Heat dissipation backboard assembly and refrigeration equipment
By designing a heat dissipation back plate assembly in the refrigerator, the heat exchange area between the condenser and the plate body is increased through surface contact, and the heat exchange between the refrigerator condenser and the cabinet body is solved through heat exchange between the plate body and the external environment. The problem of low efficiency improves the heat dissipation and cooling effect of the refrigerator and reduces energy consumption.
Patent Information
- Application Number
- CN202323581030.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-26
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2033-12-26
AI Technical Summary
The heat exchange efficiency between the condenser and the cabinet in the existing refrigerator is low, resulting in unsatisfactory heat dissipation efficiency and cooling effect of the refrigerator.
Design a heat dissipation back plate assembly, by opening a container groove on the side wall of the plate body, installing a condenser coil, making it contact with the plate body, increasing the heat exchange area, and increasing heat exchange with the external environment through the plate body to improve the Heat dissipation efficiency.
The heat exchange efficiency between the condenser coil and the plate body is improved, the energy consumption of the refrigeration equipment is reduced, and the refrigeration effect of the refrigerator is enhanced.
Smart Images
Figure CN222165365U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of refrigeration appliances, and in particular to a heat dissipation backplane assembly and a refrigeration device. Background Art
[0002] At present, freezers are widely used in daily life and supermarket sales because of their ability to refrigerate and preserve food. The freezer exchanges heat with the internal environment of the freezer through the evaporator in its refrigeration system, so that the internal environment of the freezer is kept at a low temperature. The condenser in the refrigeration system is set inside the freezer to exchange heat with the external environment, thereby ensuring the stable operation of the refrigeration system. The refrigeration effect of the freezer is related to the heat dissipation effect of the condenser. The better the heat dissipation effect of the condenser, the better the refrigeration effect of the freezer, and the lower the energy consumption of the freezer. However, the condenser can hardly ensure the heat dissipation effect of the freezer by only exchanging heat with the air of the external environment, which affects the refrigeration effect of the freezer.
[0003] There is a refrigerator in the related art, characterized in that it includes: a cabinet, an evaporator and a condenser. An inner liner is arranged inside the cabinet, the evaporator plate is arranged on the outer wall of the inner liner, the condenser is arranged between the cabinet and the inner liner, and the condenser is attached to the inner wall of the cabinet. By attaching the condenser to the inner wall of the cabinet, the heat in the condenser can be transferred to the side wall of the cabinet, so that the cabinet and the condenser cooperate to exchange heat with the air of the external environment at the same time, thereby increasing the heat exchange area of the condenser, thereby improving the refrigeration effect of the refrigerator.
[0004] In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art:
[0005] Although the condenser is attached to the side wall of the cabinet, the condenser and the side wall of the cabinet are in line contact, and the heat exchange efficiency between the condenser and the cabinet is still low, resulting in low heat dissipation efficiency of the refrigerator and unsatisfactory refrigeration effect of the refrigerator.
[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content
[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.
[0008] The embodiments of the present disclosure provide a heat dissipation backplane assembly and a refrigeration device to increase the heat exchange area between the condenser coil and the plate body and improve the heat exchange efficiency between the condenser coil and the plate body. The refrigeration device exchanges heat with the external environment through the plate body to improve the heat dissipation efficiency of the refrigeration device and reduce the energy consumption of the refrigeration device.
[0009] In some embodiments, a heat dissipation back plate assembly includes: a plate body. A receiving groove is formed on a side wall of the plate body; wherein the receiving groove is used to receive a condenser coil, and when the condenser coil is installed in the receiving groove, the outer wall of the portion of the condenser coil located in the receiving groove abuts against the inner wall of the receiving groove.
[0010] Optionally, the depth of the accommodating groove is greater than or equal to half of the diameter of the condenser coil and less than the diameter of the condenser coil.
[0011] Optionally, the depth of the accommodating groove is equal to half of the diameter of the condenser coil.
[0012] Optionally, the depth of the accommodating tank is equal to two-thirds of the diameter of the condenser coil.
[0013] Optionally, a plurality of accommodating grooves are formed on the side wall of the plate body, and the plurality of accommodating grooves are arranged parallel to each other.
