Motherboard and server

Abstract

The present application relates to the technical field of motherboard structure, and discloses a motherboard and a server, including a board body and a first power module. Specifically, the board body is provided with a mounting portion for mounting a processor; the first power module is arranged in the mounting portion and overlaps with the mounting portion along a first direction, and the first power module is used to supply power to the processor, wherein the first direction is perpendicular to the board body. The motherboard and the server disclosed in the present application solve or improve the problem of a long power supply path between the processor and the power supply and low power supply efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of motherboard structures, and in particular to motherboards and servers. Background Art

[0002] With the development of artificial intelligence and big data technologies, the demand for high-performance computers is growing. The computing power of processors such as CPU (Central Processing Unit) and GPU (Graphics Processing Unit) has increased, which has brought about an increase in power, causing the current supplying power to the processor to continue to increase.

[0003] In the related art, the processor and the power supply are arranged on the same board, and the power supply is arranged around the processor. However, since the processor is usually arranged in a packaging structure, the power supply cannot be arranged close to the processor, which will result in a longer power supply path between the processor and the power supply and a larger impedance, thereby causing the power supply efficiency of the processor to be low.

[0004] In the related art, the power supply and processor are located on the front and back of the board respectively to shorten the distance between the power supply and the processor. Although this shortens the power supply path from the power supply to the processor to a certain extent and reduces energy loss, for high-performance processors, the power supply path is still long and the power supply efficiency is low. Summary of the invention

[0005] In view of this, the present application provides a motherboard and a processor system to solve or improve the problem of a long power supply path between the processor and the power supply and low power supply efficiency.

[0006] In a first aspect, the present application provides a mainboard, comprising:

[0007] A board body, wherein a mounting portion for mounting a processor is provided on the board body;

[0008] A first power module is disposed in the mounting portion and overlapped with the mounting portion along a first direction, wherein the first power module is used to supply power to the processor, wherein the first direction is perpendicular to the board body.

[0009] In this embodiment, the mounting portion is arranged on the board body, the processor is installed on the mounting portion, and the first power supply module is arranged in the mounting portion, so that the first power supply module and the processor are located on the same side of the board body. Compared with the related art, the power supply and the processor are respectively arranged on the opposite sides of the board body, which can shorten the power supply path of the first power supply module and the processor, reduce the current loss in the power supply path, and improve the power supply efficiency.

[0010] The first power module and the mounting portion are overlapped, further shortening the length of the power supply path between the first power module and the processor.

[0011] In an optional embodiment, a socket is provided on the first surface of the board body, the socket is electrically connected to the board body, the first power module is electrically connected to the board body, and a portion of the board body corresponding to the socket along the first direction and the socket form the mounting portion;

[0012] Wherein, the first power module is arranged in the installation portion.

[0013] In this embodiment, the processor is plugged into the socket, the socket is electrically connected to the board body, the first power module is electrically connected to the board body, the first power module supplies power to the processor through the socket, and the processor is directly plugged into the socket, thereby shortening the power supply path between the first power module and the processor, reducing the current loss in the power supply path, and improving the power supply efficiency.

[0014] In an optional implementation, the first power module is located in the socket.

[0015] In this embodiment, the first power module is located in the socket, and the processor is plugged into the socket, which shortens the power supply path between the first power module and the socket, and further shortens the power supply path between the first power module and the processor.

[0016] In an optional implementation, a through hole is provided on the socket, and the first power module is located in the through hole.

[0017] In this embodiment, the through hole is arranged corresponding to the board body, the first power module is set in the through hole, and the first power module is electrically connected to the board body, and the processor is plugged into the socket, so that the first power module and the processor are overlapped in the first direction, thereby reducing the distance between the first power module and the processor.

[0018] In an optional embodiment, at least one second power module is further included, wherein the second power module is arranged on the second surface of the board body, the second power module is overlapped with the mounting portion along the first direction, and the second power module is electrically connected to the first power module.

[0019] In this embodiment, the second power supply module is arranged on the second surface, and the second power supply module and the first power supply module are arranged on both sides of the board body. The second power supply module supplies power to the first power supply module, and the first power supply module supplies power to the processor, which can reduce the power supply burden of the first power supply module. Therefore, the first power supply module can select a smaller power supply module for easy installation in the installation part to shorten the power supply path.

[0020] In an optional embodiment, a heat sink is further included, and the heat sink includes a heat sink and a heat conductor, and a plurality of the heat conductors are provided. A plurality of vias are provided on the plate body, and each of the heat conductors passes through a plurality of the vias, and both ends thereof are respectively connected to the heat sink and the first power module, and the heat sink is abutted against the second power module.

