Split type jig for wafer feeding and discharging

Abstract

The utility model discloses a split type jig for wafer loading and unloading, which comprises a bottom plate and an object carrying mechanism, the object carrying mechanism comprises a first substrate, a second substrate and a lifting assembly, one end of the lifting assembly is fixedly connected with the second substrate, and the lifting assembly is used for lifting the first substrate and the second substrate upwards; a positioning rod and a plurality of clamping jaw assemblies are fixedly arranged on the first base plate, each clamping jaw assembly comprises a clamping jaw, a rotating shaft and a gear, one end of each rotating shaft is fixedly connected with the corresponding clamping jaw, the other end of each rotating shaft is fixedly connected with the corresponding gear, and chains are arranged among the gears in the clamping jaw assemblies. According to the split type jig, under the action of the lifting assembly, the first substrate and the second substrate can be lifted upwards at the same time, when the positioning rod abuts against the upper die, the first substrate is kept immovable, the second substrate continues to be lifted upwards till a wafer is tightly attached to the upper die, and the situation that the product quality is affected due to the fact that a gap is generated is avoided. The multiple clamping jaws are in transmission connection through the chain, and the multiple clamping jaws can be controlled to act at the same time.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor packaging equipment, and in particular relates to a split fixture used for loading and unloading wafers. Background Art

[0002] In current semiconductor packaging equipment, the fixture used for wafer loading and unloading is an integrated structure. When loading and unloading, the four positioning pins on the fixture will first contact the upper mold, and because the fixture is integrated, the entire fixture cannot continue to rise; it will also cause the wafer to not fit tightly against the upper mold, resulting in a gap between the wafer and the upper mold, which will affect the quality of the product. In addition, the eight clamps in the existing integrated fixture cannot be controlled at the same time, which will affect the packaging accuracy of the wafer. Utility Model Content

[0003] In view of this, in order to overcome the defects of the prior art, the purpose of the utility model is to provide a split fixture for loading and unloading wafers, which can ensure that the wafer is close to the upper mold, which is conducive to improving product quality; at the same time, multiple clamps in the fixture can also be controlled at the same time to ensure the packaging accuracy of the product.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A split fixture for loading and unloading wafers, comprising a bottom plate and a loading mechanism, wherein the loading mechanism comprises a first base plate, a second base plate and a lifting assembly, wherein one end of the lifting assembly is fixedly connected to the second base plate, and the lifting assembly is used to lift the first base plate and the second base plate upwards, so that the first base plate and the second base plate are away from the bottom plate; a positioning rod and a plurality of clamping jaw assemblies are fixedly arranged on the first base plate, each of the clamping jaw assemblies comprises a clamping jaw, a rotating shaft and a gear, one end of the rotating shaft is fixedly connected to the clamping jaw, and the other end of the rotating shaft is fixedly connected to the gear, and a chain is arranged between the clamping jaws in the plurality of clamping jaw assemblies; the second base plate is used to place wafers;

[0006] The carrier mechanism has a first state, a second state and a third state. When the carrier mechanism is in the first state, the top surface of the first substrate is in contact with the top surface of the second substrate, and the distance from the first substrate to the bottom plate is a first distance; when the carrier mechanism is in the second state, the top surface of the first substrate is in contact with the top surface of the second substrate, the positioning rod abuts against the upper mold of the semiconductor packaging device, the distance from the first substrate to the bottom plate is a second distance, and the second distance is greater than the first distance; when the carrier mechanism is in the third state, the first substrate is separated from the second substrate and the second substrate is located above the first substrate, the positioning rod abuts against the upper mold of the semiconductor packaging device, the distance from the first substrate to the bottom plate is a third distance, and the third distance is equal to the second distance.

