Lower die structure of semiconductor plastic packaging press
By introducing designs such as slidable auxiliary shaft, electric slider and stable block into the lower mold structure of the semiconductor plastic sealing press, the problem of insufficient stability and flexibility in traditional design is solved, and an efficient and accurate pressing process is achieved.
Patent Information
- Application Number
- CN202420801873.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-18
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-04-18
AI Technical Summary
The design of the lower mold structure of the traditional semiconductor plastic sealing press has a limited range of fixed or adjustment, resulting in limited production efficiency and flexibility when adapting to chips of different sizes and shapes, making it difficult to maintain stability.
A semiconductor plastic seal press lower mold structure including support plate, adjustment components and plastic sealing press plate is designed, and a slidable auxiliary shaft, electric slider, stable press and engaging groove are used to ensure the stability of the pressing process. and precision.
High stability and wide applicability are achieved, ensuring the accuracy and efficiency of the pressing process, avoiding offset or shaking, and improving operating stability and equipment life.
Smart Images
Figure CN222156364U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a lower mold structure of a semiconductor plastic packaging press. Background Art
[0002] With the continuous advancement of the semiconductor industry, the requirements for chip packaging are becoming increasingly higher, especially in terms of packaging accuracy, efficiency and stability. The traditional semiconductor plastic packaging press lower mold structure often has some problems in dealing with these challenges.
[0003] Traditional lower mold structures often adopt a fixed or limited adjustment range design, which limits the plastic packaging press in adapting to semiconductor chips of different sizes and shapes, reducing production efficiency and flexibility. Therefore, a semiconductor plastic packaging press lower mold structure is proposed. Utility Model Content
[0004] 1. Technical issues to be solved
[0005] In view of the deficiencies in the prior art, the utility model provides a lower mold structure for a semiconductor plastic sealing press, which has the advantages of adjustable stable plastic sealing pressing, and solves the problems of inconvenient adjustment, limitation and difficulty in maintaining stability.
[0006] (II) Technical solution
[0007] In order to achieve the above-mentioned adjustable and stable plastic sealing pressing purpose, the utility model provides the following technical solutions: a semiconductor plastic sealing press lower mold structure, including a support plate and an adjusting component, the adjusting component is arranged on the inner side of the support plate;
[0008] An upper mold structure is arranged on the top of the support plate, a fixed bottom plate is arranged on the bottom of the support plate, and a plastic sealing pressing plate is slidably mounted on the outer surface of the support plate;
[0009] The adjusting component comprises a pressing template, which is arranged at the top center of the plastic sealing pressing plate, and a rotating shaft is arranged at the bottom of the pressing template.
[0010] As a preferred technical solution of the utility model, an adjustment panel is provided on the top of the plastic-sealed pressure plate, and four auxiliary shafts penetrating the inner side of the adjustment panel are fixedly installed on the top of the fixed base plate. The plastic-sealed pressure plate is slidably installed on the outer surface of the auxiliary shaft, and limit blocks are fixedly installed on the upper and lower ends of the four auxiliary shafts.
[0011] The beneficial effects of the above-mentioned preferred technical solution are as follows: the auxiliary shaft not only provides a sliding track for the plastic sealing platen, but also enhances the stability of the entire lower mold structure through its solid structure. The smooth sliding of the plastic sealing platen on the auxiliary shaft ensures that no deviation or shaking occurs during the pressing process, thereby improving the stability of the operation.
[0012] As a preferred technical solution of the utility model, electric sliders that can slide inside the adjustment panel are arranged on the left and right sides of the support plate, and positioning blocks are arranged on the front and rear sides of the upper mold structure.
[0013] The beneficial effects of the above-mentioned preferred technical solution are: the application of the electric slider makes the movement and adjustment of the support plate automated, greatly simplifies the operation process and improves work efficiency. At the same time, the precise control of the electric slider also ensures the accuracy and stability of the movement of the support plate, thereby improving the accuracy of the entire pressing process.
[0014] As an optimal technical solution of the utility model, stabilizing pressure blocks are arranged on both sides of the left and right sides of the recessed part of the plastic sealing pressure plate, the pressing template is rotatably installed on the inner side of the stabilizing pressure blocks, the bottom of the pressing template is rotatably connected with a rotating shaft, the bottom of the rotating shaft is movably installed with a shock-absorbing shaft, and the shock-absorbing shaft is fixedly installed at the bottom of the recessed part of the plastic sealing pressure plate.
