Automatic test equipment for semiconductor chip

Abstract

The utility model discloses automatic testing equipment for a semiconductor chip. The automatic testing equipment for the semiconductor chip comprises a conveying device, and a hot tin device, a tin removing device and at least one testing device which are sequentially arranged along the conveying direction of the conveying device, the conveying device is used for conveying inverted semiconductor chips; the tin heating device is used for heating soldering tin at the bottom of the semiconductor chip; the tin removing device comprises a rolling brush assembly, and the rolling brush assembly is used for brushing away soldering tin at the bottom of the semiconductor chip. The at least one testing device is used for being electrically connected with the semiconductor chip so as to test the semiconductor chip. According to the semiconductor chip automatic test equipment, automatic tin removal is realized, compared with manual tin removal, the operation is time-saving and labor-saving, coherent operation of chip tin removal and chip test is realized on the same production line, chip transfer is not needed, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip testing, in particular to a semiconductor chip automatic testing device. Background Art

[0002] With the rapid development of semiconductor technology, semiconductor chips are applied to many fields including computers, home appliances, automobiles, and medical treatment. As one of the many semiconductor chips, SPI Nand flash is suitable for storing large amounts of data due to its large capacity and fast rewriting speed. It has been increasingly widely used in the industry, such as in digital cameras, USB flash drives and other embedded products.

[0003] Chip particles based on BGA (integrated circuit packaging technology) packaging (such as DDR, SPI Nand flash and other chip particles) are usually assembled on boards. If the board has problems during mass production, the chip particles need to be removed from the board and the chip particles need to be tested for individual electrical performance. After removal, the bottom of the chip particles usually adheres to solder. If the residual solder is not removed, the solder can easily cause a virtual connection or short circuit between the chip particles and the test socket, thereby affecting the test results.

[0004] Currently, manual detinning of batch chip particles before testing is usually done manually, which is time-consuming and labor-intensive, resulting in low production efficiency. Utility Model Content

[0005] The main purpose of the utility model is to provide an automatic testing device for semiconductor chips, aiming to solve the technical problem that manual detinning of batches of BGA packaged chip particles before testing is currently used, which is time-consuming and labor-intensive and leads to low production efficiency.

[0006] To achieve the above-mentioned purpose, the utility model provides a semiconductor chip automatic testing device, which includes a conveying device and a hot tin device, a tin removal device, and at least one testing device sequentially arranged along the conveying direction of the conveying device;

[0007] The conveying device is used to convey the inverted semiconductor chip;

[0008] The hot tin device is used to heat the solder at the bottom of the semiconductor chip;

[0009] The tin removal device comprises a rolling brush assembly, and the rolling brush assembly is used to brush away the solder on the bottom of the semiconductor chip;

[0010] The at least one testing device is used to be electrically connected to the semiconductor chip to test the semiconductor chip.

[0011] In some embodiments, the roller brush assembly includes a driving member and a roller brush connected to an output end of the driving member, the roller brush is horizontally arranged above the conveying device, and the length direction of the roller brush is perpendicular to the conveying direction of the conveying device.

[0012] In some embodiments, the tin removal device further includes a mounting plate and a driving mechanism for driving the mounting plate to move, and the roller brush assembly is mounted on the mounting plate.

[0013] In some embodiments, the conveying device includes a conveying frame, a conveying belt arranged on the conveying frame, and a first driving assembly for driving the conveying belt to operate;

[0014] The conveyor belt is provided with a plurality of positioning components sequentially arranged along its length direction. The positioning components include two positioning bars, and the two positioning bars are arranged opposite to each other along the length direction of the conveyor belt to form a containing space for containing the semiconductor chip.

[0015] In some embodiments, the hot tin device includes a mounting frame and an air gun disposed on the mounting frame, wherein the air gun is located above the conveying device and is used to blow hot air to heat the solder at the bottom of the semiconductor chip.

[0016] In some embodiments, the at least one testing device includes a short circuit testing device, and the short circuit testing device is used to perform a short circuit test on the semiconductor chip.

[0017] In some embodiments, the short circuit testing device includes a fixing plate, a plurality of probes disposed on the fixing plate, and a driving module for driving the fixing plate to move, wherein the plurality of probes are used to contact the pins at the bottom of the semiconductor chip for electrical connection.

