Halogen-free three-layer multi-signal transmission connecting wire

Abstract

The utility model discloses a halogen-free three-layer multi-signal transmission connecting wire, which comprises a conductor layer and an anti-electromagnetic adhesive layer, conductor layers are symmetrically arranged on the upper surface and the lower surface of the anti-electromagnetic adhesive layer; the conductor layer comprises a first base material layer, a halogen-free flame-retardant polyester adhesive layer and a first FFC flat conductor which are sequentially stacked, and the first FFC flat conductor is in contact with the anti-electromagnetic adhesive layer; the anti-electromagnetic adhesive layer comprises a second base material layer, a first shielding adhesive layer, a second FFC flat conductor and at least two second shielding adhesive layers; the second base material layer, the first shielding glue layer and the second FFC flat conductor are sequentially stacked; one second shielding glue layer is arranged between the second FFC flat conductor and one first FFC flat conductor, and the other second shielding glue layer is arranged between the second base material layer and the other first FFC flat conductor. According to the halogen-free three-layer multi-signal transmission connecting wire rod provided by the utility model, the electromagnetic shielding performance of the wire rod can be effectively improved on the premise of ensuring the halogen-free flame retardant performance and the metal bonding performance.

Description

Technical Field

[0001] The utility model relates to the technical field of connecting wires, in particular to a halogen-free three-layer multi-signal transmission connecting wire. Background Art

[0002] FFC (Flexible Flat Cable) is a new type of data cable made by hot-melt adhesive film and extremely thin tinned flat copper wire on a substrate through an automatic roller-pressing laminating machine. It is soft and bendable, small and light, and has a high degree of wiring harness integration. It is not only widely used in traditional fields such as printers, plotters and copiers, but also in emerging fields such as laptops, plotters and automobiles.

[0003] As halogenated flame retardants are restricted by more and more countries, it is a future trend to realize halogen-free flame retardant for connecting wires of devices such as automobiles and laptops. At present, halogen-free flame retardants are required in the coating production process of halogen-free flame retardant connecting wires. Due to the large fineness of halogen-free flame retardants, it is not easy to disperse the materials. In the subsequent product coating process, it is easy to have adhesive surface particles and poor metal adhesion, which makes the flame retardant, metal adhesion and shielding performance of the connecting wires unstable.

[0004] At the same time, with the development of science and technology, centralized and flat FFC multi-signal transmission connection cables are becoming more and more popular in the market, but the increased centralization and flattening of transmission connection cables means that they also put forward higher requirements for electromagnetic shielding performance. Traditional transmission connection cables generally have only one or two layers of anti-electromagnetic adhesive, which is difficult to meet actual usage needs. Utility Model Content

[0005] The purpose of the utility model is to provide a halogen-free three-layer multi-signal transmission connection wire, which can effectively improve the electromagnetic shielding performance of the wire while ensuring halogen-free flame retardant performance and metal bonding performance, so as to overcome the shortcomings of the prior art.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] A halogen-free three-layer multi-signal transmission connection wire, comprising a conductor layer and an anti-electromagnetic adhesive layer; the conductor layer is symmetrically arranged on the upper surface and the lower surface of the anti-electromagnetic adhesive layer;

[0008] The conductor layer includes a first substrate layer, a halogen-free flame-retardant polyester adhesive layer and a first FFC flat conductor which are stacked in sequence, and the first substrate layer is located outside the halogen-free three-layer multi-signal transmission connecting wire, and the first FFC flat conductor is in contact with the anti-electromagnetic adhesive layer;

[0009] The anti-electromagnetic adhesive layer includes a second substrate layer, a first shielding adhesive layer, a second FFC flat conductor and at least two second shielding adhesive layers; the second substrate layer, the first shielding adhesive layer and the second FFC flat conductor are stacked in sequence; one second shielding adhesive layer is arranged between the second FFC flat conductor and one first FFC flat conductor, and another second shielding adhesive layer is arranged between the second substrate layer and another first FFC flat conductor;

[0010] The halogen-free flame-retardant polyester adhesive layer is formed by coating the first substrate layer using a micro-dimpled process.