[0015] The beneficial effects of the above preferred technical solution are: the design of the stable pressing block provides a firm support for the pressing template, ensures the stability and accuracy of the template during the pressing process, and helps prevent uneven pressing or component damage caused by shaking or displacement of the template.
[0016] As a preferred technical solution of the utility model, eight engaging grooves are provided on the inner side of the plastic sealing pressing plate, and a buffer layer located on the inner side of the plastic sealing pressing plate is provided at the bottom of the eight engaging grooves.
[0017] As a preferred technical solution of the utility model, two engaging columns are fixedly installed on the bottom of the pressing template, and the two engaging columns can be symmetrically engaged with the inner side of the engaging groove.
[0018] The beneficial effect of the above preferred technical solution is that through the symmetrical clamping design of the clamping column and the clamping groove, the position of the pressing template on the plastic packaging pressing plate can be accurately fixed, thereby ensuring the stability and accuracy of the pressing template during the pressing process.
[0019] (III) Beneficial effects
[0020] Compared with the prior art, the utility model provides a lower mold structure of a semiconductor plastic packaging press, which has the following beneficial effects:
[0021] The lower mold structure of the semiconductor plastic sealing press achieves high stability and wide applicability through a stable basic structure, flexible adjustment components, convenient operation design and efficient buffering effect. The support plate, fixed bottom plate and plastic sealing pressing plate form a stable foundation. The adjustment components and shock-absorbing shaft ensure precise pressing, realizing stable adjustment of plastic sealing pressing. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 This is a schematic diagram of the planar structure of the utility model;
[0023] Figure 2 This is a schematic diagram of the top view structure of the utility model;
[0024] Figure 3 This is a schematic diagram of the structure of the pressing template of the utility model.
[0025] In the figure: 1. Support plate; 2. Upper mold structure; 3. Pressing template; 4. Fixed bottom plate; 5. Plastic sealing pressure plate; 6. Auxiliary shaft; 7. Rotating shaft; 8. Engaging column; 9. Shock-absorbing shaft; 10. Buffer layer; 11. Limit block; 12. Electric slider; 13. Positioning block; 14. Stabilizing pressure block; 15. Adjustment panel; 16. Engaging groove. DETAILED DESCRIPTION
[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0027] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.
[0028] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0029] See also Figure 1-3 A lower mold structure of a semiconductor plastic packaging press comprises a support plate 1 and an adjusting component, wherein the adjusting component is arranged on the inner side of the support plate 1.
[0030] An upper mold structure 2 is disposed on the top of the support plate 1 , a fixed bottom plate 4 is disposed on the bottom of the support plate 1 , and a plastic sealing pressing plate 5 is slidably mounted on the outer surface of the support plate 1 .
[0031] The adjusting component comprises a pressing template 3 , which is arranged at the top center of the plastic sealing pressing plate 5 , and a rotating shaft 7 is arranged at the bottom of the pressing template 3 .
[0032] In this embodiment, an adjustment panel 15 is provided on the top of the plastic-sealed pressure plate 5, and four auxiliary shafts 6 that pass through the inner side of the adjustment panel 15 are fixedly installed on the top of the fixed base plate 4. The plastic-sealed pressure plate 5 is slidably installed on the outer surface of the auxiliary shafts 6, and limit blocks 11 are fixedly installed on the upper and lower ends of the four auxiliary shafts 6.
[0033] In this embodiment, electric sliders 12 slidable inside the adjustment panel 15 are disposed on both the left and right sides of the support plate 1 , and positioning blocks 13 are disposed on both the front and rear sides of the upper mold structure 2 .
[0034] In this embodiment, stabilizing pressure blocks 14 are provided on both sides of the left and right sides of the recessed part of the plastic sealing pressure plate 5. The pressing template 3 is rotatably installed on the inner side of the stabilizing pressure block 14. The bottom of the pressing template 3 is rotatably connected to the rotating shaft 7. The bottom of the rotating shaft 7 is movably installed with a shock-absorbing shaft 9, and the shock-absorbing shaft 9 is fixedly installed at the bottom of the recessed part of the plastic sealing pressure plate 5.
[0035] It should be noted that the design of the stabilizing pressing block 14 provides a firm support for the pressing template 3, ensuring the stability and accuracy of the template during the pressing process, and helping to prevent uneven pressing or component damage caused by shaking or displacement of the template.