[0018] In some embodiments, a visual inspection device is also included. The tin removal device, the visual inspection device, and the at least one testing device are arranged in sequence along the conveying direction of the conveying device. The visual inspection device is used to capture the bottom image of the semiconductor chip to detect the amount of solder on the bottom of the semiconductor chip.

[0019] In some embodiments, a sorting device is further included. The sorting device is disposed at the outgoing end of the conveying device and is used to sort the semiconductor chips that have passed the test from the semiconductor chips that have failed the test.

[0020] In some embodiments, the sorting device comprises:

[0021] A receiving plate connected to the outgoing end of the conveying device and used for receiving the semiconductor chip transmitted by the conveying device;

[0022] A sorting paddle is rotatably disposed on the receiving plate and is used to move the semiconductor chips that have passed the test and the semiconductor chips that have failed the test to different directions respectively;

[0023] The second driving assembly is connected to the sorting paddle, and the second driving assembly is used to drive the sorting paddle to rotate.

[0024] The semiconductor chip automatic testing equipment proposed in the utility model can be used to perform batch testing on chip particles based on BGA packaging (such as DDR, SPI Nand Flash and other chip particles). Specifically, the conveying device conveys the inverted semiconductor chip along the conveying direction to the workstations corresponding to the hot tin device, the tin removal device, and at least one testing device in turn. The solder at the bottom of the semiconductor chip is first heated by the hot tin device to melt the solder at the bottom of the semiconductor chip, and then the solder at the bottom of the semiconductor chip is brushed off by the roller brush assembly of the tin removal device, and then the semiconductor chip is electrically connected to the semiconductor chip through at least one testing device to test the semiconductor chip. The semiconductor chip automatic testing equipment of the utility model realizes automated tin removal, which saves time and effort compared to manual tin removal, and also realizes the continuous operation of chip tin removal and chip testing on the same production line, without the need for chip transfer, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the structure of chip particles based on BGA packaging in the prior art;

[0026] Figure 2 This is a schematic diagram of the structure of a semiconductor chip automatic testing device in one embodiment of the utility model;

[0027] Figure 3 This is a schematic diagram of a portion of the structure of a semiconductor chip automatic testing device in one embodiment of the utility model;

[0028] Figure 4 This is a schematic structural diagram of a conveying device for semiconductor chip automatic testing equipment in one embodiment of the utility model;

[0029] Figure 5 This is another structural schematic diagram of a semiconductor chip automatic testing device in one embodiment of the utility model;

[0030] Figure 6 This is a schematic diagram of another part of the structure of the semiconductor chip automatic testing equipment in one embodiment of the utility model;

[0031] Figure 7 This is another partial structural diagram of the semiconductor chip automatic testing equipment in one embodiment of the utility model. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the scheme in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0034] It should also be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0035] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0036] Based on the technical problems existing in the related prior art pointed out in the background technology, the embodiment of the utility model proposes an automatic testing equipment for semiconductor chips, so as to improve production efficiency by replacing the traditional manual tin removal with automated tin removal.

[0037] Reference Figure 2 and Figure 3 The semiconductor chip automatic testing equipment includes a conveying device 100 and a hot tinning device 200, a tin removal device 300, and at least one testing device 400 arranged in sequence along the conveying direction of the conveying device 100; the conveying device 100 is used to convey the inverted semiconductor chip 10; the hot tinning device 200 is used to heat the solder at the bottom of the semiconductor chip 10; the tin removal device 300 includes a roller brush assembly 310, and the roller brush assembly 310 is used to brush off the solder at the bottom of the semiconductor chip 10; at least one testing device 400 is used to be electrically connected to the semiconductor chip 10 to test the semiconductor chip 10.

[0038] The semiconductor chip automatic test equipment involved in this embodiment is used to automatically test the semiconductor chip 10, wherein the semiconductor chip 10 can be a chip particle based on BGA packaging (such as DDR, SPI Nand Flash, etc. chip particles), specifically, Figure 1 As shown, two groups of pin contacts are arranged at intervals at the bottom of the semiconductor chip 10. When the semiconductor chip 10 is removed from the board, the bottom of the semiconductor chip 10 is usually adhered with solder.

