Quartz wafer grinding and polishing machine

Abstract

The utility model discloses a quartz wafer grinding and polishing machine which comprises a handheld polisher and a dust collector, and further comprises a workbench and a fixator, the fixator is arranged on the workbench and used for fixing a wafer needing to be ground and polished, the dust collector is arranged on the workbench, the fixator comprises a supporting shaft, a supporting plate and a suction device, and the supporting plate is arranged on the supporting shaft and used for fixing the wafer needing to be ground and polished. The supporting shaft is arranged on the workbench, the supporting plate is arranged on the supporting shaft, a plurality of sets of through openings are formed in the supporting plate, the suction devices are arranged on the workbench, the number of the suction devices is multiple, and the suction devices are located in the through openings. The utility model relates to the field of quartz wafer polishing tool design and polisher use, in particular to a quartz wafer grinding and polishing machine.

Description

Technical Field

[0001] The utility model relates to the field of quartz wafer polishing tool design and polishing device use, in particular to a quartz wafer grinding and polishing machine. Background Art

[0002] Quartz wafers are widely used in decoration and optical products. In actual production, in order to reduce defects and flaws in optical components and improve the surface quality of optical components, the surface of quartz wafers will be ground and polished. In decoration and installation, it is for a more beautiful appearance.

[0003] Due to the thickness of the quartz wafer, the most troublesome part during grinding and polishing is fixing. If it is fixed from the top, no matter how small the fixing pad is, there will be a problem of covering part of the area, and the grinding and polishing of the upper surface cannot be completed at one time. If it is fixed from the side, the external fixing structure needs to be very thin. If the thickness is greater than the quartz wafer, there will be interference. However, if it is too thin, sometimes the hardness is not enough and the fixing structure is easily damaged.

[0004] Therefore, fixing from the bottom is a better way. The bottom can be fixed with the help of a fixed suction cup, but the fixation of the suction cup itself also requires special attention. Because the upper leather material will be deformed when the suction cup is vacuumed during use, the fixation of the suction cup also requires a certain buffer. Utility Model Content

[0005] In view of the above situation, in order to overcome the defects of the prior art, the utility model provides a quartz wafer grinding and polishing machine.

[0006] The technical solution adopted by the utility model is as follows: The utility model is a quartz wafer grinding and polishing machine, including a hand-held polisher and a vacuum cleaner, and also includes a workbench and a fixer, wherein the fixer is arranged on the workbench, the fixer is used to fix the wafer to be ground and polished, the vacuum cleaner is placed on the workbench, the fixer includes a support shaft, a support plate and a suction device, the support shaft is arranged on the workbench, the support plate is arranged on the support shaft, a plurality of groups of through openings are arranged on the support plate, the suction device is arranged on the workbench, the suction device is provided with a plurality of groups, and the suction device is located in the through openings.

[0007] Furthermore, a retaining ring is provided on the support plate.

[0008] Furthermore, a positioning frame is provided on the workbench, and the vacuum cleaner is located in the positioning frame.

[0009] Furthermore, the absorber includes a telescopic structure, a connecting plate and a suction cup, the telescopic structure is provided with multiple groups, the telescopic structure is arranged on a workbench, the connecting plate is arranged on the telescopic structure, the suction cup is arranged through the connecting plate, and the top of the suction cup is located in the through opening.

[0010] Furthermore, the suction cup is externally connected to a vacuum machine.

[0011] Furthermore, the telescopic structure includes a positioning column, a positioning shaft, a sliding shaft and a spring. The positioning column is arranged on a workbench, the positioning column is arranged in a hollow structure, the positioning shaft is arranged in the positioning column, the sliding shaft is slidably sleeved on the positioning shaft and slides through the positioning column, the sliding shaft is connected to a connecting disk, and the spring is arranged between the sliding shaft and the positioning column.

[0012] Furthermore, a placement seat is provided on the workbench, a placement groove is provided on the placement seat, and the handheld polisher is placed in the placement groove.

[0013] Furthermore, a groove is provided on the side wall of the placement seat.

[0014] The beneficial effects achieved by the utility model using the above structure are as follows:

[0015] 1. By adopting the bottom fixing method, the upper surface can be completely exposed to the outside, and the polishing work of the upper surface can be completed at one time, without the need to disassemble and move the fixed structure for multiple times and polish multiple times.

[0016] 2. The vacuum fixation method using a suction cup reduces the risk of damage to the surface of the quartz wafer compared to the clamping and screw locking methods. Fixing and releasing can be completed by switching the vacuum machine, which is faster and more efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of a quartz wafer grinding and polishing machine proposed by the utility model;

[0018] Figure 2 A top view of a quartz wafer grinding and polishing machine proposed by the utility model;

[0019] Figure 3 This is a structural schematic diagram of a quartz wafer grinding and polishing machine suction device proposed by the utility model;

[0020] Figure 4 A cross-sectional view of a positioning column of a quartz wafer grinding and polishing machine proposed by the utility model;

[0021] Figure 5 The utility model provides a schematic structural diagram of a quartz wafer grinding and polishing machine placement seat and a handheld polisher.