[0007] By setting a lifting assembly and cooperating between the lifting assembly and the first substrate and the second substrate, under the action of the lifting assembly, the first substrate and the second substrate can be lifted up at the same time, and when the positioning rod on the first substrate abuts against the upper mold of the semiconductor packaging device, the first substrate can be kept stationary and the second substrate can be continuously lifted up, so that the wafer placed on the second substrate can continue to move upward until it is close to the upper mold, avoiding the generation of gaps and affecting product quality. In addition, by setting a chain to connect multiple clamps, when any one of the clamps is manually rotated, the remaining clamps can be synchronously rotated under the transmission action of the chain.

[0008] According to some preferred implementation aspects of the utility model, the lifting assembly includes a bracket, a first handle, a cross bar and a support rod, the bottom surface of the bracket is fixedly connected to the top surface of the base plate, the first handle is rotatably connected to the bracket, the first handle includes a first end and a second end, the first end is located outside the first substrate and the second substrate, the second end is located between the first substrate and the base plate, the distance from the first end to the bracket is greater than the distance from the second end to the bracket; taking the horizontal plane where the connection between the first handle and the bracket is located as the reference plane, the first end is inclined upward from the reference plane, and the second end is inclined downward from the reference plane; the cross bar is fixedly connected to the second end.

[0009] According to some preferred implementation aspects of the utility model, the support rods are fixedly arranged at both ends of the cross bar, the end of the support rod away from the cross bar penetrates through the thickness direction of the first substrate and is fixedly connected to the second substrate, and the outer periphery of the end of the support rod close to the first substrate is provided with a fixing block and a fixing column, and the support rod is slidably connected to the fixing block and the fixing column.

[0010] According to some preferred implementation aspects of the utility model, one end of the fixed block is fixedly connected to the first substrate, and the other end of the fixed block is fixedly connected to one end of the fixed column; a first elastic member is sleeved on the outer periphery of the fixed column, one end of the first elastic member abuts against one end of the fixed block close to the fixed column, and the other end of the first elastic member abuts against one end of the cross bar close to the first substrate.

[0011] According to some preferred implementation aspects of the utility model, when the object carrying mechanism is in the first state, the second state and the third state, the first elastic member is in a compressed state.

[0012] According to some preferred implementation aspects of the utility model, the lifting assembly also includes a limit plate arranged between the bottom plate and the first substrate, the limit plate includes a plate body and an extension plate perpendicular to the plate body, the extension plate is fixedly connected to one end of the plate body away from the bottom plate, and one end of the plate body away from the first substrate is fixedly connected to the bottom plate.

[0013] According to some preferred implementation aspects of the utility model, one end of the extension plate away from the plate body extends from a side of the plate body close to the cross bar toward a direction close to the cross bar, and when the carrier mechanism is in the first state, there is a gap between the extension plate and the first substrate, the cross bar is located below the extension plate, and the distance from one end of the extension plate away from the plate body to the plate body is greater than the distance from the cross bar to the plate body.

[0014] According to some preferred implementation aspects of the utility model, the clamping jaw assembly further includes a fixed module, the rotating shaft is rotatably connected to the fixed module, and the first substrate is fixedly connected to the fixed module. In some embodiments of the utility model, the fixed module includes a rotating bearing, a fixed sleeve and a fixed frame, the rotating bearing is located inside the fixed sleeve and the outer wall of the rotating bearing is fixedly connected to the inner wall of the fixed sleeve, the fixed frame fixed sleeve is arranged on the outer periphery of the fixed sleeve, and the fixed frame is fixedly connected to the first substrate.

[0015] According to some preferred implementation aspects of the present invention, the bottom surface of the positioning rod is in contact with the top surface of the first substrate, and the length of the positioning rod is greater than the sum of the thicknesses of the first substrate and the second substrate.

[0016] According to some preferred implementation aspects of the utility model, it also includes a lifting mechanism, which is located between the bottom plate and the first substrate. The lifting mechanism includes a sleeve and a connecting shaft, one end of the connecting shaft is slidably connected to the sleeve, the other end of the connecting shaft is fixedly connected to the first substrate, and the end of the sleeve away from the first substrate is fixedly connected to the bottom plate.