[0039] The semiconductor chip automatic test equipment includes a conveying device 100, a hot tinning device 200, a tin removal device 300 and at least one test device 400, wherein the hot tinning device 200, the tin removal device 300 and the at least one test device 400 are sequentially arranged along the conveying direction of the conveying device 100. Based on the device composition of the semiconductor chip automatic test equipment in this embodiment, the production process of the semiconductor chip automatic test equipment is: chip hot tinning→chip tin removal→chip testing. Specifically, when the equipment is running, the conveying device 100 conveys the inverted semiconductor chip 10 along the conveying direction to the hot tinning device 200, the tin removal device 300, and the at least one test device 400 corresponding to the workstation, firstly, the hot tinning device 200 heats the solder at the bottom of the semiconductor chip 10 to melt the solder at the bottom of the semiconductor chip 10, then the roller brush assembly 310 of the tin removal device 300 brushes the solder at the bottom of the semiconductor chip 10, and then the at least one test device 400 is electrically connected to the semiconductor chip 10 to test the semiconductor chip 10.

[0040] Furthermore, the semiconductor chip automatic testing equipment is provided with a main control module (not shown), and the conveying device 100, the hot tin device 200, the tin removal device 300 and at least one testing device 400 are all electrically connected to the main control module, so that the conveying device 100, the hot tin device 200, the tin removal device 300 and at least one testing device 400 are uniformly controlled and work in coordination through the main control module.

[0041] The semiconductor chip 10 is placed upside down (i.e., bottom facing up) on the conveying device 100, and the conveying device 100 conveys the inverted semiconductor chip 10. The conveying device 100 can adopt various structural forms, such as a conveying line type (such as a roller, a double-speed chain, etc.), a turntable type, etc., which are set according to actual conditions. Correspondingly, the conveying form of the conveying device 100 can be linear conveying, rotary conveying, etc. In addition, the conveying device 100 can be a fixture carrying the semiconductor chip 10 to convey the semiconductor chip 10. Among them, on the conveying device 100, the semiconductor chip 10 can be conveyed in a single or multiple form, that is, the conveying device 100 can convey one semiconductor chip 10 or convey multiple semiconductor chips 10 to the device that performs the corresponding process operation at a time. When the conveying device 100 conveys multiple semiconductor chips 10 at a time, each device performs corresponding process operations on multiple semiconductor chips 10 at the same time, which can further improve the test efficiency. In addition, the semiconductor chips 10 on the conveying device 100 can be loaded manually or by a robot, and can also be unloaded manually or by a robot, depending on the actual situation.

[0042] The hot tin device 200 is used to heat the solder at the bottom of the semiconductor chip 10. Through the heating of the hot tin device 200, the solder at the bottom of the semiconductor chip 10 can be melted so that the tin removal device 300 can remove it. The hot tin device 200 can have a variety of structural forms. For example, the hot tin device 200 includes a manipulator and a heating tube. The heating tube is connected to the output execution end of the manipulator. Under the drive of the manipulator, the heating tube can move in the workspace, and then can approach the semiconductor chip 10 to heat the solder at the bottom of the semiconductor chip 10, and move away from the semiconductor chip 10 after the heating is completed. Among them, the manipulator can be a collaborative multi-axis robot arm, a spatial XYZ drive module, etc., which is set according to actual conditions. This is only exemplary and not restrictive.

[0043] The tin removal device 300 is used to remove tin from the semiconductor chip 10. Specifically, the roller brush assembly 310 of the tin removal device 300 brushes off the solder at the bottom of the semiconductor chip 10 to avoid residual solder on the semiconductor chip 10 and affect the subsequent test results. Optionally, the roller brush assembly 310 is arranged above the conveying device 100. When the conveying device 100 conveys the semiconductor chip 10 to pass under the roller brush assembly 310, the roller brush assembly 310 contacts the bottom of the semiconductor chip 10, thereby brushing off the solder at the bottom of the semiconductor chip 10. The specific structural composition of the roller brush assembly 310 is described in detail in the subsequent embodiments and will not be described in detail here.

[0044] One or more test devices 400 may be provided, and the test devices 400 may be provided according to the actual situation. When multiple test devices 400 are provided, the multiple test devices 400 are provided in sequence along the conveying direction of the conveying device 100, and the multiple test devices 400 may be located on the same side or different sides of the conveying device 100. Optionally, the test contents of the multiple test devices 400 are different. The test contents of the test devices 400 may be provided according to the actual situation, such as short circuit test, etc.