[0021] In this embodiment, one end of the through hole corresponds to the board body, and the other end is covered with a processor. The first power module is arranged in the through hole, and the first power module is in a relatively closed space. Multiple vias are connected to the through hole, and multiple heat conducting members pass through the multiple vias, and one end abuts against the first power module, and the other end abuts against the heat sink, so that the heat of the first power module can be transferred to the heat sink through the heat conducting member for heat dissipation, thereby reducing the temperature of the first power module. The second power module is arranged on the second surface, and can directly contact the heat sink, so that the heat in the second power module is transferred to the heat sink, thereby reducing the temperature of the second power module.

[0022] The heat emitted by the first power module and the second power module will be transferred to the processor, causing the temperature of the processor to further increase, affecting the working efficiency of the processor. Therefore, it is necessary to dissipate heat from the first power module and the second power module in time.

[0023] Lower the temperature of the processor. First, it can significantly improve the stability and reliability of the processor operation and ensure the normal operation of the computer.

[0024] Second, it can slow down processor aging and extend the service life of the hardware.

[0025] Third, when the processor automatically reduces its frequency due to overheating, lowering the temperature can restore it to its normal operating frequency, thereby increasing the processing speed. Lowering the temperature can also reduce the power consumption of the processor, allowing it to maintain a higher performance level in a low-power state.

[0026] In an optional implementation, a plurality of heat dissipation slots are formed on a surface of the heat dissipation plate away from the second power module.

[0027] In this embodiment, the heat dissipation plate is provided with a plurality of heat dissipation grooves, which can increase the heat dissipation area and improve the heat dissipation effect.

[0028] In an optional implementation, a first heat sink and a second heat sink are respectively provided at both ends of the heat conducting member, the first heat sink is connected to the first power module, and the second heat sink is connected to the heat dissipation plate.

[0029] In this embodiment, the first heat sink is connected to the first power module, and the second heat sink is connected to the heat dissipation plate. The first heat sink and the second heat sink can increase the contact area with the first power module and the heat dissipation plate, thereby improving the heat dissipation effect.

[0030] In an optional implementation, the plurality of second heat sinks are an integrated structure.

[0031] In this embodiment, a plurality of second heat sinks are connected into an integral structure, which can increase the connection strength with the heat sink plate, improve the stability of the connection, and improve the heat dissipation effect.

[0032] In an optional implementation, heat dissipation glue is provided between the first heat sink and the first power module;

[0033] And / or, heat dissipation glue is arranged between the second heat sink and the heat dissipation plate.

[0034] In this embodiment, by providing heat dissipation glue between the first heat sink and the first power module and between the second heat sink and the heat dissipation plate, the connection strength between the first heat sink and the first power module is improved, and the connection strength between the second heat sink and the heat dissipation plate is improved.

[0035] The heat dissipation adhesive has high thermal conductivity and can transfer heat more effectively. The heat dissipation adhesive can quickly transfer the heat of the first power module to the first heat sink and transfer the heat of the second heat sink to the heat dissipation plate, thereby improving the heat dissipation efficiency.

[0036] The heat dissipation adhesive can effectively absorb and transfer the heat from the inside of the first power module, thereby reducing the operating temperature of the entire first power module, helping to prevent the first power module from malfunctioning due to overheating, and improving the reliability and service life of the first power module.

[0037] The heat dissipation adhesive can tightly connect the first heat sink and the first power module as well as the second heat sink and the heat dissipation plate, thereby reducing vibration and looseness between components and further improving the stability and reliability of the device.

[0038] In an optional embodiment, it also includes multiple decoupling filter capacitors, at least a part of the multiple decoupling filter capacitors are arranged overlapping with the first power supply module along the first direction, the multiple decoupling filter capacitors are arranged on the second surface, and the multiple decoupling filter capacitors are electrically connected to the board body; and the multiple heat conductors are interspersed between the multiple decoupling filter capacitors.

[0039] In this embodiment, the decoupling filter capacitor is arranged on the second surface, providing a larger space for the first power module to be arranged in the through hole.

[0040] A plurality of heat conducting members are inserted between the plurality of decoupling filter capacitors, so that the gaps between the plurality of decoupling filter capacitors can be reasonably utilized, thereby making the structure more compact.

[0041] The plurality of decoupling filter capacitors are at least partially arranged to overlap with the first power module along the first direction, shortening the distance from the first power module and the processor, and the decoupling filter capacitors can prevent parasitic oscillation caused by the positive feedback path formed by the circuit through the power supply. In other words, it can effectively eliminate the parasitic coupling between the circuit networks and ensure the normal operation of the circuit.

[0042] In an optional embodiment, the first power supply module includes a plurality of power supply units, the plurality of power supply units are used to supply power to the processor, and the plurality of power supply units are arranged side by side along a second direction, wherein the second direction is perpendicular to the first direction.

[0043] In this embodiment, multiple power supply units supply power to the processor, which can reduce the power supply current of a single power supply unit, reduce the current loss in the power supply path, and improve the power supply efficiency.

[0044] In an optional implementation, the first power supply module is a high-frequency voltage regulator, which is used to adjust the voltage to the rated voltage of the processor;

[0045] And / or, the second power module is a low-frequency voltage regulator, used to reduce the voltage delivered to the first power module.

