Battery protection plate and battery with same

Abstract

The utility model provides a battery protection board and a battery, and relates to the technical field of batteries. According to the battery protection board provided by the invention, the components and the conductive member of the battery protection board are not arranged on different planes in the prior art, but are located on the same side of the board main body of the battery protection board, and the plastic package area, where the components are arranged, on the board main body is packaged by the plastic package layer when the electronic components are packaged in an injection molding manner; therefore, local packaging of the component is realized. Therefore, according to the battery protection board provided by the invention, the situation that the conductive member and the component are arranged on different planes in order to prevent the conductive member from being packaged in a conventional SIP plastic packaging process is avoided, the conductive member and the component are arranged on the same plane, and the component is locally packaged, so that the thickness of the battery protection board is reduced, and the reliability of the battery protection board is improved. Therefore, the battery protection plate is thinned, and miniaturization of the battery protection plate is realized.

Description

Technical Field

[0001] The present application relates to the field of battery technology, and in particular to a battery protection board and a battery having the same. Background Art

[0002] In the current battery field, miniaturization is the development area. For example, in the field of mobile phone batteries, with the advent of foldable screen mobile phones, mobile phone batteries are developing in a thinner direction, constantly impacting the thickness limit. The head thickness space is one of the main reasons that limit the thickness of the battery. In order to reduce the thickness of the battery head, the thickness of the battery protection board (ie PCM, Protection Circuit Module) is constantly thinning, which leads to a significant decrease in the strength of the protection board, and usually requires corresponding reinforcement.

[0003] Conventionally, the SIP (system in package) process is used to reinforce the protection board. However, SIP covers the surface of components with plastic encapsulation material by injection molding. The components on the circuit board of the battery protection board need to be on different sides from the nickel sheet and FPC. Otherwise, the plastic encapsulation will cover the pads of the nickel sheet and FPC, making it impossible to solder the nickel sheet and FPC to the circuit board. However, the nickel sheet, components and FPC are on different sides, resulting in increased thickness on both sides of the circuit board, which will increase the overall thickness of the protection board. In particular, the thickness space occupied by the corresponding area of ​​the nickel sheet may be 0.3 to 0.5 mm, which cannot achieve the purpose of thinning. Utility Model Content

[0004] In view of this, the present application provides a battery protection board and a battery having the same, aiming to solve the above technical problems to a certain extent.

[0005] The first aspect of the present application provides a battery protection board, comprising:

[0006] The first circuit board comprises a board body, a plastic sealing area and a non-glue area are arranged on one side of the board body, the plastic sealing area is provided with components and a plastic sealing layer covering the plastic sealing area, and the non-glue area is provided with a conductive member;

[0007] A second circuit board is connected to the first circuit board.

[0008] Preferably, there are a plurality of the adhesive-free areas, and the plurality of adhesive-free areas are arranged at intervals along the length direction of the board body, and each of the adhesive-free areas is provided with at least one conductive component.

[0009] Preferably, there are a plurality of plastic sealing areas, and the plurality of plastic sealing areas are arranged at intervals along the length direction of the board body.

[0010] Preferably, the plurality of glue-free areas and the plurality of plastic-sealed areas are alternately arranged along the length direction.

[0011] Preferably, the distance between the side of the plastic packaging layer facing away from the board body and the side facing the board body is d1, and the thickness of the component is d2, wherein 0.1 mm≤d1-d2≤0.2 mm.

[0012] Preferably, the thickness of the board body is d3, and the distance between the side of the plastic sealing layer facing away from the board body and the side facing the board body is d1, wherein 0.7 mm≤d1+d3≤0.9 mm.

[0013] Preferably, d1=0.6 mm, and / or, 0.1 mm≤d3≤0.3 mm.

[0014] Preferably, a connection area is provided at an end portion of the first circuit board along the length direction, and one end of the second circuit board is connected to the connection area;

[0015] Wherein, the connection area and the plastic sealing area are located on the same surface of the board body.