[0036] The coordinated design of the rotating shaft 7 and the shock-absorbing shaft 9 effectively reduces the impact force and vibration during the pressing process. The shock-absorbing shaft 9 can absorb and disperse the impact force, protect the semiconductor components from damage, and also help to extend the service life of the equipment.
[0037] In this embodiment, eight engaging grooves 16 are formed on the inner side of the plastic encapsulation pressing plate 5 , and the bottoms of the eight engaging grooves 16 are all provided with a buffer layer 10 located on the inner side of the plastic encapsulation pressing plate 5 .
[0038] The buffer layer 10 at the bottom of the engagement groove 16 can effectively absorb and disperse the impact force generated during the pressing process, which not only protects the semiconductor components from damage, but also reduces the wear of the equipment caused by long-term impact.
[0039] In this embodiment, two engaging posts 8 are fixedly mounted on the bottom of the pressing template 3 , and the two engaging posts 8 can be symmetrically engaged with the inner sides of the engaging grooves 16 .
[0040] It should be noted that, through the symmetrical snap-fit design of the snap-fit column 8 and the snap-fit groove 16 , the position of the pressing template 3 on the plastic packaging pressing plate 5 is accurately fixed, thereby ensuring the stability and accuracy of the pressing template 3 during the pressing process.
[0041] The beneficial effects of the above embodiments are:
[0042] High stability and wide applicability are achieved through a stable basic structure, flexible adjustment components, convenient operation design and efficient buffering effect. The support plate 1, the fixed bottom plate 4 and the plastic sealing pressing plate 5 form a stable foundation. The adjustment components and the shock-absorbing shaft 9 ensure precise pressing to achieve stable adjustment of the plastic sealing pressing.
[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A lower mold structure of a semiconductor plastic packaging press, comprising a support plate (1) and an adjusting component, wherein the adjusting component is arranged on the inner side of the support plate (1); Its characteristics are: An upper mold structure (2) is provided on the top of the support plate (1), a fixed base plate (4) is provided on the bottom of the support plate (1), and a plastic sealing pressing plate (5) is slidably mounted on the outer surface of the support plate (1); The adjusting component comprises a pressing template (3), which is arranged at the top center of the plastic sealing pressing plate (5), and a rotating shaft (7) is arranged at the bottom of the pressing template (3).
2. The semiconductor plastic packaging press lower mold structure according to claim 1, characterized in that: An adjustment panel (15) is provided on the top of the plastic-sealed pressure plate (5), and four auxiliary shafts (6) penetrating the inner side of the adjustment panel (15) are fixedly installed on the top of the fixed base plate (4). The plastic-sealed pressure plate (5) is slidably mounted on the outer surface of the auxiliary shafts (6), and limit blocks (11) are fixedly mounted on the upper and lower ends of the four auxiliary shafts (6).
3. The semiconductor plastic packaging press lower mold structure according to claim 2, characterized in that: The left and right sides of the support plate (1) are both provided with electric sliders (12) that can slide inside the adjustment panel (15), and the front and rear sides of the upper mold structure (2) are both provided with positioning blocks (13).
4. The semiconductor plastic packaging press lower mold structure according to claim 1, characterized in that: Stabilizing pressure blocks (14) are provided on both sides of the left and right sides of the recessed portion of the plastic sealing pressure plate (5); the pressing template (3) is rotatably mounted on the inner side of the stabilizing pressure blocks (14); the bottom of the pressing template (3) is rotatably connected to a rotating shaft (7); a shock-absorbing shaft (9) is movably mounted on the bottom of the rotating shaft (7); and the shock-absorbing shaft (9) is fixedly mounted on the bottom of the recessed portion of the plastic sealing pressure plate (5).
5. The semiconductor plastic packaging press lower mold structure according to claim 1, characterized in that: Eight engaging grooves (16) are provided on the inner side of the plastic sealing pressing plate (5), and the bottoms of the eight engaging grooves (16) are all provided with a buffer layer (10) located on the inner side of the plastic sealing pressing plate (5).
6. The semiconductor plastic packaging press lower mold structure according to claim 5, characterized in that: Two engaging columns (8) are fixedly mounted on the bottom of the pressing template (3), and the two engaging columns (8) can be symmetrically engaged with the inner side of the engaging groove (16).