[0017] Due to the adoption of the above technical solution, compared with the prior art, the utility model is a split fixture for wafer loading and unloading. Under the action of the lifting assembly, the first substrate and the second substrate can be lifted up at the same time, and when the positioning rod on the first substrate abuts against the upper mold of the semiconductor packaging equipment, the first substrate can be kept stationary and the second substrate can be continuously lifted up, so that the wafer placed on the second substrate can continue to move upward until it is close to the upper mold, avoiding the generation of gaps and affecting the product quality. In addition, by setting a chain to connect multiple jaws in transmission, when any one of the jaws is manually rotated, the remaining jaws can rotate synchronously with it under the transmission action of the chain, and multiple jaws in the fixture can be controlled at the same time, which is conducive to ensuring the packaging accuracy of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the split fixture in the preferred embodiment of the utility model when it is in the first state (with the chain hidden);

[0020] Figure 2 This is a schematic diagram of the main structure of the split fixture in the preferred embodiment of the utility model when it is in the first state (the chain and the first elastic member are hidden);

[0021] Figure 3 It is a schematic diagram of the side view structure of the split fixture in the preferred embodiment of the utility model when it is in the first state with part of the structure hidden;

[0022] Figure 4 This is a schematic diagram of the main structure of the split fixture in the preferred embodiment of the utility model when it is in the third state (the chain and the first elastic member are hidden);

[0023] Figure 5 It is a schematic diagram of the structure of the chain in the clamping jaw assembly and the clamping jaw clamping assembly of the split-type fixture being wound around the gear in the preferred embodiment of the utility model;

[0024] Figure 6 This is a schematic diagram of the three-dimensional structure of the reset assembly in the preferred embodiment of the utility model;

[0025] Figure 7 It is a three-dimensional structural schematic diagram of the opening and closing degree adjustment component in the preferred embodiment of the utility model;

[0026] In the accompanying drawings: loading mechanism-1, first base plate-11, second base plate-12, lifting assembly-13, bracket-131, first handle-132, first end-d1, second end-d2, cross bar-133, support rod-134, fixing block-135, fixing column-136, first elastic member-137, plate body-138, extension plate-139, positioning rod-14, clamping claw-151, rotating shaft-152, gear-153, chain-154, fixing sleeve-155, fixing frame-156, reset assembly-16, first clamping block-161, second elastic member-162, first connecting rod-163, second connecting rod-164, opening and closing degree adjustment assembly-17, second clamping block-171, second handle-172, baffle-173, first gear slot-c 1, second gear slot-c2, third gear slot-c3, lifting mechanism-2, sleeve-21, connecting shaft-22, bottom plate-3, armrest-4, groove mark-5. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0028] Reference Figures 1 to 7 The present embodiment is a split fixture for loading and unloading wafers, comprising a carrier mechanism 1, a lifting mechanism 2 and a base plate 3. The lifting mechanism 2 is located between the carrier mechanism 1 and the base plate 3. The lifting mechanism 2 is used to support the carrier mechanism 1 to a certain extent, and can also rise as the carrier mechanism 1 is lifted upward, and fall as the carrier mechanism 1 is reset.

[0029] Furthermore, if Figures 1 to 4 As shown, the loading mechanism 1 includes a first substrate 11, a second substrate 12, a lifting assembly 13 and a clamping claw assembly, and the second substrate 12 is located above the first substrate 11. When loading and unloading, the second substrate 12 is used to place the wafer, and the lifting assembly 13 is used to lift the first substrate 11 and the second substrate 12 upward to keep the first substrate 11 and the second substrate 12 away from the bottom plate 3; in this embodiment, a positioning rod 14 is fixedly provided at each of the four corners of the first substrate 11, and there are four positioning rods 14 in total, and the bottom surface of the positioning rod 14 is in contact with the top surface of the first substrate 11 and the length of the positioning rod 14 is greater than the sum of the thickness of the first substrate 11 and the second substrate 12. The positioning rod 14 will abut against the upper mold of the semiconductor packaging equipment during the upward lifting process of the lifting assembly 13, indicating that the wafer on the second substrate 12 is close to the upper mold.