[0016] Preferably, in the thickness direction of the board body, the orthographic projection of one end of the second circuit board falls into the connection area, and the battery protection board also includes a packaging portion, which covers the one end of the second circuit board and the connection area.

[0017] Preferably, the packaging part is a UV glue block, an injection-molded rubber block or an injection-molded plastic block.

[0018] Preferably, the conductive component is a heightening component having two opposite sides, one side of the heightening component is connected to the glue-free area, and the other side of the heightening component is used for being electrically connected to a tab of the battery cell.

[0019] Preferably, the adhesive-free area is provided with a raising component, the raising component has two opposite sides, one side of the raising component is connected to the adhesive-free area, and the other side of the raising component is connected to the conductive component.

[0020] Preferably, the thickness of the raising component is at least 0.2 mm to 0.5 mm.

[0021] Preferably, the plurality of molding layers in the plurality of molding areas are configured to be molded in the same injection molding process.

[0022] Preferably, the plurality of molding layers corresponding to the plurality of molding areas are configured to be molded in the same injection molding process.

[0023] A second aspect of the present application provides a battery, comprising the battery protection board as described above.

[0024] According to the battery protection board provided by the present application, the components and the conductive members of the battery protection board are no longer arranged on different planes as in the prior art, but are located on the same side of the board body of the battery protection board, and the plastic sealing area on the board body where the components are arranged is encapsulated by the plastic sealing layer when the electronic components are encapsulated by injection molding, thereby realizing partial encapsulation of the components. Therefore, according to the battery protection board provided by the present application, the situation in which the conductive members and the components are arranged on different planes in order to prevent the conductive members from being encapsulated in the conventional SIP (system in package) plastic sealing process is avoided, but the conductive members and the components are arranged on the same plane, and the components are partially encapsulated, which is conducive to reducing the thickness of the battery protection board, thereby thinning the battery protection board to realize the miniaturization of the battery protection board.

[0025] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A schematic diagram showing an exploded view of a battery protection board provided according to an embodiment of the present application;

[0028] Figure 2 A schematic diagram showing a plan view of a battery protection board provided according to an embodiment of the present application;

[0029] Figure 3 A schematic diagram showing a plan view of a partial structure of a battery protection plate provided according to an embodiment of the present application;

[0030] Figure 4 A schematic diagram showing a production process of a battery protection board provided according to an embodiment of the present application is shown.

[0031] Reference numerals:

[0032] 100-PCB; 110-board body; 200-conductive component; 300-FPC; 400-plastic sealing layer; 500-heightening component; 600-components; 700-packaging part; 800-mold. DETAILED DESCRIPTION

[0033] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0034] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0035] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0037] According to a first aspect of an embodiment of the present application, a protection circuit board is provided. Figures 1 to 4 Describe in detail the structure and working principle of the protection circuit board.

[0038] The battery protection board provided according to the embodiment of the present application includes a first circuit board and a second circuit board. The first circuit board includes a board body 110, and a plastic sealing area and a non-glue area are arranged on one side of the board body 110. The plastic sealing area is provided with components 600 and a plastic sealing layer 400 covering the plastic sealing area, and the non-glue area is provided with a conductive member 200. The second circuit board is connected to the first circuit board.

[0039] Thus, according to the battery protection board provided in the embodiment of the present application, the components 600 and the conductive member 200 of the battery protection board are no longer arranged on different planes as in the prior art, but are located on the same side of the board body 110 of the battery protection board, and the plastic sealing area on the board body 110 where the components 600 are arranged is encapsulated by the plastic sealing layer 400 when the electronic components are encapsulated by injection molding, thereby realizing partial encapsulation of the components 600. Therefore, according to the battery protection board provided in the embodiment of the present application, the situation that the conductive member 200 and the components 600 are arranged on different planes in order to prevent the conductive member 200 from being encapsulated in the conventional SIP (system in package) plastic sealing process is avoided, but the conductive member 200 and the components 600 are arranged on the same plane, and the components 600 are partially encapsulated, which is conducive to reducing the thickness of the battery protection board, thereby thinning the battery protection board to realize the miniaturization of the battery protection board.