[0011] Furthermore, the thickness of the first substrate layer is 12-28 μm; the thickness of the second substrate layer is 40-80 μm.

[0012] Furthermore, the thickness of the first substrate layer is 25 μm; the thickness of the second substrate layer is 50 μm.

[0013] Furthermore, the thickness of the halogen-free flame-retardant polyester adhesive layer is 1 to 6 μm.

[0014] Furthermore, the thickness of the halogen-free flame-retardant polyester adhesive layer is 2 μm.

[0015] Furthermore, the thickness of the first FFC flat conductor is 35-65 μm.

[0016] Furthermore, the thickness of the first shielding adhesive layer is 8 to 20 μm;

[0017] The thickness of the second shielding adhesive layer is 8-20 μm.

[0018] Furthermore, the thickness of the first shielding adhesive layer is 10 μm;

[0019] The thickness of the second shielding adhesive layer is 10 μm.

[0020] Furthermore, the first substrate layer 11 and the second substrate layer are both PET films.

[0021] Furthermore, the color of the PET film is black.

[0022] The technical solution provided by the embodiment of the present application may include the following beneficial effects: the technical solution provides a conductor layer symmetrically on the upper and lower surfaces of the anti-electromagnetic adhesive layer, and designs the structures of the conductor layer and the anti-electromagnetic adhesive layer, so that the flame retardant performance of the prepared connecting wire reaches UL94 flame retardant grade VW-1, and the metal bonding force is ≥30g. Under the premise of ensuring halogen flame retardant performance and metal bonding performance, the electromagnetic shielding performance is improved, which is more able to meet the actual use requirements. At the same time, because it is optimized on the existing structure, the technology is relatively mature, which is conducive to large-scale production, and the production cost does not change much, while the performance is improved, and the cost performance is high. In addition, the structure of the connecting wire is simple, and the anti-electromagnetic adhesive layer is used between the conductor layers to prevent electromagnetic interference. The anti-electromagnetic adhesive layer is used instead of the existing anti-magnetic film with metal foil or metal plating layer, which more effectively reduces the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 The utility model is a structural schematic diagram of a halogen-free three-layer multi-signal transmission connection wire.

[0024] Among them: conductor layer 1, first substrate layer 11, halogen-free flame-retardant polyester adhesive layer 12, first FFC flat conductor 13, anti-electromagnetic adhesive layer 2, second substrate layer 21, first shielding adhesive layer 22, second FFC flat conductor 23, second shielding adhesive layer 24. DETAILED DESCRIPTION

[0025] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0026] The technical solution provides a halogen-free three-layer multi-signal transmission connection wire, comprising a conductor layer 1 and an anti-electromagnetic adhesive layer 2; the conductor layer 1 is symmetrically arranged on the upper surface and the lower surface of the anti-electromagnetic adhesive layer 2;

[0027] The conductor layer 1 comprises a first substrate layer 11, a halogen-free flame-retardant polyester adhesive layer 12 and a first FFC flat conductor 13 which are stacked in sequence, and the first substrate layer 11 is located outside the halogen-free three-layer multi-signal transmission connecting wire, and the first FFC flat conductor 13 is in contact with the anti-electromagnetic adhesive layer 2;

[0028] The anti-electromagnetic adhesive layer 2 includes a second substrate layer 21, a first shielding adhesive layer 22, a second FFC flat conductor 23 and at least two second shielding adhesive layers 24; the second substrate layer 21, the first shielding adhesive layer 22 and the second FFC flat conductor 23 are stacked in sequence; one second shielding adhesive layer 24 is arranged between the second FFC flat conductor 23 and one first FFC flat conductor 13, and another second shielding adhesive layer 24 is arranged between the second substrate layer 21 and another first FFC flat conductor 13;

[0029] The halogen-free flame-retardant polyester adhesive layer 12 is formed by coating the first substrate layer 11 using a micro-dimpled process.

