Optoelectronic device coupler
By adopting detachable fixed plate, heat dissipation silicone and bending plate designs in the optoelectronic device coupler, the problem of heat accumulation of the optoelectronic device is solved, effective heat dissipation and convenient installation are achieved, and safety and applicability are improved.
Patent Information
- Application Number
- CN202420755893.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-12
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-04-12
AI Technical Summary
Existing optocouplers will accumulate heat during use, causing temperature to rise, damage to internal parts and reducing safety.
An optoelectronic device coupler is designed, using a detachable fixed plate and heat dissipation silicone, combined with a bent plate and support foot, heat dissipation using a heat dissipation tank and flowing air, and convenient installation is achieved through a rotating plate and limiting tank. Fixing bolts and adjustment plates are adapted to different heights.
It effectively reduces the temperature of the coupler during operation, improves safety, and increases installation convenience and applicability.
Smart Images

Figure CN222146231U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of couplers, in particular to an optoelectronic device coupler. Background Art
[0002] An optocoupler is a voltage isolation device that transmits electrical signals between two isolated circuits through optical signals. Existing optocouplers mainly include two electrically isolated lead frames, a light emitting chip disposed on the lead frames, and a photosensitive chip disposed on another lead frame.
[0003] According to the Chinese patent publication number: CN209516028U, the coupler includes an upper coupler and a lower coupler, the upper coupler includes a plurality of pins, the rear end of each pin is connected to a wire for wiring, the rear end of the pin is injection molded with a first base, the rear end of the pin is integrally formed with a rivet head, the pin is provided with an annular protrusion, the end of the wire is connected with a metal ring, the upper end of the rivet head presses the metal ring to the annular protrusion through a riveting process, the rear end of the first base is provided with openings corresponding to the positions of each rivet head, the pin is provided with a conical annular groove, the conical annular groove is narrow at the top and wide at the bottom, the lower end of the first base is integrally formed with a conical protrusion covering the conical annular groove, the conical protrusion is wide at the top and narrow at the bottom, and the gap between the outer surface of the conical protrusion and the inner wall of the conical annular groove is evenly set.
[0004] In the above scheme, the upper coupler and the lower coupler are inserted together, resulting in the following disadvantages: when the coupler is in use, the bottom surface will fit with the top surface of the mounting surface, causing heat accumulation in the coupler during use, increasing the temperature of the coupler during operation, and easily causing the internal parts of the coupler to be damaged due to high temperature, thereby reducing the safety of the coupler during use. Utility Model Content
[0005] The purpose of the utility model is to provide an optoelectronic device coupler to solve the problem that heat accumulates when the coupler is in use, which increases the temperature of the coupler during operation, easily causes parts inside the coupler to be damaged due to high temperature, and reduces the safety of the coupler during use.
[0006] In order to achieve the above-mentioned purpose of the utility model, the utility model adopts the following technical scheme: an optoelectronic device coupler, including a coupler body, a fixing plate detachably provided on the bottom surface of the coupler body, a mounting opening provided on the top surface of the fixing plate, a mounting plate fixed inside the mounting opening, heat dissipation silica gel fixed on the top surface of the mounting plate, a plurality of heat dissipation grooves respectively provided on the four sides of the fixing plate, a plurality of bending plates respectively fixed on the two sides of the coupler body, and support feet slidably provided on the bottom surface of the bending plates.
[0007] Preferably, fixed columns are fixed on both sides of the fixed plate, a rotating plate is rotatably inserted on the fixed column, a limiting groove is opened on one side of the rotating plate, and limiting columns are fixed on both sides of the coupler body, and the limiting columns are slidably inserted into the limiting groove.
[0008] Preferably, a placement groove is provided on the top surface of the coupler body, a storage frame is fixed to the inner bottom surface of the placement groove, and a removal outlet is provided on the top surface of the storage frame.
[0009] Preferably, an adjustment plate is fixed to the bottom surface of the bending plate, a storage groove is provided on the top surface of the supporting foot, and the adjustment plate is slidably inserted into the storage groove.
[0010] Preferably, fixing holes are respectively opened on both sides of the storage groove, a threaded hole is opened on one side of the adjustment plate, a fixing bolt is rotatably inserted in the fixing hole, and one end of the fixing bolt passes through the fixing hole and is threadedly connected to the threaded hole.