[0014] Optionally, a plurality of accommodating grooves are evenly arranged along the side wall of the plate body.
[0015] Optionally, the side wall of the plate body is provided with curved pipe grooves at both end regions corresponding to the plurality of accommodating grooves, for accommodating curved pipe sections in the condenser coil.
[0016] Optionally, the plate is made of a heat-conducting material.
[0017] Optionally, a protrusion is provided on the other side wall of the plate body at a position corresponding to the receiving groove, wherein the side wall where the protrusion is located and the side wall where the receiving groove is located are two opposite side walls of the plate body.
[0018] A refrigeration device comprises: a heat dissipation backplane assembly according to any one of the above embodiments.
[0019] The heat dissipation backplane assembly and refrigeration equipment provided by the embodiments of the present disclosure can achieve the following technical effects:
[0020] By opening a receiving groove in the side wall of the plate body, when the heat dissipation back plate assembly is assembled in the refrigeration equipment for use, the receiving groove can be used to install the condenser coil of the refrigeration equipment. The part of the condenser coil installed in the receiving groove abuts against the inner wall of the receiving groove, so that the condenser coil and the plate body form a surface contact, thereby increasing the heat exchange area between the condenser coil and the plate body, and improving the heat exchange efficiency between the condenser coil and the plate body. The refrigeration equipment exchanges heat with the external environment through the plate body to improve the heat dissipation efficiency of the refrigeration equipment and reduce the energy consumption of the refrigeration equipment.
[0021] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:
[0023] Figure 1 is a structural schematic diagram of a heat dissipation backplane assembly provided by an embodiment of the present disclosure;
[0024] Figure 2 It is a structural schematic diagram of the assembly of the plate body and the condenser coil provided in the embodiment of the present disclosure;
[0025] Figure 3 The embodiment of the present disclosure provides Figure 2 The enlarged schematic diagram of the middle A part;
[0026] Figure 4 is a schematic diagram of the location of the raised portion provided in an embodiment of the present disclosure;
[0027] Figure 5 The embodiment of the present disclosure provides Figure 4 The enlarged schematic diagram of the middle B part;
[0028] Figure 6 It is a structural schematic diagram of the refrigeration equipment provided in an embodiment of the present disclosure.
[0029] Reference numerals:
[0030] 100, plate body; 110, accommodating groove; 120, flange; 130, elbow groove; 140, inlet groove; 150, outlet groove; 160, raised portion; 300, condenser coil; 310, straight pipe section; 320, elbow section; 330, refrigerant inlet pipe; 340, refrigerant outlet pipe; 400, cabinet body. DETAILED DESCRIPTION
[0031] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.
[0032] The terms "first", "second", etc. in the specification and claims of the disclosed embodiments and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate to describe the disclosed embodiments herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.
[0033] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements, or components to have specific directions, or to be constructed and operated in specific directions. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.
[0034] In addition, the terms "disposed", "connected" and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to the specific circumstances.
[0035] Unless otherwise stated, the term "plurality" means two or more.
[0036] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.
[0037] Combination Figure 1-5 As shown, in some embodiments, the heat dissipation back plate assembly includes: a plate body 100. A receiving groove 110 is provided on the side wall of the plate body 100; wherein the receiving groove 110 is used to receive the condenser coil 300, and when the condenser coil 300 is installed in the receiving groove 110, the outer wall of the portion of the condenser coil 300 located in the receiving groove 110 abuts against the inner wall of the receiving groove 110.
[0038] By adopting the heat dissipation back plate assembly provided by the embodiment of the present disclosure, a receiving groove 110 is opened on the side wall of the plate body 100. When the heat dissipation back plate assembly is assembled in a refrigeration device for use, the receiving groove 110 can be used to install the condenser coil 300 of the refrigeration device. The part of the condenser coil 300 installed in the receiving groove 110 abuts against the inner wall of the receiving groove 110, so that the condenser coil 300 and the plate body 100 form a surface contact form, thereby increasing the heat exchange area between the condenser coil 300 and the plate body 100, and improving the heat exchange efficiency between the condenser coil 300 and the plate body 100. The refrigeration device exchanges heat with the external environment through the plate body 100, so as to improve the heat dissipation efficiency of the refrigeration device and reduce the energy consumption of the refrigeration device.
