Cover plate assembly, battery, energy storage equipment and electric equipment

Abstract

The utility model discloses a cover plate assembly, a battery, energy storage equipment and electric equipment. The cover plate assembly comprises a cover plate and an insulating plate, the insulating plate is arranged on one side of the cover plate, the cover plate and the insulating plate are provided with pole holes allowing poles to penetrate through, and the insulating plate is provided with chip embedding holes used for fixing chips. According to the cover plate assembly provided by the embodiment of the utility model, the chip can be fixed in the chip embedding hole by arranging the chip embedding hole on the insulating plate, so that the chip and the insulating plate are connected more tightly, the chip and the cover plate assembly are connected more tightly, the looseness and displacement of the chip are reduced, and the reliability of the cover plate assembly is improved. The stability and reliability of chip function operation can be improved, and the structure compactness of the cover plate assembly can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of power batteries, and in particular to a cover plate assembly, a battery, an energy storage device and an electrical device. Background Art

[0002] Power batteries are the heart of new energy vehicles and are crucial to their development. However, with the rapid development of vehicle electrification, the safety of power batteries has attracted widespread attention.

[0003] In the related art, in order to improve the safety of power batteries, a chip including a detection structure is provided, and the chip can monitor the changes in the internal state of the battery pack to provide safety warnings. However, the chip is fixed in the battery by a wiring harness, which is prone to loosening and detachment. Therefore, there is room for improvement. Utility Model Content

[0004] The utility model aims to solve at least one of the above technical problems in the prior art to a certain extent. To this end, the utility model provides a cover plate assembly, which can embed a chip into an insulating plate to improve the stability and reliability of chip fixing.

[0005] The utility model also provides a battery.

[0006] The utility model also provides an energy storage device.

[0007] The utility model also provides an electric device.

[0008] According to an embodiment of the utility model, the cover plate assembly includes a cover plate and an insulating plate, wherein the insulating plate is arranged on one side of the cover plate, the cover plate and the insulating plate are provided with pole holes for poles to pass through, and the insulating plate is provided with a chip embedding hole for fixing the chip.

[0009] According to the cover assembly of the embodiment of the utility model, by setting a chip embedding hole on the insulating plate, the chip can be fixed in the chip embedding hole, so that the chip and the insulating plate are more closely connected, thereby the chip and the cover assembly are more closely connected, reducing the looseness and displacement of the chip, which is beneficial to improving the stability and reliability of the chip function operation, and also beneficial to improving the structural compactness of the cover assembly.

[0010] In some embodiments, the chip embedding hole is disposed on a surface of the insulating plate facing away from the cover plate.

[0011] In some embodiments, the cover assembly also includes a chip fixing buckle, which is arranged on the insulating plate, and a chip accommodating space for fixing the chip is formed between the chip fixing buckle and the chip embedding hole, and the chip fixing buckle is used to fix the chip in the chip embedding hole.

[0012] In some embodiments, a slot is provided on the insulating plate, one end of the chip fixing buckle is snapped into the slot, and the other end of the chip fixing buckle is used to enclose the chip accommodating space together with the hole wall of the chip embedding hole.

[0013] In some embodiments, the electrode post hole includes a positive electrode post hole and a negative electrode post hole, and the chip embedding hole is located between the positive electrode post hole and the negative electrode post hole.

[0014] In some embodiments, the chip embedding hole is a blind hole, the depth of the chip embedding hole ranges from 0.5mm to 7mm, and in the axial direction of the chip embedding hole, the remaining thickness of the insulating plate ranges from 0.5mm to 7.5mm; and / or the thickness of the cover plate ranges from 0.5mm to 5mm.

[0015] In some embodiments, the chip embedding hole has a length ranging from 2 mm to 25 mm and a width ranging from 2 mm to 20 mm.

[0016] In some embodiments, the pole hole is a positive pole hole, injection holes are provided on the cover plate and the insulating plate, and the chip embedding hole is located between the positive pole hole and the injection hole.

[0017] In some embodiments, the pole hole is a negative pole hole, explosion-proof valve holes are provided on the cover plate and the insulating plate, and the chip embedding hole is located between the negative pole hole and the explosion-proof valve hole.

[0018] In some embodiments, the chip embedding hole is a blind hole, the depth of the chip embedding hole ranges from 0.5mm to 4mm, and in the axial direction of the chip embedding hole, the remaining thickness of the insulating plate ranges from 0.5mm to 3.5mm; and / or the thickness of the cover plate ranges from 0.5mm to 5mm.

[0019] In some embodiments, the chip embedding hole has a length ranging from 2 mm to 25 mm and a width ranging from 2 mm to 20 mm.

[0020] The battery according to the second embodiment of the utility model comprises a positive pole, a negative pole, a shell body, a chip assembly and a cover assembly according to the embodiment of the utility model. At least one of the positive pole and the negative pole is arranged in the pole hole; at least one end of the shell body is an open end, and the cover assembly is arranged at the open end; the chip assembly comprises a chip, a positive pole piece and a negative pole piece, the chip is embedded in the chip embedding hole and comprises a circuit board and a detection structure, the circuit board has an integrated circuit, the detection structure is electrically connected to the circuit board, one end of the positive pole piece is electrically connected to the circuit board, the other end of the positive pole piece is suitable for connecting to the positive pole, one end of the negative pole piece is electrically connected to the circuit board, and the other end of the negative pole piece is suitable for connecting to the negative pole.

[0021] According to the battery of the embodiment of the utility model, on the one hand, the chip can be embedded in the chip embedding hole, and the chip is more firmly and stably fixed on the cover plate assembly, which improves the integration degree of the chip assembly and the cover plate assembly, thereby improving the structural integration degree of the chip assembly and the battery, and is also conducive to improving the compactness of the structure; the detection structure is electrically connected to the circuit board, and the circuit board and the battery are electrically connected through the positive electrode and the negative electrode, that is, the battery can power the detection structure, and then the battery can power the chip assembly, and the battery and the chip assembly form an integrated self-powered battery chip assembly, without the need to set an external power supply to power the chip assembly, thereby improving the integration of the battery and the chip assembly. The chip assembly is arranged inside the battery housing, and the chip assembly can monitor a single battery, and can effectively monitor the temperature, air pressure and stress changes of the battery, and more accurately reflect the internal state of the battery. In addition, by setting a chip embedding hole on the insulating plate, the chip can be fixed in the chip embedding hole, so that the chip is more closely connected to the insulating plate, so that the chip and the cover plate assembly are more closely connected, reducing the looseness and displacement of the chip, which is conducive to improving the stability and reliability of the chip function operation.

[0022] In some embodiments, the chip further includes a wireless transmission structure, the wireless transmission structure is electrically connected to the circuit board, and the wireless transmission structure is at least used to transmit the signal detected by the detection structure to an external device via wireless communication.

[0023] In some embodiments, the battery further includes a pole core, which is disposed in the shell body, and has a positive pole tab and a negative pole tab, the positive pole piece and the positive pole tab are connected to the positive pole column, and the negative pole piece and the negative pole tab are connected to the negative pole column.

[0024] In some embodiments, the detection structure includes a detection belt, one end of which is connected to the circuit board, and the other end of which is suitable for being inserted into the pole core.

[0025] In some embodiments, the cover plate assembly includes a positive cover plate assembly and a second negative cover plate assembly, the positive cover plate assembly is arranged at one end of the shell body, the positive cover plate assembly has the chip embedding hole, the positive electrode column is arranged on the positive cover plate assembly, the second negative electrode cover plate assembly is arranged at the other end of the shell body, and the negative electrode column is arranged in the negative electrode column hole on the second negative electrode cover plate assembly.

[0026] In some embodiments, the cover plate assembly includes a negative cover plate assembly and a second positive cover plate assembly, the negative cover plate assembly is arranged at one end of the shell body, the negative cover plate assembly has the chip embedding hole, the negative electrode column is arranged on the negative cover plate assembly, the second positive electrode cover plate assembly is arranged at the other end of the shell body, and the positive electrode column is arranged in the positive electrode column hole on the second positive cover plate assembly.

