Lead frame for clip packaging

Abstract

The utility model belongs to the field of lead frames, particularly relates to a lead frame for clip packaging, and aims to solve the problems that after an existing chip is formed and cut off, manufacturers of other parts except the chip need to re-melt and re-manufacture the lead frame, the production procedures are more, the manufacturing cost is too high, the product profit is reduced, and the production cost is reduced. In order to solve the problems of inconvenience in connection and inconvenience in continuous operation among a plurality of traditional lead frames, the utility model provides the following scheme: the lead frame comprises an outer frame and a plurality of inner frames, the plurality of inner frames are arranged in the outer frame, two sides of each inner frame are respectively and fixedly connected with a connecting rod, and a chip body is welded between the two connecting rods. Through the arrangement of the connecting rod, the chip body and the connecting rod are welded, after the outer frame is packaged in the chip body, the used outer frame is recycled by an original manufacturer, and then lacked parts are welded, so that the outer frame is convenient to reuse.

Description

Technical Field

[0001] The utility model relates to the technical field of lead frames, in particular to a lead frame for clip packaging. Background Art

[0002] Lead frame is the chip carrier of integrated circuit. It is a key structural component that uses bonding materials to realize the electrical connection between the internal circuit lead end of the chip and the external lead to form an electrical circuit. It plays a bridge role in connecting with external wires. Lead frame is needed in most semiconductor integrated blocks.

[0003] After the chip is formed and cut, the lead frame used in the existing clip packaging needs to be re-melted and melted to manufacture the lead frame again. There are many production processes and the manufacturing cost is too high, which reduces product profits. Traditional multiple lead frames are not easy to connect and are not convenient for continuous operation. Utility Model Content

[0004] The purpose of the utility model is to solve the problem in the prior art that after the chip is formed and cut off, the other parts except the chip need to be re-melted and melted to manufacture the lead frame again, the production process is complicated and the manufacturing cost is too high, which reduces the product profit, and the traditional multiple lead frames are not convenient to connect and not convenient for continuous operation. A lead frame for clip packaging is proposed to solve the problem that the chip is not formed and cut off in the prior art, and the other parts except the chip need to be re-melted and melted to manufacture the lead frame again, the production process is complicated and the manufacturing cost is too high, which reduces the product profit.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A lead frame for clip packaging, comprising an outer frame and a plurality of inner frames, wherein the plurality of inner frames are arranged inside the outer frame, connecting rods are fixedly connected to both sides of the inner frame, and a chip body is welded between two connecting rods;

[0007] A plurality of first identification holes and alignment grooves are respectively provided on both sides of the outer frame, and the plurality of first identification holes and alignment grooves are alternately and evenly distributed;

[0008] A plurality of second identification holes are formed on the upper surface of the outer frame, and the second identification holes are all located on the left side of the inner frame.

[0009] In a possible design, one end of the outer frame is fixedly connected to a first connecting plate, the other end of the outer frame is fixedly connected to a second connecting plate, one side of the first connecting plate is fixedly connected to a plurality of inclined fixing blocks, one side of the second connecting plate is provided with a plurality of fixing grooves that cooperate with the fixing blocks, and the inclination directions of two adjacent fixing blocks are opposite.

[0010] In a possible design, a side wall of the alignment groove is provided with an inclined surface.

[0011] In a possible design, the distance between the two connecting bars is the same as the width of the chip body.

[0012] In a possible design, the two adjacent outer frames are installed from top to bottom.

[0013] In the present application, when in use, the produced chip body is placed in the corresponding inner frame, and then the connecting rods in the inner frame and the chip body are welded to form the chip body and the outer frame into a whole for subsequent use;

[0014] When packaging the chip body, the alignment groove facilitates accurate positioning, and the inclined surface of the side wall of the alignment groove can improve the error tolerance during docking and avoid inaccurate alignment;

[0015] The first identification hole and the second identification hole on both sides of the outer frame facilitate accurate and rapid identification of the outer frame;

[0016] The chip body and the connecting rod are welded, and the outer frame is an integral one. After the chip body is packaged, the used outer frame is recycled by the original manufacturer and the missing parts are welded on, which is convenient for the reuse of the outer frame, reduces the cost of materials, increases the profit of the product, and only requires one process;

[0017] When the two outer frames are spliced ​​together, the fixing block on the first connecting plate is placed above the fixing groove on the second connecting plate, and then the fixing blocks are respectively installed in the inside of the fixing grooves, so as to facilitate the splicing of the two outer frames and facilitate continuous operation. The inclination directions of the two adjacent fixing blocks are opposite, which can prevent the two outer frames from shaking.

[0018] In the utility model, the lead frame for clip packaging is provided with connecting rods, and the chip body and the connecting rods are welded. When the chip body is packaged, the used frame is recycled by the original manufacturer and the missing parts are welded on, so that the frame can be reused.

