Full-automatic equipment for testing and sorting performance of full-size flash memory wafer

Abstract

The utility model discloses full-automatic equipment for testing and sorting the performance of a full-size flash memory wafer. Comprising a lower rack, a marble base plate is fixedly connected to the lower rack, and a feeding and discharging claw transplanting Y-axis module is fixedly connected to the marble base plate. The utility model has the advantages that: the non-mobile automatic accurate alignment mode of the flash memory wafer and the performance test sorting of the full-size flash memory wafer are realized, including the flash memory wafer which is bent due to large deformation quantity of the ultrathin flash memory wafer; a flash memory wafer positioning mode adopts a high-precision XYZ three-phase alignment platform and a CCD camera for positioning, so that the problems of damage, subfissure, pollution, scratch and the like of the flash memory wafer caused by L side and wafer positioning can be effectively avoided, meanwhile, the precision of the high-precision alignment platform is high and can reach + / -1mu m, and the high-precision alignment platform can cover the full-size flash memory wafer, so that the production efficiency is improved, and the production cost is reduced. Particularly, the capacity of the flash memory wafer and the function sorting efficiency can be improved, the loss caused by misjudgment is reduced, and the cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to fully automatic equipment for performance testing and sorting of full-size flash memory wafers. Background Art

[0002] Flash memory wafer is a storage medium based on Flash Memory, usually called "flash memory" or simply "flash memory". It is the common name for non-volatile random access memory (NVRAM), which has the characteristic that data does not disappear after power failure and can be used as external memory.

[0003] During the production process, there will be some unstable, insufficient, partially damaged or completely damaged chips on the wafer. These chips cannot meet the production requirements and will be defined as waste by the original factory and all scrapped. Those chips that pass the inspection are packaged into flash memory particles, which are called original chips.

[0004] At present, most of the automatic inspection and sorting equipment for flash memory wafers adopts L-shaped edge-to-edge plus clamping positioning. This positioning method has poor positioning accuracy. Secondly, during the alignment process, the edge of the positioning mechanism will contact the side of the flash memory wafer, which will cause slight impact, so it will cause the flash memory wafer to be damaged or cracked. In addition, this positioning method can only be used to sort flash memory wafers of 0.07mm or above, because flash memory wafers below 0.07mm are too thin, their own deformation is too large, and they are positioned against the edge when bent. Not only is the positioning inaccurate, but it is also more likely to cause damage to the flash memory wafer, cracks, contamination, scratches and other problems. Therefore, flash memory wafers below 0.07mm thickness can only be sorted by manual loading and unloading. Since there is no automatic alignment system for alignment, the problem of misalignment against the edge often occurs, resulting in too slow overall sorting efficiency and wrong sorting, treating some good products as defective products, and manually misclassifying and placing them, which is not enough to meet industry needs. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies in the prior art, the utility model provides a fully automatic device for performance testing and sorting of full-size flash memory wafers, which has the advantages of realizing a non-movable automatic precise alignment method for flash memory wafers and performance testing and sorting of full-size flash memory wafers, reducing losses caused by misjudgment, and reducing costs.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a fully automatic device for performance testing and sorting of full-size flash memory wafers, comprising a lower frame, a marble substrate is fixedly connected to the lower frame, a Y-axis module for loading and unloading claws is fixedly connected to the marble substrate, an X-axis module for loading and unloading claws is movably connected to the Y-axis module for loading and unloading claws, a loading and unloading claws module is arranged on the X-axis module for loading and unloading claws, and tray transplanting modules are fixedly connected to both sides of the top surface of the marble substrate. The Tray tray transplanting module is movably connected to the Tray tray module, the middle position of the top surface of the marble substrate is fixedly connected to the unloading camera positioning module, the front position of the top surface of the marble substrate is fixedly connected to the high-precision XYZ alignment adsorption platform module, a test pin card mounting platform transplanting module is arranged behind the high-precision XYZ alignment adsorption platform module, a test pin card mounting platform is movably connected to the test pin card mounting platform transplanting module, and an artificial alignment microscope module is arranged behind the test pin card mounting platform transplanting module.

[0009] Preferably, the bottom of the lower frame is provided with supporting feet, and the side of the lower frame is provided with heat dissipation holes.

[0010] Preferably, the loading and unloading claw transplanting Y-axis module and the loading and unloading claw transplanting X-axis module are both composed of a drive motor, a lead screw, a lead screw nut and a mounting seat.

