Full-automatic prism laminating equipment for mini LED

Abstract

The utility model relates to the field of display, in particular to full-automatic prism laminating equipment for a mini LED, which comprises a lower rack, a mounting substrate, a material taking and laminating transverse moving module, a mini LED plate limiting barrier strip mechanism, a mini LED plate material taking and laminating alignment lifting module, a mini LED plate alignment platform module, a mini LED plate adsorption module, a mini LED plate CCD camera positioning module and a prism jig positioning module. The method has the advantages that manual operation is replaced, the production efficiency and the yield are improved, comprehensive development of the industry is facilitated, a full-automatic miniLED board high-precision position attaching technology breaks through a traditional mechanical and manual alignment mode, a brand-new CCD camera positioning mode and a high-precision alignment platform position deviation correction alignment mode are adopted, and the production efficiency is improved. According to the full-automatic prism laminating equipment for the mini LED board, the problems of inaccurate laminating position, laminating bubbles, poor contact, poor laminating quality and the like in the laminating process can be effectively solved, meanwhile, the full-automatic prism laminating equipment for the mini LED board can cover the full-size mini LED board, the laminating efficiency and precision of the mini LED board are improved, and the manufacturing cost is reduced.

Description

Technical Field

[0001] The present invention relates to the field of display, and in particular to a fully automatic prism bonding device for miniLED. Background Art

[0002] Currently in the miniLED prism bonding in the display industry, it is necessary to stick small-sized prisms on a miniLED light-emitting board with a size of 90mm*90mm to 250mm*250mm. The bonding accuracy is high and assembly bonding is required. The current method is manual bonding one by one, which has low bonding efficiency and low bonding accuracy. The uneven force due to manual pressing will also lead to incomplete bonding, bubbles and poor contact.

[0003] Therefore, in order to solve the above problems, a fully automatic miniLED prism bonding equipment is invented, which is compatible with the bonding of miniLED boards of various sizes. Summary of the invention

[0004] The object of the present invention is to solve at least one of the technical drawbacks.

[0005] To this end, an object of the present invention is to propose a fully automatic prism bonding device for miniLED to solve the problems mentioned in the background technology and overcome the shortcomings of the prior art.

[0006] In order to achieve the above-mentioned purpose, an embodiment of one aspect of the present invention provides a miniLED fully automatic prism bonding device, including a lower frame, a mounting substrate, a material bonding transverse shift module, a miniLED board limiting baffle mechanism, a miniLED board material bonding alignment lifting module, a miniLED board alignment platform module, a miniLED board adsorption module, a miniLED board CCD camera positioning module, a prism fixture positioning module and a material unloading and transplanting module, wherein the lower frame is arranged on the ground, the mounting substrate is arranged above the lower frame, the material bonding transverse shift module is arranged on the mounting substrate, the miniLED board limiting baffle mechanism is arranged on the left side above the mounting substrate, the miniLED board material bonding alignment lifting module is fixedly installed on the material bonding transverse shift module, the miniLED board alignment platform module is fixedly installed above the miniLED board material bonding alignment lifting module, and the miniLED board adsorption module is fixedly installed on the miniLED The board alignment platform module is below the miniLED board CCD camera positioning module, the miniLED board CCD camera positioning module is arranged below the mounting substrate, the prism fixture positioning module is arranged above the mounting substrate and on the right, and the material unloading and transplanting module is arranged on the right side of the equipment. The technical effect achieved by adopting the above scheme is: first, manually or mechanically place the miniLED board to be bonded on the miniLED board limiting block bar mechanism, let the miniLED board material picking and bonding alignment lifting module descend to absorb the miniLED board to be bonded, and move it to the top of the miniLED board CCD camera positioning module through the material picking and bonding transverse shifting module for positioning. After positioning is completed, the miniLED board is corrected in position through the miniLED board alignment platform module, and at the same time, it moves to the top of the prism fixture positioning module through the material picking and bonding transverse shifting module, and then the bonding is completed. Finally, the bonded miniLED board is transported by the material picking and bonding transverse shifting module and placed on the platform above the unloading and transplanting module.

[0007] Preferably, any of the above schemes is that the miniLED board material picking and pasting positioning lifting module includes a first module mounting base plate, the first module mounting base plate is arranged on one side of the material picking and pasting transverse movement module, a high-precision guide rail 1 is fixedly installed on one side of the first module mounting base plate, a lifting drive motor is fixedly installed on the top of the first module mounting base plate, a first high-precision grinding screw is fixedly installed on the bottom of the lifting drive motor through a coupling, a connecting plate is slidably connected to the surface of the high-precision guide rail 1, and the first high-precision grinding screw is threadedly connected to the connecting plate. The technical effect achieved by adopting the above scheme is: the first high-precision grinding screw is driven to rotate by the operation of the lifting drive motor, so that the first connecting plate slides along the surface of the high-precision guide rail 1, thereby driving the adsorbed miniLED board to move.