[0046] In this embodiment, the high-frequency voltage regulator is small in size. When the high-frequency voltage regulator adjusts the voltage to the rated voltage of the processor, due to the high power of the processor, when the voltage is reduced, the power supply current delivered from the high-frequency voltage regulator to the processor increases. Therefore, it is necessary to shorten the power supply path between the high-frequency voltage regulator and the processor to reduce current loss. Installing the high-frequency voltage regulator in the through hole can shorten the power supply path and improve power supply efficiency.

[0047] The low-frequency voltage regulator is used to adjust the total power supply voltage, lowering the total power supply voltage but not reaching the rated voltage of the processor. The current is transmitted to the first power module for further voltage reduction to reach the rated voltage of the processor. The current transmitted from the second power module to the first power module is smaller than the current transmitted from the first power module to the processor. Therefore, the current loss is smaller on the power supply path between the second power module and the first power module.

[0048] In an optional embodiment, a connecting frame is further included, wherein the connecting frame is connected to the plate body, and the heat dissipation plate is connected to the connecting frame.

[0049] In a second aspect, the present application further provides a server, comprising: a processor and a mainboard, wherein the processor is installed in the installation part.

[0050] The server has the same effect as the motherboard, so I won't go into details here. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0052] Figure 1 A schematic diagram of the structure of a mainboard according to an embodiment of the present application;

[0053] Figure 2 This is a schematic structural diagram of a first power module, a board body, a heat conducting member and a heat sink in a mainboard according to an embodiment of the present application;

[0054] Figure 3 This is a schematic structural diagram of a plurality of heat-conducting members, a board body, a first power module and a heat sink in a mainboard according to an embodiment of the present application;

[0055] Figure 4 This is a schematic diagram of the structure of a heat conducting member in a mainboard according to an embodiment of the present application;

[0056] Figure 5 A schematic diagram of the distribution of multiple decoupling filter capacitors and multiple second power modules on a main board in an embodiment of the present application;

[0057] Figure 6 This is a schematic diagram of the structure of a socket and a first power module in a mainboard according to an embodiment of the present application;

[0058] Figure 7 A motherboard assembly process according to an embodiment of the present application;

[0059] Figure 8 It is a structural diagram of a mainboard in the related art;

[0060] Fig. 9 It is a structural schematic diagram of a motherboard in another related technology.

[0061] Description of reference numerals:

[0062] 1. Board body; 101. First side; 102. Second side; 103. Via hole; 2. Socket; 3. Through hole; 4. First power module; 401. Power supply unit; 5. Second power module; 6. Radiator; 601. Heat sink; 6011. Heat sink; 602. Heat conductor; 6021. First heat sink; 6022. Second heat sink; 7. Decoupling filter capacitor; 8. Processor; 9. Power supply; 10. Current path; X, first direction; Y, second direction. DETAILED DESCRIPTION

[0063] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application.

[0064] With the development of artificial intelligence and big data technologies, the demand for high-performance computers is growing. The improvement in the computing power of processors such as CPUs and GPUs has brought about an increase in power, which has led to a continuous increase in the current supplying power to the processors.

[0065] In the related art, the processor and the power supply are arranged on the same board, and the power supply is arranged around the processor. However, since the processor is usually arranged in a packaging structure, the power supply cannot be arranged close to the processor, which will result in a longer power supply path between the processor and the power supply and a larger impedance, thereby causing the power supply efficiency of the processor to be low.

[0066] In the related art, the power supply and the processor are located on the front and back of the board respectively to shorten the distance between the power supply and the processor. Although the power supply path from the power supply to the processor is shortened to a certain extent and the energy loss is reduced, for high-performance processors, the power supply path is still long and the power supply efficiency is low. In order to solve the above technical problems, the present application provides a motherboard and a server.

[0067] Combine the following Figures 1 to 9 , describing an embodiment of the present application.

[0068] According to an embodiment of the present application, on the one hand, a main board is provided, such as Figure 1 and Figure 7 As shown, it includes: a board body 1 and a first power module 4, and the specific scheme is as follows.

[0069] like Figure 1As shown, a mounting portion for mounting a processor 8 is provided on the board body 1; a first power module 4 is disposed in the mounting portion and overlaps with the mounting portion along a first direction X, and the first power module 4 is used to supply power to the processor 8, wherein the first direction X is perpendicular to the board body 1.

[0070] In this embodiment, if Figure 1 As shown, the mounting portion is arranged on the board body 1, the processor 8 is installed on the mounting portion, and the first power supply module 4 is arranged in the mounting portion, so that the first power supply module 4 and the processor 8 are located on the same side of the board body 1. Compared with the related art, the power supply and the processor 8 are respectively arranged on the opposite sides of the board body, which can shorten the power supply path of the first power supply module 4 and the processor 8, reduce the current loss in the power supply path, and improve the power supply efficiency.