[0011] Preferably, two extrusion arc blocks are fixed to the top surface of the coupler body.
[0012] Compared with the prior art, an optoelectronic device coupler using the above technical solution has the following features:
[0013] Beneficial effects:
[0014] 1. When the coupler body is in use, the supporting feet and the bending plate are used to install the coupler body in the designated position. When the coupler body is in the working state, the fixing plate is at the bottom surface of the coupler body. The heat generated by the coupler body during operation will be guided by the heat dissipation silicone and absorbed by the mounting plate, and the heat can be transferred to the mounting plate. When the environment in which the coupler body is located is in the heat dissipation state, the air flowing in the environment will pass through the heat dissipation slot and flow inside the mounting port. The flowing air will take out the heat in the mounting plate, reducing the temperature of the coupler body during operation.
[0015] Second, when installing the fixing plate on the bottom surface of the coupler body, the staff will first rotate the rotating plate, and the rotating rotating plate will store the limit column inside the limit groove, so that the fixing plate can be fixed on the bottom surface of the coupler body. The staff will place the model of the coupler body inside the storage frame, which is convenient for the staff to select the appropriate model of the coupler body according to the needs and install it on the corresponding electronic device, which increases the convenience of the staff in selecting the appropriate coupler body;
[0016] 3. In order to use installation locations at different heights, the staff will first unscrew the fixing bolts from the inside of the threaded hole, and then move the support feet down and drive the storage slot to slide downward on the surface of the adjustment plate, thereby increasing the total length of the bending plate and the support feet to adapt to installation points at different heights, thereby increasing the applicability of the coupler body when in use. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a three-dimensional schematic diagram of an embodiment.
[0018] Figure 2 It is an exploded perspective schematic diagram of an embodiment.
[0019] Figure 3 It is an exploded schematic diagram of the fixing plate and the mounting plate in the embodiment.
[0020] Figure 4 It is a schematic diagram of the explosion of the bending plate and the adjusting plate in the embodiment.
[0021] In the figure: 1. Coupler body; 2. Fixing plate; 3. Mounting port; 4. Mounting plate; 5. Heat dissipation silicone; 6. Heat dissipation slot; 7. Bending plate; 8. Fixing column; 9. Rotating plate; 10. Limiting slot; 11. Limiting column; 12. Placement slot; 13. Storage frame; 14. Removal port; 15. Extrusion arc block; 16. Support foot; 17. Storage slot; 18. Adjustment plate; 19. Fixing hole; 20. Threaded hole; 21. Fixing bolt. DETAILED DESCRIPTION
[0022] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.
[0023] like Figure 1-Figure 3 As shown, an optoelectronic device coupler includes a coupler body 1, a fixing plate 2 is detachably provided on the bottom surface of the coupler body 1, a mounting opening 3 is provided on the top surface of the fixing plate 2, a mounting plate 4 is fixed inside the mounting opening 3, a heat dissipation silica gel 5 is fixed on the top surface of the mounting plate 4, a plurality of heat dissipation grooves 6 are respectively provided on the four sides of the fixing plate 2, a plurality of bending plates 7 are respectively fixed on the two sides of the coupler body 1, and support feet 16 are slidably provided on the bottom surface of the bending plate 7.
[0024] During use, the coupler body 1 is installed at a designated position using the supporting feet 16 and the bending plate 7. When the coupler body 1 is in working condition, the fixing plate 2 is at the bottom surface of the coupler body 1. The heat generated by the coupler body 1 during operation will be guided by the heat dissipating silica gel 5 and absorbed by the mounting plate 4, and the heat can be transferred to the mounting plate 4. When the environment in which the coupler body 1 is located is in a heat dissipating state, the air flowing in the environment will pass through the heat dissipating groove 6 and flow inside the mounting port 3. The flowing air will take out the heat in the mounting plate 4, thereby reducing the temperature of the coupler body 1 during operation.