[0040] In the embodiment, as an example, the first circuit board may be, for example, a PCB100 (printed circuit board), and the second circuit board may be, for example, an FPC300 (Flexible Printed Circuit). The plastic layer 400 may be formed of plastic, such as the plastic layer 400 formed by partially plastic-sealing the components 600 in the SIP process mentioned in the above description. It should be noted that the second circuit board may be connected to one of the two opposite faces of the first circuit board, that is, the same face or different face as the plastic layer 400 or the components 600. In this embodiment, the same face is used as the preferred solution for description.

[0041] In an embodiment, the above-mentioned glue-free area is used to set the conductive member 200, and the conductive member 200 can be used to connect to the battery's pole lug, for example. Specifically, the conductive member 200 can be a metal sheet, and the metal sheet can be connected to the battery's pole lug through the battery's pole. In an embodiment, the metal sheet can be formed of nickel, for example. That is to say, the conductive member 200 can be formed as a substantial nickel sheet, for example. In addition, in an embodiment, the sheet-shaped conductive member 200 can be bent, and one of the two parts formed by the bend can be connected to the board body 110, and the other part of the two parts formed by the bend can extend in a direction away from the board body 110. This is Figure 1 and Figure 2 Shown in.

[0042] In an embodiment, the conductive member 200 can be used to electrically connect the component 600 and the battery. As an example, in an embodiment, the component 600 can form a protection circuit of a battery protection board, and the conductive member 200 plays a role in electrically connecting the protection circuit and the battery.

[0043] It should be noted that the "plastic sealing area" and "glue-free area" mentioned in the above description can be defined by corresponding boundaries, respectively. Specifically, the "plastic sealing area" is defined by the boundary of the plastic sealing layer 400, that is, the area occupied by the plastic sealing layer 400 on the surface of the board body 110 is the "plastic sealing area". Similarly, the "glue-free area" is defined by the boundary of the conductive component 200, that is, the area occupied by the conductive component 200 on the surface of the board body 110 is part or all of the "glue-free area". The boundary between the "plastic sealing area" and the "glue-free area" can be joined or spaced, that is, the distance between the boundaries of the "plastic sealing area" and the "glue-free area" can be greater than or equal to 0. In this embodiment, the joining of the boundaries of the two is used as an exemplary illustration, that is, the distance between the boundaries of the "plastic sealing area" and the "glue-free area" is 0.

[0044] Specifically, the area occupied by the component 600 in the plastic sealing area is at least part of or all of the plastic sealing area. At this time, the plastic sealing layer 400 completely covers the plastic sealing area, thereby covering the component 600. The area occupied by the conductive component 200 in the non-glue area is at least part of or all of the non-glue area. When the area occupied by the component 600 in the plastic sealing area is at least part of the plastic sealing area and the area occupied by the conductive component 200 in the non-glue area is at least part of the non-glue area, there may be overlapping parts between the plastic sealing area and the non-glue area, that is, the boundaries of the two are respectively located in the areas of each other, and the plastic sealing layer 400 arranged in the plastic sealing area will not cover the conductive component 200 in the non-glue area, and the conductive component 200 in the non-glue area will not contact or hinder the components in the plastic sealing area. At this time, the plastic sealing layer 400 can cover the overlapping area between the non-glue area and the plastic sealing area.

[0045] In this embodiment, the boundary definition of the "plastic encapsulation area" and the "glue-free area" can be understood with reference to the above description, which aims to provide an adaptive description of the relevant structures within the "plastic encapsulation area" and the "glue-free area", so that the component 600 can be partially encapsulated by the plastic encapsulation layer, while the conductive component 200 is not encapsulated, and the component 600 and the conductive component 200 will not hinder each other.

[0046] In an embodiment, there may be a plurality of adhesive-free regions, and the aforementioned plurality of adhesive-free regions may be arranged at intervals along the length direction of the board body 110 , and at least one conductive member 200 may be arranged in each adhesive-free region.