[0039] Optionally, the plate body 100 is a rectangular plate structure. In this way, the rectangular plate body 100 can be better adapted to the assembly and use of refrigeration equipment, thereby improving the versatility of the heat dissipation backplane assembly.
[0040] Specifically, the plate body 100 is a rectangular plate structure, and the receiving groove 110 is arranged along the length direction of the plate body 100, and the receiving groove 110 is parallel to the long side of the plate body 100. In this way, the plate body 100 with a rectangular plate structure can be better adapted to the assembly and use of the refrigeration equipment, and the receiving groove 110 is arranged along the length direction of the plate body 100, so that the opening space of the receiving groove 110 is larger, thereby increasing the contact area between the condenser coil 300 and the receiving groove 110, and improving the heat exchange efficiency between the condenser coil 300 and the plate body 100.
[0041] Optionally, along the length direction of the plate body 100, the length of the receiving groove 110 is greater than or equal to two-thirds of the length of the plate body 100, and less than the length of the plate body 100. In this way, when the length of the receiving groove 110 is less than two-thirds of the length of the plate body 100, the length of the receiving groove 110 is relatively short, and cannot be adapted to accommodate the condenser coil 300 with a longer length, and the heat exchange area between the condenser coil 300 installed in the receiving groove 110 and the plate body 100 is relatively small. When the length of the receiving groove 110 is equal to the length of the plate body 100, it is difficult to open the receiving groove 110, the strength of the plate body 100 itself is low, and the plate body 100 is prone to breakage at the position where the receiving groove 110 is opened. Therefore, the length of the accommodating groove 110 is set to be greater than or equal to two-thirds of the length of the plate body 100, and less than the length of the plate body 100, so that the accommodating groove 110 can not only better adapt to the accommodation of the condenser coil 300, but also ensure the heat exchange area between the condenser coil 300 and the plate body 100, thereby improving the heat dissipation efficiency.
[0042] Specifically, the length of the accommodating groove 110 is equal to two-thirds of the length of the plate body 100. In this way, the length of the accommodating groove 110 is set to be equal to two-thirds of the length of the plate body 100, so that the accommodating groove 110 can not only better adapt to the accommodation of the condenser coil 300, but also ensure the heat exchange area between the condenser coil 300 and the plate body 100, thereby improving the heat dissipation efficiency.
[0043] Optionally, the side of the plate body 100 is provided with a flange 120, the flange 120 is folded toward the side wall of the plate body 100 where the receiving groove 110 is provided, and the plane where the flange 120 is located is perpendicular to the plane where the plate body 100 is located. In this way, the setting of the flange 120 enables the heat dissipation back plate assembly to be assembled through the flange 120 during assembly and use, thereby improving the assembly efficiency of the heat dissipation back plate assembly.
[0044] Specifically, the four sides of the plate body 100 are all provided with flanges 120, and the flanges 120 of the four sides are all folded toward the side walls of the body where the receiving grooves 110 are provided, and the planes where the flanges 120 of the four sides are located are all perpendicular to the plane where the plate body 100 is located. In this way, when the heat dissipation back plate assembly is assembled and used, the four sides of the plate body 100 are assembled through the corresponding flanges 120, thereby improving the assembly efficiency of the heat dissipation back plate assembly and improving the stability of the assembled heat dissipation back plate assembly.