[0030] In order to improve the electromagnetic shielding performance of the connecting wire while ensuring the halogen-free flame retardant performance and metal bonding performance, this technical solution proposes a halogen-free three-layer multi-signal transmission connecting wire, such as Figure 1 As shown, it includes a conductor layer 1 and an anti-electromagnetic adhesive layer 2; the conductor layer 1 is symmetrically arranged on the upper and lower surfaces of the anti-electromagnetic adhesive layer 2, wherein the conductor layer 1 plays a role in signal transmission, and has high flame retardant performance and metal adhesion performance, the anti-electromagnetic adhesive layer 2 plays a protective role on the upper and lower surfaces of the conductor layer 1, and has high electromagnetic shielding performance, and the transmission connection wire with a three-layer structure obtained by using the conductor layer 1 and the anti-electromagnetic adhesive layer 2 improves the electromagnetic shielding performance while ensuring halogen-free flame retardant performance and metal adhesion performance; at the same time, it has a simple structure, is easy to produce, and is conducive to improving production efficiency.

[0031] Specifically, the conductor layer 1 includes a first substrate layer 11, a halogen-free flame-retardant polyester adhesive layer 12 and a first FFC flat conductor 13 which are stacked in sequence, and the first substrate layer 11 is located outside the halogen-free three-layer multi-signal transmission connecting wire, and the first FFC flat conductor 13 is in contact with the anti-electromagnetic adhesive layer 2; wherein the first substrate layer 11 has the function of isolating air, which can increase the anti-oxidation and anti-aging properties of the FFC flat conductor, and at the same time can increase the anti-bending ability of the FFC flat conductor; the halogen-free flame-retardant polyester adhesive layer 12 is arranged between the first substrate layer 11 and the first FFC flat conductor 13, which can effectively retard flames on the one hand; on the other hand, the halogen-free flame-retardant polyester adhesive layer 12 is arranged in the middle of the conductor layer 1, which reduces the effect of the performance attenuation caused by the occurrence of adhesive surface particles and low metal adhesion during the coating process, and ensures its flame retardant performance and metal adhesion performance. At the same time, coating the halogen-free flame-retardant polyester adhesive layer 12 on the first substrate layer 11 can play a role in bonding the first substrate layer 11 and the first FFC flat conductor 13, thereby ensuring the performance of the conductor layer 1 obtained.

[0032] Furthermore, the halogen-free flame retardant polyester adhesive layer 12 in the present technical solution is formed by coating the conventional halogen-free flame retardant polyester adhesive currently available on the market on the first substrate layer 11 using a micro-concave process, which is more conducive to solving the undesirable phenomena such as adhesive surface particles and poor metal adhesion in the existing ordinary gravure coating process, thereby ensuring the halogen-free flame retardant performance and metal adhesion performance of the product.

[0033] It should be noted that the conductor layer 1 is formed by coating a halogen-free flame-retardant polyester adhesive layer 12 on the first substrate layer 11, and the halogen-free flame-retardant polyester adhesive layer 12 and the first FFC flat conductor 13 are pressed together by a hot pressing composite process. The above production steps are conducive to ensuring the halogen-free flame retardant performance and metal bonding performance of the connecting wire, and reducing the thickness of the connecting wire, and at the same time, it is conducive to ensuring the bonding performance between the first substrate layer 11, the halogen-free flame-retardant polyester adhesive layer 12 and the first FFC flat conductor 13.

[0034] More specifically, the anti-electromagnetic adhesive layer 2 includes a second substrate layer 21, a first shielding adhesive layer 22, a second FFC flat conductor 23 and at least two second shielding adhesive layers 24; the second substrate layer 21, the first shielding adhesive layer 22 and the second FFC flat conductor 23 are stacked in sequence; one second shielding adhesive layer 24 is arranged between the second FFC flat conductor 23 and a first FFC flat conductor 13, and another second shielding adhesive layer 24 is arranged between the second substrate layer 21 and another first FFC flat conductor 13. The anti-electromagnetic adhesive layer 2 has at least three shielding adhesive layers, and its electromagnetic shielding performance is greatly improved compared with the existing single-layer or double-layer shielding adhesive layer, which can meet the use environment with high requirements for electromagnetic shielding performance; at the same time, the second shielding adhesive layer 24 plays a role in bonding the first FFC flat conductor 13 and the second FFC flat conductor 23 / the second substrate layer 21.