[0030] like Figure 3 As shown, the lifting assembly 13 includes a bracket 131, a first handle 132, a cross bar 133, a support bar 134 and a limit plate. The bottom surface of the bracket 131 is fixedly connected to the top surface of the bottom plate 3, and the first handle 132 is rotatably connected to the bracket 131. The first handle 132 includes a first end d1 and a second end d2. The first end d1 is located outside the first substrate 11 and the second substrate 12, and the second end d2 is located between the first substrate 11 and the bottom plate 3. The distance from the first end d1 to the bracket 131 is greater than the distance from the second end d2 to the bracket 131. Moreover, taking the horizontal plane where the first handle 132 and the bracket 131 are connected as the reference plane, the first end d1 is tilted upward from the reference plane, and the second end d2 is tilted downward from the reference plane. When it is necessary to lift the first substrate 11 and the second substrate 12 upward, the first end d1 is manually held and the first handle 132 is pushed downward with force.

[0031] The cross bar 133 is fixedly connected to the second end d2 of the first handle 132, and the length direction of the cross bar 133 is parallel to the length direction of the base plate 3. Support rods 134 are fixedly arranged at both ends of the cross bar 133. The end of the support rod 134 away from the cross bar 133 passes through the thickness direction of the first substrate 11 and is fixedly connected to the second substrate 12. The support rod 134 can move up and down relative to the first substrate 11; a fixed block 135 and a fixed column 136 are sleeved on the outer periphery of the end of the support rod 134 close to the first substrate 11. The support rod 134 is slidably connected to the fixed block 135 and the fixed column 136. One end of the fixed block 135 is fixedly connected to the first substrate 11, and the other end of the fixed block 135 is fixedly connected to one end of the fixed column 136. In addition, a first elastic member 137 is sleeved on the outer periphery of the fixing column 136, one end of the first elastic member 137 abuts against one end of the fixing block 135 close to the fixing column 136, and the other end of the first elastic member 137 abuts against one end of the cross bar 133 close to the first substrate 11. In order to ensure that the lifting assembly 13 lifts the second substrate 12 upward while also driving the first substrate 11 upward, the first elastic member 137 is set to be in a compressed state when the lifting assembly 13 is not lifted. The first elastic member 137 in this embodiment is preferably a spring.

[0032] In this embodiment, the object-carrying mechanism 1 has a first state, a second state and a third state. When the lifting assembly 13 is not lifted, the object-carrying mechanism 1 is in the first state. Figure 1 and Figure 2As shown, the top surface of the first substrate 11 is in contact with the top surface of the second substrate 12, and the distance between the first substrate 11 and the bottom plate 3 is a first distance; when the lifting assembly 13 is lifted upward until the positioning rod 14 abuts against the upper mold of the semiconductor packaging device, the carrier mechanism 1 is in a second state at this time, the top surface of the first substrate 11 is in contact with the top surface of the second substrate 12, and the distance between the first substrate 11 and the bottom plate 3 is a second distance, and the second distance is greater than the first distance; when the positioning rod 14 abuts against the upper mold of the semiconductor packaging device and the lifting assembly 13 continues to be lifted upward, the carrier mechanism 1 is in a third state at this time, the first substrate 11 is separated from the second substrate 12 and the second substrate 12 is located above the first substrate 11, as shown in FIG. Figure 4 The distance between the first substrate 11 and the bottom plate 3 is a third distance, which is equal to the second distance. When the object-carrying mechanism 1 is in the first state, the second state and the third state, the first elastic member 137 is in a compressed state.