[0071] The first power module 4 is arranged to overlap with the mounting portion, which further shortens the length of the power supply path between the first power module 4 and the processor 8 .

[0072] It should be noted that the first power supply module 4 is a switching power supply that supplies power to the processor 8. With the development of switching power supply technology, the switching frequency continues to increase, and the volume of the inductor and capacitor required by the first power supply module 4 is gradually reduced. The volume of the entire first power supply module 4 is reduced, making it possible to place it in the installation part.

[0073] It should be noted that the board body 1 is a circuit board.

[0074] In one embodiment, a socket 2 is provided on the first surface 101 of the board body 1, the socket 2 is electrically connected to the board body 1, the first power module 4 is electrically connected to the board body 1, and a portion of the board body 1 corresponding to the socket 2 along the first direction X forms a mounting portion with the socket 2;

[0075] The first power module 4 is arranged in the installation portion.

[0076] Socket 2 is a CPU mounting seat and is an existing structure.

[0077] In this embodiment, if Figure 1 As shown, the processor 8 is plugged into the socket 2, the socket 2 is electrically connected to the board body 1, the first power module 4 is electrically connected to the board body 1, the first power module 4 supplies power to the processor 8 through the socket 2, and the processor 8 is directly plugged into the socket 2, which shortens the power supply path between the first power module 4 and the processor 8, reduces the current loss in the power supply path, and improves the power supply efficiency.

[0078] Specifically, the first power module 4 may also be disposed in the board body 1 .

[0079] In one embodiment, Figure 1 As shown, the first power module 4 is located in the socket 2 .

[0080] In this embodiment, the first power module 4 is located in the socket 2, and the processor 8 is plugged into the socket 2, which shortens the power supply path between the first power module 4 and the socket 2, and further shortens the power supply path between the first power module 4 and the processor 8.

[0081] In one embodiment, Figure 1 and Figure 6 As shown, a through hole 3 is provided on the socket 2 , and the first power module 4 is located in the through hole 3 .

[0082] In this embodiment, the through hole 3 is arranged corresponding to the board body 1, the first power module 4 is set in the through hole 3, and the first power module 4 is electrically connected to the board body 1, and the processor 8 is plugged into the socket 2, so that the first power module 4 and the processor 8 are overlapped in the first direction X, thereby reducing the distance between the first power module 4 and the processor 8.

[0083] In one embodiment, at least one second power module 5 is further included. The second power module 5 is arranged on the second surface 102 of the board body 1 , and the second power module 5 overlaps with the mounting portion along the first direction X. The second power module 5 is electrically connected to the first power module 4 .

[0084] Specifically, the second surface 102 is disposed opposite to the first surface 101 .

[0085] In this embodiment, the second power supply module 5 is arranged on the second surface 102, and the second power supply module 5 and the first power supply module 4 are arranged on both sides of the board body 1. The second power supply module 5 supplies power to the first power supply module 4, and the first power supply module 4 supplies power to the processor 8, which can reduce the power supply burden of the first power supply module 4. Therefore, the first power supply module 4 can select a smaller power supply module for easy installation in the installation part to shorten the power supply path.

[0086] In one embodiment, Figure 1 and Figure 5 As shown, the projection of the second power module 5 in the first direction X is arranged along the circumference of the first power module 4 .

[0087] In this embodiment, the first power module 4 and the second power module 5 are respectively arranged on the first surface 101 and the second surface 102 of the board body 1, and the second power module 5 is located outside the first power module 4, so as to provide power to the first power module 4. The second power module 5 is located in the circumference of the first power module 4, and can reserve space for the part of the first power module 4 corresponding to the second surface 102 along the first direction X, so as to facilitate the installation of the decoupling filter capacitor 7.

[0088] The plurality of second power modules 5 are arranged at intervals, and there are gaps between the plurality of second power modules 5 , so as to improve the heat dissipation effect of the second power modules 5 .

[0089] In one embodiment, Figures 1 to 4 As shown, the heat sink 6 includes a heat sink 601 and a heat conductor 602, and a plurality of heat conductors 602 are provided. A plurality of vias 103 are provided on the plate body 1, and each heat conductor 602 passes through a plurality of vias 103, and its two ends are respectively connected to the heat sink 601 and the first power module 4, and the heat sink 601 is abutted against the second power module 5.

[0090] In this embodiment, the heat emitted by the first power module 4 and the second power module 5 will be transferred to the processor 8, causing the temperature of the processor 8 to further increase, affecting the working efficiency of the processor 8. Therefore, it is necessary to dissipate the heat of the first power module 4 and the second power module 5 in time.

[0091] Lower the temperature of the processor 8. First, it can significantly improve the stability and reliability of the operation of the processor 8 and ensure the normal operation of the computer.

[0092] Second, it can slow down the aging of processor 8 and extend the service life of the hardware.