[0011] Adopting the above technical solution: the lower frame supports the upper structure to ensure the stability of the upper structure. The lower frame can be made of high-strength square tube welding and gantry milling to ensure that the strength, structure stability and precision meet the requirements. The marble base plate is made of marble and serves as the base for the installation of the entire equipment module to further improve the stability of the equipment. The Y-axis module of the loading and unloading claw transplanting is installed on the surface of the marble base plate and is driven by a high-precision high-speed motor. It has the advantages of fast transmission speed, short response time, and accurate transmission position. The X-axis module of the loading and unloading claw transplanting is installed on the Y-axis module of the loading and unloading claw transplanting to form an XY motion module. It is also driven by a high-precision high-speed motor. It has the advantages of fast transmission speed, short response time, and accurate transmission position.

[0012] Preferably, the loading and unloading suction claw module is provided with a nozzle lifting motor, a nozzle lifting guide rail, a nozzle rotating motor, an anti-static and traceless nozzle, a positioning CCD camera and a motor lifting and adjusting slide.

[0013] Preferably, each of the Tray transplanting modules is provided with a plurality of Tray modules, and the unloading camera positioning module is arranged between the high-precision XYZ alignment adsorption platform module and the Tray transplanting module.

[0014] The above technical solution is adopted: the loading and unloading suction claw module includes a positioning CCD camera and an anti-static traceless suction claw. The number of anti-static traceless suction claws is N (N≥2). Each anti-static traceless suction claw is equipped with a nozzle rotation motor and a nozzle lifting motor. The positioning CCD camera can locate the position of the loading flash memory wafer to ensure the accuracy of the test results. The anti-static traceless suction claw is equipped with a nozzle rotation motor, which can be rotated at any angle of 0°-360° through electric control. The nozzle lifting motor of the anti-static traceless suction claw can adjust the lifting and lowering of the anti-static traceless suction claw, and it can stay at any position within the designed lifting stroke. The number of anti-static traceless suction claws N (N≥2) can be designed according to the required number of the whole machine.

[0015] The unloading camera positioning module uses a high-pixel positioning camera to position the unloading flash memory wafers to ensure that the flash memory wafers can be accurately placed in the tray to prevent damage to the flash memory wafers during the unloading process. The tray transfer module is mainly used to move the tray to the loading and unloading suction claw module to pick up and place the flash memory wafers and the manual loading and unloading flash memory wafers. The drive method can be electric control or pneumatic control. The tray module is set according to different flash memory wafer sizes. The material selection can be non-metallic materials such as bakelite, PEEK, POM, fiberglass, or metal materials such as aluminum alloy, steel and some other non-ferrous metals, which are not specified here.

[0016] Preferably, the high-precision XYZ alignment adsorption platform module is provided with a Y-axis alignment electric mechanism, an X-axis alignment electric mechanism, a Z-axis alignment electric mechanism and an adsorption fixture platform.

[0017] The above technical solution is adopted: the high-precision XYZ alignment adsorption platform module has electric mobile drive control in the three directions of XYZ and vacuum fixture adsorption. The XY dual-axis automatically adjusts the position of the flash memory wafer in the XY directions with an adjustment accuracy of ±um. The Z-axis movement is to test the Z-direction lifting performance and avoidance of the flash memory wafer. The adsorption fixture platform adsorbs the product to ensure that the flash memory wafer is adsorbed flat, and the final CCD positioning accuracy and the alignment accuracy of the high-precision XYZ alignment adsorption platform module are ensured. The XYZ three-axis adopts four drive shafts installed in an interlaced manner, and the motion components are made of high-precision ground screws and guide rails. The position correction accuracy of the flash memory wafer can reach ±1um. The true adsorption fixture platform can be made of metal materials such as aluminum alloy, steel, copper or other alloy materials, or non-metallic materials such as PEE, POM, glass fiber or some other organic polymer materials, which are not specified here.

[0018] Preferably, the test needle card installation platform is provided with a Z-direction precision adjustment slide, a Y-direction precision adjustment slide, an X-direction precision adjustment slide, a test needle card mounting seat and an X-direction precision adjustment rod.

[0019] Preferably, the test pin card mounting platform transplanting module is provided with a driving motor, a precision guide rail, a precision mounting platform and a precision grinding screw.