[0045] Optionally, the depth of the receiving groove 110 is greater than or equal to one-half of the diameter of the condenser coil 300, and less than the diameter of the condenser coil 300. In this way, when the depth of the receiving groove 110 is less than one-half of the diameter of the condenser coil 300, the depth of the receiving groove 110 is relatively small. When the condenser coil 300 is installed in the receiving groove 110, the heat exchange area between the condenser coil 300 and the inner wall of the receiving groove 110 is relatively small, resulting in reduced installation stability of the condenser coil 300 and low heat exchange efficiency between the condenser coil 300 and the plate body 100. When the depth of the receiving groove 110 is greater than or equal to the diameter of the condenser coil 300, the depth of the receiving groove 110 is large. It is more difficult to open a receiving groove 110 with a large depth, resulting in increased costs. In addition, opening a receiving groove 110 with a large depth will reduce the strength of the plate body 100, making it easy for the plate body 100 to break at the position of the receiving groove 110. Moreover, the deep accommodating groove 110 will completely wrap the condenser coil 300. Although it can increase the heat exchange area between the condenser coil 300 and the accommodating groove 110 to a certain extent, when the condenser coil 300 expands, the side wall of the accommodating groove 110 will be squeezed and broken, affecting the service life of the plate body 100. Therefore, the depth of the accommodating groove 110 is set to be greater than or equal to one-half of the diameter of the condenser coil 300, and less than the diameter of the condenser coil 300, so that the stability of the condenser coil 300 installed in the accommodating groove 110 is higher, and the heat exchange area between the condenser coil 300 and the plate body 100 is relatively large, the heat exchange efficiency is improved, and a buffer space can be provided when the condenser coil 300 expands, thereby extending the service life of the plate body 100.
[0046] It can be understood that the depth of the receiving groove 110 refers to the distance between the top and bottom of the receiving groove 110 along a direction perpendicular to the plane where the plate body 100 is located.
[0047] In one embodiment, the depth of the receiving groove 110 is equal to one-half of the diameter of the condenser coil 300. In this way, when the condenser coil 300 is installed in the receiving groove 110, the lower half of the condenser coil 300 is embedded in the receiving groove 110, which can not only ensure the heat exchange area between the condenser coil 300 and the plate body 100 and improve the heat dissipation efficiency, but also reduce the difficulty of opening the receiving groove 110 and reduce the processing cost. Moreover, when the condenser coil 300 expands, the condenser coil 300 expands outward, reducing the risk of the expansion of the condenser coil 300 squeezing and rupturing the receiving groove 110, thereby extending the service life of the plate body 100.
[0048] In another embodiment, the depth of the receiving groove 110 is equal to two-thirds of the diameter of the condenser coil 300. In this way, when the condenser coil 300 is installed in the receiving groove 110, two-thirds of the condenser coil 300 along its radial direction is embedded in the receiving groove 110, which can increase the heat exchange area between the condenser coil 300 and the plate body 100 and improve the heat dissipation efficiency. After installation, one-third of the condenser coil 300 along its radial direction is exposed outside the receiving groove 110. When the condenser coil 300 expands, the condenser coil 300 expands outward, reducing the risk of the expansion of the condenser coil 300 squeezing and rupturing the receiving groove 110, thereby extending the service life of the plate body 100.
[0049] Optionally, the side wall of the plate body 100 is provided with a plurality of receiving grooves 110, and the plurality of receiving grooves 110 are arranged parallel to each other. In this way, since the condenser coil 300 has a plurality of straight tubes, a plurality of receiving grooves 110 are provided on the side wall of the plate body 100 to simultaneously accommodate the plurality of straight tubes of the condenser coil 300, thereby further increasing the heat exchange area between the condenser coil 300 and the plate body 100 and improving the heat dissipation efficiency. Moreover, in order to ensure the uniformity of heat exchange of the condenser coil 300, the plurality of straight tubes are mostly arranged in parallel, so the plurality of receiving grooves 110 are arranged in parallel to each other, so that the condenser coil 300 can be better installed, so that the plurality of straight tubes in the condenser coil 300 can be embedded in the corresponding receiving grooves 110.
[0050] In the embodiment of the present disclosure, the provision of multiple receiving grooves 110 can also position the condenser coil 300. When the condenser coil 300 is assembled with the heat dissipation backplane assembly, the multiple parallel straight tubes of the condenser coil 300 are embedded in the corresponding receiving grooves 110, so that the installation of the condenser coil 300 can be positioned, thereby improving the assembly efficiency.