[0093] Third, when processor 8 automatically reduces its frequency due to overheating, it can be restored to its normal operating frequency by lowering the temperature, thereby increasing the processing speed. Lowering the temperature can also reduce the power consumption of processor 8, allowing it to maintain a higher performance level in a low power consumption state.

[0094] In this embodiment, one end of the through hole 3 corresponds to the board body 1, and the other end is covered with a processor 8. The first power module 4 is arranged in the through hole 3, and the first power module 4 is in a relatively closed space. Multiple through holes 103 are connected to the through hole 3, and multiple heat conducting members 602 pass through the multiple through holes 103, and one end abuts against the first power module 4, and the other end abuts against the heat sink 601, so that the heat of the first power module 4 can be transferred to the heat sink 601 through the heat conducting member 602 for heat dissipation, thereby reducing the temperature of the first power module 4. The second power module 5 is arranged on the second surface 102, and can directly contact the heat sink 601, so that the heat in the second power module 5 is transferred to the heat sink 601, thereby reducing the temperature of the second power module 5.

[0095] Specifically, the material of the heat conducting member 602 may be a heat conducting material such as copper, iron, silicon carbide, or graphite.

[0096] Specifically, the heat conductor 602 is a columnar body that is wide at both ends and narrow in the middle. The heat conductor 602 occupies a small area on the second surface 102, which largely retains the space of the second surface 102, so that a large number of decoupling filter capacitors 7 can continue to be arranged on the second surface 102. In order to avoid interference with the vertical power supply module, the decoupling filter capacitor 7 is placed on the second surface 102 at a position far away from the processor 8 in the relevant vertical power supply solution.

[0097] It should be noted that the present application takes into account the vertical power supply and the position of the decoupling filter capacitor 7, both of which can be placed at a position close to the processor 8. In the vertical power supply technology, both the power supply efficiency and the decoupling filter effect are improved.

[0098] Specifically, Figure 4 As shown, both ends of the heat conducting member 602 extend outward to form a tapered connecting end, thereby increasing the contact area with the first power module 4 and the heat sink 6 and improving the heat conduction effect.

[0099] Specifically, Figure 5 As shown, the vias 103 are set to nine, and the nine vias 103 are arranged in an array. The nine vias 103 are located between multiple decoupling filter capacitors 7. The distance between the first power module 4 and the heat sink 601 is extended by the heat conductor 602, so that the decoupling filter capacitor 7 can have sufficient space to be set.

[0100] Specifically, if air cooling is adopted, the material of the radiator 6 can be selected from heat-conducting materials such as aluminum alloy, pure copper, copper-aluminum composite materials, etc.; the radiator 6 can also be a cold plate radiator 6 for liquid cooling.

[0101] In one embodiment, Figure 1 As shown, a plurality of heat dissipation slots 6011 are formed on a side of the heat dissipation plate 601 away from the second power module 5 .

[0102] In this embodiment, the heat dissipation plate 601 is provided with a plurality of heat dissipation grooves 6011 , which can increase the heat dissipation area and improve the heat dissipation effect.

[0103] In one embodiment, Figures 2 to 4 As shown, a first heat sink 6021 and a second heat sink 6022 are respectively provided at both ends of the heat conducting member 602 . The first heat sink 6021 is connected to the first power module 4 , and the second heat sink 6022 is connected to the heat dissipation plate 601 .

[0104] In this embodiment, the first heat sink 6021 is connected to the first power module 4, and the second heat sink 6022 is connected to the heat sink 601. The first heat sink 6021 and the second heat sink 6022 can increase the contact area with the first power module 4 and the heat sink 601, thereby improving the heat dissipation effect.

[0105] In one embodiment, the plurality of second heat sinks 6022 are an integrated structure.

[0106] In this embodiment, a plurality of second heat sinks 6022 are connected into an integral structure, which can increase the connection strength with the heat sink 601, improve the stability of the connection, and improve the heat dissipation effect.

[0107] In one embodiment, heat dissipation glue is provided between the first heat sink 6021 and the first power module 4;

[0108] And / or, heat dissipation glue is provided between the second heat sink 6022 and the heat dissipation plate 601 .

[0109] In this embodiment, by providing heat dissipation glue between the first heat sink 6021 and the first power module 4 and between the second heat sink 6022 and the heat sink 601, the connection strength between the first heat sink 6021 and the first power module 4 is improved, and the connection strength between the second heat sink 6022 and the heat sink 601 is improved.

[0110] The heat dissipation adhesive has high thermal conductivity and can transfer heat more effectively. The heat dissipation adhesive can quickly transfer the heat of the first power module 4 to the first heat sink 6021 and transfer the heat of the second heat sink 6022 to the heat sink 601, thereby improving the heat dissipation efficiency.

[0111] The heat dissipation adhesive can effectively absorb and transfer the heat from the inside of the first power module 4, thereby reducing the operating temperature of the entire first power module 4. This helps prevent the first power module 4 from malfunctioning due to overheating and improves the reliability and service life of the first power module 4.