[0022] Among them, 1. hand-held polisher, 2. vacuum cleaner, 3. workbench, 4. fixer, 5. support shaft, 6. support plate, 7. absorber, 8. through port, 9. retaining ring, 10. positioning frame, 11. telescopic structure, 12. connecting plate, 13. suction cup, 14. positioning column, 15. positioning shaft, 16. sliding shaft, 17. spring, 18. placement seat, 19. placement groove, 20. groove. DETAILED DESCRIPTION

[0023] like Figure 1 to Figure 5 As shown, the utility model is a quartz wafer grinding and polishing machine, including a handheld polisher 1 and a vacuum cleaner 2, and also including a workbench 3 and a fixture 4, the fixture 4 is arranged on the workbench 3, the fixture 4 is used to fix the wafer to be ground and polished, the vacuum cleaner 2 is placed on the workbench 3, the fixture 4 includes a support shaft 5, a support plate 6 and a suction device 7, the support shaft 5 is arranged on the workbench 3, the support plate 6 is arranged on the support shaft 5, a plurality of through openings 8 are arranged on the support plate 6, the suction device 7 is arranged on the workbench 3, the suction device 7 is provided with a plurality of groups, and the suction device 7 is located in the through opening 8; a retaining ring 9 is provided on the support plate 6 for easy positioning.

[0024] A positioning frame 10 is provided on the workbench 3, and the vacuum cleaner 2 is located in the positioning frame 10 for cleaning polishing powder.

[0025] The absorber 7 includes a telescopic structure 11, a connecting plate 12 and a suction cup 13. The telescopic structure 11 is provided with multiple groups. The telescopic structure 11 is arranged on the workbench 3, the connecting plate 12 is arranged on the telescopic structure 11, and the suction cup 13 is arranged through the connecting plate 12, and the top of the suction cup 13 is located in the opening 8; the suction cup 13 is externally connected to a vacuum machine (not shown in the figure), and the vacuum machine is used to control the suction cup to suck the quartz wafer.

[0026] The telescopic structure 11 includes a positioning column 14, a positioning shaft 15, a sliding shaft 16 and a spring 17. The positioning column 14 is arranged on the workbench 3. The positioning column 14 is arranged in a hollow structure. The positioning shaft 15 is arranged in the positioning column 14. The sliding shaft 16 is slidably sleeved on the positioning shaft 15 and slides through the positioning column 14. The sliding shaft 16 is connected to the connecting disk 12. The spring 17 is arranged between the sliding shaft 16 and the positioning column 14. The spring is located outside the positioning shaft. It should be noted that in order to reduce the risk of resonance, the damping between the positioning shaft and the sliding shaft should be larger. When necessary, the positioning shaft and the sliding shaft can directly select a damping telescopic rod.

[0027] A placement seat 18 is provided on the workbench 3, and a placement groove 19 is provided on the placement seat 18. The handheld polisher 1 is placed in the placement groove 19; a groove 20 is provided on the side wall of the placement seat 18, and the handle of the handheld polisher is placed in the groove for easy placement and removal.

[0028] When used specifically: place the quartz wafer to be polished on the support plate 6 with the surface to be polished facing up, then start the vacuum machine, which controls the suction cup 13 to work, and the suction cup 13 sucks the quartz wafer from the bottom, then take down the handheld polisher 1 to polish, and after completion, use the vacuum cleaner 2 to vacuum, turn off the vacuum machine and then polish the reverse side.

[0029] It should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A quartz wafer grinding and polishing machine, comprising a handheld polisher and a vacuum cleaner, Features: It also includes a workbench and a fixture, wherein the fixture is arranged on the workbench, and the fixture is used to fix the wafer that needs to be ground and polished. The vacuum cleaner is placed on the workbench, and the fixture includes a support shaft, a support plate and a suction device. The support shaft is arranged on the workbench, and the support plate is arranged on the support shaft. The support plate is provided with multiple groups of through openings, and the suction device is arranged on the workbench, and the suction device is provided with multiple groups, and the suction device is located in the through openings.

2. A quartz wafer grinding and polishing machine according to claim 1, Features: A retaining ring is arranged on the supporting plate.

3. A quartz wafer grinding and polishing machine according to claim 1, Features: A positioning frame is provided on the workbench, and the vacuum cleaner is located in the positioning frame.

4. A quartz wafer grinding and polishing machine according to claim 1, Features: The absorber comprises a telescopic structure, a connecting plate and a suction cup, wherein the telescopic structure is provided with a plurality of groups, the telescopic structure is arranged on a workbench, the connecting plate is arranged on the telescopic structure, the suction cup is arranged through the connecting plate, and the top of the suction cup is located in the through opening.

5. A quartz wafer grinding and polishing machine according to claim 4, Features: The suction cup is externally connected to a vacuum machine.

6. A quartz wafer grinding and polishing machine according to claim 4, Features: The telescopic structure includes a positioning column, a positioning shaft, a sliding shaft and a spring. The positioning column is arranged on a workbench. The positioning column is arranged in a hollow structure. The positioning shaft is arranged in the positioning column. The sliding shaft is slidably sleeved on the positioning shaft and slides through the positioning column. The sliding shaft is connected to a connecting disk. The spring is arranged between the sliding shaft and the positioning column.

7. A quartz wafer grinding and polishing machine according to claim 3, Features: The workbench is provided with a placement seat, the placement seat is provided with a placement groove, and the hand-held polisher is placed in the placement groove.

8. A quartz wafer grinding and polishing machine according to claim 7, Features: A groove is arranged on the side wall of the placement seat.

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