[0035] It should be noted that the first shielding adhesive layer 22 and the second shielding adhesive layer 24 in the present technical solution are both formed by coating conventional shielding adhesive currently available in the market, and the specific types are not limited here.

[0036] It should be further explained that the anti-electromagnetic adhesive layer 2 is produced by coating the second shielding adhesive layer 24 and the first shielding adhesive layer 22 on the upper surface and the lower surface of the first FFC flat conductor 13, respectively, hot pressing the first shielding adhesive layer 22 and the second FFC flat conductor 23, and then coating the second shielding adhesive layer 24 on the surface of the second FFC flat conductor 23. The above production steps are conducive to ensuring the electromagnetic shielding performance and metal bonding performance of the connecting wire, as well as the bonding performance between the layers in the anti-electromagnetic adhesive layer 2.

[0037] Therefore, the technical solution symmetrically arranges the conductor layer 1 on the upper and lower surfaces of the anti-electromagnetic adhesive layer 2, and designs the structures of the conductor layer 1 and the anti-electromagnetic adhesive layer 2, so that the flame retardant performance of the prepared connecting wire reaches UL94 flame retardant grade VW-1, and the metal bonding force is ≥30g. Under the premise of ensuring halogen flame retardant performance and metal bonding performance, the electromagnetic shielding performance is improved, which can better meet the actual use requirements. At the same time, because it is optimized on the existing structure, the technology is relatively mature, which is conducive to large-scale production, and the production cost does not change much, while the performance is improved, and the cost performance is high. In addition, the structure of the connecting wire is simple, and the anti-electromagnetic adhesive layer 2 is used between the conductor layers 1 to prevent electromagnetic interference. The anti-electromagnetic adhesive layer is used instead of the existing anti-magnetic film with metal foil or metal plating layer, which more effectively reduces the production cost.

[0038] To further illustrate, the thickness of the first substrate layer 11 is 12-28 μm; the thickness of the second substrate layer 21 is 40-80 μm.

[0039] When the thickness of the first substrate layer 11 is less than 12 μm or the thickness of the second substrate layer 22 is less than 40 μm, the formed connecting wire is easy to wrinkle, which affects the adhesion performance between the conductor layer 1 and the anti-electromagnetic adhesive layer 2, and finally affects the halogen-free flame retardant performance, metal adhesion performance and electromagnetic shielding performance of the product; when the thickness of the first substrate layer 11 is greater than 28 μm or the thickness of the second substrate layer 22 is greater than 80 μm, on the one hand, the production cost of the connecting wire is increased, and on the other hand, the overall thickness of the connecting wire is thicker, and the transportation cost and manufacturing cost are high, resulting in cost increase. Therefore, in a preferred embodiment of the present technical solution, the thickness of the first substrate layer 11 is limited to 12 to 28, and the thickness of the second substrate layer 22 is 40 to 80 μm, which can ensure the halogen-free flame retardant performance, metal adhesion performance and electromagnetic shielding performance of the connecting wire at a lower cost, and at the same time ensure that the obtained product is not easy to wrinkle and ensure the appearance of the product.

[0040] To further illustrate, the thickness of the first substrate layer 11 is 25 μm; the thickness of the second substrate layer 21 is 50 μm.

[0041] In a more preferred embodiment of the present technical solution, the thickness of the first substrate layer 11 is limited to 25 μm, and the thickness of the second substrate layer 21 is limited to 50 μm, which can not only ensure the adhesion performance between the formed conductor layer 1 and the anti-electromagnetic adhesive layer 2; but also ensure that the thickness of the obtained connecting wire is moderate, which helps to meet the demand for the use of thinner connecting wires in the prior art, while reducing production costs and transportation costs.

[0042] It is further explained that the thickness of the halogen-free flame-retardant polyester adhesive layer 12 is 1-6 μm.