[0020] The above technical solution is adopted: the test pin card installation platform transplanting module is driven by a high-precision motor, which can be a servo motor, and the stepper motor and linear motor are not uniquely specified here. The module movement mode is to move the test pin card installation platform to the detection position and the safety avoidance nozzle position above the flash memory wafer. The repeatability can reach ±1um. The test pin card installation platform is used to place the test pin card, and test pin cards of various sizes can be universally installed. A manual adjustment slide in three directions of XYZ is designed under the installation platform. The manual adjustment slide adopts a spiral scale adjustment with an adjustment accuracy of micron level. The main function is to facilitate technicians to adjust the correct position of the contact point between the flash memory wafer pad and the test pin card for the first time. The test pin card is customized according to the needs of different types of flash memory wafers, and no further description is given here; the manual alignment microscope module is convenient for manual work when performing flash memory wafer detection and correction for the first time. It can accurately align the flash memory wafer test pin card with the flash memory wafer for testing, so as to ensure the accuracy and pass rate of the subsequent automatic testing. The entire full-size flash memory wafer performance test and sorting fully automatic equipment is arranged on a marble substrate and can perform N (N≥2) workstation operations to achieve an efficient production operation mode.

[0021] (III) Beneficial effects

[0022] Compared with the prior art, the utility model provides a fully automatic device for testing and sorting full-size flash memory wafers, which has the following beneficial effects:

[0023] The fully automatic equipment for performance testing and sorting of full-size flash memory wafers realizes a non-movable automatic precise alignment method for flash memory wafers and performance testing and sorting of full-size flash memory wafers, including ultra-thin flash memory wafers that have large deformation and thus bend themselves. The flash memory wafer positioning method adopts a high-precision XYZ three-phase alignment platform plus a CCD camera for positioning, which can effectively avoid the damage, hidden cracks, contamination, scratches and other problems of flash memory wafers caused by L-side and clamp-type positioning. At the same time, the high-precision alignment platform has a high accuracy of up to ±1um, and can cover full-size flash memory wafers. Specifically, it can improve the efficiency of capacity and function sorting of flash memory wafers, reduce losses caused by misjudgment, and reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a first-view structural schematic diagram of a fully automatic device for performance testing and sorting of full-size flash memory wafers proposed by the utility model;

[0025] Figure 2This is a second-view structural schematic diagram of a fully automatic device for performance testing and sorting of full-size flash memory wafers proposed by the utility model;

[0026] Figure 3 This is a structural schematic diagram of a loading and unloading suction claw module for a full-size flash memory wafer performance test and sorting fully automatic device proposed by the utility model;

[0027] Figure 4 This is a structural schematic diagram of a high-precision XYZ alignment adsorption platform module for a full-size flash memory wafer performance test and sorting fully automatic device proposed by the utility model;

[0028] Figure 5 This is a structural schematic diagram of a test pin card installation platform for a full-size flash memory wafer performance test and sorting fully automatic device proposed by the utility model;

[0029] Figure 6 This is a structural schematic diagram of a test pin card installation platform transplanting module for a full-size flash memory wafer performance test and sorting fully automatic device proposed by the utility model.

[0030] In the figure: 1-lower frame, 2-marble base plate, 3-loading and loading claws transplanting Y-axis module, 4-loading and loading claws transplanting X-axis module, 5-loading and loading claws module, 51-nozzle lifting motor, 52-nozzle lifting guide rail, 53-nozzle rotation motor, 54-anti-static traceless suction claw, 55-positioning CCD camera, 56-motor lifting and adjusting slide, 6-Tray plate module, 7-Tray plate transplanting module, 8-unloading camera positioning module, 9-high-precision XYZ alignment adsorption platform module, 91-Y-alignment motor Structure, 92-X-axis alignment electric mechanism, 93-Z-axis alignment electric mechanism, 94-adsorption fixture platform, 10-test needle card installation platform, 101-Z-axis precision adjustment slide, 102-Y-axis precision adjustment slide, 103-X-axis precision adjustment slide, 104-test needle card mounting seat, 105-X-axis precision adjustment rod, 11-test needle card installation platform transplanting module, 111-drive motor, 112-precision guide rail, 113-precision installation platform, 114-precision grinding screw, 12-artificial alignment microscope module. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] See also Figure 1-6 A fully automatic device for performance testing and sorting of full-size flash memory wafers comprises a lower frame 1, a marble substrate 2 is fixedly connected to the lower frame 1, a Y-axis module 3 for transferring loading and unloading claws is fixedly connected to the marble substrate 2, a X-axis module 4 for transferring loading and unloading claws is movably connected to the Y-axis module 3, a suction claw module 5 for transferring loading and unloading claws is arranged on the X-axis module 4, a tray transfer module 7 is fixedly connected to both sides of the top surface of the marble substrate 2, and a suction claw module 6 is movably connected to the tray transfer module 7. It is connected to a Tray module 6, a feeding camera positioning module 8 is fixedly connected to the middle position of the top surface of the marble substrate 2, a high-precision XYZ alignment adsorption platform module 9 is fixedly connected to the front position of the top surface of the marble substrate 2, a test pin card mounting platform transplanting module 11 is arranged behind the high-precision XYZ alignment adsorption platform module 9, a test pin card mounting platform 10 is movably connected to the test pin card mounting platform transplanting module 11, and an artificial alignment microscope module 12 is arranged behind the test pin card mounting platform transplanting module 11.