[0027] In some embodiments, the positive electrode member is electrically connected to the circuit board via a first wire; and / or the negative electrode member is electrically connected to the circuit board via a second wire.

[0028] The energy storage device according to the embodiment of the third aspect of the utility model includes a plurality of batteries according to the embodiment of the utility model.

[0029] The energy storage device according to the embodiment of the utility model includes the battery according to the embodiment of the utility model. By setting the above-mentioned battery, the safety of the electrical equipment can be improved. On the one hand, the chip can be embedded in the chip embedding hole, and the chip is more firmly and stably fixed on the insulating plate, thereby improving the integration of the chip assembly and the cover plate assembly, thereby improving the structural integration of the chip assembly and the battery; the detection structure is electrically connected to the circuit board, and the circuit board and the battery are electrically connected through the positive electrode and the negative electrode. That is to say, the battery can power the detection structure, and then the battery can power the chip assembly. The battery and the chip assembly form an integrated self-powered battery chip assembly without the need to set an external power supply to power the chip assembly, thereby improving the integration of the battery and the chip assembly. In addition, the chip assembly is arranged inside the battery housing, and the chip assembly can monitor a single battery, and can effectively monitor the temperature, air pressure and stress changes of the battery, and more accurately reflect the internal state of the battery. In addition, by setting a chip embedding hole on the insulating plate, the chip can be fixed in the chip embedding hole, so that the chip and the insulating plate are connected more closely, so that the chip and the cover plate assembly are connected more closely, reducing the looseness and displacement of the chip, which is conducive to improving the stability and reliability of the chip function operation, and also conducive to improving the compactness of the structure.

[0030] The electrical equipment according to the embodiment of the fourth aspect of the utility model includes the energy storage device according to the embodiment of the utility model.

[0031] According to the electric equipment of the embodiment of the utility model, by setting the above-mentioned energy storage device, the safety of the electric equipment can be improved. On the one hand, the chip can be embedded in the chip embedding hole, and the chip is more firmly and stably fixed on the insulating plate, which improves the integration of the chip assembly and the cover plate assembly, thereby improving the structural integration of the chip assembly and the battery; the detection structure is electrically connected to the circuit board, and the circuit board and the battery are electrically connected through the positive electrode and the negative electrode. That is to say, the battery can power the detection structure, and then the battery can power the chip assembly, and the battery and the chip assembly form an integrated self-powered battery chip assembly, without the need to set an external power supply to power the chip assembly, thereby improving the integration of the battery and the chip assembly. In addition, the chip assembly is arranged inside the battery housing, and the chip assembly can monitor a single battery, and can effectively monitor the temperature, air pressure and stress changes of the battery, and more accurately reflect the internal state of the battery. In addition, by setting a chip embedding hole on the insulating plate, the chip can be fixed in the chip embedding hole, so that the chip and the insulating plate are connected more closely, so that the chip and the cover plate assembly are connected more closely, reducing the looseness and displacement of the chip, which is conducive to improving the stability and reliability of the chip function operation, and also conducive to improving the compactness of the structure.

[0032] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of a total cover plate assembly, a positive electrode column and a negative electrode column according to an embodiment of the utility model;

[0034] Figure 2 is a schematic diagram of a negative electrode cover plate assembly and a negative electrode pole according to an embodiment of the utility model;

[0035] Figure 3 is a schematic diagram of a positive electrode cover plate assembly and a positive electrode column according to an embodiment of the utility model;

[0036] Figure 4 is a schematic diagram of a chip assembly according to an embodiment of the utility model;

[0037] Figure 5 is a schematic diagram of a chip assembly including a first conductive line according to an embodiment of the utility model;

[0038] Figure 6 is a schematic diagram of a chip assembly including a second wire according to an embodiment of the utility model;

[0039] Figure 7 is a schematic diagram of a chip assembly including a first conductive line and a second conductive line according to an embodiment of the utility model;

[0040] Figure 8 It is a schematic diagram of assembling the main cover plate assembly and the chip assembly according to an embodiment of the utility model;

[0041] Fig. 9 It is a schematic diagram of assembling the positive electrode cover plate assembly and the chip assembly according to an embodiment of the utility model;

[0042] Fig.10 It is a schematic diagram of assembling the negative electrode cover plate assembly and the chip assembly according to an embodiment of the utility model;

[0043] Fig.11 It is a schematic diagram of assembling the positive electrode cover plate assembly, the second negative electrode cover plate assembly, the chip assembly and the pole core according to an embodiment of the utility model;

[0044] Fig.12 It is a schematic diagram of the assembly of the negative electrode cover plate assembly, the second positive electrode cover plate assembly, the chip assembly and the pole core according to an embodiment of the utility model;

[0045] Fig.13 It is a schematic diagram of assembling a second positive electrode cover plate assembly, a second negative electrode cover plate assembly, a chip assembly including a first wire and a second wire, and a pole core according to an embodiment of the utility model;

[0046] Fig.14 is a schematic diagram of a battery according to an embodiment of the utility model;

[0047] Fig.15 is a schematic diagram of an energy storage device according to an embodiment of the utility model;

[0048] Fig.16 It is a schematic diagram of an electrical device according to an embodiment of the utility model.

[0049] Reference numerals:

[0050] Electrical equipment 2000, energy storage equipment 1000, chip assembly 100, battery 200, cover assembly 300, positive cover assembly 300a, negative cover assembly 300b, second positive cover assembly 320a, second negative cover assembly 320b, total cover assembly 300c, chip 10, positive electrode 101, negative electrode 102, first wire 11, second wire 12, detection tape 13, cover 2, pole core 20, positive pole ear 201, negative pole ear 202, positive cover 21, second positive cover 21d, positive pole column 211, injection hole 212, negative cover 22, second negative cover 22d, explosion-proof valve 221, negative pole column 222, total cover 23, insulating layer 30, insulating plate 4, chip embedding hole 41, chip fixing buckle 5. DETAILED DESCRIPTION

[0051] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0052] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0053] Combine the following Figure 1-Figure 16 The cover plate assembly 300 according to the embodiment of the present invention is described in detail.

[0054] Reference Figure 1 As shown, the cover plate assembly 300 according to the embodiment of the utility model includes a cover plate 2 and an insulating plate 4. The insulating plate 4 is arranged on one side of the cover plate 2, and a pole hole is arranged on the cover plate 2, and a pole hole is arranged on the insulating plate 4. The pole can pass through the pole hole of the cover plate 2 and the pole hole of the insulating plate 4, so that the pole can be exposed from one side of the cover plate 2 and the insulating plate 4 and electrically connected to an external device.

[0055] The insulating plate 4 is also provided with a chip embedding hole 41 , and the chip embedding hole 41 can fix the chip 10 .

[0056] Combination Figure 1 and Figure 8 As shown, in some technical solutions, the cover plate assembly 300 can be a total cover plate assembly 300c, which includes a total cover plate 23 and an insulating plate 4. The total cover plate 23 and the insulating plate 4 are provided with positive pole column holes and negative pole column holes. The positive pole 211 can extend from the positive pole column hole, and the negative pole 222 can extend from the negative pole hole. The insulating plate 4 is also provided with a chip embedding hole 41.

[0057] Combination Figure 3 , Fig. 9 and Fig.11As shown, in some technical solutions, the cover plate assembly 300 can be a combination of a positive cover plate assembly 300a and a second negative cover plate assembly 320b; the positive cover plate assembly 300a includes a positive cover plate 21 and an insulating plate 4, and the positive cover plate 21 and the insulating plate 4 are provided with pole holes, and the pole holes only include positive pole holes, and the positive pole 211 can extend from the positive pole hole, and the insulating plate 4 is also provided with a chip embedding hole 41; the second negative cover plate assembly 320b includes a second negative cover plate 22d and an insulating plate 4, and the second negative cover plate 22d and the insulating plate 4 are provided with negative pole holes but not with chip embedding holes 41, and the negative pole 222 can extend from the negative pole hole.