[0112] The heat dissipation adhesive can tightly connect the first heat sink 6021 and the first power module 4 as well as the second heat sink 6022 and the heat dissipation plate 601, thereby reducing vibration and looseness between components and further improving the stability and reliability of the device.

[0113] In one embodiment, Figure 1 and Figure 5 As shown, it also includes multiple decoupling filter capacitors 7, at least a part of the multiple decoupling filter capacitors 7 is arranged overlapping with the first power module 4 along the first direction X, the multiple decoupling filter capacitors 7 are arranged on the second surface 102, and the multiple decoupling filter capacitors 7 are electrically connected to the board body 1; multiple heat conductors 602 are interspersed between the multiple decoupling filter capacitors 7.

[0114] In this embodiment, if Figure 1 As shown, the decoupling filter capacitor 7 is disposed on the second surface 102 , providing a larger space for the first power module 4 to be disposed in the through hole 3 .

[0115] The plurality of heat conducting members 602 are inserted between the plurality of decoupling filter capacitors 7 , so that the gaps between the plurality of decoupling filter capacitors 7 can be reasonably utilized, making the structure more compact.

[0116] The plurality of decoupling filter capacitors 7 are at least partially arranged to overlap with the first power module 4 along the first direction X, shortening the distance from the first power module 4 and the processor 8. The decoupling filter capacitors 7 can prevent parasitic oscillation caused by the positive feedback path formed by the circuit through the power supply. In other words, it can effectively eliminate the parasitic coupling between the circuit networks and ensure the normal operation of the circuit.

[0117] Specifically, Figure 1 , Figure 5 and 7 As shown, the power module is divided into a first power module 4 and a second power module 5, the first power module 4 is installed in the socket 2, and the number and arrangement of the heat conductor 602 are determined according to the power of the first power module 4, and a plurality of decoupling filter capacitors 7 are arranged on the second surface 102 and located around the heat conductor 602, and the second power module 5 is installed on the second surface 102 and arranged on the outside of the decoupling filter capacitor 7.

[0118] In one embodiment, Figure 6 As shown, the first power supply module 4 includes a plurality of power supply units 401, and the plurality of power supply units 401 are used to supply power to the processor 8, and the plurality of power supply units 401 are arranged side by side along the second direction Y, wherein the second direction Y is perpendicular to the first direction X.

[0119] In this embodiment, multiple power supply units 401 provide power to the processor 8, which can reduce the power supply current of a single power supply unit 401, reduce the current loss in the power supply path, and improve the power supply efficiency.

[0120] In one embodiment, the first power supply module 4 is a high-frequency voltage regulator, which is used to adjust the voltage to the rated voltage of the processor 8;

[0121] And / or, the second power module 5 is a low-frequency voltage regulator, used to reduce the voltage delivered to the first power module 4.

[0122] In this embodiment, the high-frequency voltage regulator is small in size. When the high-frequency voltage regulator adjusts the voltage to the rated voltage of the processor 8, due to the high power of the processor 8, when the voltage is reduced, the power supply current delivered from the high-frequency voltage regulator to the processor 8 increases. Therefore, it is necessary to shorten the power supply path between the high-frequency voltage regulator and the processor 8 and reduce the current loss. Installing the high-frequency voltage regulator in the through hole 3 can shorten the power supply path and improve the power supply efficiency.

[0123] The low-frequency voltage regulator is used to adjust the total power supply voltage, lowering the total power supply voltage but not reaching the rated voltage of the processor 8. The current is transmitted to the first power supply module 4 for further voltage reduction to reach the rated voltage of the processor 8. The current transmitted from the second power supply module 5 to the first power supply module 4 is smaller than the current transmitted from the first power supply module 4 to the processor 8. Therefore, the current loss is smaller on the power supply path between the second power supply module 5 and the first power supply module 4.

[0124] In a specific embodiment, a plurality of second power modules 5 are arranged in parallel, and the second power modules 5 are electrically connected to the main power supply. A plurality of first power modules 4 are arranged in parallel, and the plurality of first power modules 4 are electrically connected to the socket 2 for supplying power to the processor 8.

[0125] In a specific embodiment, the voltage of the total power supply is 12V, which is stepped down by multiple second power modules 5, so that the voltage of the first power module 4 is 5V, and the first power module 4 continues to step down the voltage to 1.2V, which is the rated voltage of the processor 8. When the power is constant, the lower the voltage, the larger the circuit, so when the first power module 4 reduces the voltage to 1.2V, the current is relatively large, and the first power module 4 and the processor 8 are on the same side of the board body 1, and are arranged overlapping with the processor 8 along the first direction X, which can greatly shorten the power supply path of the first power module 4 to the processor 8, reduce the current loss in the power supply path, and improve the power supply efficiency.

