Single-sided circuit board with grounding function

Abstract

The utility model discloses a single-sided circuit board with a grounding function, which comprises a shell, a single-sided circuit board and a grounding layer are arranged in the shell, an adhesive layer is arranged between the single-sided circuit board and the grounding layer, and the grounding layer is arranged between the adhesive layer and the shell. The single-sided circuit board is simple in structure and convenient to use, the spot welding holes are formed in the single-sided circuit board, the through holes corresponding to the spot welding holes in position are formed in the adhesive layer, and during assembly, the adhesive layer is attached to the lower end face of the single-sided circuit board, and the hole positions of the adhesive layer and the single-sided circuit board are aligned; then the tin-plated layer corresponding to the spot welding hole in position is arranged on the grounding layer, so that the spot welding hole and the tin-plated layer are located at the same position, and then tin soldering is performed through a tin soldering technology, so that the tin-plated layer at the bottom layer can be connected with the tin-plated layer at the top, and the grounding layer is connected with the shell to realize a conduction grounding effect; electric leakage touch, lightning stroke and the like are effectively avoided, a good protection effect is achieved, and electric shock, fire disasters or explosions are prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of single-sided circuit boards, in particular to a single-sided circuit board with a grounding function. Background Art

[0002] The main function of grounding is to prevent people from electric shock, damage to equipment or lines, prevent fire, prevent lightning strikes, prevent electrostatic damage and ensure the normal operation of the equipment power system. Grounding can ensure the normal operation of electronic equipment and play an effective safety protection measure to protect personal safety. It mainly connects the inside of the electronic equipment with the grounding device through metal wires, so as to introduce the leakage current, static electricity, etc. into the underground, realize the grounding protection, and play an effective protection effect, thereby avoiding electric shock, fire or explosion.

[0003] As society continues to progress and develop, electronic technology is also advancing by leaps and bounds. Various electronic products have become popular in our work and daily life, especially the most common electronic devices such as home appliances. It is necessary to add a grounding structure to the double-sided or multi-layer circuit board to achieve the grounding effect. However, there is no single-sided board on the market that can achieve the grounding function.

[0004] Therefore, it is necessary to study a new technical solution to solve the above problems. Utility Model Content

[0005] In view of this, the present invention aims to solve the deficiencies in the prior art, and its main purpose is to provide a single-sided circuit board with a grounding function.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A single-sided circuit board with a grounding function comprises a shell, wherein the single-sided circuit board and a grounding layer are arranged in the shell, an adhesive layer is arranged between the single-sided circuit board and the grounding layer, and the grounding layer is arranged between the adhesive layer and the shell.

[0008] As a preference, the grounding layer is made of nickel sheet material, the size of the grounding layer is larger than the size of the single-sided circuit board, and the lower end surface of the grounding layer is attached to the inner end surface of the shell to achieve connection and conduction.

[0009] As a preference, a tin-plated layer is provided on the grounding layer, and the tin-plated layer is located in a lower center area of ​​an upper end surface of the grounding layer.

[0010] As a preferred embodiment, the single-sided circuit board is provided with spot welding holes which penetrate vertically, and the spot welding holes are located above the tin-plated layer.

[0011] As a preference, the number of the spot welding holes is set to be plural, and the plural spot welding holes are evenly distributed on the single-sided circuit board and are located above the tin-plated layer.

[0012] As a preferred embodiment, the adhesive layer is provided with through holes corresponding to the positions of the spot welding holes on the single-sided circuit board, the upper end surface of the adhesive layer is bonded to the lower end surface of the single-sided circuit board, and the hole positions of the two are aligned, and the lower end surface of the adhesive layer is bonded to the upper end surface of the grounding layer and the spot welding holes are located above the tin-plated layer.

[0013] As a preference, a tinning layer is further provided at the spot welding holes of the single-sided circuit board, and the tinning layer is tinned inward from the spot welding holes of the single-sided circuit board through a tinning technology and connected with the tin-plated layer below.

[0014] As a preference, the adhesive layer is made of pure adhesive material.

[0015] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical scheme that the utility model has a simple structure and is easy to use. By opening spot welding holes on the single-sided circuit board and providing through holes corresponding to the positions of the spot welding holes on the adhesive layer, during assembly, the adhesive layer is attached to the lower end surface of the single-sided circuit board and the hole positions of the two are aligned. Then, a tin-plated layer corresponding to the positions of the spot welding holes is provided on the grounding layer, and the two are bonded and fixed together through the adhesive layer, so that the spot welding holes and the tin-plated layer are in the same position. Then, soldering technology is used to solder from the front side of the single-sided circuit board so that the tin-plated layer of the bottom layer can be connected to the solder on the top, and the single-sided circuit board is firmly welded and fixed together. Finally, the shell is installed so that the grounding layer can be in contact and connected with the shell, so as to achieve the conductive grounding effect, effectively avoid leakage touch, lightning strike and the like, play a good personal protection and equipment protection effect, and prevent electric shock, fire or explosion. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0017] Figure 1 It is a schematic diagram of the overall planar structure of the utility model.

[0018] Figure 2 It is a schematic diagram of the cross-sectional structure of the utility model.