[0045] This semiconductor chip automatic testing equipment realizes automated tin removal, which saves time and effort compared to manual tin removal. It also realizes the continuous operation of chip tin removal and chip testing on the same production line, without the need for chip transfer, thereby improving production efficiency.

[0046] In some embodiments, reference Figure 3 The roller brush assembly 310 includes a driving member 311 and a roller brush 312 connected to the output end of the driving member 311. The roller brush 312 is horizontally arranged above the conveying device 100, and the length direction of the roller brush 312 is perpendicular to the conveying direction of the conveying device 100. In this embodiment, the roller brush assembly 310 includes a driving member 311 and a roller brush 312. The roller brush 312 is connected to the output end of the driving member 311. Under the drive of the driving member 311, the roller brush 312 can rotate around its own axis. Optionally, the driving member 311 includes a driving motor, and the output shaft of the driving motor is connected to one end of the roller brush 312. The connection between the two can be directly connected or indirectly connected through a transmission structure. The transmission structure can be a gear transmission structure, a pulley transmission structure, etc., including but not limited to this. Optionally, the roller brush 312 includes a brush body and bristles arranged on the circumferential side of the brush body. When removing tin, the bristles rotate with the brush body and brush off the solder on the semiconductor chip 10 during the rotation process. Further, the bristles can be made of metal. The roller brush 312 is arranged across the top of the conveying device 100, and the length direction of the roller brush 312 is perpendicular to the conveying direction of the conveying device 100. In this way, the roller brush 312 can cover the entire bottom area of ​​the semiconductor chip 10 for detinning, thereby improving the detinning effect.

[0047] In some embodiments, the detinning device 300 further includes a mounting plate (not shown) and a driving mechanism (not shown) for driving the mounting plate to move, and the roller brush assembly 310 is mounted on the mounting plate. In this embodiment, the roller brush assembly 310 is movably arranged, and under the drive of the driving mechanism, the roller brush assembly 310 can move with the mounting plate in the workspace. Specifically, when the conveying device 100 conveys the semiconductor chip 10 to the detinning station, the driving mechanism drives the mounting plate to move so that the roller brush assembly 310 contacts the semiconductor chip 10, thereby brushing the solder at the bottom of the semiconductor chip 10 through the roller brush assembly 310. After the preset detinning time, the driving mechanism drives the mounting plate to move so that the roller brush assembly 310 is separated from the semiconductor chip 10, and the detinning operation is completed. The conveying device 100 then conveys the semiconductor chip 10 that has completed the detinning to the next station, such as a test station, to perform subsequent process operations. Among them, the driving mechanism can be a collaborative multi-axis robot arm, a spatial XYZ drive module, etc., which is set according to actual conditions. This is only exemplary and not restrictive.

[0048] In some embodiments, reference Figure 4 The conveying device 100 includes a conveying frame 110, a conveying belt 120 disposed on the conveying frame 110, and a first driving component (not shown) for driving the conveying belt 120 to operate;

[0049] The conveyor belt 120 is provided with a plurality of positioning components sequentially arranged along the length direction thereof. The positioning components include two positioning bars 121 . The two positioning bars 121 are arranged opposite to each other along the length direction of the conveyor belt 120 to form an accommodation space for accommodating the semiconductor chip 10 .

[0050] In this embodiment, the conveying device 100 includes a conveying frame 110, a conveyor belt 120 and a first driving assembly. The conveyor belt 120 is connected to the first driving assembly. Under the drive of the first driving assembly, the conveyor belt 120 can rotate to transport the semiconductor chips 10 placed thereon. Optionally, the first driving assembly includes a driving drum, a driven drum and a motor connected to one end of the driving drum. The driving drum and the driven drum are respectively arranged at opposite ends of the conveying frame 110. The two ends of the conveyor belt 120 are respectively sleeved on the driving drum and the driven drum. The driving drum is driven to rotate by the motor to make the conveyor belt 120 run. This is only exemplary and not restrictive.