[0051] Optionally, the plurality of accommodating grooves 110 are evenly arranged along the side wall of the plate body 100. In this way, since the condenser coil 300 is evenly arranged between the plurality of mutually parallel straight tubes in the condenser coil 300 to ensure the uniformity of its heat exchange, the plurality of accommodating grooves 110 are evenly arranged along the side wall of the plate body 100, so that the plurality of accommodating grooves 110 can better adapt to the installation of the plurality of straight tubes in the condenser coil 300, so that the heat exchange between the condenser coil 300 and the plate body 100 is more uniform.
[0052] Optionally, the side wall of the plate body 100 is provided with curved pipe grooves 130 at both ends of the plurality of receiving grooves 110, for receiving the curved pipe sections 320 in the condenser coil 300. In this way, since there are a plurality of curved pipes in the condenser coil 300, and the plurality of curved pipes are used to connect a plurality of straight pipes, curved pipe grooves 130 are provided at both ends of the side wall of the plate body 100 corresponding to the plurality of receiving grooves 110 to receive the curved pipes, so as to avoid the side wall of the plate body 100 from blocking the curved pipes, thereby improving the assembly efficiency of the condenser coil 300.
[0053] Optionally, the bend groove 130 is a rectangular groove structure, and the bend groove 130 is connected to the end of each accommodating groove 110. In this way, since the curvature of the multiple bends in the condenser coil 300 may be different during processing, resulting in slight differences in the degree of bending between the bends, if the bend groove 130 is opened as a curved groove structure to accommodate the bends, it is difficult to ensure that each bend can be installed appropriately, which will increase the difficulty of assembling the condenser coil 300. Therefore, the bend groove 130 is opened as a rectangular groove structure, so that the bend groove 130 can accommodate multiple bends at the same time, thereby improving the assembly efficiency of the condenser coil 300.
[0054] Exemplarily, the condenser coil 300 includes a straight pipe section 310 and a curved pipe section 320, and the ends of adjacent straight pipe sections 310 are connected through a curved pipe section 320. The straight pipe section 310 is the straight pipe in the above embodiment, and the straight pipe section 310 is assembled in the corresponding accommodating groove 110. The curved pipe section 320 is the curved pipe in the above embodiment, and the curved pipe section 320 is assembled in the curved pipe groove 130, wherein each accommodating groove 110 can only accommodate one straight pipe section 310, and the curved pipe groove 130 can accommodate multiple curved pipe sections 320 at the same time.
[0055] Optionally, the plurality of accommodating grooves 110 are provided with an inlet groove 140 on one side in the width direction thereof, and the plurality of accommodating grooves 110 are provided with an outlet groove 150 on the other side in the width direction thereof. In this way, since the condenser coil 300 also has a refrigerant input pipe 330 and a refrigerant output pipe 340, the inlet groove 140 and the outlet groove 150 are respectively provided on both sides in the width direction of the plurality of accommodating grooves 110 for installing the refrigerant input pipe 330 and the refrigerant output pipe 340 in the condenser coil 300, thereby improving the assembly efficiency of the condenser coil 300. Moreover, the provision of the inlet groove 140 and the outlet groove 150 can increase the heat exchange area between the refrigerant input pipe 330 and the refrigerant output pipe 340 and the plate body 100, thereby further improving the heat dissipation efficiency of the plate body 100.
[0056] Exemplarily, the condenser coil 300 further includes a refrigerant input pipe 330 and a refrigerant output pipe 340 . The refrigerant input pipe 330 is installed in the pipe inlet groove 140 , and the refrigerant output pipe 340 is installed in the pipe outlet groove 150 .
[0057] Optionally, the plate body 100 is made of a heat-conducting material. In this way, the plate body 100 made of a heat-conducting material can more efficiently exchange heat with the condenser coil 300 and efficiently dissipate heat to the external environment, thereby improving the heat dissipation efficiency of the plate body 100.
[0058] Optionally, the plate body 100 is made of a heat-conducting metal material. In this way, the plate body 100 made of a heat-conducting metal material not only has a good heat dissipation effect, but also has high strength and corrosion resistance, and can extend the service life of the plate body 100.
[0059] Optionally, the plate body 100 is made of aluminum alloy material. In this way, aluminum alloy not only has good thermal conductivity, but also has relatively high strength. The plate body 100 made of aluminum alloy material not only has good heat dissipation effect, but also has high strength and corrosion resistance.