[0047] In an embodiment, Figures 1 to 4As shown, the PCB 100 may be formed into a strip shape, and the direction in which it extends is the length direction. Along the length direction, the above-mentioned multiple glue-free areas may be arranged at intervals, and a conductive member 200 may be arranged corresponding to each glue-free area. In an embodiment, as an example, a pad may be preset on the board body 110 of the PCB 100, and then the conductive member 200 such as a nickel sheet may be welded to the pad.

[0048] In the embodiment, as described above, the number of the conductive members 200 corresponds to the number of the adhesive-free regions, that is, one conductive member 200 can be provided for one adhesive-free region. Therefore, when there are multiple adhesive-free regions, the number of the conductive members 200 is also multiple. As described above, these conductive members 200 can all be used to electrically connect to the tabs of the battery. In the embodiment, the number of the conductive members 200 can be, for example, two. Figure 1 and Figure 2 In an embodiment, the two conductive members 200 may be electrically connected to the positive electrode and the negative electrode of the battery, respectively.

[0049] According to the battery protection board provided in the embodiment of the present application, the number of plastic sealing areas can be multiple, and the aforementioned multiple plastic sealing areas are arranged at intervals along the length direction of the board body 110, and each plastic sealing area is provided with a component 600 and a plastic sealing layer 400 covering the plastic sealing area.

[0050] Similar to the glue-free area described above, the plastic-sealed area can also be arranged at intervals along the length direction, and corresponding components 600 and a plastic-sealed layer 400 covering the plastic-sealed area are arranged in each plastic-sealed area, that is, this plastic-sealed layer 400 covers the components 600 in the plastic-sealed area. In other words, in the embodiment, the number of plastic-sealed layers 400 is also multiple, and they correspond one-to-one to the plastic-sealed areas, that is, one plastic-sealed layer 400 is arranged in one plastic-sealed area, and if the components 600 arranged in each plastic-sealed area are defined as a group of components 600, then there are multiple groups of components 600 in the embodiment of the present application, and the aforementioned multiple groups of components 600 correspond one-to-one to the aforementioned multiple plastic-sealed areas.

[0051] As an example, in the embodiment, the number of the plastic encapsulation areas may be, for example, two, but is not limited thereto, and may also be another number greater than two, such as three, four, or five.

[0052] According to the battery protection plate provided in the embodiment of the present application, the above-mentioned multiple glue-free areas and the above-mentioned multiple plastic-sealed areas are alternately arranged along the length direction. As an example, in an example in which the number of glue-free areas is two and the number of plastic-sealed areas is two, along the length direction of the board body 110, a plastic-sealed area can be set at one end of the board body 110, and the corresponding components 600 are set in the plastic-sealed area, and then the plastic-sealed layer 400 covering the components 600 in the plastic-sealed area is set. Then, a glue-free area is set on the inner side of the plastic-sealed area at the end, and a conductive member 200 is set in the glue-free area. Next, another plastic-sealed area is set on the inner side of the aforementioned conductive member 200, and the corresponding components 600 and the plastic-sealed layer 400 are set. Finally, a glue-free area is set at a position close to the other end of the board body 110, and a corresponding conductive member 200 is set.

[0053] It should be noted that the sequential expression used in the arrangement order of the components in the above-described example in which the number of glue-free areas is two and the number of plastic-sealed areas is two is only intended to reflect the relative positional relationship between these areas and the components within the areas, and is not intended to limit the actual production process of the battery protection board to that these areas and the components within the areas are arranged according to the above sequential expression.

[0054] According to the battery protection board provided in the embodiment of the present application, the distance between the side of the plastic encapsulation layer 400 facing away from the board body 110 and the side facing the board body 110 is d1 (that is, the thickness of the plastic encapsulation layer 400 is d1), and the height of the component 600 is d3, wherein 0.1mm≤d1-d2≤0.2mm. In the embodiment, d1-d2 can essentially be expressed as the plastic encapsulation layer 400 being 0.1mm to 0.2mm higher than the component 600. In the embodiment, since the plastic encapsulation layer 400 is coated on the component 600, when the above height difference is limited, it can ensure that the plastic encapsulation layer 400 better coats the component 600 located in the plastic encapsulation area, and the plastic encapsulation strength and tightness of the plastic encapsulation layer 400 can be ensured.

