Capacitor and IGBT integral installation structure
Through the design of flip capacitors and bent stacked busbars, combined with the heat sink, the parasitic inductance and heat dissipation problems caused by the connection of the IGBT module to the DC-Link capacitor are solved, and a compact installation structure and a longer life of the IGBT module are achieved.
Patent Information
- Application Number
- CN202323277708.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-01
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2033-12-01
Smart Images

Figure CN222146001U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of inverter capacitors and IGBT installation, in particular to a DC-Link capacitor and IGBT installation technology. Background Art
[0002] IGBT modules are mainly used in inverter circuits. The DC-Link capacitor in the inverter circuit mainly smoothes the output voltage of the rectifier, absorbs the high-amplitude pulsating current required by the inverter to the DC-Link capacitor, and prevents it from generating a high-amplitude pulsating voltage on the DC-Link capacitor impedance, so that the voltage fluctuation on the DC bus remains within the allowable range. There is parasitic inductance on the conductor connecting the IGBT module and the DC-Link capacitor, which can easily cause spike voltage and damage the IGBT module. To solve this problem, laminated busbars are usually used to connect the IGBT module and the DC-Link capacitor. However, since the DC-Link capacitor requires a large design margin and is usually self-cooled, the laminated busbar occupies a large space and the capacitor has poor heat dissipation. Therefore, the use of laminated busbars and capacitors with large margins increases space requirements and usage costs. Utility Model Content
[0003] In view of the problems existing in the above background technology, the utility model proposes a DC-Link capacitor and IGBT installation structure, which has the characteristics of compact structure, small occupied space, good heat dissipation effect and small parasitic inductance.
[0004] To this end, the utility model adopts the following technical scheme: a capacitor and IGBT integral installation structure, including a fixed sheet metal frame, a capacitor, an IGBT module, a radiator and a laminated busbar, the fixed sheet metal frame is a frame-shaped structure with the bottom and front and rear sides open, the fixed bracket is provided with a mounting hole for mounting the capacitor, the capacitor is inverted inside the frame structure of the fixed bracket 1 and fastened by nuts and washers; the laminated busbar is connected to the capacitor terminal, the laminated busbar is a bent structure, one end is connected to the capacitor terminal, and the other end is connected to the IGBT module, the radiator is arranged below the IGBT module, and a fan and an air duct are installed on the radiator.
[0005] The utility model can achieve the following beneficial effects: the utility model has a compact structure, occupies a small space, is easy to connect, and greatly improves the space utilization rate through its structural design and layout; modular production and testing can be easily realized through the installation method of the utility model; the utility model shortens the connection distance between the DC-Link capacitor and the IGBT module to the greatest extent by inverting the DC-Link capacitor on the upper part of the IGBT module, greatly reduces the influence of parasitic inductance, and prolongs the service life of the IGBT. BRIEF DESCRIPTION OF THE DRAWINGS
[0006] Figure 1 The figure shows the structural diagram of the DC-Link capacitor installation method.
[0007] Figure 2 Shown is a schematic diagram of the structure of the laminated busbar connection method.
[0008] Figure 3 The figure shows the structural diagram of the DC-Link capacitor and IGBT installation method. DETAILED DESCRIPTION
[0009] The specific implementation modes of the present invention are described in detail below in conjunction with the accompanying drawings. The described embodiments are only for illustration and explanation of the present invention and do not constitute the sole limitation of the present invention.
[0010] like Figure 1 As shown, the utility model includes a DC-Link capacitor 3, an IGBT module 5, a heat sink 6, a laminated busbar 4 and a fixed sheet metal frame 1. The fixed bracket 1 is provided with a DC-Link capacitor 3 mounting hole. First, the DC-Link capacitor 3 is inverted on the fixed bracket 1 and fastened with a nut and a washer 2. Some holes are provided on the fixed bracket 1 to reduce weight and facilitate the installation of other devices. After the DC-Link capacitor 3 is fixed, the fixed bracket 1 is turned over, and the laminated busbar 4 is connected to the DC-Link capacitor 3 terminal. The laminated busbar 4 adopts a bending structure, one side is connected to the DC-Link capacitor 3 terminal, and the other side is connected to the IGBT module 5. After installation, the fan 7 and the air duct 8 are installed on the heat sink 6, the required IGBT module 5 is fixed, the laminated busbar 4 is connected and fixed to the P and N terminals of the IGBT module 5, and the fixed bracket 1 is installed on the heat sink 6.
[0011] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.
Claims
1. A capacitor and IGBT integral mounting structure, Features: The capacitor and IGBT integral mounting structure comprises a fixed sheet metal frame (1), a capacitor (3), an IGBT module (5), a heat sink (6) and a laminated busbar (4); the fixed sheet metal frame is a frame-shaped structure with the bottom and front and rear sides open; the fixed sheet metal frame (1) is provided with a mounting hole for mounting the capacitor (3); the capacitor (3) is invertedly mounted inside the frame-shaped structure of the fixed sheet metal frame (1) and fastened by nuts and washers (2); the laminated busbar (4) is connected to the wiring terminal of the capacitor (3); the laminated busbar (4) is a bent structure with one end connected to the wiring terminal of the capacitor (3) and the other end connected to the IGBT module (5); the heat sink is arranged below the IGBT module (5); and a fan (7) and an air duct (8) are installed on the heat sink (6).
2. The capacitor and IGBT integrated mounting structure according to claim 1, Features: The capacitor is a DC-Link capacitor.
3. The capacitor and IGBT integrated mounting structure according to claim 2, Features: A plurality of holes are provided on the fixed sheet metal frame (1).