[0058] Combination Figure 2 , Fig.10 and Fig.12 As shown, in some technical solutions, the cover plate assembly 300 can be a combination of a negative cover plate assembly 300b and a second positive cover plate assembly 320a; the negative cover plate assembly 300b includes a negative cover plate 22 and an insulating plate 4, and the negative cover plate 22 and the insulating plate 4 are provided with pole holes, and the pole holes only include negative pole holes, and the negative pole 222 can extend from the negative pole hole, and the insulating plate 4 is also provided with a chip embedding hole 41. The second positive cover plate assembly 320a includes a second positive cover plate 21d and an insulating plate 4, and the second positive cover plate 21d and the insulating plate 4 are provided with positive pole holes but not with chip embedding holes 41, and the positive pole 211 can extend from the positive pole hole.

[0059] It should be further explained that the chip embedding hole 41 is recessed along the thickness direction of the insulating plate 4. For example, the depth of the chip embedding hole 41 is less than the thickness of the plate body of the insulating plate 4; for another example, the depth of the chip embedding hole 41 may be equal to the thickness of the plate body of the insulating plate 4, in which case the chip embedding hole 41 penetrates the plate body of the insulating plate 4 along the thickness direction of the insulating plate 4 to form a through hole; for another example, the depth of the chip embedding hole 41 may be greater than the thickness of the plate body of the insulating plate 4, and the chip embedding hole 41 is divided into two parts, one part of the chip embedding hole 41 is recessed along the thickness direction of the insulating plate 4, and another part of the chip embedding hole 41 is recessed along the thickness direction of the cover plate 2.

[0060] In the related art, the chip is connected to the cover plate through a bipolar wire. However, this connection method relying on the wire is not tight enough to the actual connection with the cover plate, which easily leads to loosening and displacement of the chip. In the present application, by providing a chip embedding hole 41 on the insulating plate 4, the chip 10 can be more firmly fixed on the insulating plate 4.

[0061] According to the cover assembly 300 of the embodiment of the utility model, by setting the chip embedding hole 41 on the insulating plate 4, the chip 10 can be fixed in the chip embedding hole 41, so that the chip 10 and the insulating plate 4 are more closely connected, thereby the chip 10 and the cover assembly 300 are more closely connected. The chip 10 and the cover assembly 300 are connected to form a whole with a stable structure, which reduces the looseness and displacement of the chip 10, is beneficial to improving the stability and reliability of the functional operation of the chip 10, and is also beneficial to improving the structural compactness of the cover assembly 300.

[0062] For example, the insulating plate 4 may be made of a plastic material, such as a polypropylene material, or may be made of a rubber material or a silicone material.

[0063] like Figure 1-Figure 3 As shown, in some specific embodiments, the chip embedding hole 41 is arranged on a side surface of the insulating plate 4 away from the cover plate 2. The chip embedding hole 41 is arranged in this way, and the chip 10 can be installed inside the battery 200. Fig.11 As shown, the chip embedding hole 41 has a simpler structure, which improves the convenience of processing and assembly, and improves the accuracy of the chip 10 detecting the internal signal of the battery 200.

[0064] like Figure 1-Figure 3 and Figure 8-Figure 10 As shown, in some embodiments, the cover assembly 300 further includes a chip fixing buckle 5, which is disposed on the insulating plate 4, and a chip accommodating space is formed between the chip fixing buckle 5 and the chip embedding hole 41, and the chip accommodating space can accommodate the chip 10, and the chip fixing buckle 5 can fix the chip 10 in the chip accommodating space. By providing the chip fixing buckle 5 to fix the chip 10, the stability and reliability of the chip 10 are improved, and the looseness and displacement of the chip 10 are reduced.

[0065] It should be further explained that the chip fixing buckle 5 can press the chip 10 against the chip embedding hole 41 to fix the chip 10. Optionally, the chip fixing buckle 5 can be made of polypropylene.

[0066] In some embodiments, a slot (not shown in the figure) is provided on the insulating plate 4, and one end of the chip fixing buckle 5 can be snapped into the slot, and the other end of the chip fixing buckle 5 can be used together with the hole wall of the chip embedding hole 41 to enclose a chip accommodating space. On the one hand, by snapping one end of the chip fixing buckle 5 into the slot of the insulating plate 4, the chip fixing buckle 5 and the insulating plate 4 can be connected more closely, thereby improving the reliability and stability of the connection between the chip fixing buckle 5 and the insulating plate 4; on the other hand, the chip fixing buckle 5 can press the chip 10 against the hole wall of the chip embedding hole 41, thereby reducing the space occupied by the chip 10 and the chip fixing buckle 5, making the chip 10 more firmly fixed and the structure more compact.

[0067] Optionally, glue may be applied inside the chip embedding hole 41 of the insulating plate 4 or the chip 10 may be firmly adhered to the chip embedding hole 41 of the insulating plate 4 by external means such as adhesive tape.

[0068] like Figure 1 and Figure 8 As shown, in some embodiments, the pole hole of the total cover plate assembly 300c includes a positive pole hole and a negative pole hole, and the chip embedding hole 41 is located between the positive pole hole and the negative pole hole. That is to say, the chip 10 can be set in the chip embedding hole 41, the positive pole 211 can be set in the positive pole hole, the negative pole can be set in the negative pole hole, the positive pole piece 101 of the chip 10 can be connected to the positive pole 211, and the negative pole piece 102 of the chip 10 can be connected to the negative pole 222, thereby reducing the number of connectors for powering the chip 10, and improving the integration between the chip 10 and the battery 200, making the structure more compact.

[0069] like Figure 1-Figure 3 and Figure 8-Figure 10 As shown, in some embodiments, the chip embedding hole 41 is a blind hole, the depth of the chip embedding hole 41 ranges from 0.5 mm to 7 mm, and the axial direction of the chip embedding hole 41 (ie Figure 1-Figure 3 and Figure 8-Figure 10 In the vertical direction of the insulating plate 4, the remaining thickness of the insulating plate 4 is in the range of 0.5 mm to 7.5 mm; and / or, the thickness of the cover plate 2 is in the range of 0.5 mm to 5 mm. That is to say, the insulating plate 4 is recessed along the thickness direction of the insulating plate 4 to form the chip embedding hole 41, and the chip embedding hole 41 does not penetrate the plate body of the insulating plate 4, thereby improving the structural strength of the insulating plate 4, which is beneficial to production and processing.

[0070] For example, when the positive electrode post hole, the negative electrode post hole and the chip embedding hole 41 are located on the same cover plate 2 (the cover plate 2 is the total cover plate 23), the depth range of the chip embedding hole 41 is 0.5 mm-7 mm. Optionally, the depth of the chip embedding hole 41 can be 0.5 mm, 0.8 mm, 1.0 mm, 2.4 mm, 3.7 mm, 4.5 mm, 6.2 mm, 7 mm, etc. Of course, the depth range of the chip embedding hole 41 can also be other values ​​in the range of 0.5 mm-7 mm, which are not listed here one by one.

[0071] For example, when the positive pole hole, the negative pole hole and the chip embedding hole 41 are located on the same cover plate assembly 300 (the cover plate assembly 300 is the total cover plate assembly 300c), in the axial direction of the chip embedding hole 41, the thickness of the insulating plate 4 ranges from 0.5mm to 8mm, and the remaining thickness of the insulating plate 4 ranges from 0.5mm to 7.5mm. Optionally, the thickness of the insulating plate 4 can be 0.5mm, 0.7mm, 1.0mm, 1.4mm, 2.8mm, 3.1mm, 4.6mm, 6.8mm, 7.5mm, 8mm, etc. The remaining thickness of the insulating plate 4 is the difference between the thickness of the insulating plate 4 and the depth of the chip embedding hole 41, and the remaining thickness of the insulating plate 4 can be 0.5mm, 0.9mm, 1.2mm, 2.7mm, 3.4mm, 4.1mm, 6.9mm, 7.5mm, etc. Of course, the thickness of the insulating plate 4 may be other values ​​between 0.5 mm and 8 mm, and the remaining thickness of the insulating plate 4 may be other values ​​between 0.5 mm and 7 mm, which are not listed here one by one.