[0033] Embodiment 1: The bottom of the lower frame 1 is provided with a support foot, and the side of the lower frame 1 is provided with a heat dissipation hole. The upper and lower material claw transplanting Y-axis module 3 and the upper and lower material claw transplanting X-axis module 4 are both composed of a driving motor, a lead screw, a lead screw nut and a mounting seat. The lower frame 1 supports the upper structure to ensure the stability of the upper structure. The lower frame 1 can be made of high-strength square tube welding and gantry milling to ensure that the strength and structure are stable and the accuracy meets the requirements. The marble substrate 2 is made of marble and serves as the base for the installation of the entire equipment module to further improve the stability of the equipment. The upper and lower material claw transplanting Y-axis module 3 is installed on the surface of the marble substrate and is driven by a high-precision high-speed motor. It has the advantages of fast transmission speed, short response time, and accurate transmission position. The upper and lower material claw transplanting X-axis module 4 is installed on the upper and lower material claw transplanting Y-axis module 3 to form an XY motion module. It is also driven by a high-precision high-speed motor and has the advantages of fast transmission speed, short response time, and accurate transmission position.

[0034] Embodiment 2: The loading and unloading suction claw module 5 is provided with a nozzle lifting motor 51, a nozzle lifting guide rail 52, a nozzle rotating motor 53, an anti-static markless suction nozzle 54, a positioning CCD camera 55 and a motor lifting adjustment slide 56. Each tray plate transplanting module 7 is provided with a plurality of tray plate modules 6, and the unloading camera positioning module 8 is arranged between the high-precision XYZ alignment adsorption platform module 9 and the tray plate transplanting module 7. The loading and unloading suction claw module 5 includes a positioning CCD camera 55 and an anti-static traceless suction claw 54. The number of anti-static traceless suction claws 54 is N (N≥2). Each anti-static traceless suction claw 54 is equipped with a nozzle rotating motor 53 and a nozzle lifting motor 51. The positioning CCD camera 55 can locate the position of the loading flash memory wafer to ensure that the test results are accurate. The anti-static traceless suction claw 54 is equipped with a nozzle rotating motor 53, which can be rotated at any angle of 0°-360° by electric control. The nozzle lifting motor 51 of the anti-static traceless suction claw 54 can adjust the lifting and lowering of the anti-static traceless suction claw 54, and it can stay at any position within the designed lifting stroke. The number N (N≥2) of the anti-static traceless suction claw 54 can be designed according to the required number of the whole machine.

[0035] The unloading camera positioning module 8 uses a high-pixel positioning camera to position the unloading flash memory wafers to ensure that the flash memory wafers can be accurately placed in the tray to prevent damage to the flash memory wafers during the unloading process. The tray transfer module 7 is mainly used to move the tray to the loading and unloading suction claw module 8 to pick up and place the flash memory wafers and the manual loading and unloading flash memory wafers. The driving method can be electric control or pneumatic control. The tray module 6 is set according to different flash memory wafer sizes. The material selection can use non-metallic materials such as bakelite, PEEK, POM, fiberglass, and metal materials such as aluminum alloy, steel and some other non-ferrous metals can also be selected, which are not exclusively specified here.

