Mass dense-state operation server mainboard of embedded optical engine

Abstract

The utility model provides a massive secret state operation server mainboard of an embedded optical engine. The mainboard comprises a shell, an optical engine and a server, the main circuit board is fixed in the shell, and a controller is arranged on the board surface of the main circuit board; the transmitting light module is provided with an electro-optical conversion element electrically connected to the controller; the receiving optical module is provided with a photoelectric conversion element electrically connected to the controller; wherein the value range of the distance between the transmitting optical module and the controller and the value range of the distance between the receiving optical module and the controller are both 20 mm-40 mm, so that the transmitting optical module and the receiving optical module are arranged in the main circuit board to form an embedded optical engine, the skin effect is not generated in optical transmission, signal loss caused by the skin effect is avoided, and the service life of the main circuit board is prolonged. The signal transmission rate can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of network equipment, and in particular to a massive dense computing server mainboard of an embedded optical engine. Background Art

[0002] In the related art, for board-to-board interconnection using optical transmission, the optoelectronic conversion module is generally set at the edge of the circuit board, such as an external QSFP, SFP and other optoelectronic conversion modules, and the CPU is set in the middle of the circuit board. As the CPU processing speed set on the circuit board is getting faster and faster, the corresponding transmission signal needs to reach 50Gbps, 100Gbps or more per channel, and the distance for the electrical signal sent by the controller to be transmitted from the middle of the circuit board to the optoelectronic conversion module located at the edge of the circuit board is relatively long, such as 100mm, etc., and there is a skin effect in the transmission of electrical signals on the main circuit board, which makes the loss of high-speed signals on the main circuit board greater and greater, resulting in signal distortion when the electrical signal is transmitted to the edge of the main circuit board, which is not conducive to the quality of the optoelectronic conversion signal and signal transmission. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a massive dense computing server motherboard of an embedded optical engine, aiming to solve the problem of large loss of high-speed signals on the main circuit board in the related technology.

[0004] In order to solve the above technical problems, the utility model provides a massive dense computing server motherboard of an embedded optical engine, comprising:

[0005] shell;

[0006] A main circuit board is fixed in the housing, and a controller is provided on the board surface of the main circuit board;

[0007] a transmitting optical module, which is contained in the housing and fixed to the surface of the main circuit board, and is provided with an electro-optical conversion element electrically connected to the controller; and

[0008] A receiving light module is housed in the housing and fixed to the surface of the main circuit board, and the receiving light module is provided with a photoelectric conversion element electrically connected to the controller; wherein the distance between the sending light module and the controller, and the distance between the receiving light module and the controller are both in the range of 20mm-40mm.

[0009] Optionally, the transmitting optical module and the receiving optical module are both provided in plurality, and the plurality of transmitting optical modules and the plurality of receiving optical modules are alternately arranged.

[0010] Optionally, the transmitting optical module is also provided with a first circuit board and a first connector, the electro-optical conversion element is fixed to the first circuit board, the controller is provided with a second connector adapted to the first connector, the first connector is fixed to the first circuit board and is plugged and assembled with the second connector.

[0011] Optionally, the electro-optical conversion element and the first connector are respectively located on two surfaces of the first circuit board.

[0012] Optionally, a first heat sink is further disposed on the surface of the first circuit board, the first heat sink and the electro-optical conversion element are located on the same side surface of the first circuit board, and the electro-optical conversion elements are distributed on both sides of the first heat sink.

[0013] Optionally, the receiving optical module is also provided with a second circuit board and a third connector, the photoelectric conversion element is fixed to the second circuit board, the controller is provided with a fourth connector adapted to the third connector, and the third connector is fixed to the second circuit board and plugged and assembled with the fourth connector.

[0014] Optionally, the photoelectric conversion element and the third connector are respectively located on two surfaces of the second circuit board.

[0015] Optionally, a second heat sink is further disposed on the surface of the second circuit board, the second heat sink and the photoelectric conversion element are located on the same side surface of the second circuit board, and the photoelectric conversion elements are distributed on both sides of the second heat sink.

[0016] Optionally, the massive dense computing server mainboard of the embedded light engine further includes a power supply, the power supply is fixed to the main circuit board, and the power supply is electrically connected to the main circuit board.

