Pressure sensor

Abstract

The pressure sensor comprises a housing, a first sealing ring, a substrate, a second sealing ring, a circuit board, a third sealing ring, a plugging housing, elastic members and a pressing head, the housing is provided with an installation cavity, the housing is provided with an installation port, the plugging housing is installed in the installation port, the elastic members are installed in the plugging housing, and the pressing head is installed on the plurality of elastic members. The shell is provided with a pressure interface, the mounting port and the pressure interface are communicated with the mounting cavity, the mounting cavity is arranged in a step shape and forms a plurality of step surfaces, the first sealing ring, the substrate, the second sealing ring, the circuit board and the third sealing ring are mounted on the plurality of step surfaces, the plurality of pressing heads are clamped and propped against the third sealing ring, and the substrate is connected with the circuit board. Through the application of the pressure sensor provided by the utility model, the sealing effect of the pressure sensor is greatly improved through the arrangement of a plurality of sealing rings, the internal elements of the pressure sensor are better protected, the service life is prolonged, and the stability of the pressure sensor is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, in particular to a pressure sensor. Background Art

[0002] Pressure sensor is the most commonly used sensor in industrial practice and instrument control, and is widely used in various industrial automatic control environments. Existing pressure sensors have the disadvantage of unsatisfactory sealing effect. When the pressure sensor is used in an environment with corrosive gases or humidity, long-term use will cause the inside of the pressure sensor to become damp or corroded, thus affecting the use of the pressure sensor. Utility Model Content

[0003] In view of this, in order to solve the above problems, the purpose of the present utility model is to provide a pressure sensor, comprising:

[0004] A shell, a first sealing ring, a substrate, a second sealing ring, a circuit board, a third sealing ring, a plug-in shell, a plurality of elastic members and a plurality of pressing heads, wherein the shell has an installation cavity, an installation opening is provided at the upper end of the shell, the lower end of the plug-in shell is installed in the installation opening, the upper ends of the plurality of elastic members are installed at the lower end of the plug-in shell, the upper ends of the plurality of pressing heads are installed at the lower ends of the plurality of elastic members, a pressure interface is provided at the lower end of the shell, the installation opening and the pressure interface are both connected to the installation cavity, the inner wall of the installation cavity is arranged in a stepped shape and forms a plurality of step surfaces, the inner diameter of the installation cavity is gradually increased in a direction away from the pressure interface, the first sealing ring, the substrate, the second sealing ring, the circuit board and the third sealing ring are sequentially installed on the plurality of step surfaces in a direction away from the pressure interface, the lower ends of the plurality of pressing heads are clamped against the upper side of the third sealing ring, and the substrate is connected to the circuit board.

[0005] In another preferred embodiment, the plurality of step surfaces include: a first step surface, a second step surface, a third step surface, a fourth step surface and a fifth step surface, the outer diameters of the first step surface, the second step surface, the third step surface, the fourth step surface and the fifth step surface are gradually increased, the first sealing ring is installed on the first step surface, the substrate is installed on the second step surface, the second sealing ring is installed on the third step surface, the circuit board is installed on the fourth step surface, and the third sealing ring is installed on the fifth step surface.

[0006] In another preferred embodiment, the thickness of the first sealing ring in the vertical direction is greater than the distance between the first step surface and the second step surface in the vertical direction, and the thickness of the second sealing ring in the vertical direction is greater than the distance between the third step surface and the fourth step surface in the vertical direction.

[0007] In another preferred embodiment, the inner diameter of the first sealing ring is smaller than the inner diameter of the first step surface, the inner diameter of the second sealing ring is smaller than the inner diameter of the third step surface, and the inner diameter of the third sealing ring is smaller than the inner diameter of the fifth step surface.

[0008] In another preferred embodiment, a thick film resistor is printed on a surface of the substrate away from the pressure interface.

[0009] In another preferred embodiment, the inner wall of the installation opening is provided with an internal thread, and the outer wall of the plug-in housing is provided with an external thread, and the external thread matches the internal thread.

[0010] In another preferred embodiment, a plurality of mounting grooves are provided at the lower end of the plug-in shell, and the plurality of mounting grooves are sequentially arranged along the circumference of the plug-in shell, the upper ends of the plurality of elastic members are mounted on the bottom walls of the plurality of mounting grooves, and the plurality of pressing heads are slidably mounted in the plurality of mounting grooves.

[0011] In another preferred embodiment, the elastic member is a micro spring.