[0072] For example, when the positive electrode post hole, the negative electrode post hole and the chip embedding hole 41 are located on the same cover plate assembly 300 (the cover plate assembly 300 is the total cover plate assembly 300c), the thickness of the cover plate 2 ranges from 0.5 mm to 5 mm. Optionally, the thickness of the cover plate 2 can be 0.5 mm, 0.8 mm, 1.0 mm, 2.4 mm, 3.7 mm, 4.5 mm, 5 mm, etc. Of course, the thickness of the cover plate 2 can also range from 0.5 mm to 5 mm, which will not be listed here one by one.

[0073] In some embodiments, the length range of the chip embedding hole 41 is 2mm-25mm, and the width range is 2mm-20mm. According to the different types and sizes of the chip 10, chip embedding holes 41 of different sizes can be manufactured to improve the adaptability of the chip embedding hole 41 to the chip 10 and make the chip 10 and the chip embedding hole 41 more closely connected.

[0074] For example, when the positive electrode column hole, the negative electrode column hole and the chip embedding hole 41 are located on the same cover plate assembly 300 (the cover plate assembly 300 is the total cover plate assembly 300c), the shape of the chip embedding hole 41 can be a cuboid, a cube, a polyhedron, etc.

[0075] Optionally, when the positive electrode column hole, the negative electrode column hole and the chip embedding hole 41 are located on the same cover plate assembly 300 (the cover plate assembly 300 is the total cover plate assembly 300c), the length of the chip embedding hole 41 can be 2mm, 5mm, 7mm, 11mm, 14mm, 18mm, 21mm, 23mm, 25mm, etc.; the width of the chip embedding hole 41 can be 2mm, 3mm, 9mm, 13mm, 15mm, 17mm, 20mm, etc. Of course, the length range of the chip embedding hole 41 can also be other values ​​in the range of 2mm-25mm, and the width range of the chip embedding hole 41 can also be other values ​​in the range of 2mm-20mm, which are not listed here one by one.

[0076] For example, when the positive pole hole, the negative pole hole and the chip embedding hole 41 are located on the same cover plate assembly 300, the connection method between the chip fixing buckle 5 and the insulating plate 4 is a snap-on type, that is, the insulating plate 4 is provided with a snap-on seam, which can accommodate the chip fixing buckle 5. The shape of the snap-on seam can be a rectangular parallelepiped or a cube. The depth of the snap-on seam is between 0.1mm-4mm, the length of the snap-on seam is between 0.5mm-8mm, and the width of the snap-on seam is between 0.5mm-3mm.

[0077] For example, when the positive pole hole, the negative pole hole and the chip embedding hole 41 are located on the same cover assembly 300 (the cover assembly 300 is the total cover assembly 300c), there are four card seams on the insulating plate 4 corresponding to the four corners of the chip embedding hole 41. The card seams match the four chip fixing buckles 5, which can better fix the chip 10.

[0078] like Figure 3 As shown, in some embodiments, the pole hole is a positive pole hole (the cover plate 2 is a positive pole cover plate 21), the cover plate 2 and the insulating plate 4 are provided with a liquid injection hole 212, and the chip embedding hole 41 is located between the positive pole hole and the liquid injection hole 212. Specifically, along the length direction of the cover plate 2 and the insulating plate 4, the positive pole hole, the chip embedding hole 41 and the liquid injection hole 212 are arranged in sequence, and the positions of the cover plate 2 and the insulating plate 4 are reasonably utilized, so that the structure of the cover plate assembly 300 is more compact and convenient for production and processing.

[0079] like Figure 2 As shown, in some embodiments, the pole hole is a negative pole hole (the cover plate 2 is a negative pole cover plate 22), an explosion-proof valve hole is provided on the cover plate 2 and the insulating plate 4, and the chip embedding hole 41 is located between the negative pole hole and the explosion-proof valve hole. The explosion-proof valve hole can be provided with an explosion-proof valve 221 to improve the safety of the battery 200. Along the length direction of the cover plate 2 and the insulating plate 4, the negative pole hole, the chip embedding hole 41 and the explosion-proof valve hole are arranged in sequence, and the positions of the cover plate 2 and the insulating plate 4 are reasonably utilized, so that the structure of the cover plate assembly 300 can be made more compact, and convenient for production and processing.

[0080] like Figure 2 and Figure 3 As shown, in some embodiments, when the cover plate 2 is the positive electrode cover plate 21 or the cover plate 2 is the negative electrode cover plate 22, the chip embedding hole 41 is a blind hole, and the depth range of the chip embedding hole 41 is 0.5mm-4mm, and in the axial direction of the chip embedding hole 41, the remaining thickness range of the insulating plate 4 is 0.5mm-3.5mm; and / or, the thickness range of the cover plate 2 is 0.5mm-5mm, that is, the insulating plate 4 is recessed along the thickness direction of the insulating plate 4 to form the chip embedding hole 41, and the chip embedding hole 41 does not penetrate the plate body of the insulating plate 4, thereby improving the structural strength of the insulating plate 4, which is beneficial to production and processing.

[0081] It should be further explained that, combined with Figure 3 As shown, on the positive cover plate assembly 300a, the chip embedding hole 41 can be set on the insulating plate 4 where the positive column hole is located or on the insulating plate 4 and the positive cover plate 21. When the chip embedding hole 41 is located between the injection hole 212 and the positive pole 211, the chip embedding hole 41 is biased towards the injection hole 212. On the negative cover plate assembly 300b, the chip embedding hole 41 can be set on the insulating plate 4 where the negative column hole is located or on the insulating plate 4 and the negative cover plate 22. The chip embedding hole 41 is located between the explosion-proof valve hole and the negative pole 222. The chip embedding hole 41 is biased towards the explosion-proof valve 221. Fig.11 and Fig.12 As shown, such an arrangement can reduce interference between components during assembly of the battery 200, increase assembly space and arrange positions reasonably, thereby improving assembly efficiency and assembly effect.

[0082] On the positive electrode cover plate assembly 300a or the negative electrode cover plate assembly 300b, the depth range of the chip embedding hole 41 can be 0.5mm-4mm. Optionally, the depth of the chip embedding hole 41 can be 0.5mm, 0.8mm, 1.0mm, 2.4mm, 3.7mm, 4, etc. Of course, the depth range of the chip embedding hole 41 can also be other values ​​in the range of 0.5mm-4mm, which are not listed here one by one.

[0083] For example, on the positive electrode cover plate assembly 300a or the negative electrode cover plate assembly 300b, in the axial direction of the chip embedding hole 41, the remaining thickness of the insulating plate 4 ranges from 0.5 mm to 3.5 mm. The remaining thickness of the insulating plate 4 can be 0.5 mm, 0.9 mm, 1.2 mm, 2.7 mm, 3.4 mm, 3.5 mm, etc. Of course, the remaining thickness of the insulating plate 4 can also be other values ​​between 0.5 mm and 3.5 mm, which are not listed here one by one.

[0084] For example, on the positive electrode cover plate assembly 300a or the negative electrode cover plate assembly 300b, the thickness of the cover plate 2 is in the range of 0.5 mm to 5 mm. Optionally, the thickness of the cover plate 2 can be 0.5 mm, 0.8 mm, 1.0 mm, 2.4 mm, 3.7 mm, 4.5 mm, 5 mm, etc. Of course, the thickness of the cover plate 2 can also be other values ​​in the range of 0.5 mm to 5 mm, which are not listed here one by one.

[0085] In some embodiments, the length range of the chip embedding hole 41 is 2mm-25mm, and the width range is 2mm-20mm. Chip embedding holes 41 of different sizes can be produced and manufactured according to different types and sizes of chips 10 to improve the adaptability of the chip 10 to the cover assembly 300.

[0086] For example, on the positive electrode cap plate assembly 300 a or the negative electrode cap plate assembly 300 b , the shape of the chip embedding hole 41 may be a cuboid, a cube, a polyhedron, or the like.

[0087] Optionally, on the positive electrode cover plate assembly 300a or the negative electrode cover plate assembly 300b, the length of the chip embedding hole 41 may be 2mm, 5mm, 7mm, 11mm, 14mm, 18mm, 21mm, 23mm, 25mm, etc.; the width of the chip embedding hole 41 may be 2mm, 3mm, 9mm, 13mm, 15mm, 17mm, 20mm, etc. Of course, the length range of the chip embedding hole 41 may also be other values ​​in the range of 2mm-25mm, and the width range of the chip embedding hole 41 may also be other values ​​in the range of 2mm-20mm, which are not listed here one by one.

