Assembly type concentration measurement sensor module

Abstract

The utility model discloses an assembly type concentration measurement sensor module which comprises a module assembly, a printed board assembly and an ultrasonic chip, wherein the printed board assembly and the ultrasonic chip are arranged in the module assembly; the module assembly comprises an upper cover and a lower cover which can be mutually buckled into a whole, and a printed board assembly and an ultrasonic chip are installed between the upper cover and the lower cover; the printed board assembly comprises a printed board part and a flexible circuit board which are connected through welding, and a rubber plug installed between the printed board part and the flexible circuit board. The side, away from the printed board part, of the flexible circuit board is connected with the ultrasonic chip in a welded mode. According to the device, the problem that a precise core structure in the sensor is prone to being damaged in the inserting process, and the detection result is affected is solved, and the purposes that the core is wrapped with the module assembly, and normal work of the core structure of the sensor is not affected are achieved; and the influence on the accuracy of the detection result caused by sensor damage in the plugging process is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, and more specifically, to an assembled concentration measurement sensor module. Background Art

[0002] In the field of vehicle measurement technology, in order to detect the concentration of liquid inside the vehicle, a concentration measurement sensor is generally placed in the liquid. The concentration of the liquid is detected by the concentration measurement sensor, and the detection result is transmitted to the post-processing system to assist the post-processing system in determining whether the liquid meets regulatory requirements.

[0003] The core module of the existing liquid concentration measurement sensor is relatively precise and needs to be manually welded to ensure its accurate measurement function. However, due to its own precise structure, the welded core module is prone to damage to internal parts even if it is slightly disturbed during the plug-in process, affecting the accuracy of the test results. Utility Model Content

[0004] The purpose of the utility model is to solve the problems raised in the above background technology with respect to an existing assembled concentration measurement sensor module.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: an assembled concentration measurement sensor module, comprising a module assembly, a printed circuit board assembly installed inside the module assembly, and an ultrasonic chip; the module assembly comprises an upper cover and a lower cover that can be snapped into each other as a whole, and the printed circuit board assembly and the ultrasonic chip are installed between the upper cover and the lower cover; the printed circuit board assembly comprises a printed circuit board portion and a flexible circuit board connected by welding, and a rubber plug installed between the printed circuit board portion and the flexible circuit board; wherein the flexible circuit board is welded to the ultrasonic chip on a side away from the printed circuit board portion.

[0006] The utility model further describes that the upper cover is configured as a hollow cylindrical structure, and a structural groove adapted to the shape of the printed circuit board is opened on its top, and two groups of buckles are arranged along the circumferential direction at the bottom of the upper cover; wherein the two groups of buckles are symmetrically arranged about the axis of the upper cover and protrude outward from the side wall of the upper cover.

[0007] The utility model further illustrates that the lower cover is configured as a cylindrical structure whose size matches that of the upper cover, and whose top diameter is larger than the bottom diameter, and the top of the lower cover is provided with two groups of slots along the circumferential direction, and the bottom of the lower cover is provided with four groups of interference ribs along the circumferential direction; wherein, the two groups of slots are symmetrically arranged with respect to the axis of the lower cover, and their shapes are adapted to the buckles, and the four groups of interference ribs are symmetrically arranged with respect to the axis of the lower cover, and are arranged on the inner side wall of the bottom of the lower cover along the vertical direction.

[0008] The utility model further illustrates that the printed circuit board portion is configured as a disc structure adapted to the inner diameter of the upper cover, and a connector is vertically installed on the top thereof, a group of chip thermistors are installed on the side of the top of the printed circuit board portion away from the connector, and the bottom of the printed circuit board portion is welded and connected to the flexible circuit board; wherein, the connector is configured as a hollow rectangular structure with an open top, and a row of PIN needles is arranged inside it.

[0009] The utility model further describes that the flexible circuit board includes a first welding part welded to the bottom of the printed circuit board, a second welding part welded to the ultrasonic chip, and a connecting part connecting the first welding part and the second welding part; wherein, the first welding part and the second welding part are both arranged as rectangular plate structures and have welding holes thereon, and the connecting part is arranged perpendicular to the first welding part and the second welding part, and the two ends are respectively connected to the first welding part and the second welding part.

[0010] The utility model further describes that a rubber plug is arranged between the first welding part and the second welding part, and the rubber plug is set to a cylindrical structure that is highly adapted to the flexible circuit board; the ultrasonic chip is welded to the bottom of the second welding part away from the rubber plug and is set to a circular structure that is adapted to the inner diameter of the lower cover.