[0012] In another preferred embodiment, the outer wall of the housing is provided with a plurality of heat dissipation fins.

[0013] Due to the adoption of the above technical solution, the utility model has the following positive effects compared with the prior art: through the application of the utility model, a pressure sensor is provided, and the sealing effect of the pressure sensor is greatly improved by the setting of multiple sealing rings, the internal components of the pressure sensor are better protected, the service life is extended, and the stability of the pressure sensor is guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 The utility model is an overall schematic diagram of a pressure sensor.

[0015] In the accompanying drawings: 1. Shell; 2. First sealing ring; 3. Base plate; 4. Second sealing ring; 5. Circuit board; 6. Third sealing ring; 7. Plug-in shell; 8. Elastic member; 9. Press head; 10. First step surface; 11. Second step surface; 12. Third step surface; 13. Fourth step surface; 14. Fifth step surface; 15. Mounting groove; 16. Heat sink fins. DETAILED DESCRIPTION

[0016] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0017] like Figure 1 As shown, a pressure sensor of a preferred embodiment is shown, comprising:

[0018] The shell 1, the first sealing ring 2, the substrate 3, the second sealing ring 4, the circuit board 5, the third sealing ring 6, the plug-in shell 7, a plurality of elastic members 8 and a plurality of pressing heads 9, the shell 1 has an installation cavity, the upper end of the shell 1 is provided with an installation port, the lower end of the plug-in shell 7 is installed in the installation port, the upper ends of a plurality of elastic members 8 are installed at the lower end of the plug-in shell 7, the upper ends of a plurality of pressing heads 9 are installed at the lower ends of a plurality of elastic members 8, the lower end of the shell 1 is provided with a pressure interface, the installation port and the pressure interface are both connected to the installation cavity, the inner wall of the installation cavity is arranged in a stepped shape, and a plurality of step surfaces are formed, the inner diameter of the installation cavity is gradually increased in the direction away from the pressure interface, the first sealing ring 2, the substrate 3, the second sealing ring 4, the circuit board 5 and the third sealing ring 6 are successively installed on the plurality of step surfaces in the direction away from the pressure interface, the lower ends of a plurality of pressing heads 9 are clamped on the upper side of the third sealing ring 6, and the substrate 3 is connected to the circuit board 5.

[0019] In actual use, the housing 1 is connected to the pressure system, and the pressure directly acts on a surface of the substrate 3 close to the pressure interface, causing the substrate 3 to produce a slight deformation. The thick film resistor is printed on a surface of the substrate 3 away from the pressure interface, thereby connecting to form a Wheatstone bridge (closed bridge). Due to the piezoresistive effect of the varistor, the Wheatstone bridge generates a highly linear voltage signal that is proportional to the pressure and is also proportional to the excitation voltage, thereby obtaining the corresponding pressure data.

[0020] Further, as a preferred embodiment, the plurality of stepped surfaces include: a first stepped surface 10, a second stepped surface 11, a third stepped surface 12, a fourth stepped surface 13 and a fifth stepped surface 14, the outer diameters of the first stepped surface 10, the second stepped surface 11, the third stepped surface 12, the fourth stepped surface 13 and the fifth stepped surface 14 are gradually increased, the first sealing ring 2 is mounted on the first stepped surface 10, the substrate 3 is mounted on the second stepped surface 11, the second sealing ring 4 is mounted on the third stepped surface 12, the circuit board 5 is mounted on the fourth stepped surface 13, and the third sealing ring 6 is mounted on the fifth stepped surface 14. Further, the multiple settings of the first sealing ring 2, the second sealing ring 4 and the third sealing ring 6 ensure the overall sealing.

[0021] Further, as a preferred embodiment, the thickness of the first sealing ring 2 in the vertical direction is greater than the distance between the first step surface 10 and the second step surface 11 in the vertical direction, and the thickness of the second sealing ring 4 in the vertical direction is greater than the distance between the third step surface 12 and the fourth step surface 13 in the vertical direction. Further, the thickness setting of the first sealing ring 2 and the thickness setting of the second sealing ring 4 make the first sealing ring 2 and the substrate 3, and the second sealing ring 4 and the substrate 3 and the circuit board 5 contact more fully, thereby ensuring the sealing effect.