[0043] When the thickness of the halogen-free flame-retardant polyester adhesive layer 12 is less than 1 μm, the bonding force between the first substrate layer 11 and the FFC flat conductor 13 is insufficient, and the first substrate layer 11 is easy to fall off; at the same time, the halogen-free flame retardant performance of the product is affected; when the thickness of the halogen-free flame-retardant polyester adhesive layer 12 is greater than 6 μm, it is easy to increase the production cost of the connecting wire. Therefore, in a preferred embodiment of the present technical solution, when the thickness of the halogen-free flame-retardant polyester adhesive layer 12 is limited to 1 to 6 μm, the bonding force between the first FET film 11 and the FFC flat conductor 13 can be met, the production cost can be saved, and the halogen-free flame retardant performance of the product can be ensured.

[0044] It is further explained that the thickness of the halogen-free flame-retardant polyester adhesive layer 12 is 2 μm.

[0045] In a more preferred embodiment of the present technical solution, the thickness of the halogen-free flame retardant polyester adhesive layer 12 is 2 μm, which is beneficial to ensuring the halogen-free flame retardant performance of the product at the lowest cost on the one hand; on the other hand, it is beneficial to control the thickness of the product, reflect the lightweight of the connecting wire, and reduce transportation costs and manufacturing costs.

[0046] To further explain, the thickness of the first FFC flat conductor 13 is 35-65 μm.

[0047] The FFC flat conductor 13 is used to transmit signals. The thickness of the first FFC flat conductor 13 can be set to 35-65 μm according to actual needs to meet actual usage requirements. When the thickness of the first FFC flat conductor 13 is greater than 65 μm, it will affect the overall softness of the manufactured connecting wire and will be difficult to bend.

[0048] Further, the thickness of the first shielding adhesive layer 22 is 8 to 20 μm;

[0049] The thickness of the second shielding adhesive layer 24 is 8-20 μm.

[0050] When the thickness of the first shielding adhesive layer 22 is less than 8μm, the electromagnetic shielding performance of the anti-electromagnetic adhesive layer 2 is insufficient, affecting the final anti-electromagnetic shielding performance of the product; at the same time, the bonding force between the second substrate layer 21 and the second FFC flat conductor 23 is insufficient, affecting the stability of the connecting wire; when the thickness of the anti-electromagnetic adhesive layer 21 is greater than 20μm, on the one hand, the electromagnetic shielding performance of the product is not greatly increased; on the other hand, the thickness of the product will increase, increasing the production cost and transportation cost of the connecting wire. Therefore, the technical solution limits the thickness of the first shielding adhesive layer 22 to 8 to 20μm, which reduces the production cost and transportation cost while satisfying the electromagnetic shielding performance of the anti-electromagnetic adhesive layer 2 and the bonding force between the second substrate layer 21 and the second FFC flat conductor 23.

[0051] Furthermore, when the thickness of the second shielding adhesive layer 24 is less than 8 μm, the electromagnetic shielding performance of the anti-electromagnetic adhesive layer 2 is insufficient, affecting the final electromagnetic shielding performance of the product; at the same time, the bonding force between the second FFC flat conductor 23 and the first FFC flat conductor 13 or the second substrate layer 21 and the first FFC flat conductor 13 is insufficient, affecting the stability of the manufactured connecting wire; when the thickness of the anti-electromagnetic adhesive layer 21 is greater than 20 μm, on the one hand, the electromagnetic shielding performance of the product is not greatly increased; on the other hand, the thickness of the product will increase, increasing or decreasing the production cost and transportation cost of the connecting wire. Therefore, the technical solution limits the thickness of the second shielding adhesive layer 24 to 8 to 20 μm, which reduces the production cost and transportation cost while satisfying the electromagnetic shielding performance of the anti-electromagnetic adhesive layer 2 and the bonding force between the second substrate layer 21 and the second FFC flat conductor 23.

[0052] It is further explained that the thickness of the first shielding adhesive layer 22 is 10 μm;

[0053] The thickness of the second shielding adhesive layer 24 is 10 μm.