[0008] Preferably, any of the above schemes is that the miniLED board alignment platform module includes a second module mounting base plate, the second module mounting base plate is fixedly mounted on one side of the second connecting plate, two first X-direction adjustment drive motors, two first Y-direction adjustment drive motors and four high-precision micro guide rails are fixedly mounted on the bottom of the second module mounting base plate, and the surfaces of the four high-precision micro guide rails are slidably connected with a rotating bearing seat, and one side of the two first X-direction adjustment drive motors and the two first Y-direction adjustment drive motors is fixedly mounted with a second high-precision grinding screw through a coupling, the second high-precision grinding screw is threadedly connected to the rotating bearing seat, one side of the four rotating bearing seats is rotatably connected with a second connecting plate, and the second connecting plate is rotatably connected to the corner of one side of the rotating bearing seat away from the center of the circle. The technical effect achieved by the above scheme is: the first X-direction adjustment drive motor and the two first Y-direction adjustment drive motors are driven to correct the X, Y and rotation angle positions, thereby adjusting the position of the miniLED board.

[0009] Preferably, any of the above schemes is that the miniLED board adsorption module includes two third module mounting base plates and high-precision micro vertical guide rails, one of the third module mounting base plates is fixedly mounted on the bottom of the connecting plate, the two third module mounting base plates are slidably connected by high-precision micro vertical guide rails, an adsorption cavity is arranged inside the two third module mounting base plates, an adsorption cavity plate sealing plate, a pressure sensor, a compression spring and a linear bearing are arranged between the two third module mounting base plates, a vacuum pressure digital display is fixedly mounted on one side of one of the third module mounting base plates, and a negative pressure air inlet is opened on the surface of the two third module mounting base plates. The above scheme is adopted to achieve The technical effect achieved is: through the miniLED board adsorption module, the upper and lower adsorption plates are adopted with a buffer type and an adsorption cavity. The negative pressure adsorption is equipped with a vacuum pressure gauge. The negative pressure value is fed back at all times during the adsorption of the miniLED board to prevent the adsorption force from being too large and causing damage to the miniLED board. If the adsorption force is too small, the miniLED board will move and affect the fitting accuracy. A compression spring and a pressure sensor are provided between the two plates to ensure that the miniLED board will not be damaged during the downward adsorption process. The sensor provides the current pressure value in real time and instant feedback. The upper and lower buffers use high-precision micro vertical guide rails as guides to ensure that the position accuracy of the miniLED board remains unchanged during the upper and lower buffering process.

[0010] Preferably, any of the above schemes is that a number of small anti-static non-permanent suction nozzles and a large anti-static non-permanent suction nozzle are arranged inside the adsorption cavity, and a number of miniLED board top pillars are fixedly installed inside the adsorption cavity. The technical effect achieved by adopting the above scheme is: by adopting a number of anti-static traceless suction nozzles inside the adsorption cavity, it is compatible with the adsorption of miniLED boards of various sizes, and a top pillar is installed in the adsorption cavity to ensure complete fitting during the bonding process without bubbles.

[0011] Preferably, from any of the above schemes, the miniLED board CCD camera positioning module includes a fourth module mounting base plate and two sliding seats, a second X-axis adjustment drive motor is fixedly mounted on one side of the fourth module mounting base plate, a high-precision guide rail 2 is fixedly mounted on one side of the fourth module mounting base plate and the sliding seat, a second Y-axis adjustment drive motor is fixedly mounted on one side of the sliding seat, a third high-precision grinding screw is fixedly mounted on one side of the second X-axis adjustment drive motor and the second Y-axis adjustment drive motor through a coupling, the surface of the third high-precision grinding screw is respectively threadedly connected to two sliding seats and two CCD cameras, a CCD light source is fixedly mounted on one end of the CCD camera, and the technical effect achieved by the above scheme is: a miniLED board is positioned simultaneously by using N (N≥1) miniLED board CCD camera positioning modules, and when multiple cameras are used for positioning, each camera can automatically adjust in the XY direction, and can be quickly changed for miniLED boards of different sizes.