[0036] Embodiment 3: The high-precision XYZ alignment adsorption platform module 9 is provided with a Y-axis alignment electric mechanism 91 , an X-axis alignment electric mechanism 92 , a Z-axis alignment electric mechanism 93 and an adsorption fixture platform 94 . The high-precision XYZ alignment adsorption platform module 9 has electric mobile drive control in the three directions of XYZ and vacuum fixture adsorption. The XY dual-axis automatically adjusts the position of the flash memory wafer in the XY directions with an adjustment accuracy of ±1um. The Z-axis movement is to test the Z-direction lifting performance and avoidance of the flash memory wafer. The adsorption fixture platform 94 adsorbs the product to ensure that the flash memory wafer is adsorbed flat, and to ensure the final CCD positioning accuracy and the alignment accuracy of the high-precision XYZ alignment adsorption platform module 9. The XYZ three-axis is made of four drive shafts installed in an interlaced manner, and the motion components are made of high-precision ground screws and guide rails. The position correction accuracy of the flash memory wafer can reach ±1um. The true adsorption fixture platform 94 can be made of metal materials such as aluminum alloy, steel, copper or other alloy materials, or non-metallic materials such as PEE, POM, glass fiber or some other organic polymer materials, which are not specified here.

[0037] Embodiment 4: The test needle card installation platform 10 is provided with a Z-axis precision adjustment slide 101, a Y-axis precision adjustment slide 102, an X-axis precision adjustment slide 103, a test needle card installation seat 104 and an X-axis precision adjustment rod 105. The test needle card installation platform transplanting module 11 is provided with a driving motor 111, a precision guide rail 112, a precision installation platform 113 and a precision grinding screw 114. The test pin card installation platform transplanting module 11 is driven by a high-precision motor. The motor can be a servo motor. Stepper motors and linear motors are not specified here. The module movement mode is to move the test pin card installation platform 10 to the detection position and safety avoidance nozzle position above the flash memory wafer. The repeatability can reach ±1um. The test pin card installation platform 10 is used to place the test pin card. Test pin cards of various sizes can be universally installed. A manual adjustment slide in three directions of XYZ is designed under the installation platform. The manual adjustment slide adopts a spiral scale adjustment with an adjustment accuracy of micron level. The main function is to facilitate technicians to adjust the correct position of the contact point between the flash memory wafer pad and the test pin card for the first time. The test pin card is customized according to the needs of different types of flash memory wafers, and no further description is given here; the manual alignment microscope module 12 is convenient for manual work when performing flash memory wafer detection and correction for the first time. It can accurately align the flash memory wafer test pin card with the flash memory wafer for testing, thereby ensuring the accuracy and pass rate of the subsequent automatic testing. The entire full-size flash memory wafer performance test and sorting fully automatic equipment is arranged on a marble substrate and can perform N (N≥2) workstation operations to achieve an efficient production operation mode.

[0038] When using:

[0039] S1. Manually place the flash memory wafers to be sorted on the Tray module 6. The Tray module 6 can hold N (N≥2) Trays and N (N≥2) flash memory wafers.

[0040] S2, using the positioning CCD camera 55 on the loading and unloading suction claw module 5 to locate the position of the tray and the flash memory wafer, and then using the suction claw to suck up the flash memory wafer. N (N≥2) flash memory wafers can be sucked up at one time, and the number of suction claws can be designed according to the equipment efficiency;

[0041] S3, the flash memory wafer on the loading and unloading claw transfer Y-axis module 3 and the loading and unloading claw transfer X-axis module 4 are moved to the detection position, and the flash memory wafer is placed on the adsorption fixture platform 94 on the high-precision XYZ alignment adsorption platform module 9, and the adsorption fixture platform 94 adsorbs the flash memory wafer, and the number of flash memory wafers placed on the high-precision flash memory wafer alignment platforms is also N (N≥2), and then the positioning CCD camera 55 is used to position and feedback the position to the high-precision XYZ alignment adsorption platform module 9, and the flash memory position is corrected through the XY dual-axis;

[0042] S4, moving the flash memory wafer test pin card installation platform 10 to the test position above the flash memory wafer through the test pin card installation platform transplanting module 11, and performing full-automatic detection and sorting on the flash memory wafer;

[0043] S5. After the test is completed, the result is fed back, and the test pin card installation platform transplanting module 11 moves the flash memory wafer test pin card installation platform 10 to a safe position. The loading and unloading suction claw module 5 positions the tested and sorted flash memory wafers through the unloading camera positioning module 8, and then corrects the position of the flash memory wafers through the suction nozzle rotating motor 53, and then sorts and unloads them to the corresponding Tray.