[0055] According to the battery protection board provided in the embodiment of the present application, the distance between the side of the plastic sealing layer 400 facing away from the board body 110 and the side facing the board body 110 is d1 (that is, the thickness of the plastic sealing layer 400 is d1), and the thickness of the board body 110 is d3, wherein 0.7mm≤d1+d3≤0.9mm. In the embodiment, d1+d3 can be the actual thickness of the battery protection board or the first protection board. In the embodiment, since the components 600 and the conductive member 200 are arranged on the same plane, the two components that originally need to be arranged on different planes no longer increase the thickness of the battery protection board from the two sides of the board body 110, thereby effectively thinning the battery protection board, and the actual thickness of the battery protection board can be processed to 0.7mm to 0.9mm. For example, the thickness of the battery protection board can be 0.7mm, 0.8mm or 0.9mm, and the thickness of the battery protection board can also be any value within 0.7mm to 0.9mm.

[0056] In the embodiment, as an example, since the thickness d1 of the plastic layer 400 and the height d2 of the component can satisfy 0.1mm≤d1-d2≤0.2mm, and the height d2 of the component 600 satisfies 0.4mm≤d2≤0.5mm, the thickness d1 of the plastic layer 400 satisfies 0.5mm≤d2≤0.7mm. Specifically, in the present embodiment, the thickness d1 of the plastic layer 400 is 0.6mm; and / or, the thickness d3 of the board body 110 can satisfy 0.1mm≤d3≤0.3mm.

[0057] According to the battery protection board provided in the embodiment of the present application, a connection area may be provided at the end of the first circuit board along the length direction, and one end of the second circuit board may be connected to the connection area. In the embodiment, the connection area and the plastic sealing area are located on the same surface of the board body 110. One end of the second circuit board is connected to the connection area by welding with a pad.

[0058] So, like Figure 1 As shown, according to the battery protection board provided in the embodiment of the present application, since the connection area and the plastic sealing area are located on the same surface of the board body 110, after one end of the second circuit board is connected to the connection area, the second circuit board can also be arranged on the same plane as the plastic sealing layer 400. This avoids increasing the thickness of the battery protection board on both sides of the board body 110 due to the two being on different planes, which is also beneficial to thinning the battery protection board.

[0059] In an embodiment, the connection area may be, for example, an area at one end of PCB100 (i.e., an end where no plastic sealing area and no glue area are set), in which a soldering pad corresponding to the second circuit board may be set, and the second circuit board may be soldered to the soldering pad and connected to PCB100.

[0060] According to the battery protection board provided in the embodiment of the present application, in the thickness direction of the board body 110, the orthographic projection of one end of the second circuit board can fall into the connection area, and the battery protection board can also include a packaging portion 700, and the packaging portion 700 can cover the connection area, that is, simultaneously cover one end of the second circuit board located in the connection area.

[0061] In the embodiment, the orthographic projection of the second circuit board, that is, one end of the FPC300, falls into the connection area to ensure that the FPC300 overlaps with a portion of the PCB100, thereby facilitating the connection between the two. It should be noted that the FPC300 can also be electrically connected to the protection circuit of the battery protection board. In the embodiment, the packaging unit 700 covers the aforementioned end of the FPC300 and the connection area, thereby avoiding the aforementioned end of the FPC300 from being exposed and increasing the connection strength between the FPC300 and the PCB100.

[0062] As an example, in an embodiment, the packaging portion 700 may be, for example, a UV glue block (ie, Figure 1 The example given in the figure is a glue block formed by curing the UV glue, or it can be an injection molded rubber block or an injection molded plastic block.