[0012] Preferably, any of the above schemes is that the miniLED board limiting baffle mechanism includes a jig base plate, the jig base plate is fixedly mounted on the top of the mounting substrate, and miniLED board baffles of different sizes are fixedly mounted on one side of the jig base plate. The technical effect achieved by adopting the above scheme is: the miniLED board limiting baffle mechanism can meet the production requirements according to various sizes of miniLED boards.

[0013] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0014] This is a miniLED fully automatic prism bonding equipment, which replaces manual work, improves production efficiency and yield, and is beneficial to the overall development of the industry through the cooperation between the lower frame, the installed substrate, the material bonding transverse movement module, the miniLED board limit stop bar mechanism, the miniLED board material bonding alignment lifting module, the miniLED board alignment platform module, the miniLED board adsorption module, the miniLED board CCD camera positioning module, the prism fixture positioning module and the material unloading and transplanting module. The fully automatic miniLED board high-precision position bonding technology breaks the traditional mechanical and manual alignment methods, adopts a new CCD camera positioning method and a high-precision alignment platform position correction alignment method, which can effectively avoid problems such as inaccurate bonding position, bubbles and poor contact, and poor bonding quality during the bonding process. At the same time, this miniLED board fully automatic prism bonding equipment can cover full-size miniLED boards, improve the bonding efficiency and accuracy of miniLED boards, and reduce manufacturing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the structure of the first viewing angle of the embodiment of the present invention;

[0016] Figure 2 This is a schematic diagram of the structure of the second viewing angle of the first embodiment of the present invention;

[0017] Figure 3 A schematic diagram of the structure of the first embodiment of the present invention from a third viewing angle;

[0018] Figure 4 4 is a schematic diagram of the structure of the first embodiment of the present invention from a fourth viewing angle;

[0019] Figure 5 Schematic diagram of the fifth viewing angle structure of the first embodiment of the present invention;

[0020] Figure 6 Schematic diagram of the sixth viewing angle structure of the first embodiment of the present invention;

[0021] Figure 7 This is a schematic diagram of the seventh viewing angle structure of the first embodiment of the present invention.

[0022] Among them: 1-lower frame, 2-mounting base plate, 3-material picking and pasting transverse movement module, 4-miniLED board limit stop bar mechanism, 41-fixture bottom plate, 42-miniLED board stop bar, 5-miniLED board picking and pasting alignment lifting module, 51-first module mounting bottom plate, 52-first high-precision grinding screw, 53-high-precision guide rail 1, 54-first connecting plate, 55-lifting drive motor, 6-miniLED board alignment platform module, 61-second module mounting bottom plate, 62-high-precision micro guide rail, 63-first X-axis adjustment drive motor, 64-second high-precision grinding screw, 65-first Y-axis adjustment drive motor, 66-rotating bearing seat, 67-second connecting plate, 7-miniLED board adsorption module , 71-the third module installation base plate, 72-adsorption chamber, 73-adsorption chamber plate sealing plate, 74-high-precision micro vertical guide rail, 75-pressure sensor, 76-compression spring, 77-linear bearing, 78-negative pressure air inlet, 79-vacuum pressure digital display, 731-small anti-static non-constant suction nozzle, 732-large anti-static non-constant suction nozzle, 733-miniLED board top column, 8-miniLED board CCD camera positioning module, 81-the fourth module installation base plate, 82-CCD camera, 83-the second X-axis adjustment drive motor, 84-CCD light source, 85-the third high-precision grinding screw, 86-the second Y-axis adjustment drive motor, 87-high-precision guide rail two, 9-prism fixture positioning module, 10-unloading and transplanting module. DETAILED DESCRIPTION

[0023] The present invention is further described below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following description.

[0024] like Figures 1 to 7As shown, a miniLED fully automatic prism bonding equipment includes a lower frame 1, a mounting substrate 2, a material bonding transverse shift module 3, a miniLED board limiting block bar mechanism 4, a miniLED board material bonding alignment lifting module 5, a miniLED board alignment platform module 6, a miniLED board adsorption module 7, a miniLED board CCD camera positioning module 8, a prism fixture positioning module 9 and a material unloading and transplanting module 10. The lower frame 1 is arranged on the ground, the mounting substrate 2 is arranged above the lower frame 1, the material bonding transverse shift module 3 is arranged on the mounting substrate 2, the miniLED board limiting block bar mechanism 4 is arranged on the left side above the mounting substrate 2, the miniLED board material bonding alignment lifting module 5 is fixedly installed on the material bonding transverse shift module 3, the miniLED board alignment platform module 6 is fixedly installed above the miniLED board material bonding alignment lifting module 5, and the miniLED board adsorption module 7 is fixedly installed. It is fixedly installed below the miniLED board alignment platform module 6, the miniLED board CCD camera positioning module 8 is arranged below the mounting substrate 2, the prism fixture positioning module 9 is arranged above the mounting substrate 2 and on the right, and the material unloading and transplanting module 10 is arranged on the right side of the equipment. First, the miniLED board to be bonded is placed on the miniLED board limit stop bar mechanism manually or by a robot, and the miniLED board material picking and bonding alignment lifting module is lowered to absorb the miniLED board to be bonded, and the material picking and bonding horizontal shifting module is moved to the top of the miniLED board CCD camera positioning module for positioning. After the positioning is completed, the miniLED board is corrected in position by the miniLED board alignment platform module, and at the same time, the material picking and bonding horizontal shifting module is moved to the top of the prism fixture positioning module, and then the bonding is completed. Finally, the bonded miniLED board is transported to the platform above the material unloading and transplanting module by the material picking and bonding horizontal shifting module.