[0033] Furthermore, the limiting plate is arranged between the bottom plate 3 and the first base plate 11, and includes a plate body 138 and an extension plate 139 perpendicular to the plate body 138. One end of the plate body 138 away from the first base plate 11 is fixedly connected to the bottom plate 3, and one end of the plate body 138 away from the bottom plate 3 is fixedly connected to the extension plate 139. One end of the extension plate 139 away from the plate body 138 extends from a side of the plate body 138 close to the cross bar 133 to a direction close to the cross bar 133, and when the object carrying mechanism 1 is in the first state, there is a gap between the extension plate 139 and the first base plate 11, the cross bar 133 is located below the extension plate 139, and the distance from one end of the extension plate 139 away from the plate body 138 to the plate body 138 is greater than the distance from the cross bar 133 to the plate body 138. The setting of the limiting plate can be used to limit the height of the lifting assembly 13 to prevent the lifting assembly 13 from being lifted too high.

[0034] Furthermore, in this embodiment, if Figure 1 and Figure 5 As shown, eight clamping assemblies are provided, and two clamping assemblies are respectively provided at the four corners of the first substrate 11; in addition, a plurality of clamping clamping assemblies are also provided on the first substrate 11, and the installation positions of the clamping clamping assemblies are as shown in FIG. Figure 5As shown, a clamping clamping assembly is provided at each corner of the first substrate 11, a clamping clamping assembly is also provided between the two corners on the left side of the first substrate 11 and between the two corners on the right side, and two clamping clamping assemblies are provided between the two corners on the upper side of the first substrate 11 and between the two corners on the lower side. Among them, the clamping jaw assembly and the clamping jaw clamping assembly both include a rotating shaft 152, a gear 153 and a fixed module. Each clamping jaw assembly also includes a clamping jaw 151. One end of the rotating shaft 152 in the clamping jaw assembly is fixedly connected to the clamping jaw 151, and the other end of the rotating shaft 152 is fixedly connected to the gear 153. The setting of the clamping jaw clamping assembly can be used to increase the clamping degree of the clamping jaw 151. One end of the rotating shaft 152 in the clamping jaw clamping assembly passes through the thickness direction of the first substrate 11 and extends toward the second substrate 12. The other end of the rotating shaft 152 is also fixedly connected to the gear 153. The gear 153 in the clamping jaw assembly and the gear 153 in the clamping jaw clamping assembly are connected by a chain 154, so that when any one of the clamping jaws 151 is manually rotated, the remaining clamping jaws 151 can rotate synchronously with it under the transmission action of the chain 154. The winding method between the chain 154 and each gear 153 is as follows: Figure 5 shown.

[0035] The fixed module includes a rotating bearing, a fixed sleeve 155 and a fixed frame 156. The rotating bearing is located inside the fixed sleeve 155 and the outer wall of the rotating bearing is fixedly connected to the inner wall of the fixed sleeve 155. The fixed frame 156 is sleeved on the outer periphery of the fixed sleeve 155 and the fixed frame 156 is fixedly connected to the first substrate 11. The setting of the fixed module can ensure that the rotating shaft 152 can rotate and also ensure the stability of the rotating shaft 152.

[0036] Furthermore, a reset assembly 16 is provided on one side of one of the clamping jaws, and an opening and closing degree adjustment assembly 17 is provided on one side of the other clamping jaws. Figure 5 and Figure 6As shown, the reset assembly 16 includes a first clamping block 161, a second elastic member 162, a first connecting rod 163 and a second connecting rod 164. The first clamping block 161 is sleeved on the outer periphery of the gear 153 of the corresponding clamping jaw clamping assembly. One end of the first clamping block 161 is fixedly connected to the first connecting rod 163, one end of the second connecting rod 164 is fixedly connected to the bottom surface of the first substrate 11, one end of the second elastic member 162 is fixedly connected to the first connecting rod 163, and the other end of the second elastic member 162 is fixedly connected to the second connecting rod 164. According to the winding method of the chain 154 in this embodiment, when the clamping jaw 151 is opened, the gear 153 connected to the reset assembly 16 rotates clockwise, driving the first clamping block 161 to rotate rightward, thereby stretching the second elastic member 162. When the clamping jaw 151 needs to be reset, the first clamping block 161 is driven to rotate by the restoring force of the second elastic member 162, and then the gear 153 connected to the first clamping block 161 is driven to rotate, and finally the clamping jaw 151 is reset. The second elastic member 162 in this embodiment is preferably a spring.

