleaning box, thereby balancing the air pressure inside and outside the cleaning box and reducing the resistance caused by the vacuum negative pressure when the sealed door of the cleaning box is opened.

[0011] Preferably, a dual-probe pressure sensor is fixedly connected to the interior of the cleaning box below the bottom end of the second material rack. The dual-probe pressure sensor is a sensor for detecting air pressure. The dual-probe pressure sensor and the balancing valve port are jointly controlled by the electronic control mainboard of the vacuum cleaning structure. The dual-probe pressure sensor is used to adjust the internal pressure of the cleaning box and change the opening of the vent of the balancing valve port.

[0012] Preferably, one detection head of the dual-probe pressure sensor is located inside the cleaning box, and the other detection head of the dual-probe pressure sensor extends to the outside of the cleaning box. The dual-probe pressure sensor has two detection detection heads, which respectively detect the gas pressure inside and outside the cleaning box.

[0013] Compared with the prior art, the advantages and positive effects of the utility model are:

[0014] 1. In the utility model, the impurity gas in the cleaning box is cleaned by a vacuum pump to form a high vacuum environment, and a sufficient amount of active gas such as argon and nitrogen is introduced into the cleaning box through the air inlet. The electrode plate is used to generate a high-frequency power supply. Under the action of the high-frequency power supply, the gas is ionized and excited to generate plasma to bombard the cleaned material, taking away the dirt or impurities on the related materials, avoiding the damage caused by mechanical cleaning in the traditional cleaning method, and achieving the effect of non-destructive cleaning of the material.

[0015] 2. In the utility model, a dual-probe pressure sensor is provided to detect the pressure difference between the inside and outside of the cleaning box. The dual-probe pressure sensor and the balance valve port are jointly controlled by the electronic control mainboard of the vacuum cleaning structure. The valve of the balance valve port is opened to allow outside air to enter the interior of the cleaning box, so that the air pressure inside and outside the cleaning box is balanced, and the resistance caused by the vacuum negative pressure when the sealed door of the cleaning box is opened is reduced. At the same time, the dual-probe pressure sensor can also detect the vacuum degree inside the cleaning box, and judge whether the vacuum pump needs to continue working, which can effectively construct a vacuum cleaning environment for the cleaning box. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The utility model provides a front view of the overall structure of a vacuum cleaning structure for a plasma machine;

[0017] Figure 2 A three-dimensional structural schematic diagram of a vacuum cleaning structure for a plasma machine is proposed for the utility model;

[0018] Figure 3 The utility model provides a structural schematic diagram of a first material stand used in a plasma machine vacuum cleaning structure;

[0019] Figure 4 The utility model provides a front view of an electrode plate used in a vacuum cleaning structure of a plasma machine.

[0020] Legend: 1. Cleaning box; 2. Electrode plate; 3. Vacuum pump; 4. Balance valve port; 5. Dual-probe pressure sensor; 6. Air inlet; 7. First material stand; 8. Second material stand. DETAILED DESCRIPTION

[0021] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0022] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0023] See also Figure 1 - Figure 4 The utility model provides a technical solution: a vacuum cleaning structure for a plasma machine, comprising a cleaning box 1, a chamber is provided inside the cleaning box 1, both inner side walls of the chamber of the cleaning box 1 are fixedly connected with electrode plates 2, a vacuum pump 3 is fixedly connected at the center of the bottom end of the cleaning box 1, and an air inlet 6 is provided on the outer side wall of the cleaning box 1. The vacuum cleaning structure utilizes active gases such as argon and nitrogen to form plasma after passing through a high-frequency power supply, and utilizes the plasma to bombard the cleaning material to complete the cleaning function of the material. In actual use, the material to be cleaned is first placed in the chamber of the cleaning box 1, and then The sealing door is completely closed on the cleaning box 1, so that a sealed space is formed inside the cleaning box 1, and then the vacuum pump 3 is activated, and the impurity gas in the cleaning box 1 is cleaned by the vacuum pump 3 to form a high vacuum environment. After the vacuum pump 3 is turned off, the air inlet 6 is connected to the external active gas storage tank, and a sufficient amount of active gas such as argon and nitrogen is introduced into the cleaning box 1. The electrode plate 2 is connected to an external power supply to generate a high-frequency power supply, and the gas is ionized and excited under the action of the high-frequency power supply, thereby generating plasma to bombard the materials that need to be cleaned placed inside, and take away the dirt or impurities on the related materials, thereby completing the effect of non-destructive cleaning of the materials.

[0024] like Figure 2 As shown, a sealing door is rotatably connected to one side of the cleaning box 1, and an observation window is provided on the sealing door of the cleaning box 1. By providing a sealing door on one side of the cleaning box 1, the cleaning material enters into the cleaning box 1 through the sealing door, and closing the sealing door can create a vacuum environment of the cleaning box 1. The observation window on the sealing door is embedded with double-layer tempered glass, and the observation window can be used to monitor the cleaning progress of the cleaning box 1 in time.