[0063] According to the battery protection plate provided in the embodiment of the present application, the conductive member 200 may also be a heightening member 500, and the heightening member 500 is arranged in the glue-free area. The heightening member 500 may have two opposite sides (the size between the two sides is the thickness of the heightening member 500), and one side of the heightening member 500 may be connected to the glue-free area, and the other side of the heightening member 500 is used for spot welding with the pole ear of the battery cell to achieve electrical connection. That is to say, in the embodiment, the conductive member 200 is a rectangular sheet or rectangular block structure such as the heightening member 500, and the heightening member 500 can be substantially formed of a conductive material, for example, formed of a metal material such as nickel. In other words, the heightening member 500 can be formed as a substantial nickel sheet or nickel block. The nickel block assumes the conventional nickel sheet form, and is directly spot welded with the pole ear of the battery cell to achieve electrical connection. There is no need to set a nickel sheet on the basis of the nickel block, which can further reduce the overall thickness of the battery protection plate. It should be noted that the heightening member 500 can be connected to the adhesive-free area in the form of a soldering pad or a soldering sheet, so that the heightening member 500 is welded to the board body 110, thereby being electrically connected to the board body 110. It should be noted that when the conductive member 200 is the heightening member 500, the previously described embodiments related to the conductive member 200 can also be applied to the description of the heightening member 500, so it will not be repeated here.

[0064] The battery protection plate provided according to the embodiment of the present application may further include a raising component 500, which is arranged in the glue-free area. The raising component 500 may have two opposite sides (the dimension between the two sides is the thickness of the raising component 500), one side of the raising component 500 may be connected to the glue-free area, and the other side of the raising component 500 may be connected to the conductive component 200.

[0065] That is, in the embodiment, the conductive member 200 can be electrically connected to the board body 110 via the padding member 500. The padding member 500 can be welded to the pads of the corresponding non-glue area of ​​the PCB 100, and then the conductive member 200 is welded to the corresponding padding member 500. In this way, the padding member 500 can increase the connection strength between the conductive member 200 and the PCB 100, and can increase the rigidity of the battery protection board itself. In the embodiment, see Figure 3 As an example, the heightening member 500 may be a rectangular sheet or a rectangular block structure, which may be substantially formed of a conductive material, such as a metal material such as nickel. In other words, the heightening member 500 may be substantially formed of a nickel sheet or a nickel block. In this embodiment, the heightening member 500 is preferably a nickel block.

[0066] According to the battery protection board provided in the embodiment of the present application, the thickness of the padding member 500 can be at least 0.2 mm to 0.5 mm, so as to ensure that it can increase the connection strength between the conductive member 200 and the PCB 100 and increase the rigidity of the battery protection board itself. In addition, this thickness of the padding member 500 is also helpful to prevent the plastic from overflowing the padding member 500 and occupying the glue-free area during the process of injection molding the packaging components 600, which will be explained in the subsequent description.

[0067] According to the battery protection board provided in the embodiment of the present application, the above-mentioned multiple plastic sealing layers 400 can be configured to be molded in the same injection molding process. Figure 4 As shown, this same injection molding process is achieved by using a mold 800. In an embodiment, the mold 800 can be covered on the surface of the PCB 100, and the mold 800 can have a plurality of chambers, each chamber corresponding to an area, in other words, each plastic sealing area corresponds to a chamber, and each glue-free area also corresponds to a chamber, and then plastic is injected into the plastic sealing area to plastic seal the components 600 in the plastic sealing area. In an embodiment, even if the chamber corresponding to the plastic sealing area is connected to the adjacent chamber corresponding to the glue-free area, due to the setting of the padding member 500, the plastic will flow along the outside of the padding member 500, and the area occupied by the padding member 500 will not be plastic sealed. In addition, it should be noted that the plastic can be injected into the mold 800 along the width direction perpendicular to the length direction.