[0019] In the utility model, the lead frame for clip packaging is provided with a plurality of fixing blocks, the fixing blocks on the first connecting plate are placed above the fixing grooves on the second connecting plate, and then the fixing blocks are respectively installed inside the fixing grooves, so as to facilitate the splicing of the two outer frames and facilitate continuous operation; BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the main structure of a lead frame for clip packaging proposed by the utility model;

[0021] Figure 2 This is a schematic diagram of the outer frame structure of a lead frame for clip packaging proposed by the utility model;

[0022] Figure 3 This is a schematic diagram of the outer frame connection relationship structure of a lead frame for clip packaging proposed by the utility model;

[0023] Figure 4 The utility model is a schematic diagram of the inner frame structure of a lead frame for clip packaging.

[0024] In the figure: 1. outer frame; 2. inner frame; 3. chip body; 4. connecting rod; 5. first identification hole; 6. alignment groove; 7. second identification hole; 8. first connecting plate; 9. second connecting plate; 10. inclined surface; 11. fixing groove; 12. fixing block. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0026] Example 1

[0027] Reference Figure 1-Figure 4 A lead frame is used in the field of lead frames and can also be used in other fields of the present application, comprising: an outer frame 1 and a plurality of inner frames 2, wherein the plurality of inner frames 2 are arranged inside the outer frame 1, and connecting rods 4 are fixedly connected to both sides of the inner frame 2, and a chip body 3 is welded between the two connecting rods 4;

[0028] A plurality of first identification holes 5 and alignment grooves 6 are respectively provided on both sides of the outer frame 1, and the plurality of first identification holes 5 and alignment grooves 6 are alternately and evenly distributed;

[0029] A plurality of second identification holes 7 are provided on the upper surface of the outer frame 1, and the second identification holes 7 are all located on the left side of the inner frame 2;

[0030] One end of the outer frame 1 is fixedly connected to a first connecting plate 8, and the other end of the outer frame 1 is fixedly connected to a second connecting plate 9. One side of the first connecting plate 8 is fixedly connected to a plurality of obliquely arranged fixing blocks 12, and one side of the second connecting plate 9 is provided with a plurality of fixing grooves 11 matched with the fixing blocks 12, and the inclination directions of two adjacent fixing blocks 12 are opposite;

[0031] In the above technical scheme, the chip body 3 and the connecting rod 4 are welded, and the outer frame 1 is an integral part. When the outer frame 1 is packaged after the chip body 3 is completed, the used outer frame 1 is recycled by the original manufacturer and then the missing parts are welded on, which is convenient for the reuse of the outer frame 1, reduces the cost of materials, and increases the profit of the product. Only one process is required. When the chip body 1 is packaged, the alignment groove 6 is convenient for precise positioning, and the first identification hole 5 and the second identification hole 7 are convenient for accurate and rapid identification of the outer frame 1. When the two outer frames 1 are spliced ​​together, the fixing block 12 on the first connecting plate 8 is placed above the fixing groove 11 on the second connecting plate 9, and then the fixing blocks 12 are respectively installed in the fixing grooves 11, which is convenient for splicing the two outer frames 1 and continuous operation. The inclination directions of the two adjacent fixing blocks 12 are opposite, which can prevent the two outer frames 1 from shaking.

[0032] Example 2

[0033] refer to Figure 4 , improved on the basis of Example 1:

[0034] A lead frame for clip packaging;

[0035] The side wall of the alignment groove 6 is provided with an inclined surface 10;

[0036] The distance between the two connecting rods 4 is the same as the width of the chip body 3;

[0037] The installation method of two adjacent outer frames 1 is from top to bottom;

[0038] In the above technical solution, the inclined surface 10 of the side wall of the alignment groove 6 can improve the error tolerance during docking and avoid inaccurate alignment. The spacing between the two connecting rods 4 and the width of the chip body 3 are the same, which is convenient for welding.

[0039] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A lead frame for clip packaging, characterized in that: include: An outer frame (1) and a plurality of inner frames (2), wherein the plurality of inner frames (2) are arranged inside the outer frame (1), connecting rods (4) are fixedly connected to both sides of the inner frame (2), and a chip body (3) is welded between two connecting rods (4); A plurality of first identification holes (5) and alignment grooves (6) are respectively provided on both sides of the outer frame (1), and the plurality of first identification holes (5) and alignment grooves (6) are alternately and evenly distributed; A plurality of second identification holes (7) are provided on the upper surface of the outer frame (1), and the second identification holes (7) are all located on the left side of the inner frame (2).

2. A lead frame for clip packaging according to claim 1, characterized in that: One end of the outer frame (1) is fixedly connected to a first connecting plate (8), and the other end of the outer frame (1) is fixedly connected to a second connecting plate (9); one side of the first connecting plate (8) is fixedly connected to a plurality of inclined fixing blocks (12); one side of the second connecting plate (9) is provided with a plurality of fixing grooves (11) that match the fixing blocks (12); and the inclination directions of two adjacent fixing blocks (12) are opposite.

3. A lead frame for clip packaging according to claim 1, characterized in that: The side wall of the alignment groove (6) is provided with an inclined surface (10).

4. A lead frame for clip packaging according to claim 1, characterized in that: The spacing between the two connecting rods (4) and the width of the chip body (3) are the same.

5. A lead frame for clip packaging according to claim 2, characterized in that: The two adjacent outer frames (1) are installed from top to bottom.

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