[0017] Compared with the related art, the utility model has the beneficial effect of a massive dense computing server motherboard of an embedded light engine: since the distance between the sending light module and the controller, and the distance between the receiving light module and the controller are both in the range of 20mm-40mm, the sending light module and the receiving light module are both arranged adjacent to the controller, so that the sending light module and the receiving light module are built into the interior of the main circuit board to form an embedded light engine, so that after the controller processes the data or before receiving the data, there is no need to transmit the electrical digital signal from the controller to the edge of the main circuit board or to transmit the electrical digital signal from the edge of the main circuit board to the controller, but directly perform photoelectric conversion or electro-optical conversion at a position close to the controller, and light transmission will not produce a skin effect, thereby causing no signal loss due to the skin effect, and the signal transmission rate can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For those skilled in the art, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a schematic diagram of a network device provided by an embodiment of the utility model;

[0020] Figure 2 It is a schematic diagram of the back side of the transmitting optical module provided by the embodiment of the utility model;

[0021] Figure 3 It is a front schematic diagram of a transmitting optical module provided in an embodiment of the utility model;

[0022] Figure 4 It is a schematic diagram of the back side of the receiving optical module provided by the embodiment of the utility model;

[0023] Figure 5 It is a front schematic diagram of a receiving optical module provided in an embodiment of the utility model.

[0024] In the accompanying drawings, each figure mark represents: 1. housing; 2. main circuit board; 3. transmitting optical module; 31. electro-optical conversion element; 32. first circuit board; 33. first connector; 34. first heat sink; 4. receiving optical module; 41. photoelectric conversion element; 42. second circuit board; 43. third connector; 44. second heat sink; 5. optical fiber interface terminal; 6. power supply; 7. PHY chip; 8. MAC chip. DETAILED DESCRIPTION

[0025] The embodiments of the utility model are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the utility model, and cannot be understood as limiting the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the utility model.

[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "circumferential", "radial" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "multiple" and "several" is two or more, unless otherwise clearly and specifically defined.

[0028] Example:

[0029] See also Figure 1 The embodiment of the utility model provides a network device, including a massive dense computing server motherboard of an embedded optical engine and an optical fiber interface terminal 5. The optical fiber interface terminal 5 is arranged in a housing 1 and is provided with a plurality of optical fibers, and the optical fiber interface terminal 5 and the transmitting optical module 3, and the optical fiber interface terminal 5 and the receiving optical module 4 are connected by optical fibers.

[0030] See also Figures 1 to 5 The mainboard of the massive dense computing server of the embedded optical engine includes a housing 1, a main circuit board 2, a transmitting optical module 3 and a receiving optical module 4. The main circuit board 2 is fixed in the housing 1, and a controller is arranged on the board surface of the main circuit board 2; the transmitting optical module 3 is accommodated in the housing 1 and fixed on the board surface of the main circuit board 2, and the transmitting optical module 3 is provided with an electro-optical conversion element 31 electrically connected to the controller; the receiving optical module 4 is accommodated in the housing 1 and fixed on the board surface of the main circuit board 2, and the receiving optical module 4 is provided with a photoelectric conversion element 41 electrically connected to the controller; wherein, the distance between the transmitting optical module 3 and the controller, and the distance between the receiving optical module 4 and the controller are both in the range of 20mm-40mm.

[0031] Since the distance between the transmitting optical module 3 and the controller, and the distance between the receiving optical module 4 and the controller are both in the range of 20mm-40mm, the transmitting optical module 3 and the receiving optical module 4 are both arranged adjacent to the controller, so that the transmitting optical module 3 and the receiving optical module 4 are built into the interior of the main circuit board 2 to form an embedded light engine, so that after the controller processes the data or before receiving the data, there is no need to transmit the electrical digital signal from the controller to the edge of the main circuit board 2 or to transmit the electrical digital signal from the edge of the main circuit board 2 to the controller, but directly perform photoelectric conversion or electro-optical conversion at a position close to the controller, and optical transmission will not produce a skin effect, thereby causing no signal loss due to the skin effect, and the signal transmission rate can be improved.

[0032] In some embodiments, the distance between the transmitting optical module 3 and the controller, and the distance between the receiving optical module 4 and the controller can be 20mm, 25mm, 30mm, 35mm, 40mm, etc., which can make the distance between the transmitting optical module 3 and the controller, and the distance between the receiving optical module 4 and the controller closer. At the same time, the reserved gap facilitates the installation of the transmitting optical module 3 and the receiving optical module 4 on the main circuit board 2.

[0033] It should be noted that the network device can be a server or a switch, etc. The single-channel transmission rate between the optical fiber interface terminal 5 and the transmitting optical module 3, and between the optical fiber interface terminal 5 and the receiving optical module 4 can reach 50Gbps, 100Gbps or even 200Gbps. Under multi-channel, 400Gbps, 800Gbps, 1.2Tbps or even 1.6Tbps can be transmitted, thereby meeting the signal transmission requirements of the motherboard of the massive dense computing server.