[0025] like Figure 1 and Figure 2 As shown, fixed columns 8 are fixed on both sides of the fixed plate 2, and a rotating plate 9 is rotatably inserted on the fixed column 8. A limiting groove 10 is provided on one side of the rotating plate 9. Limiting columns 11 are fixed on both sides of the coupler body 1, and the limiting columns 11 are slidably inserted in the limiting groove 10. A placement groove 12 is provided on the top surface of the coupler body 1, and a storage frame 13 is fixed on the inner bottom surface of the placement groove 12, and a removal outlet 14 is provided on the top surface of the storage frame 13.
[0026] During use, when installing the fixed plate 2 on the bottom surface of the coupler body 1, the staff will first rotate the rotating plate 9, and the rotating rotating plate 9 will store the limit column 11 inside the limit groove 10, so that the fixed plate 2 can be fixed on the bottom surface of the coupler body 1. The staff will place the model of the coupler body 1 inside the storage frame 13, which is convenient for the staff to select the appropriate model of the coupler body 1 according to needs and install it on the corresponding electronic device, thereby increasing the convenience of the staff in selecting the appropriate coupler body 1.
[0027] like Figure 2 and Figure 4 As shown, an adjusting plate 18 is fixed to the bottom surface of the bending plate 7, a storage groove 17 is provided on the top surface of the supporting foot 16, the adjusting plate 18 and the storage groove 17 are slidably inserted, fixing holes 19 are respectively provided on both sides of the storage groove 17, a threaded hole 20 is provided on one side of the adjusting plate 18, a fixing bolt 21 is rotatably inserted in the fixing hole 19, one end of the fixing bolt 21 passes through the fixing hole 19 and is threadedly connected to the threaded hole 20, and two extrusion arc blocks 15 are fixed to the top surface of the coupler body 1.
[0028] During use, in order to use installation locations at different heights, the staff will first unscrew the fixing bolt 21 from the inside of the threaded hole 20, and then the staff will move the supporting foot 16 downward and drive the storage slot 17 to slide downward on the surface of the adjustment plate 18, thereby increasing the total length of the bending plate 7 and the supporting foot 16 to adapt to installation points at different heights, thereby increasing the applicability of the coupler body 1 during use.
[0029] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. An optoelectronic device coupler, comprising a coupler body (1), characterized in that: The bottom surface of the coupler body (1) is detachably provided with a fixing plate (2), the top surface of the fixing plate (2) is provided with a mounting opening (3), a mounting plate (4) is fixed inside the mounting opening (3), a heat dissipation silica gel (5) is fixed to the top surface of the mounting plate (4), a plurality of heat dissipation grooves (6) are respectively provided on four sides of the fixing plate (2), a plurality of bending plates (7) are respectively fixed on two sides of the coupler body (1), and a support foot (16) is slidably provided on the bottom surface of the bending plate (7).
2. An optoelectronic device coupler according to claim 1, characterized in that: Fixed columns (8) are fixed on both sides of the fixed plate (2), a rotating plate (9) is rotatably inserted on the fixed column (8), a limiting groove (10) is provided on one side of the rotating plate (9), and limited columns (11) are fixed on both sides of the coupler body (1), and the limited columns (11) are slidably inserted into the limited groove (10).
3. The optoelectronic device coupler according to claim 1, characterized in that: The top surface of the coupler body (1) is provided with a placement groove (12), the inner bottom surface of the placement groove (12) is fixed with a storage frame (13), and the top surface of the storage frame (13) is provided with a removal outlet (14).
4. The optoelectronic device coupler according to claim 1, characterized in that: An adjusting plate (18) is fixed to the bottom surface of the bending plate (7), a storage groove (17) is provided on the top surface of the supporting foot (16), and the adjusting plate (18) and the storage groove (17) are slidably inserted.
5. The optoelectronic device coupler according to claim 4, characterized in that: The storage groove (17) is provided with fixing holes (19) on both sides thereof, and the adjustment plate (18) is provided with a threaded hole (20) on one side thereof. A fixing bolt (21) is rotatably inserted into the fixing hole (19), and one end of the fixing bolt (21) passes through the fixing hole (19) and is threadedly connected to the threaded hole (20).
6. The optoelectronic device coupler according to claim 1, characterized in that: Two extrusion arc blocks (15) are fixed on the top surface of the coupler body (1).
Citation Information
Cited By
Optoelectronic device coupler
CN223694242U