[0054] In a preferred embodiment of the present technical solution, the thickness of the first shielding adhesive layer 22 and the thickness of the second shielding adhesive layer 24 are both limited to 10 μm, which can not only ensure the electromagnetic shielding performance of the obtained connecting wire, but also ensure that the thickness of the obtained connecting wire is moderate, which is conducive to reducing production costs and transportation costs.

[0055] To further explain, both the first substrate layer 11 and the second substrate layer 21 are PET films.

[0056] In a preferred embodiment of the present technical solution, the first substrate layer 11 and the second substrate layer 21 are both PET films (polyethylene terephthalate films). In addition to excellent anti-oxidation and anti-aging properties, good toughness, and high impact strength, PET films also have excellent electrical insulation and can still maintain good anti-electromagnetic interference performance at high frequencies. Therefore, in the present technical solution, the first substrate layer 11 and the second substrate layer 21 are limited to PET films, which is not only beneficial to increase the anti-bending and anti-twisting capabilities of the connecting wires, but also beneficial to increase the electromagnetic shielding performance of the connecting wires.

[0057] It is further specified that the color of the PET film is black.

[0058] In a preferred embodiment of the present technical solution, the color of the PET film is limited to black, which is more conducive to improving its electromagnetic shielding performance, thereby improving the electromagnetic shielding performance of the connecting wire.

[0059] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0060] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps described in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0061] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present utility model; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0062] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0063] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0064] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0065] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A halogen-free three-layer multi-signal transmission connection wire, characterized in that: It comprises a conductor layer and an anti-electromagnetic adhesive layer; the conductor layer is symmetrically arranged on the upper surface and the lower surface of the anti-electromagnetic adhesive layer; The conductor layer includes a first substrate layer, a halogen-free flame-retardant polyester adhesive layer and a first FFC flat conductor which are stacked in sequence, and the first substrate layer is located outside the halogen-free three-layer multi-signal transmission connecting wire, and the first FFC flat conductor is in contact with the anti-electromagnetic adhesive layer; The anti-electromagnetic adhesive layer includes a second substrate layer, a first shielding adhesive layer, a second FFC flat conductor and at least two second shielding adhesive layers; the second substrate layer, the first shielding adhesive layer and the second FFC flat conductor are stacked in sequence; one second shielding adhesive layer is arranged between the second FFC flat conductor and one first FFC flat conductor, and another second shielding adhesive layer is arranged between the second substrate layer and another first FFC flat conductor; The halogen-free flame-retardant polyester adhesive layer is formed by coating the first substrate layer using a micro-dimpled process.

2. The halogen-free three-layer multi-signal transmission connection wire according to claim 1, characterized in that: The thickness of the first substrate layer is 12 to 28 μm; the thickness of the second substrate layer is 40 to 80 μm.

3. The halogen-free three-layer multi-signal transmission connection wire according to claim 2, characterized in that: The thickness of the first substrate layer is 25 μm; the thickness of the second substrate layer is 50 μm.

4. The halogen-free three-layer multi-signal transmission connection wire according to claim 1, characterized in that: The thickness of the halogen-free flame-retardant polyester adhesive layer is 1-6 μm.

5. The halogen-free three-layer multi-signal transmission connection wire according to claim 4, characterized in that: The thickness of the halogen-free flame-retardant polyester adhesive layer is 2 μm.

6. The halogen-free three-layer multi-signal transmission connection wire according to claim 1, characterized in that: The thickness of the first FFC flat conductor is 35-65 μm.

7. The halogen-free three-layer multi-signal transmission connection wire according to claim 1, characterized in that: The thickness of the first shielding adhesive layer is 8 to 20 μm; The thickness of the second shielding adhesive layer is 8-20 μm.

8. The halogen-free three-layer multi-signal transmission connection wire according to claim 7, characterized in that: The thickness of the first shielding adhesive layer is 10 μm; The thickness of the second shielding adhesive layer is 10 μm.

9. The halogen-free three-layer multi-signal transmission connection wire according to claim 1, characterized in that: The first substrate layer and the second substrate layer are both PET films.

10. The halogen-free three-layer multi-signal transmission connection wire according to claim 9, characterized in that: The color of the PET film is black.

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