[0019] Among them, the reference numerals in the figure are:

[0020] 10. Shell; 20. Single-sided circuit board; 21. Spot welding hole; 22. Spot tin layer; 30. Adhesive layer; 31. Through hole; 40. Ground layer; 41. Tin plating layer. DETAILED DESCRIPTION

[0021] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0022] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0023] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0024] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0025] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0026] Reference Figure 1-2 As shown: A single-sided circuit board with a grounding function includes a shell 10, in which a single-sided circuit board 20 and a grounding layer 40 are arranged, wherein the single-sided circuit board 20 is composed of copper, pure glue and pi layer, and an adhesive layer 30 is also arranged between the single-sided circuit board 20 and the grounding layer 40, and by arranging the grounding layer 40 between the adhesive layer 30 and the shell 10, the grounding layer 40 can be in contact with the shell 10 to achieve a conduction effect.

[0027] Specifically, the grounding layer 40 used is made of nickel sheet material, and the size of the grounding layer 40 is made larger than the size of the single-sided circuit board 20, so that the single-sided circuit board 20 can be completely within the range of the grounding layer 40, avoiding the appearance of uncovered areas, which may cause leakage, electric shock, etc., and the lower end surface of the grounding layer 40 is attached to the inner end surface of the shell 10 to achieve connection and conduction, thereby conducting the leakage current to avoid touch leakage and equipment damage.

[0028] Furthermore, a tin-plated layer 41 is provided on the grounding layer 40, and the tin-plated layer 41 is arranged in the lower center area of ​​the upper end surface of the grounding layer 40, and the tin-plated layer 41 has a rectangular structure, and the thickness of the tin-plated layer 41 is 3-8 um.

[0029] In this embodiment, a spot welding hole 21 is provided on the single-sided circuit board 20 so as to pass through the single-sided circuit board 20 from top to bottom, and the spot welding hole 21 is configured to be a circular hole or a square shape, and the position of the spot welding hole 21 is located above the tin-plated layer 41, and the number of the spot welding holes 21 is configured to be plural, and the plural spot welding holes 21 are evenly spaced and distributed on the single-sided circuit board 20, and are located above the tin-plated layer 41, so as to facilitate subsequent processing.

[0030] Specifically, the adhesive layer 30 is provided with through holes 31 corresponding to the positions of the spot welding holes 21 on the single-sided circuit board 20. During production and processing, the upper end surface of the adhesive layer 30 is bonded to the lower end surface of the single-sided circuit board 20, and the hole positions of the two are aligned, and then the lower end surface of the adhesive layer 30 is bonded to the upper end surface of the grounding layer 40, and the spot welding holes 21 and the through holes 31 are both located above the tin-plated layer 41, so that the tin-plated layer 41 can be directly processed during subsequent processing.

[0031] Furthermore, the adhesive layer 30 used is made of pure adhesive material.

[0032] In this embodiment, a tinning layer 22 is provided at the spot welding hole 21 of the single-sided circuit board 20, so that the tinning layer 22 is tinned inward from the spot welding hole 21 of the single-sided circuit board 20 through the tinning technology, and the solder can be connected with the tin-plated layer 41 below through the spot welding hole 21 and the through hole 31 in turn, so that the tinning layer 22 and the tin-plated layer 41 are connected and fixed together, and the single-sided circuit board 20 can be firmly fixed to the grounding layer 40.

[0033] The above are only preferred embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for the purpose of explaining the principles of the present invention, and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanation here, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention, and other specific implementation methods of the present invention that can be associated with by technicians in this field without creative labor, should be included in the scope of protection of the present invention.

Claims

1. A single-sided circuit board with a grounding function, comprising a housing (10), characterized in that: A single-sided circuit board (20) and a grounding layer (40) are arranged in the housing (10); an adhesive layer (30) is arranged between the single-sided circuit board (20) and the grounding layer (40); and the grounding layer (40) is arranged between the adhesive layer (30) and the housing (10).

2. The single-sided circuit board with grounding function according to claim 1, characterized in that: The grounding layer (40) is made of a nickel sheet material, the size of the grounding layer (40) is larger than the size of the single-sided circuit board (20), and the lower end surface of the grounding layer (40) is attached to the inner end surface of the shell (10) to achieve a connection and conduction function.

3. The single-sided circuit board with grounding function according to claim 1, characterized in that: A tin-plated layer (41) is provided on the grounding layer (40), and the tin-plated layer (41) is located in a lower central area of ​​the upper end surface of the grounding layer (40).

4. The single-sided circuit board with grounding function according to claim 3, characterized in that: The single-sided circuit board (20) is provided with spot welding holes (21) that penetrate vertically, and the spot welding holes (21) are located above the tin-plated layer (41).

5. The single-sided circuit board with grounding function according to claim 4, characterized in that: The number of the spot welding holes (21) is set to be plural, and the plural spot welding holes (21) are evenly distributed on the single-sided circuit board (20) and are located above the tin-plated layer (41).

6. The single-sided circuit board with grounding function according to claim 5, characterized in that: The adhesive layer (30) is provided with through holes (31) corresponding to the positions of the spot welding holes (21) on the single-sided circuit board (20); the upper end surface of the adhesive layer (30) is bonded to the lower end surface of the single-sided circuit board (20), and the hole positions of the two are aligned; the lower end surface of the adhesive layer (30) is bonded to the upper end surface of the grounding layer (40), and the spot welding holes (21) are located above the tin-plated layer (41).

7. The single-sided circuit board with grounding function according to claim 6, characterized in that: A tinning layer (22) is also provided at the spot welding hole (21) of the single-sided circuit board (20). The tinning layer (22) is tinned inward from the spot welding hole (21) of the single-sided circuit board (20) through a tinning technology and is connected to the tinned layer (41) below.

8. The single-sided circuit board with grounding function according to claim 1, characterized in that: The adhesive layer (30) is made of pure adhesive material.

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