[0088] For example, on the positive electrode cover plate assembly 300a or the negative electrode cover plate assembly 300b, the connection method between the chip fixing buckle 5 and the insulating plate 4 is a snap-on type, that is, a snap-on seam is provided on the insulating plate 4, and the snap-on seam can accommodate the chip fixing buckle 5. The shape of the snap-on seam can be a rectangular parallelepiped or a cube. The depth of the snap-on seam is between 0.1mm-2mm, the length of the snap-on seam is between 0.4mm-6mm, and the width of the snap-on seam is between 0.3mm-2mm.

[0089] For example, on the positive electrode cover plate assembly 300a or the negative electrode cover plate assembly 300b, there are four card seams on the insulating plate 4 corresponding to the four corners of the chip embedding hole 41, and the card seams match the four chip fixing buckles 5, which can better fix the chip 10.

[0090] like Fig.14 As shown, the battery 200 according to the embodiment of the present invention includes a positive electrode column 211, a negative electrode column 222, a chip assembly 100, a shell body and a cover assembly 300 according to the embodiment of the present invention.

[0091] Combination Figure 1 and Figure 8 As shown, in some technical solutions, the cover plate assembly 300 can be a total cover plate assembly 300c, which includes a total cover plate 23 and an insulating plate 4. The total cover plate 23 and the insulating plate 4 are provided with positive pole column holes and negative pole column holes. The positive pole 211 can extend from the positive pole column hole, and the negative pole 222 can extend from the negative pole hole. The insulating plate 4 is also provided with a chip embedding hole 41.

[0092] Combination Figure 3 , Fig. 9 and Fig.11 As shown, in some technical solutions, the cover plate assembly 300 can be a combination of a positive cover plate assembly 300a and a second negative cover plate assembly 320b; the positive cover plate assembly 300a includes a positive cover plate 21 and an insulating plate 4, and the positive cover plate 21 and the insulating plate 4 are provided with pole holes, and the pole holes only include positive pole holes, and the positive pole 211 can extend from the positive pole hole, and the insulating plate 4 is also provided with a chip embedding hole 41; the second negative cover plate assembly 320b includes a second negative cover plate 22d and an insulating plate 4, and the second negative cover plate 22d and the insulating plate 4 are provided with negative pole holes but not with chip embedding holes 41, and the negative pole 222 can extend from the negative pole hole.

[0093] Combination Figure 2 , Fig.10 and Fig.12 As shown, in some technical solutions, the cover plate assembly 300 can be a combination of a negative cover plate assembly 300b and a second positive cover plate assembly 320a; the negative cover plate assembly 300b includes a negative cover plate 22 and an insulating plate 4, and the negative cover plate 22 and the insulating plate 4 are provided with pole holes, and the pole holes only include negative pole holes, and the negative pole 222 can extend from the negative pole hole, and the insulating plate 4 is also provided with a chip embedding hole 41. The second positive cover plate assembly 320a includes a second positive cover plate 21d and an insulating plate 4, and the second positive cover plate 21d and the insulating plate are provided with positive pole holes but not with chip embedding holes 41, and the positive pole 211 can extend from the positive pole hole.

[0094] At least one end of the shell body is an open end, and the cover plate assembly 300 is arranged at the open end. The cover plate assembly 300 and the shell body form a battery shell, and the cover plate assembly 300 and the shell body can form a closed space. Specifically, one end of the shell body is an open end, and the cover plate assembly 300 is a total cover plate assembly 300c, and the total cover plate assembly 300c is arranged at the open end; or, both ends of the shell body are open ends, and the cover plate assembly 300 can be a combination of a positive cover plate assembly 300a and a second negative cover plate assembly 320b, and the positive cover plate assembly 300a is arranged at one open end of the shell body, and the second negative cover plate assembly 320b is arranged at the other open end of the shell body; or, both ends of the shell body are open ends, and the cover plate assembly 300 can be a combination of a negative cover plate assembly 300b and a second positive cover plate assembly 320a, and the negative cover plate assembly 300b is arranged at one open end of the shell body, and the second positive cover plate assembly 320a is arranged at the other open end of the shell body.

[0095] Combination Figure 4-Figure 13 As shown, the chip assembly 100 includes a chip 10, a positive electrode component 101 and a negative electrode component 102. The chip 10 is embedded in the chip embedding hole 41 and the chip 10 includes a circuit board and a detection structure. The circuit board has an integrated circuit. The detection structure is electrically connected to the circuit board. One end of the positive electrode component 101 is electrically connected to the circuit board, and the other end of the positive electrode component 101 is suitable for connection with the positive electrode column 211. One end of the negative electrode component 102 is electrically connected to the circuit board, and the other end of the negative electrode component 102 is suitable for connection with the negative electrode column 222. Thus, the detection structure is electrically connected to the circuit board, and the circuit board and the battery 200 are electrically connected through the positive electrode component 101 and the negative electrode component 102. That is to say, the battery 200 can supply power to the detection structure, and then the battery 200 can supply power to the chip assembly 100. On the one hand, the chip 10 can be embedded in the chip embedding hole 41, and the chip 10 is more firmly and stably fixed on the cover plate 2, thereby improving the integration of the chip assembly 100 and the cover plate assembly 300, and the structure is more compact; the battery 200 and the chip assembly 100 form an integrated self-powered battery chip assembly, and there is no need to set up an external power supply to power the chip assembly 100, thereby improving the integration of the battery 200 and the chip assembly 100.

[0096] It should be further explained that the detection structure can be a temperature sensor and its associated connectors to detect the temperature of the battery 200; the detection structure can be a stress detection device to detect the stress condition inside the battery 200; the detection structure can also be an air pressure detection device to detect the air pressure inside the battery 200. That is to say, according to different monitoring contents and requirements, the detection structure inside the chip 10 can be replaced according to different test requirements. Therefore, the detection structure includes but is not limited to a temperature sensor, a stress detection device, and an air pressure detection device.

[0097] According to the battery 200 of the embodiment of the utility model, on the one hand, the chip 10 can be embedded in the chip embedding hole 41, and the chip 10 is more firmly and stably fixed on the cover plate assembly 300, thereby improving the integration degree of the chip assembly 100 and the cover plate assembly 300, thereby improving the structural integration degree of the chip assembly 100 and the battery 200, and also helping to improve the compactness of the structure; the detection structure is electrically connected to the circuit board, and the circuit board and the battery 200 are electrically connected through the positive electrode 101 and the negative electrode 102, that is, the battery 200 can power the detection structure, and then the battery 200 can power the chip assembly 100, and the battery 200 and the chip assembly 100 form an integrated self-powered battery chip assembly, without the need to set an external power supply to power the chip assembly 100, thereby improving the integration of the battery 200 and the chip assembly 100. The chip assembly 100 is arranged inside the battery housing, and the chip assembly 100 can monitor a single battery 200, and can effectively monitor the temperature, air pressure and stress changes of the battery 200, and more accurately reflect the internal state of the battery 200. Furthermore, by providing a chip embedding hole 41 on the insulating plate 4, the chip 10 can be fixed in the chip embedding hole 41, so that the chip 10 and the insulating plate 4 are more closely connected, thereby the chip 10 and the cover plate assembly 300 are more closely connected. The chip 10 and the cover plate assembly 300 are connected to form a whole with a stable structure, which reduces the looseness and displacement of the chip 10, and is beneficial to improving the stability and reliability of the functional operation of the chip 10.

[0098] In the related art, the detection device is located outside the battery. However, the detection device located outside detects the external state of the battery. There is still a certain gap between the external state of the battery and the internal state of the battery. Therefore, the detection device located outside the battery reflects the internal state of the battery with low accuracy. In this application, the chip assembly 100 is arranged inside the battery housing. The chip assembly 100 can monitor a single battery 200, and can effectively monitor the temperature, air pressure and stress changes of the battery 200, and more accurately reflect the internal state of the battery 200. It can achieve high-precision evaluation and safety warning of the working state and health state of the battery 200, thereby greatly improving the safety performance of the battery 200.