[0011] Compared with the prior art, the beneficial effects achieved by the utility model are:

[0012] (1) By providing two sets of buckles and two sets of slots symmetrically arranged on the top of the lower cover, the two can be connected into a whole by inserting the buckles into the slots, thereby wrapping the printed circuit board assembly and the ultrasonic chip inside. During the plug-in process, the two can be protected to prevent the printed circuit board assembly and the ultrasonic chip from being damaged by external forces.

[0013] (2) By providing four sets of interference ribs, when the ultrasonic chip is placed on the bottom of the lower cover 12, the ultrasonic chip is closely attached to the side wall of the ultrasonic chip, and the ultrasonic chip is pressed tightly to prevent loosening during subsequent use.

[0014] (3) By providing a rubber plug, on the one hand, it can provide support and cushioning for the flexible circuit board to prevent the flexible circuit board from being deformed by external force disturbance; on the other hand, after power is turned on, the rubber plug can also serve as a shock-absorbing material to reduce the interference caused by the vibration of the ultrasonic chip itself. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a schematic diagram of the explosion structure of the utility model;

[0018] Figure 3 It is a structural schematic diagram of the upper cover of the utility model;

[0019] Figure 4 It is a structural schematic diagram of the lower cover of the utility model;

[0020] Figure 5 It is a structural schematic diagram of a printed circuit board assembly of the utility model.

[0021] In the figure: 1. module assembly; 11. upper cover; 111. structural groove; 112. buckle; 12. lower cover; 121. slot; 122. interference rib; 2. printed circuit board assembly; 21. printed circuit board portion; 211. connector; 212. chip thermistor; 22. flexible circuit board; 221. first welding part; 222. second welding part; 223. connector; 23. rubber plug; 3. ultrasonic chip. DETAILED DESCRIPTION

[0022] The following is a further non-limiting detailed description of the technical solution of the utility model in conjunction with the preferred embodiments and the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-5 The utility model provides a technical solution: an assembled concentration measurement sensor module, including a module assembly 1, a printed circuit board assembly 2 and an ultrasonic chip 3. The printed circuit board assembly 2 is connected to the ultrasonic chip 3 by welding to realize electrical signal connection, and the module assembly 1 wraps and protects the printed circuit board assembly 2 and the ultrasonic chip 3.

[0024] The module assembly 1 includes an upper cover 11, a structural groove 111, a buckle 112, a lower cover 12, a slot 121 and an interference rib 122. The upper cover 11 and the lower cover 12 can be buckled into a whole, and a printed circuit board assembly 2 and an ultrasonic chip 3 are installed between the upper cover 11 and the lower cover 12. The printed circuit board assembly 2 and the ultrasonic chip 3 are wrapped by the upper cover 11 and the lower cover 12, and the printed circuit board assembly 2 and the ultrasonic chip 3 are protected when the sensor is plugged in to prevent them from being damaged by external forces.

[0025] The upper cover 11 is configured as a hollow cylindrical structure, and a structural groove 111 matching the shape of the printed circuit board portion 21 is provided on its top. When the printed circuit board assembly 2 is placed inside, the connector 211 on the top of the printed circuit board portion 21 can still maintain normal plug-in functions. Two groups of buckles 112 are provided along the circumferential direction at the bottom of the upper cover 11. The two groups of buckles 112 are symmetrically arranged about the axis of the upper cover 11 and protrude outward from the side wall of the upper cover 11. The upper cover 11 can be buckled with the lower cover 12 through the two groups of buckles 112, thereby being connected to the lower cover 12 as a whole.

[0026] The lower cover 12 is set as a cylindrical structure with a size matching that of the upper cover 11, and its top diameter is larger than the bottom diameter, so as to facilitate snap connection with the upper cover 11, and at the same time ensure that its internal space can be used to place the printed circuit board assembly 2 and the ultrasonic chip 3. Two groups of card slots 121 are set along the circumferential direction at the top of the lower cover 12. The two groups of card slots 121 are symmetrically arranged about the axis position of the lower cover 12, and the shape is adapted to the card buckle 112. The connection between the upper cover 11 and the lower cover 12 can be achieved by inserting the two groups of card buckles 112 into the two groups of card slots 121 respectively. Four groups of interference ribs 122 are set along the circumferential direction at the bottom of the lower cover 12. The four groups of interference ribs 122 are symmetrically arranged about the axis position of the lower cover 12, and are arranged on the inner side wall of the bottom of the lower cover 12 in the vertical direction. The provision of four groups of interference ribs 122 can ensure that when the ultrasonic chip 3 is placed at the bottom of the lower cover 12, it cooperates with the side wall of the ultrasonic chip 3 to press the ultrasonic chip 3 tightly to prevent loosening during subsequent use.