[0068] Therefore, according to the battery protection board provided in the embodiment of the present application, the outer side of the heightening member 500 can be joined with the adjacent plastic sealing layer. In other examples, the outer side of the heightening member 500 is spaced from the adjacent plastic sealing layer. In this example, the cavity corresponding to the plastic sealing area may not be connected to the cavity corresponding to the adjacent non-glue area, or the cavity corresponding to the plastic sealing area may be connected to the cavity corresponding to the adjacent non-glue area, but the plastic shrinks after the injection molding is cooled to form the aforementioned gap.

[0069] According to the second aspect of the embodiment of the present application, a battery is provided, the battery includes the battery protection board as described above, the battery as described above, and the above beneficial effects, which are not repeated here. The battery also includes a battery cell, the battery cell has a corresponding tab, and the battery cell is connected to the battery protection board through the tab.

[0070] The above are only preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. All equivalent structural changes made by using the contents of the present application specification and drawings under the innovative concept of the present application, or directly / indirectly applied in other related technical fields are included in the protection scope of the present application.

Claims

1. A battery protection board, characterized in that: include: The first circuit board comprises a board body, a plastic sealing area and a non-glue area are arranged on one side of the board body, the plastic sealing area is provided with components and a plastic sealing layer covering the plastic sealing area, and the non-glue area is provided with a conductive member; A second circuit board is connected to the first circuit board.

2. The battery protection board according to claim 1, characterized in that: There are a plurality of the adhesive-free areas, and the plurality of adhesive-free areas are arranged at intervals along the length direction of the board body, and each of the adhesive-free areas is provided with at least one conductive component.

3. The battery protection board according to claim 2, characterized in that: There are multiple plastic sealing areas, and the multiple plastic sealing areas are arranged at intervals along the length direction of the board body.

4. The battery protection board according to claim 3, characterized in that: The plurality of glue-free areas and the plurality of plastic-sealed areas are alternately arranged along the length direction.

5. The battery protection board according to any one of claims 1 to 4, characterized in that: The distance between the side of the plastic packaging layer facing away from the board body and the side facing the board body is d1, and the thickness of the component is d2, wherein 0.1 mm≤d1-d2≤0.2 mm.

6. The battery protection board according to claim 5, characterized in that: The thickness of the board body is d3, and the distance between the side of the plastic sealing layer facing away from the board body and the side facing the board body is d1, wherein 0.7 mm≤d1+d3≤0.9 mm.

7. The battery protection board according to claim 6, characterized in that: d1=0.6mm, and / or, 0.1mm≤d3≤0.3mm.

8. The battery protection board according to claim 1, characterized in that: A connection area is provided at an end portion of the first circuit board along the length direction, and one end of the second circuit board is connected to the connection area; Wherein, the connection area and the plastic sealing area are located on the same surface of the board body.

9. The battery protection board according to claim 8, characterized in that: In the thickness direction of the board body, the orthographic projection of one end of the second circuit board falls into the connection area, and the battery protection board also includes a packaging portion, which covers the one end of the second circuit board and the connection area.

10. The battery protection board according to claim 9, characterized in that: The packaging part is a UV glue block, an injection-molded rubber block or an injection-molded plastic block.

11. The battery protection board according to claim 3, characterized in that: The conductive component is a heightening component having two opposite sides, one side of the heightening component is connected to the glue-free area, and the other side of the heightening component is used for being electrically connected to the tab of the battery cell.

12. The battery protection board according to claim 3, characterized in that: The non-glue area is provided with a raising component, the raising component has two opposite sides, one side of the raising component is connected to the non-glue area, and the other side of the raising component is connected to the conductive component.

13. The battery protection board according to claim 11 or 12, characterized in that: The thickness of the raising component is 0.2 mm to 0.5 mm.

14. The battery protection board according to claim 11 or 12, characterized in that: The multiple molding layers of the multiple molding areas are configured to be molded in the same injection molding process.

15. The battery protection board according to claim 14, characterized in that: The outer side of the raising component is connected to the adjacent plastic sealing layer, or the outer side of the raising component is spaced from the adjacent plastic sealing layer.

16. A battery, characterized in that: The battery comprises the battery protection plate according to any one of claims 1 to 15.

Images