[0034] See also Figure 1 There are multiple transmitting optical modules 3 and multiple receiving optical modules 4, and the multiple transmitting optical modules 3 and the multiple receiving optical modules 4 are alternately arranged. For example, in a specific example, there are four transmitting optical modules 3 and four receiving optical modules 4, and the four transmitting optical modules 3 and the four receiving optical modules 4 are arranged in a row and alternately distributed at intervals, so that the optical modules are regularly distributed on the main circuit board 2, thereby making the circuit design on the main circuit board 2 relatively simple.

[0035] See also Figure 2 and Figure 3The transmitting optical module 3 is also provided with a first circuit board 32 and a first connector 33. The electro-optical conversion element 31 is fixed to the first circuit board 32. The controller is provided with a second connector adapted to the first connector 33. The first connector 33 is fixed to the first circuit board 32 and is plugged and assembled with the second connector to achieve mutual fixation between the transmitting optical module 3 and the main circuit board 2. Specifically, the electro-optical conversion element 31 can be a laser generator. One of the first connector 33 and the second connector is a plug, and the other is a socket. The plug is provided with a plurality of pins, and the socket is provided with a plurality of jacks. The electro-optical conversion element 31 is electrically connected to the first circuit board 32. The first circuit board 32 is electrically connected to the main circuit board 2 through the first connector 33 and the second connector. The controller is electrically connected to the main circuit board 2, thereby achieving electrical connection between the electro-optical conversion element 31 and the controller.

[0036] See also Figure 2 and Figure 3 The electro-optical conversion element 31 and the first connector 33 are respectively located on the two sides of the first circuit board 32, wherein the electro-optical conversion element 31 is located on the back side of the first circuit board 32, and the first connector 33 is located on the front side of the first circuit board 32, so that a large free area can be left on the board surface of the first circuit board 32 where the electro-optical conversion element 31 is provided, so as to facilitate the installation of other devices on the board surface. The board surface of the first circuit board 32 is also provided with a first heat sink 34, and the first heat sink 34 and the electro-optical conversion element 31 are located on the same side of the board surface of the first circuit board 32, and the electro-optical conversion elements 31 are distributed on both sides of the first heat sink 34, which is conducive to the first heat sink 34 to export the heat generated by the electro-optical conversion element 31.

[0037] In a specific example, the transmitting optical module 3 is provided with a total of twenty-four transmission channels, and the twenty-four transmission channels are composed of six electro-optical conversion elements 31. Three electro-optical conversion elements 31 are provided on both sides of the first heat sink 34, and each electro-optical conversion element 31 is provided with four optical channels. The distance between two adjacent lasers in the four optical channels is less than 250μm, for example, 250μm, 230μm, 220μm, etc., and the distance between two adjacent lenses in the four optical channels is greater than 10mm, for example, 10mm, 12mm, 15mm, etc.

[0038] See also Figure 4 and Figure 5, the receiving optical module 4 is also provided with a second circuit board 42 and a third connector 43, the photoelectric conversion element 41 is fixed to the second circuit board 42, the controller is provided with a fourth connector adapted to the third connector 43, the third connector 43 is fixed to the second circuit board 42 and is plugged and assembled with the fourth connector, so as to realize the mutual fixation between the receiving optical module 4 and the main circuit board 2. Specifically, the photoelectric conversion element 41 can be a photodiode, one of the third connector 43 and the fourth connector is a plug, and the other is a socket, the plug is provided with a plurality of pins, and the socket is provided with a plurality of jacks, the photoelectric conversion element 41 is electrically connected to the second circuit board 42, the second circuit board 42 is electrically connected to the main circuit board 2 through the third connector 43 and the fourth connector, and the controller is electrically connected to the main circuit board 2, so as to realize the electrical connection between the photoelectric conversion element 41 and the controller.

[0039] See also Figure 4 and Figure 5 The photoelectric conversion element 41 and the third connector 43 are respectively located on the two sides of the second circuit board 42, wherein the photoelectric conversion element 41 is located on the back side of the second circuit board 42, and the third connector 43 is located on the front side of the second circuit board 42, so that a large free area can be left on the board surface of the second circuit board 42 where the photoelectric conversion element 41 is provided, so as to facilitate the installation of other devices on the board surface. The board surface of the second circuit board 42 is also provided with a second heat sink 44, and the second heat sink 44 and the photoelectric conversion element 41 are located on the same side of the board surface of the second circuit board 42, and the photoelectric conversion elements 41 are distributed on both sides of the second heat sink 44, which is conducive to the second heat sink 44 to export the heat generated by the photoelectric conversion element 41.