[0027] The printed circuit board assembly 2 includes a printed circuit board portion 21, a connector 211, a chip thermistor 212, a flexible circuit board 22, a first welding piece 221, a second welding piece 222, a connecting piece 223 and a rubber plug 23. The printed circuit board assembly 2 includes a printed circuit board portion 21 and a flexible circuit board 22 connected by welding, and a rubber plug 23 installed between the printed circuit board portion 21 and the flexible circuit board 22. The printed circuit board portion 21 and the flexible circuit board 22 are connected by welding to realize electrical signal connection, and the rubber plug 23 is arranged between the two as a shock absorbing material to provide a buffer, which can prevent damage to the internal structure and reduce the interference caused by the ultrasonic chip 3 itself after power is turned on.

[0028] The printed circuit board portion 21 is configured as a disc structure that matches the inner diameter of the upper cover 11, ensuring that the printed circuit board assembly 2 will not become loose when placed inside the upper cover 11. The bottom of the printed circuit board portion 21 is welded to the flexible circuit board 22 to achieve the connection of electrical signals. A connector 211 is vertically installed on the top of the printed circuit board portion 21. The connector 211 is configured as a hollow rectangular structure with an open top and a row of PIN pins are arranged inside. The connector 211 serves as a signal output interface and can be plugged into the signal input interface to transmit the signal to the post-processing system for processing through the PIN pins. A group of chip thermistors 212 are installed on the side of the top of the printed circuit board portion 21 away from the connector 211. The chip thermistors 212 can detect the ambient temperature and transmit the signal to the post-processing system.

[0029] The flexible circuit board 22 includes a first welding piece 221 welded to the bottom of the printed circuit board portion 21, a second welding piece 222 welded to the ultrasonic chip 3, and a connecting piece 223 connecting the first welding piece 221 and the second welding piece 222. The flexible circuit board 22 is respectively welded to the printed circuit board portion 21 and the ultrasonic chip 3, so as to realize the connection and transmission of electrical signals, and transmit the electrical signals generated by the ultrasonic chip 3 to the printed circuit board portion 21. The first welding piece 221 and the second welding piece 222 are respectively used for welding to the printed circuit board portion 21 and the ultrasonic chip 3, and both are set as rectangular plate structures and have welding holes thereon. The connecting piece 223 is arranged perpendicular to the first welding piece 221 and the second welding piece 222, and the two ends are respectively connected to the first welding piece 221 and the second welding piece 222.

[0030] A rubber plug 23 is provided between the first welding piece 221 and the second welding piece 222. The rubber plug 23 is provided as a cylindrical structure highly adapted to the flexible circuit board 22. The rubber plug 23 is provided between the flexible circuit boards 22 to provide support and buffering for the flexible circuit boards 22, and prevent the flexible circuit boards 22 from being deformed by external disturbances. At the same time, the rubber plug 23 can also be used as a shock-absorbing material to reduce the interference caused by the vibration of the ultrasonic chip 3 itself after power is turned on.

[0031] The ultrasonic chip 3 is welded to the bottom of the second welding piece 222, away from the rubber plug 23, and is set to a circular structure that matches the inner diameter of the lower cover 12, ensuring that it fits tightly with the lower cover 12 and will not get loose when placed inside the lower cover 12. After being powered on, the ultrasonic chip 3 can generate vibrations and emit ultrasonic waves to the outside. The ultrasonic waves emitted by the ultrasonic chip 3 are reflected by obstacles, and after the ultrasonic chip 3 receives the reflected ultrasonic waves, it generates voltage to output electrical signals to the outside, and finally transmits the electrical signals to the post-processing system through the connector 211 at the top of the printed circuit board 21.

[0032] The first welding piece 221 is welded to the bottom of the printed circuit board portion 21 , and the second welding piece 222 is welded to the ultrasonic chip 3 , so that the printed circuit board assembly 2 and the ultrasonic chip 3 are connected as a whole, and the electrical signal connection between the ultrasonic chip 3 and the printed circuit board portion 21 is realized.

[0033] Then, a rubber plug 23 is placed inside the flexible circuit board 22 to provide support and cushioning for the flexible circuit board 22 and prevent the flexible circuit board 22 from being deformed by external disturbance.

[0034] After the rubber plug 23 is installed, the printed circuit board assembly 2 and the ultrasonic chip 3 are placed inside the upper cover 11. Then, the two sets of buckles 112 on the upper cover 11 are respectively inserted into the two sets of slots 121 to achieve the connection between the upper cover 11 and the lower cover 12. When the ultrasonic chip 3 is placed in the bottom of the lower cover 12, the four sets of interference ribs 122 on the inner wall of the lower cover 12 fit with the side wall of the ultrasonic chip 3, pressing the ultrasonic chip 3 tightly to prevent it from loosening during subsequent use.