[0037] In addition, if Figure 5 and Figure 7 As shown, the opening and closing degree adjustment assembly 17 includes a second clamping block 171, a second handle 172 and a baffle 173. The second clamping block 171 is sleeved on the outer periphery of the gear 153 of the corresponding clamping claw clamping assembly. One end of the second handle 172 is rotatably connected to the second clamping block 171, and the other end of the second handle 172 is matched with the baffle 173. Specifically, in this embodiment, the baffle 173 is provided with a first gear slot c1, a second gear slot c2 and a third gear slot c3. The second gear slot c2 is located between the first gear slot c1 and the third gear slot c3. The length of the first gear slot c1 is greater than the length of the second gear slot c2, and the length of the second gear slot c2 is greater than the length of the third gear slot c3. By rotating the second handle 172 and adjusting the position of the second handle 172 on the baffle 173, the angle between the second handle 172 and the second clamp 171 can be adjusted, thereby adjusting the tightness of the second clamp 171 rotating with the gear 153. Since the gears 153 are connected by a chain 154, the opening and closing degree of the clamp 151 can be adjusted.

[0038] Furthermore, if Figure 4 As shown, the lifting mechanism 2 includes a sleeve 21 and a connecting shaft 22, one end of the connecting shaft 22 is slidably connected to the sleeve 21, the other end of the connecting shaft 22 is fixedly connected to the first substrate 11, and the end of the sleeve 21 away from the first substrate 11 is fixedly connected to the bottom plate 3. When the object-carrying mechanism 1 is in the first state, the lifting mechanism 2 can support the entire object-carrying mechanism 1; when the lifting assembly 13 lifts the first substrate 11 and the second substrate 12 upward, the connecting shaft 22 will move with the upward movement of the second substrate 12, and will not affect the movement of the second substrate 12.

[0039] Furthermore, if Figure 1 As shown, handrails 4 are also provided on both sides of the bottom plate 3 to facilitate workers to move the jig when loading and unloading materials. A groove mark 5 corresponding to the groove opening on the wafer is also fixedly provided on the second substrate 12 to facilitate positioning of the wafer when placing the wafer on the second substrate 12.

[0040] The working process of the split fixture for wafer loading and unloading of the utility model is as follows:

[0041] When loading, one of the jaws 151 is opened manually, driving the other jaws 151 to open at the same time, and the wafer is placed on the second substrate 12 with the back side facing up. The groove on the wafer corresponds to the groove mark 5 on the second substrate 12. The jaws 151 are closed, the jig is placed in the press, and the first handle 132 is pushed downward manually to drive the first substrate 11 and the second substrate 12 to move upward. When the first substrate 11 is moved to abut against the upper mold of the semiconductor packaging equipment, the first handle 132 is continued to be pushed downward to make the second substrate 12 continue to move upward. At this time, the first substrate 11 remains stationary, and only the second substrate 12 moves upward until the wafer on the second substrate 12 is tightly attached to the upper mold.

[0042] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with this technology to understand the content of the utility model and implement it accordingly. They cannot be used to limit the protection scope of the utility model. All equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A split fixture for loading and unloading wafers. It is characterized in that The invention comprises a bottom plate and a carrying mechanism, wherein the carrying mechanism comprises a first base plate, a second base plate and a lifting assembly, wherein one end of the lifting assembly is fixedly connected to the second base plate, and the lifting assembly is used to lift the first base plate and the second base plate upwards so that the first base plate and the second base plate are away from the bottom plate; a positioning rod and a plurality of clamping jaw assemblies are fixedly arranged on the first base plate, each of the clamping jaw assemblies comprises a clamping jaw, a rotating shaft and a gear, one end of the rotating shaft is fixedly connected to the clamping jaw, and the other end of the rotating shaft is fixedly connected to the gear, and a chain is arranged between the gears in the plurality of the clamping jaw assemblies; The carrier mechanism has a first state, a second state and a third state. When the carrier mechanism is in the first state, the top surface of the first substrate is in contact with the top surface of the second substrate, and the distance from the first substrate to the bottom plate is a first distance. When the carrier mechanism is in the second state, the top surface of the first substrate is in contact with the top surface of the second substrate, the positioning rod is in contact with the upper mold of the semiconductor packaging device, and the distance from the first substrate to the bottom plate is a second distance, which is greater than the first distance. When the carrier mechanism is in the third state, the first substrate is separated from the second substrate and the second substrate is located above the first substrate, the positioning rod is in contact with the upper mold of the semiconductor packaging device, and the distance from the first substrate to the bottom plate is a third distance, which is equal to the second distance.