[0126] Specifically, the power module used to supply power to the processor 8 is split into a first power module 4 and a second power module 5. The first power module 4 is small in size and has a high switching frequency, while the second power module 5 is large in size and has a low switching frequency. The low-frequency second power module 5 is placed at the bottom of the board body 1, while the high-frequency first power module 4 is placed in the socket 2. The high-frequency first power module 4 is located inside the socket 2, which realizes the shortest power supply path for the power supply current and minimizes the power supply path loss. In addition, since the first power module 4 is moved to the first surface 101, the space for the decoupling filter capacitor 7 on the second surface 102 is retained.

[0127] In one embodiment, a connecting frame is further included, the connecting frame is connected to the board body 1, and the heat sink 601 is connected to the connecting frame.

[0128] Specifically, the connecting frame includes a plurality of connecting rods, one end of the connecting rod is connected to the plate body 1, and the other end is connected to the heat sink 601, and the connection method can be welding or bolt connection.

[0129] According to an embodiment of the present application, on the other hand, a server is provided, including: a processor 8 and a mainboard, the processor 8 is installed in the installation part, and the processor 8 is electrically connected to the first power module 4.

[0130] The server may be any one of a mail server, a database server, an application server, a Web server, a virtualization server, a cloud computing server, a website server, and a dedicated server.

[0131] The server has the same effect as the motherboard, so I won't go into details here.

[0132] Below is an example, combined with Figures 1 to 9 A comprehensive description of all the above schemes is given.

[0133] In related technologies, such as Figure 8 As shown, the power supply 9 is arranged on the peripheral side of the processor 8, the current path 10 is long, and the power supply efficiency is low.

[0134] In related technologies, such as Fig. 9 As shown, the vertical power supply technology is adopted, the power supply 9 is arranged on the second surface 102 of the board body 1, and the power supply 9 is arranged overlapping with the processor 8 along the first direction X, which shortens the current path 10 to a certain extent, but the power supply 9 occupies the space of the decoupling filter capacitor 7, resulting in the decoupling filter capacitor 7 being far away from the first power module 4 and the processor 8, and the parasitic oscillation caused by the positive feedback path formed by the circuit through the power supply 9 cannot be effectively prevented. In other words, the parasitic coupling between the circuit networks cannot be effectively eliminated, affecting the normal operation of the circuit.

[0135] In the embodiment of the present application, the main power supply is connected to the board body 1, and is connected to multiple second power modules 5 through the board body 1. The multiple second power modules 5 perform a first-stage voltage reduction, and the multiple second power modules 5 transmit the reduced current to the multiple first power modules 4. The multiple first power modules 4 perform a second-stage voltage reduction to adjust the voltage to the rated voltage of the processor 8. For example, the voltage of the main power supply is 12V, and after the voltage is reduced by multiple second power modules 5, the voltage of the first power module 4 is 5V. The first power module 4 continues to reduce the voltage and reduces the voltage to 1.2V, which is the rated voltage of the processor 8. When the power is constant, the lower the voltage, the larger the circuit. Therefore, when the first power module 4 reduces the voltage to 1.2V, the current is relatively large. The first power module 4 and the processor 8 are on the same side of the board body 1, and are arranged overlapping with the processor 8 along the first direction X, which can greatly shorten the power supply path of the first power module 4 to the processor 8, reduce the current loss in the power supply path, and improve the power supply efficiency.

[0136] The first power module 4 is installed in the through hole 3, and the decoupling filter capacitor 7 originally in the through hole 3 is arranged on the second surface 102, shortening the power supply path between the first power module 4 and the processor 8. A plurality of decoupling filter capacitors 7 are arranged to overlap with the first power module 4 at least partially along the first direction X, shortening the distance between the first power module 4 and the processor 8, and the decoupling filter capacitor 7 can prevent parasitic oscillation caused by the positive feedback path formed by the circuit through the power supply. In other words, it can effectively eliminate the parasitic coupling between the circuit networks and ensure the normal operation of the circuit.

[0137] like Figure 1 , Figure 5 and 6 As shown, the first power module 4 is arranged in the through hole 3, the number of the heat conductors 602 is determined to be nine according to the heat dissipation requirements of the first power module 4, and the first heat sink 6021 is in contact with the first power module 4, and the plurality of second heat sinks 6022 are arranged as an integrated structure, which can increase the connection strength with the heat sink 601, improve the stability of the connection, and improve the heat dissipation effect. A plurality of decoupling filter capacitors 7 are arranged on the second surface 102 of the board body 1, and a plurality of second power modules 5 are arranged outside the plurality of decoupling filter capacitors 7 and close to the first power module 4 and the processor 8.

[0138] like Figure 5 As shown, the number of vias 103 and the heat conductor 602 is the same, which is set to nine. The nine vias 103 are arranged in an array. The nine vias 103 are located between multiple decoupling filter capacitors 7. The distance between the first power module 4 and the heat sink 601 is extended by the heat conductor 602, so that the decoupling filter capacitor 7 can have sufficient space to be set.