[0051] Among them, Figure 4As shown, when the semiconductor chip 10 is placed on the conveyor belt 120, it is positioned by the positioning assembly on the conveyor belt 120. Specifically, the semiconductor chip 10 is placed between the two positioning bars 121 of the positioning assembly, and the two positioning bars 121 limit the semiconductor chip 10. There are a plurality of positioning assemblies, and the plurality of positioning assemblies are arranged in sequence along the length direction of the conveyor belt 120. When the first driving assembly drives the conveyor belt 120 to run, the semiconductor chips 10 can be loaded one by one to the plurality of positioning assemblies from the input end of the conveyor device 100 as the conveyor belt 120 rotates; and, from the output end of the conveyor device 100, as the conveyor belt 120 rotates, the semiconductor chips 10 at the plurality of positioning assemblies can be unloaded one by one. The structural form of the positioning bar 121 can be various, for example, the positioning bar 121 is a plastic strip and is adhesively fixed to the conveyor belt 120.

[0052] In some embodiments, reference Figure 5 The hot tinning device 200 includes a mounting frame 210 and an air gun 220 disposed on the mounting frame 210. The air gun 220 is located above the conveying device 100 and is used to blow hot air to heat the solder at the bottom of the semiconductor chip 10. In this embodiment, the mounting frame 210 can be a gantry frame and is erected on the conveying device 100. The air gun 220 is mounted on the mounting frame 210, and the air outlet end of the air gun 220 faces the conveying surface of the conveying device 100. Specifically, when the conveying device 100 conveys the semiconductor chip 10 to the hot tinning station, the air outlet end of the air gun 220 blows hot air to heat the solder at the bottom of the semiconductor chip 10. After a preset heating time, the air outlet end of the air gun 220 stops blowing air, and the conveying device 100 conveys the semiconductor chip 10 that has completed the hot tinning to the next station, such as the detinning station, to perform subsequent process operations. The air gun 220 is a device that uses electric heat to heat a heat conductor (usually a heating tube) to heat a heat storage body (usually air) to a high temperature, and then sprays hot air toward the object to be processed. The air gun 220 can generate high-temperature air and blow it toward the metal material to be processed, thereby conducting heat to achieve the purpose of heat treatment. In this embodiment, the hot tin device 200 uses the air gun 220, which has the advantages of being simple and easy to use, easy to operate, and able to quickly increase the temperature.

[0053] In some embodiments, reference Figure 6 At least one test device 400 includes a short circuit test device 410, which is used to perform a short circuit test on the semiconductor chip 10. After the test of the short circuit test device 410, it can be tested whether the semiconductor chip 10 is short-circuited. When the test result of the tested semiconductor chip 10 is short-circuited, it is determined to be unqualified; conversely, when the test result of the tested semiconductor chip 10 is not short-circuited, it is determined to be qualified. After the test is completed, the short circuit test device 410 uploads the test result to the main control module.

[0054] In some embodiments, reference Figure 6 The short circuit test device 410 includes a fixed plate 411, a plurality of probes 412 arranged on the fixed plate 411, and a driving module for driving the fixed plate 411 to move, and the plurality of probes 412 are used to contact the pins at the bottom of the semiconductor chip 10 for electrical connection. In this embodiment, the plurality of probes 412 are arranged in an array on the fixed plate 411, and are arranged one by one corresponding to the pins at the bottom of the semiconductor chip 10. When the conveying device 100 conveys the semiconductor chip 10 to the short circuit test station, the driving module drives the fixed plate 411 to move so that the plurality of probes 412 on the fixed plate 411 are connected to the pins at the bottom of the semiconductor chip 10, thereby connecting the test circuit and performing a short circuit test on the semiconductor chip 10. After the test is completed, the driving module drives the fixed plate 411 to move so that the plurality of probes 412 on the fixed plate 411 are separated from the pins at the bottom of the semiconductor chip 10, thereby disconnecting the test circuit, and the conveying device 100 conveys the semiconductor chip 10 that has completed the test to the next station to perform subsequent process operations. Among them, the driving module can adopt a collaborative multi-axis robot arm, a spatial XYZ driving module, etc., and can be set according to actual conditions.