[0035] After the upper cover 11 and the lower cover 12 are connected, the connector 211 is plugged into the signal input interface to complete the connection with the post-processing system.

[0036] After the sensor is connected to the post-processing system and powered on, the ultrasonic chip 3 itself vibrates and emits ultrasonic waves. The ultrasonic waves emitted by the ultrasonic chip 3 are reflected by obstacles, and after the ultrasonic chip 3 receives the reflected ultrasonic waves, it generates voltage and outputs electrical signals. The electrical signal generated by the ultrasonic chip 3 is transmitted to the printed circuit board part 21 through the flexible circuit board 22, and the PIN pin inside the connector 211 transmits the signal to the post-processing system for processing, thereby completing the detection.

[0037] During the operation of the ultrasonic chip 3, the chip thermistor 212 on the top of the printed circuit board 21 detects the ambient temperature in real time and transmits the signal to the post-processing system. The rubber plug 23 acts as a shock absorbing material to reduce the interference caused by the vibration of the ultrasonic chip 3 itself.

[0038] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0039] Finally, it should be pointed out that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit them. Although the utility model is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features can be replaced by equivalents, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model.

Claims

1. An assembled concentration measurement sensor module, characterized in that: It comprises a module assembly (1), a printed circuit board assembly (2) installed inside the module assembly (1), and an ultrasonic chip (3); The module assembly (1) comprises an upper cover (11) and a lower cover (12) which can be snapped together to form a whole, and a printed circuit board assembly (2) and an ultrasonic chip (3) are installed between the upper cover (11) and the lower cover (12); The printed circuit board assembly (2) comprises a printed circuit board portion (21) and a flexible circuit board (22) connected by welding, and a rubber plug (23) installed between the printed circuit board portion (21) and the flexible circuit board (22); The side of the flexible circuit board (22) away from the printed circuit board portion (21) is welded to the ultrasonic chip (3).

2. The assembled concentration measurement sensor module according to claim 1, characterized in that: The upper cover (11) is configured as a hollow cylindrical structure, and a structural groove (111) adapted to the shape of the printed circuit board portion (21) is provided on the top thereof, and two groups of buckles (112) are provided on the bottom of the upper cover (11) along the circumferential direction; The two groups of buckles (112) are symmetrically arranged about the axis of the upper cover (11) and protrude outward from the side wall of the upper cover (11).

3. The assembled concentration measurement sensor module according to claim 2, characterized in that: The lower cover (12) is configured as a cylindrical structure having a size matching that of the upper cover (11), and the top diameter thereof is larger than the bottom diameter; the top of the lower cover (12) is provided with two groups of slots (121) along the circumferential direction; and the bottom of the lower cover (12) is provided with four groups of interference ribs (122) along the circumferential direction; The two groups of the clamping grooves (121) are symmetrically arranged about the axis of the lower cover (12) and have shapes that match the buckle (112); the four groups of the interference ribs (122) are symmetrically arranged about the axis of the lower cover (12) and are arranged on the inner side wall of the bottom of the lower cover (12) along the vertical direction.

4. The assembled concentration measurement sensor module according to claim 1, characterized in that: The printed circuit board portion (21) is configured as a disc structure adapted to the inner diameter of the upper cover (11), and a connector (211) is vertically mounted on the top of the printed circuit board portion (21), a group of surface mount thermistors (212) are mounted on the side of the top of the printed circuit board portion (21) away from the connector (211), and the bottom of the printed circuit board portion (21) is welded to the flexible circuit board (22); The connector (211) is configured as a hollow rectangular structure with an open top, and a row of PIN pins is arranged inside the structure.

5. The assembled concentration measurement sensor module according to claim 4, characterized in that: The flexible circuit board (22) comprises a first welding piece (221) welded to the bottom of the printed circuit board portion (21), a second welding piece (222) welded to the ultrasonic chip (3), and a connecting piece (223) connecting the first welding piece (221) and the second welding piece (222); The first welding piece (221) and the second welding piece (222) are both arranged as rectangular plate-shaped structures and are provided with welding holes, and the connecting piece (223) is arranged perpendicular to the first welding piece (221) and the second welding piece (222), and has two ends respectively connected to the first welding piece (221) and the second welding piece (222).

6. The assembled concentration measurement sensor module according to claim 5, characterized in that: A rubber plug (23) is provided between the first welding piece (221) and the second welding piece (222), and the rubber plug (23) is configured as a cylindrical structure highly adapted to the flexible circuit board (22); The ultrasonic chip (3) is welded to the bottom of the second welding piece (222) on a side away from the rubber plug (23) and is arranged to be a circular structure that matches the inner diameter of the lower cover (12).

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