[0099] In some embodiments, the chip 10 further includes a wireless transmission structure. The wireless transmission structure can be electrically connected to the circuit board, and the wireless transmission structure can transmit signals by wireless communication. The wireless transmission structure is at least used to transmit signals to an external device, and the transmitted signals may include signals detected by the detection structure, or the signals may include circuit board status signals of the chip assembly 100 and signals detected by the detection structure. By setting up a wireless transmission structure to transmit signals, no additional connecting wires are required to be led out from the inside of the battery 200, so there is no need to open a hole in the battery housing structure to pass the connecting wires, which is beneficial to improving the overall sealing of the battery 200.

[0100] In some embodiments, the wireless transmission structure can transmit the signal to the external device at preset intervals. Or in other embodiments, the wireless transmission structure further includes a receiving module and a transmission module, and the transmission module transmits the signal to the external device only when the receiving module receives a trigger command from the external device.

[0101] Optionally, the communication mode of the wireless transmission structure can be 4G communication, 5G communication or Bluetooth, etc.

[0102] For example, the communication rate of the chip 10 is between 2 Mbps and 10 Mbps, the stable communication distance is between 0.1 m and 1000 m, and the transmission delay is less than 10 ms.

[0103] like Figure 11-13 As shown, in some embodiments, the battery 200 further includes a pole core 20, which is disposed in the shell body, and has a positive pole ear 201 and a negative pole ear 202. The positive electrode member 101 and the positive pole ear 201 are connected to the positive pole column 211, and the negative electrode member 102 and the negative pole ear 202 are connected to the negative pole column 222. The chip assembly 100 is connected to the positive pole column 211 of the battery 200 through the positive electrode member 101, and the chip assembly 100 is connected to the negative pole column 222 of the battery 200 through the negative electrode member 102. A closed loop is formed between the chip assembly 100 and the pole core 20 of the battery 200. The pole core 20 of the battery 200 can supply power to the chip assembly 100, forming an integrated self-powered battery chip assembly, thereby improving the degree of integration between the battery 200 and the chip assembly 100. In addition, the positive electrode component 101 and the positive electrode tab 201 are connected to the positive electrode column 211, and the negative electrode component 102 and the negative electrode tab 202 are connected to the negative electrode column 222. On the one hand, the internal structure of the battery 200 can be made more compact and the internal space utilization of the battery 200 can be improved; on the other hand, the pole core 20 can be monitored to improve the accuracy of the evaluation and the safety of the battery 200.

[0104] like Figure 4 , Figure 8-Figure 12 As shown, in some embodiments, the detection structure further includes a detection belt 13, one end of which is connected to the circuit board, and the other end of which is suitable for inserting into the pole core 20. Specifically, a detection belt 13 can be extended from the middle position of the chip 10, and the detection belt 13 can be extended into the pole core 20 of the battery 200, so as to facilitate more accurate monitoring of the battery 200.

[0105] Preferably, when the detection structure is a temperature sensor, a detection belt 13 can be extended from the middle position of the chip 10, and the detection belt 13 can be extended between the pole piece and the diaphragm inside the pole core 20 to perform more accurate temperature monitoring of the battery 200.

[0106] It should be further explained that, according to the monitoring requirements, the number, length, width, etc. of the detection belt 13 can be modified and adjusted accordingly.

[0107] In some embodiments, the length range of the detection tape 13 is 0.5 cm-100 cm; and / or, the width range of the detection tape 13 is 0.2 cm-5 cm; and / or, the thickness range of the detection tape 13 is 0.2 mm-1 cm, thereby adjusting the size of the detection tape 13 according to the type, size and monitoring type of the battery 200 to improve the adaptability of the detection tape 13.

[0108] Optionally, the length of the detection belt 13 can be 0.5 cm, 4 cm, 17 cm, 21 cm, 54 cm, 94 cm, 100 cm, etc. The width of the detection belt 13 can be 0.2 cm, 0.4 cm, 1.4 cm, 2.7 cm, 3.6 cm, 4.8 cm, 5.0 cm, etc. The thickness of the detection belt 13 can be 0.2 cm, 0.3 cm, 0.4 cm, 0.6 cm, 0.7 cm, 0.9 cm, 1 cm. Of course, the length of the detection belt 13 can be other values ​​between 0.5 cm and 100 cm, the width of the detection belt 13 can be other values ​​between 0.2 cm and 5 cm, and the thickness of the detection belt 13 can be other values ​​between 0.2 mm and 1 cm, which are not listed here one by one.

[0109] like Fig.11 As shown, in some embodiments, the cover plate assembly 300 includes a positive cover plate assembly 300a and a second negative cover plate assembly 320b, the positive cover plate assembly 300a is arranged at one end of the shell body, the positive cover plate assembly 300a has the chip embedding hole 41, the positive electrode column 211 is arranged on the positive cover plate assembly 300a, the second negative electrode cover plate assembly 320b is arranged at the other end of the shell body, and the negative electrode column 222 is arranged in the negative electrode column hole on the second negative electrode cover plate 22d, so that the cover plate assembly 300 can be suitable for different battery types, thereby improving the versatility of the cover plate assembly 300.

[0110] In some embodiments, the cover plate assembly 300 includes a negative cover plate assembly 300b and a second positive cover plate assembly 320a, the cover plate assembly 300b is arranged at one end of the shell body, the negative cover plate assembly 300b has the chip embedding hole 41, the negative electrode column 222 is arranged on the negative cover plate assembly 300b, the second positive cover plate assembly 320a is arranged at the other end of the shell body, and the positive electrode column 211 is arranged in the positive electrode column hole on the second positive cover plate 21d, so that the cover plate assembly 300 can be suitable for different battery types, thereby improving the versatility of the cover plate assembly 300.

[0111] In some examples not shown in the drawings, the cover plate assembly 300 includes a total cover plate assembly 300 c , which is disposed at an open end of the housing body.

[0112] like Figure 5-Figure 7 , Fig.11 and Fig.12 As shown, in some embodiments, the positive electrode 101 is electrically connected to the circuit board through a first wire 11; and / or, the negative electrode 102 is electrically connected to the circuit board through a second wire 12. The connection between the circuit board and the positive electrode 101 and between the circuit board and the negative electrode 102 can be achieved by either a direct connection or a wire switching solution. By using a wire switching method, the installation position of the chip 10 can be made more flexible, and the positions of the positive electrode 101 and the negative electrode 102 do not need to be too close, and can be adjusted according to different battery types and monitoring types, thereby improving the adaptability of the chip assembly 100.

[0113] like Fig.11 As shown, for example, the chip 10 and the positive electrode member 101 are arranged on the positive electrode column 211 side, the negative electrode member 102 is arranged on the negative electrode column 222 side, and the negative electrode member 102 is connected to the chip 10 through the second wire 12.

[0114] like Fig.12 As shown, for example, the chip 10 and the negative electrode member 102 are arranged on the negative electrode column 222 side, the positive electrode member 101 is arranged on the positive electrode column 211 side, and the positive electrode member 101 is connected to the chip 10 through the first wire 11.

[0115] like Fig.13 As shown, for example, one end of the shell body is a second positive cover plate assembly 320a, and the other end is a second negative cover plate assembly 320b. The chip 10 is not arranged on the insulating plate 4, but is arranged in the internal cavity of the battery 200. The chip 10 is located between the positive electrode column 211 and the negative electrode column 222. The positive electrode component 101 is arranged on the side of the positive electrode column 211, and the positive electrode component 101 is connected to the chip 10 through the first wire 11; the negative electrode component 102 is arranged on the side of the negative electrode column 222, and the negative electrode component 102 is connected to the chip 10 through the second wire 12.

[0116] like Fig.11As shown, in some specific examples, the chip 10 is first placed on the side of the positive pole column 211, and then the positive electrode member 101 of the chip 10 is connected to the positive pole ear 201 of the pole core 20, and the connection method is one or a combination of ultrasonic welding and laser welding methods, and then the positive pole ear 201 welded with the positive electrode member 101 is laser welded to the positive pole column 211 on the positive electrode cover 21. The negative electrode member 102 is connected to the chip 10 through the second wire 12, and the negative electrode member 102 is placed on the negative side of the battery 200. The negative electrode member 102 is welded to the negative pole ear 202 of the pole core 20. After the welding is completed, the negative pole ear 202 is laser welded to the negative pole column 222 on the negative electrode cover 22. In this way, the positive electrode part of the chip 10 is connected to the positive pole ear 201, and the negative electrode part is connected to the negative pole ear 202, so as to form a closed loop inside the battery 200, power the chip 10, and form an integrated self-powered chip.