[0022] Further, as a preferred embodiment, the inner diameter of the first sealing ring 2 is smaller than the inner diameter of the first step surface 10, the inner diameter of the second sealing ring 4 is smaller than the inner diameter of the third step surface 12, and the inner diameter of the third sealing ring 6 is smaller than the inner diameter of the fifth step surface. Further, the inner diameter of each sealing ring is smaller than the inner diameter of a corresponding step surface, so that the sealing effect is better.

[0023] Furthermore, as a preferred embodiment, a thick film resistor is printed on a surface of the substrate 3 away from the pressure interface.

[0024] Further, as a preferred embodiment, the inner wall of the installation opening is provided with an internal thread, and the outer wall of the plug-in housing 7 is provided with an external thread, and the external thread matches the internal thread.

[0025] Further, as a preferred embodiment, a plurality of mounting grooves 15 are provided at the lower end of the plug housing 7, the plurality of mounting grooves 15 are sequentially arranged along the circumference of the plug housing 7, the upper ends of the plurality of elastic members 8 are mounted on the bottom walls of the plurality of mounting grooves 15, and the plurality of pressing heads 9 are slidably mounted in the plurality of mounting grooves 15. Further, in actual use, the elastic member 8 is in a compressed state, thereby pushing the pressing head 9 to press against the third sealing ring 6, further enhancing the sealing effect.

[0026] Further, as a preferred embodiment, the elastic member 8 is a micro spring.

[0027] Furthermore, as a preferred embodiment, a plurality of heat dissipation fins 16 are provided on the outer wall of the housing 1 .

[0028] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A pressure sensor, characterized in that: include: A shell, a first sealing ring, a substrate, a second sealing ring, a circuit board, a third sealing ring, a plug-in shell, a plurality of elastic members and a plurality of pressing heads, wherein the shell has an installation cavity, an installation opening is provided at the upper end of the shell, the lower end of the plug-in shell is installed in the installation opening, the upper ends of the plurality of elastic members are installed at the lower end of the plug-in shell, the upper ends of the plurality of pressing heads are installed at the lower ends of the plurality of elastic members, a pressure interface is provided at the lower end of the shell, the installation opening and the pressure interface are both connected to the installation cavity, the inner wall of the installation cavity is arranged in a stepped shape and forms a plurality of step surfaces, the inner diameter of the installation cavity is gradually increased in a direction away from the pressure interface, the first sealing ring, the substrate, the second sealing ring, the circuit board and the third sealing ring are sequentially installed on the plurality of step surfaces in a direction away from the pressure interface, the lower ends of the plurality of pressing heads are clamped against the upper side of the third sealing ring, and the substrate is connected to the circuit board.

2. The pressure sensor according to claim 1, characterized in that: The plurality of step surfaces include: a first step surface, a second step surface, a third step surface, a fourth step surface and a fifth step surface, the outer diameters of the first step surface, the second step surface, the third step surface, the fourth step surface and the fifth step surface are gradually increased, the first sealing ring is installed on the first step surface, the substrate is installed on the second step surface, the second sealing ring is installed on the third step surface, the circuit board is installed on the fourth step surface, and the third sealing ring is installed on the fifth step surface.

3. The pressure sensor according to claim 2, characterized in that: The thickness of the first sealing ring in the vertical direction is greater than the distance between the first step surface and the second step surface in the vertical direction, and the thickness of the second sealing ring in the vertical direction is greater than the distance between the third step surface and the fourth step surface in the vertical direction.

4. The pressure sensor according to claim 2, characterized in that: The inner diameter of the first sealing ring is smaller than the inner diameter of the first step surface, the inner diameter of the second sealing ring is smaller than the inner diameter of the third step surface, and the inner diameter of the third sealing ring is smaller than the inner diameter of the fifth step surface.

5. The pressure sensor according to claim 1, characterized in that: A thick film resistor is printed on a surface of the substrate away from the pressure interface.

6. The pressure sensor according to claim 1, characterized in that: The inner wall of the installation opening is provided with an internal thread, and the outer wall of the plug-in shell is provided with an external thread, and the external thread matches the internal thread.

7. The pressure sensor according to claim 1, characterized in that: The lower end of the plug shell is provided with a plurality of installation grooves, which are arranged in sequence along the circumference of the plug shell, the upper ends of the elastic members are installed on the bottom walls of the installation grooves, and the pressing heads are slidably installed in the installation grooves.

8. The pressure sensor according to claim 1, characterized in that: The elastic member is a micro spring.

9. The pressure sensor according to claim 1, characterized in that: The outer wall of the shell is provided with a plurality of heat dissipation fins.

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