[0055] In some embodiments, reference Figure 2 , the semiconductor chip automatic test equipment also includes a visual inspection device 500, the tin removal device 300, the visual inspection device 500, and at least one test device 400 are sequentially arranged along the conveying direction of the conveying device 100, and the visual inspection device 500 is used to collect the bottom image of the semiconductor chip 10 to detect the amount of solder at the bottom of the semiconductor chip 10. In this embodiment, after the semiconductor chip 10 on the conveying device 100 is tin-removed by the tin removal device 300, it continues to be conveyed to the visual inspection device 500, and the semiconductor chip 10 is subjected to tin removal detection by the visual inspection device 500, specifically, the amount of solder at the bottom of the semiconductor chip 10 is detected to ensure the tin removal quality. The visual inspection device 500 may include a manipulator and an image acquisition mechanism, and the image acquisition mechanism is connected to the execution end of the manipulator. Under the drive of the manipulator, the image acquisition mechanism can move in the detection workspace and reach the semiconductor chip 10, and then can collect the bottom image of the semiconductor chip 10 to detect whether the tin removal effect of the semiconductor chip 10 meets the requirements. The image acquisition mechanism may include a visual camera, and the manipulator may be a collaborative multi-axis manipulator, a spatial XYZ drive module, etc., which are set according to actual conditions. This is only exemplary and not restrictive. When the test result is qualified, the subsequent chip test process operation can be performed; as an optional implementation, when the test result is unqualified, the semiconductor chip 10 can be re-detinned or unloaded.

[0056] In some embodiments, reference Figure 2The semiconductor chip automatic test equipment also includes a sorting device 600, which is arranged at the outgoing end of the conveying device 100 and is used to sort the semiconductor chips 10 that have passed the test and the semiconductor chips 10 that have failed the test. In this embodiment, after the testing device 400 has tested the semiconductor chip 10, the test result of whether it is qualified is uploaded to the main control module, and the conveying device 100 continues to convey the semiconductor chip 10, and conveys the semiconductor chip 10 to the sorting device 600. The main control module issues a control instruction to the sorting device 600 according to the test result. The sorting device 600 sorts the semiconductor chips 10 that have passed the test and the semiconductor chips 10 that have failed the test according to the control instruction issued by the main control module, for example, sorting the semiconductor chips 10 that have passed the test to the qualified product placement area / position, and sorting the semiconductor chips 10 that have failed the test to the unqualified product placement area / position. By sorting the semiconductor chips 10 after testing using the sorting device 600, semiconductor chips 10 that have passed the test and semiconductor chips 10 that have failed the test can be automatically classified without human intervention, thereby further improving the degree of automation.

[0057] The structure of the sorting device 600 can be various, for example:

[0058] In some embodiments, reference Figure 7 , the sorting device 600 comprises:

[0059] The receiving plate 610 is connected to the outgoing end of the conveying device 100 and is used to receive the semiconductor chip 10 transmitted from the conveying device 100;

[0060] The sorting paddle 620 is rotatably disposed on the receiving plate 610 and is used to move the semiconductor chips 10 that have passed the test and the semiconductor chips 10 that have failed the test to different directions respectively;

[0061] The second driving assembly (not shown) is connected to the sorting paddle 620 , and the second driving assembly is used to drive the sorting paddle 620 to rotate.

[0062] In this embodiment, the sorting device 600 includes a receiving plate 610, a sorting paddle 620 and a second drive assembly. The sorting paddle 620 is mounted on the receiving plate 610 through a rotating shaft and can rotate around the axis of the rotating shaft. Driven by the second drive assembly, the sorting paddle 620 can rotate on the receiving plate 610 to move the semiconductor chip 10. Optionally, the second drive assembly includes a motor and a transmission unit, the power input end of the transmission unit is connected to the output shaft of the motor, and the power output end of the transmission unit is connected to the sorting paddle 620. The transmission unit can be a gear transmission unit, a pulley transmission unit, etc., which is not limited.

[0063] Specifically, the sorting process of the sorting device 600 is as follows: when the semiconductor chip 10 reaches the outgoing end of the conveying device 100, the semiconductor chip 10 is automatically dropped or placed on the receiving plate 610 by other means (such as being grabbed by a robot). Then, according to the test result, the second driving component drives the sorting paddle 620 to rotate to move the semiconductor chip 10 on the receiving plate 610 and move it to the corresponding placement area to achieve the sorting and placement of the semiconductor chips 10 that have passed the test and the semiconductor chips 10 that have failed the test. For example, when the test result of the semiconductor chip 10 is a short circuit, the second driving component drives the sorting paddle 620 to rotate 180° clockwise to move the semiconductor chip 10 to the unqualified product placement area; when the test result of the semiconductor chip 10 is normal, the second driving component drives the sorting paddle 620 to rotate 180° counterclockwise to move the semiconductor chip 10 to the qualified product placement area.