[0044] To summarize, the fully automatic equipment for performance testing and sorting of full-size flash memory wafers realizes the non-mobile automatic precise alignment method of flash memory wafers and the performance testing and sorting of full-size flash memory wafers, including ultra-thin flash memory wafers that have large deformation and thus bend themselves. The flash memory wafer positioning method adopts a high-precision XYZ three-phase alignment platform plus a CCD camera for positioning, which can effectively avoid the damage, hidden cracks, contamination, scratches and other problems of flash memory wafers in L-side and clamp-type positioning. At the same time, the high-precision alignment platform has a high accuracy of up to ±1um, and can cover full-size flash memory wafers. Specifically, it can improve the efficiency of capacity and function sorting of flash memory wafers, reduce losses caused by misjudgment, and reduce costs.

[0045] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise one" do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0046] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A fully automatic device for testing and sorting full-size flash memory wafers, characterized in that: The machine comprises a lower frame (1), the lower frame (1) is fixedly connected to a marble base plate (2), the marble base plate (2) is fixedly connected to a Y-axis module (3) for transferring loading and unloading claws, the Y-axis module (3) for transferring loading and unloading claws is movably connected to an X-axis module (4) for transferring loading and unloading claws, the X-axis module (4) for transferring loading and unloading claws is provided with a loading and unloading suction claw module (5), both sides of the top surface of the marble base plate (2) are fixedly connected to tray plate transfer modules (7), the tray plate transfer module (7) is movably connected to a tray plate module ( 6), a material unloading camera positioning module (8) is fixedly connected to the middle position of the top surface of the marble substrate (2), a high-precision XYZ alignment adsorption platform module (9) is fixedly connected to the front position of the top surface of the marble substrate (2), a test needle card installation platform transplanting module (11) is arranged behind the high-precision XYZ alignment adsorption platform module (9), a test needle card installation platform (10) is movably connected to the test needle card installation platform transplanting module (11), and an artificial alignment microscope module (12) is arranged behind the test needle card installation platform transplanting module (11).

2. The fully automatic equipment for full-size flash memory wafer performance testing and sorting according to claim 1, characterized in that: The bottom of the lower frame (1) is provided with supporting feet, and the side of the lower frame (1) is provided with heat dissipation holes.

3. The fully automatic equipment for full-size flash memory wafer performance testing and sorting according to claim 2, characterized in that: The loading and unloading claws transplanting Y-axis module (3) and the loading and unloading claws transplanting X-axis module (4) are both composed of a driving motor, a lead screw, a lead screw nut and a mounting seat.

4. The fully automatic equipment for full-size flash memory wafer performance testing and sorting according to claim 1, characterized in that: The loading and unloading suction claw module (5) is provided with a suction nozzle lifting motor (51), a suction nozzle lifting guide rail (52), a suction nozzle rotating motor (53), an anti-static traceless suction claw (54), a positioning CCD camera (55) and a motor lifting and adjusting slide (56).

5. The fully automatic equipment for full-size flash memory wafer performance testing and sorting according to claim 1, characterized in that: Each of the tray transfer modules (7) is provided with a plurality of tray modules (6), and the unloading camera positioning module (8) is arranged between the high-precision XYZ alignment adsorption platform module (9) and the tray transfer module (7).

6. The fully automatic equipment for full-size flash memory wafer performance testing and sorting according to claim 1, characterized in that: The high-precision XYZ alignment adsorption platform module (9) is provided with a Y-axis alignment electric mechanism (91), an X-axis alignment electric mechanism (92), a Z-axis alignment electric mechanism (93) and an adsorption fixture platform (94).

7. The fully automatic equipment for full-size flash memory wafer performance testing and sorting according to claim 1, characterized in that: The test needle card installation platform (10) is provided with a Z-direction precision adjustment slide (101), a Y-direction precision adjustment slide (102), an X-direction precision adjustment slide (103), a test needle card installation seat (104) and an X-direction precision adjustment rod (105).

8. The fully automatic equipment for full-size flash memory wafer performance testing and sorting according to claim 1, characterized in that: The test needle card installation platform transplanting module (11) is provided with a driving motor (111), a precision guide rail (112), a precision installation platform (113) and a precision grinding screw (114).

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