[0139] like Figure 4 As shown, the heat conductor 602 is a columnar body that is wide at both ends and narrow in the middle. The heat conductor 602 occupies a small area on the second surface 102, which largely retains the space of the second surface 102, so that a large number of decoupling filter capacitors 7 can continue to be arranged on the second surface 102. In order to avoid interference with the vertical power supply module, the decoupling filter capacitor 7 is placed at a position far away from the processor 8 on the second surface 102 in the relevant vertical power supply solution.

[0140] Both ends of the heat conducting member 602 extend outward to form a tapered connecting end, thereby increasing the contact area with the first power module 4 and the heat sink 6 and improving the heat conduction effect.

[0141] The present application takes into account the vertical power supply and the position of the decoupling filter capacitor 7, both of which can be placed at a position close to the processor 8. In the vertical power supply technology, both the power supply efficiency and the decoupling filter effect are improved.

[0142] Although the embodiments of the present application are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present application, and such modifications and variations are all within the scope defined by the attached present application.

Claims

1. A motherboard, characterized in that: include: A board body (1), wherein a mounting portion for mounting a processor (8) is provided on the board body (1); A first power module (4) is arranged in the mounting portion and overlapped with the mounting portion along a first direction (X), the first power module (4) being used to supply power to the processor (8), wherein the first direction (X) is perpendicular to the board body (1); A heat sink (6), the heat sink (6) comprising a heat sink (601) and a heat conducting member (602), a plurality of the heat conducting members (602) being provided, a plurality of via holes (103) being provided on the plate body (1), each of the heat conducting members (602) correspondingly passing through the plurality of via holes (103), and having two ends thereof respectively connected to the heat sink (601) and the first power module (4).

2. The mainboard according to claim 1, characterized in that: A socket (2) is provided on the first surface (101) of the board body (1), the socket (2) is electrically connected to the board body (1), the first power module (4) is electrically connected to the board body (1), and a portion of the board body (1) corresponding to the socket (2) along the first direction (X) forms the mounting portion with the socket (2); Wherein, the first power module (4) is arranged in the mounting portion.

3. The mainboard according to claim 2, characterized in that: The first power module (4) is located in the socket (2).

4. The mainboard according to claim 3, characterized in that: The socket (2) is provided with a through hole (3), and the first power module (4) is located in the through hole (3).

5. The mainboard according to any one of claims 1 to 4, characterized in that: The board also comprises at least one second power module (5), wherein the second power module (5) is arranged on the second surface (102) of the board body (1), the second power module (5) is arranged to overlap with the mounting portion along the first direction (X), and the second power module (5) is electrically connected to the first power module (4).

6. The mainboard according to claim 5, characterized in that: The heat dissipation plate (601) abuts against the second power module (5).

7. The mainboard according to claim 6, characterized in that: A plurality of heat dissipation slots (6011) are provided on a side of the heat dissipation plate (601) away from the second power module (5).

8. The mainboard according to claim 6, characterized in that: A first heat sink (6021) and a second heat sink (6022) are respectively provided at two ends of the heat conducting member (602); the first heat sink (6021) is connected to the first power module (4), and the second heat sink (6022) is connected to the heat dissipation plate (601).

9. The mainboard according to claim 8, characterized in that: The plurality of second heat sinks (6022) are an integrated structure.

10. The mainboard according to claim 8, characterized in that: Heat dissipation glue is provided between the first heat sink (6021) and the first power module (4); And / or, heat dissipation glue is provided between the second heat sink (6022) and the heat dissipation plate (601).

11. The mainboard according to claim 6, characterized in that: It also includes a plurality of decoupling filter capacitors (7), at least a portion of the plurality of decoupling filter capacitors (7) being arranged overlapping with the first power module (4) along a first direction (X), the plurality of decoupling filter capacitors (7) being arranged on the second surface (102), the plurality of decoupling filter capacitors (7) being electrically connected to the board body (1); and the plurality of heat conducting members (602) being interspersed between the plurality of decoupling filter capacitors (7).

12. The mainboard according to any one of claims 1 to 4, characterized in that: The first power supply module (4) comprises a plurality of power supply units (401), the plurality of power supply units (401) being used to supply power to the processor (8), the plurality of power supply units (401) being arranged side by side along a second direction (Y), wherein the second direction (Y) is perpendicular to the first direction (X).

13. The mainboard according to claim 5, characterized in that: The first power supply module (4) is a high-frequency voltage regulator, used for adjusting the voltage to the rated voltage of the processor (8); And / or, the second power module (5) is a low-frequency voltage regulator, used to reduce the voltage transmitted to the first power module (4).

14. The mainboard according to claim 6, characterized in that: It also comprises a connecting frame, the connecting frame being connected to the plate body (1), and the heat dissipation plate (601) being connected to the connecting frame.

15. A server, characterized in that: It comprises a processor (8) and a mainboard according to any one of claims 1 to 14, wherein the processor (8) is mounted on the mounting portion.

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