[0060] Optionally, a ridge 160 is provided at the position of the other side wall of the plate body 100 corresponding to the position of the receiving groove 110, wherein the side wall where the ridge 160 is located and the side wall where the receiving groove 110 is located are opposite side walls of the plate body 100. In this way, since the condenser coil 300 is assembled on the inner side wall of the plate body 100, when the plate body 100 is assembled and used, the outer side wall of the plate body 100 is in contact with the external environment for heat exchange, so the ridge 160 is provided at the position of the receiving groove 110 corresponding to the other side wall of the plate body 100 opposite to the side wall where the receiving groove 110 is provided, and the provision of the ridge 160 further increases the heat exchange area between the plate body 100 and the external environment, and can further improve the heat dissipation efficiency of the plate body 100. Moreover, the provision of the ridge 160 can make room for the opening of the receiving groove 110, reduce the thickness of the plate body 100, and reduce the consumables and cost of the heat dissipation backplane assembly.
[0061] Combination Figure 6 As shown, in some embodiments, a refrigeration device includes: a heat dissipation backplane assembly of any of the above embodiments.
[0062] The refrigeration device provided in the embodiment of the present disclosure exchanges heat with the external environment through the plate body 100 to improve the heat dissipation efficiency of the refrigeration device and reduce the energy consumption of the refrigeration device.
[0063] Optionally, the refrigeration device further comprises a box body 400, and a mounting opening is provided on the rear side wall of the box body 400, and the heat dissipation back plate assembly of any of the above embodiments is mounted at the mounting opening. In this way, the heat dissipation back plate assembly of any of the above embodiments is mounted at the mounting opening of the rear side wall of the box body 400, and is used to install the condenser coil 300 of the refrigeration device for heat dissipation, thereby improving the heat dissipation efficiency of the refrigeration device, improving the refrigeration effect of the refrigeration device, and reducing energy consumption.
[0064] Optionally, the refrigeration equipment includes a refrigerator.
[0065] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims
1. A heat dissipation backplane assembly, characterized in that: include: The plate body (100) has a side wall provided with a receiving groove (110); The receiving groove (110) is used to receive the condenser coil (300). When the condenser coil (300) is installed in the receiving groove (110), the outer wall of the portion of the condenser coil (300) located in the receiving groove (110) abuts against the inner wall of the receiving groove (110).
2. The heat dissipation back plate assembly according to claim 1, characterized in that: The depth of the accommodating groove (110) is greater than or equal to half of the diameter of the condenser coil (300), and less than the diameter of the condenser coil (300).
3. The heat dissipation back plate assembly according to claim 2, characterized in that: The depth of the accommodating groove (110) is equal to half the diameter of the condenser coil (300).
4. The heat dissipation back plate assembly according to claim 2, characterized in that: The depth of the accommodating groove (110) is equal to two-thirds of the diameter of the condenser coil (300).
5. The heat dissipation back plate assembly according to claim 1, characterized in that: The side wall of the plate body (100) is provided with a plurality of accommodating grooves (110), and the plurality of accommodating grooves (110) are arranged parallel to each other.
6. The heat dissipation back plate assembly according to claim 5, characterized in that: A plurality of accommodating grooves (110) are evenly arranged along the side wall of the plate body (100).
7. The heat dissipation back plate assembly according to claim 5, characterized in that: Bend pipe grooves (130) are provided at the two end regions of the side wall of the plate body (100) corresponding to the plurality of accommodating grooves (110) for accommodating the bend pipe sections (320) in the condenser coil (300).
8. The heat dissipation back plate assembly according to any one of claims 1 to 7, characterized in that: The plate body (100) is made of a heat-conducting material.
9. The heat dissipation back plate assembly according to any one of claims 1 to 7, characterized in that: A raised portion (160) is provided at the position of the other side wall of the plate body (100) corresponding to the receiving groove (110), wherein the side wall where the raised portion (160) is located and the side wall where the receiving groove (110) is located are two opposite side walls of the plate body (100).
10. A refrigeration device, characterized in that: include: A heat dissipation back plate assembly as claimed in any one of claims 1 to 9.