[0064] In addition, the sorting device 600 may also use a manipulator, which may be a collaborative multi-axis manipulator, a spatial XYZ drive module, etc., and is set according to actual conditions. In addition, a suction cup assembly or a clamping claw may be installed at the execution end of the manipulator to grab the semiconductor chip 10. Specifically, according to the test results, the manipulator grabs the semiconductor chip 10 from the conveying device 100 and places the semiconductor chip 10 in the qualified product placement area or the unqualified product placement area.

[0065] The above description is only a partial or preferred embodiment of the present invention. Neither the text nor the drawings can limit the scope of protection of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the overall concept of the present invention, or direct / indirect application in other related technical fields are included in the scope of protection of the present invention.

Claims

1. A semiconductor chip automatic testing equipment, characterized in that: It comprises a conveying device and a hot tin device, a tin removal device and at least one testing device which are sequentially arranged along the conveying direction of the conveying device; The conveying device is used to convey the inverted semiconductor chip; The hot tin device is used to heat the solder at the bottom of the semiconductor chip; The tin removal device comprises a rolling brush assembly, and the rolling brush assembly is used to brush away the solder on the bottom of the semiconductor chip; The at least one testing device is used to be electrically connected to the semiconductor chip to test the semiconductor chip.

2. The semiconductor chip automatic testing equipment according to claim 1, characterized in that: The roller brush assembly includes a driving member and a roller brush connected to the output end of the driving member. The roller brush is horizontally arranged above the conveying device, and the length direction of the roller brush is perpendicular to the conveying direction of the conveying device.

3. The semiconductor chip automatic testing equipment according to claim 1 or 2, characterized in that: The tin removal device also includes a mounting plate and a driving mechanism for driving the mounting plate to move, and the roller brush assembly is mounted on the mounting plate.

4. The semiconductor chip automatic testing equipment according to claim 1, characterized in that: The conveying device comprises a conveying frame, a conveying belt arranged on the conveying frame, and a first driving assembly for driving the conveying belt to operate; The conveyor belt is provided with a plurality of positioning components sequentially arranged along its length direction. The positioning components include two positioning bars, and the two positioning bars are arranged opposite to each other along the length direction of the conveyor belt to form a containing space for containing the semiconductor chip.

5. The semiconductor chip automatic testing equipment according to claim 1, characterized in that: The hot tin device comprises a mounting frame and an air gun arranged on the mounting frame. The air gun is located above the conveying device and is used for blowing out hot air to heat the solder at the bottom of the semiconductor chip.

6. The semiconductor chip automatic test equipment according to claim 1, characterized in that: The at least one testing device comprises a short circuit testing device, and the short circuit testing device is used to perform a short circuit test on the semiconductor chip.

7. The semiconductor chip automatic testing equipment according to claim 6, characterized in that: The short circuit testing device comprises a fixing plate, a plurality of probes arranged on the fixing plate and a driving module for driving the fixing plate to move, wherein the plurality of probes are used to contact with the pins at the bottom of the semiconductor chip for electrical connection.

8. The semiconductor chip automatic testing equipment according to claim 1, characterized in that: It also includes a visual inspection device. The tin removal device, the visual inspection device, and the at least one testing device are arranged in sequence along the conveying direction of the conveying device. The visual inspection device is used to collect the bottom image of the semiconductor chip to detect the amount of solder on the bottom of the semiconductor chip.

9. The semiconductor chip automatic testing equipment according to claim 1, characterized in that: It also includes a sorting device, which is arranged at the outgoing end of the conveying device and is used to sort the semiconductor chips that have passed the test and the semiconductor chips that have failed the test.

10. The semiconductor chip automatic testing equipment according to claim 9, characterized in that: The sorting device comprises: A receiving plate connected to the outgoing end of the conveying device and used for receiving the semiconductor chip transmitted by the conveying device; A sorting paddle is rotatably disposed on the receiving plate and is used to move the semiconductor chips that have passed the test and the semiconductor chips that have failed the test to different directions respectively; The second driving assembly is connected to the sorting paddle, and the second driving assembly is used to drive the sorting paddle to rotate.

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