[0117] like Fig.12 As shown, in some specific examples, the chip 10 is first placed on the negative pole column 222 side, and then the negative electrode member 102 of the chip 10 is connected to the negative pole ear 202 of the pole core 20, and the connection method is one or a combination of ultrasonic welding and laser welding methods, and then the negative pole ear 202 welded with the negative electrode member 102 is laser welded to the negative pole column 222 on the negative electrode cover 22. The positive electrode member 101 is connected to the chip 10 through the first wire 11, and the positive electrode member 101 is placed on the positive side of the battery 200. The positive electrode member 101 is welded to the positive pole ear 201 of the pole core 20. After the welding is completed, the positive pole ear 201 is laser welded to the positive pole column 211 on the positive electrode cover 21. In this way, the positive electrode part of the chip 10 is connected to the positive pole ear 201, and the negative electrode part is connected to the negative pole ear 202, so as to form a closed loop inside the battery 200, power the chip 10, and form an integrated self-powered chip.

[0118] like Fig.13As shown, in some specific examples, the chip 10 is placed between the positive pole 211 and the negative pole 222, the positive pole member 101 is connected to the chip 10 through the first wire 11, the positive pole member 101 is placed on the positive side of the battery 200, the positive pole member 101 is welded to the positive pole ear 201 of the pole core 20, and after the welding is completed, the positive pole ear 201 is laser welded to the positive pole 211 on the positive cover 21. The negative pole member 102 is connected to the chip 10 through the second wire 12, the negative pole member 102 is placed on the negative side of the battery 200, the negative pole member 102 is welded to the negative pole ear 202 of the pole core 20, and after the welding is completed, the negative pole ear 202 is laser welded to the negative pole 222 on the negative cover 22. In this way, the positive electrode part of the chip 10 is connected to the positive electrode tab 201, and the negative electrode part is connected to the negative electrode tab 202, thereby forming a closed loop inside the battery 200 to power the chip 10 and form an integrated self-powered chip.

[0119] It should be further explained that the first wire 11 and the second wire 12 can be made of one or more combinations of copper, silver, aluminum and some alloy materials with good conductivity. The first wire 11 and the second wire 12 are cylindrical in shape, with a radius between 0.2mm-3mm and a length between 1mm-200cm.

[0120] like Figure 4-Figure 7 As shown, for example, the outer surface of the first wire 11 is coated with an insulating layer 30 (not shown); the outer surface of the second wire 12 is coated with an insulating layer 30 (not shown); the connection between the second wire 12 and the chip housing is coated with an insulating layer 30. By coating the insulating layer 30 at the above positions, the chip 10 and the wire can be effectively prevented from being corroded by the electrolyte in the battery 200.

[0121] like Figure 4-Figure 7 As shown, in some embodiments, the chip 10 includes a chip housing, and the circuit board and the detection structure are arranged in the chip housing, and the chip housing can protect the circuit board and the detection structure. The other end of the positive electrode 101 and the other end of the negative electrode 102 are both located outside the chip housing. The outer surface of the chip housing is coated with an insulating layer 30 (not shown), the connection between the first wire 11 and the chip housing is coated with an insulating layer 30, and the connection between the second wire 12 and the chip housing is coated with an insulating layer 30. By arranging the insulating layer 30 at the above positions, the chip housing can be protected, and the connection between the first wire 11 and the chip housing and the connection between the second wire 12 and the chip housing can also be protected, so as to prevent the chip housing, the connection between the first wire 11 and the chip housing, and the connection between the second wire 12 and the chip housing from being corroded by the electrolyte in the battery 200.

[0122] Optionally, the chip housing may be a hard housing or a soft housing.

[0123] For example, the insulating layer 30 may also cover the surface of the solder connection.

[0124] For example, the insulating layer 30 may be made of one or a combination of materials such as polyimide, polypropylene, and polyethylene.

[0125] In some examples not shown in the figures, the battery case only includes a shell body and a positive electrode cover assembly, one end of the shell body has an opening, the positive electrode cover 21 is arranged at the opening of the shell body, the positive electrode column 211 is arranged on the positive electrode cover 21, the positive electrode member 101 and the positive electrode tab 201 are connected to the positive electrode column 211, the negative electrode column 222 is arranged on the shell body and contacts the shell body, the negative electrode member 102 and the negative electrode tab 202 are connected to the negative electrode column 222, and the shell body is negatively charged.

[0126] It should be pointed out that the positive electrode member 101 of the chip 10 can be connected to the positive electrode tab 201 of the electrode core 20, and the negative electrode member 102 of the chip 10 can be connected to the negative electrode tab 202 of the electrode core 20; and then welded to the corresponding positive electrode column 201 and negative electrode column 202. This connection method is simple and practical.

[0127] In some embodiments, the battery 200 is a blade-shaped battery. For example, the length of the blade-shaped battery can range from 400 mm to 700 mm. For another example, the length of the blade-shaped battery can be greater than 700 mm. The battery 200 can also be a cylindrical battery, a square battery, or a soft-pack battery. The structure in which the chip 10 is embedded in the cover assembly 300 is applicable to all batteries 200 containing a cover 2. It is only necessary to adjust and modify the size of the chip embedding hole 41 on the insulating plate 4 in the cover assembly 300 and the size of the chip 10 itself according to different battery 200 configurations.

[0128] like Figure 11-13 As shown, in some specific examples, an insulating plate 4 is provided between the positive pole 211 and the positive cover 21, and an insulating plate 4 is provided between the negative pole 222 and the negative cover 22. By providing the insulating plate 4, the positive pole 211 and the negative pole 222 can be charged, while the positive cover 21 and the negative cover 22 are not charged, thereby avoiding the current from being conducted to the shell body through the positive cover 21 and the negative cover 22, thereby reducing the risk of short circuit.

[0129] like Fig.15As described above, the energy storage device 1000 according to the embodiment of the utility model includes a plurality of batteries 200 according to the embodiment of the utility model. By setting the above-mentioned batteries 200, the safety of the electrical equipment 2000 can be improved. On the one hand, the chip 10 can be embedded in the chip embedding hole 41, and the chip 10 is more firmly and stably fixed on the insulating plate 4, thereby improving the integration degree of the chip assembly 100 and the cover assembly 300, thereby improving the structural integration degree of the chip assembly 100 and the battery 200; the detection structure is electrically connected to the circuit board, and the circuit board and the battery 200 are electrically connected through the positive electrode 101 and the negative electrode 102, that is, the battery 200 can power the detection structure, and then the battery 200 can power the chip assembly 100, and the battery 200 and the chip assembly 100 form an integrated self-powered battery chip assembly, without the need to set an external power supply to power the chip assembly 100, thereby improving the integration of the battery 200 and the chip assembly 100. Furthermore, the chip assembly 100 is arranged inside the battery housing, and the chip assembly 100 can monitor a single battery 200, and can effectively monitor the temperature, air pressure and stress changes of the battery 200, and more accurately reflect the internal state of the battery 200. Furthermore, by providing a chip embedding hole 41 on the insulating plate 4, the chip 10 can be fixed in the chip embedding hole 41, so that the chip 10 is more closely connected to the insulating plate 4, so that the chip 10 is more closely connected to the cover plate assembly 300, and the chip 10 and the cover plate assembly 300 are connected to form a whole, the structure is stable, and the looseness and displacement of the chip 10 are reduced, which is conducive to improving the stability and reliability of the functional operation of the chip 10, and also conducive to improving the compactness of the structure.