[0025] like Figure 2 As shown, a first material rack 7 and a second material rack 8 are respectively placed inside the chamber of the cleaning box 1. Both the first material rack 7 and the second material rack 8 are frame designs for quick installation of sheet materials. Rectangular plush strips are designed on the frames of the first material rack 7 and the second material rack 8. The plush strips on both sides work together to stably position the sheet on the material rack, and are not prone to scratches on the surface of the sheet, thereby reducing damage to the sheet during cleaning. The first material rack 7 and the second material rack 8 can each hold six groups of materials for cleaning, and each vacuum cleaning structure operation can clean up to twelve groups of materials.

[0026] like Figure 2As shown, the air inlet 6 is located at a height of fifteen centimeters above the top of the first material stand 7. Since the interior of the cleaning box 1 is a high vacuum environment after the action of the vacuum pump 3, the active gas is introduced from above the material to be cleaned. After the action of gravity, the active gas settles downward, so that the entire surface of the sheet can be bombarded by the plasma, thereby enhancing the cleaning effect on the material surface.

[0027] like Figure 1 As shown, a balancing valve port 4 is provided on the outer wall of the cleaning box 1. The balancing valve port 4 is a vent controlled by a valve. The balancing valve port 4 is used after the material cleaning is completed. In actual use, after plasma cleaning, the valve of the balancing valve port 4 is opened to allow outside air to enter the interior of the cleaning box 1, thereby balancing the air pressure inside and outside the cleaning box 1 and reducing the resistance caused by the vacuum negative pressure when the sealed door of the cleaning box 1 is opened.

[0028] like Figure 1 As shown, a dual-probe pressure sensor 5 is fixedly connected to the interior of the cleaning box 1 below the bottom end of the second material stand 8. The dual-probe pressure sensor 5 is a sensor for detecting air pressure. The dual-probe pressure sensor 5 and the balancing valve port 4 are jointly controlled by the electronic control mainboard of the vacuum cleaning structure. The dual-probe pressure sensor 5 is used to adjust the internal pressure of the cleaning box 1 and change the opening of the vent of the balancing valve port 4.

[0029] like Figure 1 As shown, one detection head of the dual-probe pressure sensor 5 is located inside the cleaning box 1, and the other detection head of the dual-probe pressure sensor 5 extends to the outside of the cleaning box 1. The dual-probe pressure sensor 5 has two detection detection heads, which respectively detect the gas pressure inside and outside the cleaning box 1.

[0030] The method of use and working principle of the device are as follows: first, the material to be cleaned is placed on the first material rack 7 and the second material rack 8, and the rectangular plush strips on the material racks are used to fix the installation position of the cleaned sheet, and then the first material rack 7 and the second material rack 8 are placed in the internal chamber of the cleaning box 1;

[0031] Then, the sealing door is completely closed on the cleaning box 1, so that a sealed space is formed inside the cleaning box 1, and the vacuum pump 3 is activated to clean the impurity gas in the cleaning box 1 and form a high vacuum environment. The vacuum degree of the cleaning box 1 is detected by the dual-probe pressure sensor 5. When the vacuum degree inside the cleaning box 1 reaches the required cleaning degree, the vacuum pump 3 is stopped in time;

[0032] Then, the air inlet 6 is connected to an external active gas storage tank, and a sufficient amount of active gas such as argon and nitrogen is introduced into the cleaning box 1. The electrode plate 2 is connected to an external power supply to generate a high-frequency power supply, and the gas is ionized and excited under the action of the high-frequency power supply to generate plasma to bombard the material and remove the dirt or impurities on the relevant material;

[0033] Finally, the valve of the balancing valve port 4 is opened to allow outside air to enter the interior of the cleaning box 1, thereby balancing the air pressure inside and outside the cleaning box 1, reducing the resistance caused by the vacuum negative pressure when the sealed door of the cleaning box 1 is opened, and facilitating opening the sealed door to take out the cleaning materials on the first material rack 7 and the second material rack 8.

[0034] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A vacuum cleaning structure for a plasma machine, comprising a cleaning box (1), characterized in that: The cleaning box (1) has a chamber formed inside, and the two inner side walls of the chamber of the cleaning box (1) are fixedly connected to electrode plates (2), a vacuum pump (3) is fixedly connected at the center of the bottom end of the cleaning box (1), and an air inlet (6) is formed on the outer side wall of the cleaning box (1).

2. The vacuum cleaning structure for a plasma machine according to claim 1, characterized in that: A sealing door is rotatably connected to one side of the cleaning box (1), and an observation window is provided on the sealing door of the cleaning box (1).

3. The vacuum cleaning structure for a plasma machine according to claim 1, characterized in that: A first material rack (7) and a second material rack (8) are respectively placed inside the chamber of the cleaning box (1).

4. The vacuum cleaning structure for a plasma machine according to claim 3, characterized in that: The air inlet (6) is located at a height of five to twenty centimeters above the top of the first material stand (7).

5. The vacuum cleaning structure for a plasma machine according to claim 1, characterized in that: The outer side wall of the cleaning box (1) is provided with a balance valve port (4).

6. The vacuum cleaning structure for a plasma machine according to claim 3, characterized in that: A dual-probe pressure sensor (5) is fixedly connected to the interior of the cleaning box (1) below the bottom end of the second material stand (8).

7. The vacuum cleaning structure for a plasma machine according to claim 6, characterized in that: One detection head of the dual-probe pressure sensor (5) is located inside the cleaning box (1), and the other detection head of the dual-probe pressure sensor (5) extends to the outside of the cleaning box (1).