2. The split fixture according to claim 1, It is characterized in that The lifting assembly includes a bracket, a first handle, a cross bar and a support rod. The bottom surface of the bracket is fixedly connected to the top surface of the base plate. The first handle is rotatably connected to the bracket. The first handle includes a first end and a second end. The first end is located outside the first substrate and the second substrate, and the second end is located between the first substrate and the base plate. The distance from the first end to the bracket is greater than the distance from the second end to the bracket. Taking the horizontal plane where the first handle and the bracket are connected as the reference plane, the first end is inclined upward from the reference plane, and the second end is inclined downward from the reference plane. The cross bar is fixedly connected to the second end.

3. The split fixture according to claim 2, It is characterized in that The support rods are fixedly arranged at both ends of the cross rod, and the end of the support rod away from the cross rod penetrates the thickness direction of the first substrate and is fixedly connected to the second substrate. A fixing block and a fixing column are sleeved on the outer periphery of the end of the support rod close to the first substrate, and the support rod is slidably connected to the fixing block and the fixing column.

4. The split fixture according to claim 3, It is characterized in that One end of the fixing block is fixedly connected to the first substrate, and the other end of the fixing block is fixedly connected to one end of the fixing column; a first elastic member is sleeved on the outer periphery of the fixing column, one end of the first elastic member abuts against one end of the fixing block close to the fixing column, and the other end of the first elastic member abuts against one end of the cross bar close to the first substrate.

5. The split fixture according to claim 4, It is characterized in that When the object carrying mechanism is in the first state, the second state and the third state, the first elastic member is in a compressed state.

6. The split fixture according to claim 2, It is characterized in that The lifting assembly also includes a limit plate arranged between the bottom plate and the first substrate, the limit plate includes a plate body and an extension plate perpendicular to the plate body, the extension plate is fixedly connected to one end of the plate body away from the bottom plate, and the end of the plate body away from the first substrate is fixedly connected to the bottom plate.

7. The split fixture according to claim 6, It is characterized in that One end of the extension plate away from the plate body extends from a side of the plate body close to the cross bar toward a direction close to the cross bar. When the carrier mechanism is in the first state, there is a gap between the extension plate and the first substrate, the cross bar is located below the extension plate, and the distance from one end of the extension plate away from the plate body to the plate body is greater than the distance from the cross bar to the plate body.

8. The split fixture according to claim 1, It is characterized in that The clamping jaw assembly further comprises a fixed module, the rotating shaft is rotatably connected to the fixed module, and the first substrate is fixedly connected to the fixed module.

9. The split fixture according to claim 1, It is characterized in that The bottom surface of the positioning rod is in contact with the top surface of the first substrate, and the length of the positioning rod is greater than the sum of the thickness of the first substrate and the second substrate.

10. The split fixture according to claim 1, It is characterized in that It also includes a lifting mechanism, which is located between the bottom plate and the first substrate. The lifting mechanism includes a sleeve and a connecting shaft. One end of the connecting shaft is slidably connected to the sleeve, the other end of the connecting shaft is fixedly connected to the first substrate, and one end of the sleeve away from the first substrate is fixedly connected to the bottom plate.

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