[0130] like Fig.16As shown, the electric device 2000 according to the embodiment of the utility model includes the energy storage device 1000 according to the embodiment of the utility model. By setting the above-mentioned battery 200, the safety of the electric device 2000 can be improved. On the one hand, the chip 10 can be embedded in the chip embedding hole 41, and the chip 10 is more firmly and stably fixed on the insulating plate 4, thereby improving the integration of the chip assembly 100 and the cover assembly 300, thereby improving the structural integration of the chip assembly 100 and the battery 200; the detection structure is electrically connected to the circuit board, and the circuit board and the battery 200 are electrically connected through the positive electrode 101 and the negative electrode 102. That is to say, the battery 200 can power the detection structure, and then the battery 200 can power the chip assembly 100. The battery 200 and the chip assembly 100 form an integrated self-powered battery chip assembly, without the need to set an external power supply to power the chip assembly 100, thereby improving the integration of the battery 200 and the chip assembly 100. Furthermore, the chip assembly 100 is arranged inside the battery housing, and the chip assembly 100 can monitor a single battery 200, and can effectively monitor the temperature, air pressure and stress changes of the battery 200, and more accurately reflect the internal state of the battery 200. Furthermore, by providing a chip embedding hole 41 on the insulating plate 4, the chip 10 can be fixed in the chip embedding hole 41, so that the chip 10 is more closely connected to the insulating plate 4, so that the chip 10 is more closely connected to the cover plate assembly 300, and the chip 10 and the cover plate assembly 300 are connected to form a whole, the structure is stable, and the looseness and displacement of the chip 10 are reduced, which is conducive to improving the stability and reliability of the functional operation of the chip 10, and also conducive to improving the compactness of the structure.

[0131] Optionally, the electrical equipment 2000 may be a vehicle, a ship, an airplane, a machine tool, a household appliance, etc.

[0132] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0133] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0134] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0135] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A cover plate assembly (300), It is characterized in that include: Cover plate (2); An insulating plate (4), the insulating plate (4) being arranged on one side of the cover plate (2), the cover plate (2) and the insulating plate (4) being provided with pole holes for poles to pass through, and the insulating plate (4) being provided with a chip embedding hole (41) for fixing a chip (10).

2. The cover plate assembly (300) according to claim 1, It is characterized in that The chip embedding hole (41) is arranged on a surface of a side of the insulating plate (4) facing away from the cover plate (2).

3. The cover plate assembly (300) according to claim 1, It is characterized in that The cover plate assembly (300) further comprises a chip fixing buckle (5), wherein the chip fixing buckle (5) is arranged on the insulating plate (4), and a chip accommodating space for fixing the chip (10) is formed between the chip fixing buckle (5) and the chip embedding hole (41), and the chip fixing buckle (5) is used to fix the chip (10) in the chip embedding hole (41).

4. The cover plate assembly (300) according to claim 3, It is characterized in that The insulating plate (4) is provided with a slot, one end of the chip fixing buckle (5) is snapped into the slot, and the other end of the chip fixing buckle (5) is used to enclose the chip accommodating space together with the hole wall of the chip embedding hole (41).

5. The cover plate assembly (300) according to claim 1, It is characterized in that The pole hole comprises a positive pole hole and a negative pole hole, and the chip embedding hole (41) is located between the positive pole hole and the negative pole hole.

6. The cover plate assembly (300) according to claim 5, It is characterized in that The chip embedding hole (41) is a blind hole, the depth of the chip embedding hole (41) ranges from 0.5 mm to 7 mm, and in the axial direction of the chip embedding hole (41), the remaining thickness of the insulating plate (4) ranges from 0.5 mm to 7.5 mm; and / or the thickness of the cover plate (2) ranges from 0.5 mm to 5 mm.

7. The cover plate assembly (300) according to claim 6, It is characterized in that The chip embedding hole (41) has a length ranging from 2 mm to 25 mm and a width ranging from 2 mm to 20 mm.

8. The cover plate assembly (300) according to claim 1, It is characterized in that The pole hole is a positive pole hole, a liquid injection hole (212) is provided on the cover plate (2) and the insulating plate (4), and the chip embedding hole (41) is located between the positive pole hole and the liquid injection hole (212).

9. The cover plate assembly (300) according to claim 1, It is characterized in that The pole hole is a negative pole hole, explosion-proof valve holes are provided on the cover plate (2) and the insulating plate (4), and the chip embedding hole (41) is located between the negative pole hole and the explosion-proof valve hole.

10. The cover plate assembly (300) according to claim 8 or 9, It is characterized in that The chip embedding hole (41) is a blind hole, the depth of the chip embedding hole (41) ranges from 0.5 mm to 4 mm, and in the axial direction of the chip embedding hole (41), the remaining thickness of the insulating plate (4) ranges from 0.5 mm to 3.5 mm; and / or the thickness of the cover plate (2) ranges from 0.5 mm to 5 mm.

11. The cover plate assembly (300) according to claim 10, It is characterized in that The chip embedding hole (41) has a length ranging from 2 mm to 25 mm and a width ranging from 2 mm to 20 mm.

12. A battery (200), It is characterized in that include: The cover plate assembly (300) according to any one of claims 1 to 11; A positive pole (211) and a negative pole (222), at least one of the positive pole (211) and the negative pole (222) being arranged in the pole hole; A shell body, wherein at least one end of the shell body is an open end, and the cover plate assembly (300) is arranged at the open end; A chip assembly (100), the chip assembly (100) comprising a chip (10), a positive electrode member (101) and a negative electrode member (102); the chip (10) is embedded in the chip embedding hole (41) and comprises a circuit board and a detection structure; the circuit board has an integrated circuit; the detection structure is electrically connected to the circuit board; one end of the positive electrode member (101) is electrically connected to the circuit board; the other end of the positive electrode member (101) is suitable for being connected to the positive electrode column (211); one end of the negative electrode member (102) is electrically connected to the circuit board; the other end of the negative electrode member (102) is suitable for being connected to the negative electrode column (222).

13. The battery (200) according to claim 12, It is characterized in that The chip (10) also includes a wireless transmission structure, which is electrically connected to the circuit board and is used at least to transmit the signal detected by the detection structure to an external device by wireless communication.

14. The battery (200) according to claim 12, It is characterized in that The battery (200) further comprises a pole core (20), wherein the pole core (20) is arranged in the shell body, and the pole core (20) has a positive pole tab (201) and a negative pole tab (202); the positive pole piece (101) and the positive pole tab (201) are connected to the positive pole column (211); and the negative pole piece (102) and the negative pole tab (202) are connected to the negative pole column (222).

15. The battery (200) according to claim 14, It is characterized in that The detection structure comprises a detection belt (13), one end of the detection belt (13) is connected to the circuit board, and the other end of the detection belt (13) is suitable for being inserted into the pole core (20).

16. The battery (200) according to claim 12, It is characterized in that The cover plate assembly (300) comprises a positive cover plate assembly (300a) and a second negative cover plate assembly (320b), wherein the positive cover plate assembly (300a) is arranged at one end of the shell body, the positive cover plate assembly (300a) has the chip embedding hole (41), the positive pole column (211) is arranged on the positive cover plate assembly (300a), the second negative cover plate assembly (320b) is arranged at the other end of the shell body, and the negative pole column (222) is arranged in the negative pole column hole on the second negative cover plate assembly (320b).

17. The battery (200) according to claim 12, It is characterized in that The cover plate assembly (300) comprises a negative cover plate assembly (300b) and a second positive cover plate assembly (320a), wherein the negative cover plate assembly (300b) is arranged at one end of the shell body, the negative cover plate assembly (300b) has the chip embedding hole (41), the negative pole column (222) is arranged on the negative cover plate assembly (300b), the second positive cover plate assembly (320a) is arranged at the other end of the shell body, and the positive pole column (211) is arranged in the positive pole column hole on the second positive cover plate assembly (320a).

18. The battery (200) according to any one of claims 12 to 17, It is characterized in that The positive electrode member (101) is electrically connected to the circuit board via a first wire (11); and / or the negative electrode member (102) is electrically connected to the circuit board via a second wire (12).

19. An energy storage device (1000), It is characterized in that A battery (200) comprising a plurality of batteries as claimed in any one of claims 12 to 18.

20. An electrical device (2000), It is characterized in that Comprising the energy storage device (1000) as claimed in claim 19.

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