[0040] In a specific example, the receiving optical module 4 is provided with a total of twenty-four transmission channels, and the twenty-four transmission channels are composed of six photoelectric conversion elements 41. Three photoelectric conversion elements 41 are provided on both sides of the second heat sink 44, and each photoelectric conversion element 41 is provided with four optical channels. The distance between two adjacent lasers in the four optical channels is less than 250μm, for example, 250μm, 230μm, 220μm, etc., and the distance between two adjacent lenses in the four optical channels is greater than 10mm, for example, 10mm, 12mm, 15mm, etc.

[0041] It should be noted that since the network device includes a transmitting optical module 3 with twenty-four transmission channels and a receiving optical module 4 with twenty-four transmission channels, the transmission rate of the embedded optical engine can reach 1.2Tbps, which meets the optical engine transmission rate required by NVIDIA and Amazon servers for the current artificial intelligence CHATGPT application.

[0042] See also Figure 1The embedded optical engine's massive dense computing server motherboard also includes a power supply 6, which is fixed to the main circuit board 2 and electrically connected to the main circuit board 2. The power supply 6 supplies power to the main circuit board 2, the first circuit board 32, and the second circuit board 42. The controller includes a PHY chip 7 (Physical Layer Device) and a MAC chip 8 (Media Access Control). The PHY chip 7 demodulates and A / D converts the received analog signal and then hands the signal to the MAC chip 8 for processing through the MII interface (Media Independent Interface). The distance between the transmitting optical module 3 and the MAC chip 8, and the distance between the receiving optical module 4 and the MAC chip 8 are both in the range of 20 mm to 40 mm.

[0043] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A massive dense computing server motherboard with an embedded optical engine. It is characterized in that include: shell; A main circuit board is fixed in the housing, and a controller is provided on the board surface of the main circuit board; a transmitting optical module, which is contained in the housing and fixed to the surface of the main circuit board, and is provided with an electro-optical conversion element electrically connected to the controller; and A receiving light module, housed in the housing and fixed to the surface of the main circuit board, wherein the receiving light module is provided with a photoelectric conversion element electrically connected to the controller; The distance between the transmitting optical module and the controller, and the distance between the receiving optical module and the controller are both in the range of 20 mm to 40 mm.

2. The embedded light engine's massive dense computing server motherboard according to claim 1, It is characterized in that There are multiple transmitting light modules and multiple receiving light modules, and the multiple transmitting light modules and the multiple receiving light modules are alternately arranged.

3. The embedded light engine's massive dense computing server motherboard according to claim 1, It is characterized in that The transmitting optical module is also provided with a first circuit board and a first connector, the electro-optical conversion element is fixed to the first circuit board, the controller is provided with a second connector adapted to the first connector, the first connector is fixed to the first circuit board and is plugged and assembled with the second connector.

4. The embedded light engine's massive dense computing server motherboard according to claim 3, It is characterized in that The electro-optical conversion element and the first connector are respectively located on two surfaces of the first circuit board.

5. The embedded light engine's massive dense computing server motherboard according to claim 3, It is characterized in that A first heat sink is also disposed on the surface of the first circuit board. The first heat sink and the electro-optical conversion element are located on the same side surface of the first circuit board, and the electro-optical conversion elements are distributed on both sides of the first heat sink.

6. The embedded light engine's massive dense computing server motherboard according to claim 1, It is characterized in that The receiving optical module is also provided with a second circuit board and a third connector, the photoelectric conversion element is fixed to the second circuit board, the controller is provided with a fourth connector adapted to the third connector, the third connector is fixed to the second circuit board and plugged and assembled with the fourth connector.

7. The embedded light engine's massive dense computing server motherboard according to claim 6, It is characterized in that The photoelectric conversion element and the third connector are respectively located on two surfaces of the second circuit board.

8. The embedded light engine's massive dense computing server motherboard according to claim 6, It is characterized in that A second heat sink is also disposed on the surface of the second circuit board. The second heat sink and the photoelectric conversion element are located on the same side surface of the second circuit board, and the photoelectric conversion elements are distributed on both sides of the second heat sink.

9. The embedded light engine's massive dense computing server motherboard according to claim 1, It is characterized in that The massive dense computing server mainboard of the embedded light engine also includes a power supply, which is fixed to the main circuit board and electrically connected to the main circuit board.

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