[0025] As an optional technical solution of the present invention, the miniLED board material picking and pasting positioning lifting module 5 includes a first module mounting base plate 51, which is arranged on one side of the material picking and pasting transverse movement module 3, and a high-precision guide rail 53 is fixedly installed on one side of the first module mounting base plate 51, and a lifting drive motor 55 is fixedly installed on the top of the first module mounting base plate 51, and a first high-precision grinding screw 52 is fixedly installed on the bottom of the lifting drive motor 55 through a coupling, and a first connecting plate 54 is slidably connected to the surface of the high-precision guide rail 53, and the first high-precision grinding screw 52 is threadedly connected to the first connecting plate 54, and the lifting drive motor 55 drives the first high-precision grinding screw 52 to rotate, so that the first connecting plate 54 slides along the surface of the high-precision guide rail 53, thereby driving the adsorbed miniLED board to move.

[0026] As an optional technical solution of the present invention, the miniLED board alignment platform module 6 includes a second module mounting base plate 61, which is fixedly mounted on one side of the first connecting plate 54, and two first X-direction adjustment drive motors 63, two first Y-direction adjustment drive motors 65 and four high-precision micro guide rails 62 are fixedly mounted on the bottom of the second module mounting base plate 61. The surfaces of the four high-precision micro guide rails 62 are slidably connected with a rotating bearing seat 66, and one side of the two first X-direction adjustment drive motors 63 and the two first Y-direction adjustment drive motors 65 is fixedly mounted with a second high-precision grinding screw 64 through a coupling, and the second high-precision grinding screw 64 is threadedly connected to the rotating bearing seat 66. One side of the four rotating bearing seats 66 is rotatably connected with a second connecting plate 67, and the second connecting plate 67 is rotatably connected to the corner of one side of the rotating bearing seat 66 away from the center of the circle. The first X-direction adjustment drive motor 63 and the two first Y-direction adjustment drive motors 65 drive the X, Y and rotation angle positions to be corrected, thereby adjusting the position of the miniLED board.

[0027] As an optional technical solution of the present invention, the miniLED board adsorption module 7 includes two third module mounting base plates 71 and a high-precision micro vertical guide rail 74. One third module mounting base plate 71 is fixedly installed at the bottom of the second connecting plate 67. The two third module mounting base plates 71 are slidably connected by the high-precision micro vertical guide rail 74. An adsorption cavity 72 is arranged inside the two third module mounting base plates 71. An adsorption cavity plate sealing plate 73, a pressure sensor 75, a compression spring 76 and a linear bearing 77 are arranged between the two third module mounting base plates 71. A vacuum pressure digital display 79 is fixedly installed on one side of the third module mounting base plate 71. The two third module mounting base plates 71 are provided with a vacuum pressure digital display 79. A negative pressure air inlet 78 is opened on the surface. The miniLED board adsorption module 7 adopts an upper and lower adsorption plate with a buffer and an adsorption cavity. The negative pressure adsorption is equipped with a vacuum pressure gauge. The negative pressure value is fed back in the process of adsorbing the miniLED board to prevent the adsorption force from being too large and causing damage to the miniLED board. If the adsorption force is too small, the miniLED board will move and affect the fitting accuracy. A compression spring and a pressure sensor are provided between the two plates to ensure that the miniLED board will not be damaged during the downward adsorption process. The sensor provides the current pressure value in real time and instant feedback. The upper and lower buffers use high-precision micro vertical guide rails as guides to ensure that the position accuracy of the miniLED board remains unchanged during the upper and lower buffering process.

[0028] As an optional technical solution of the present invention, a plurality of small anti-static non-constant suction nozzles 731 and a large anti-static non-constant suction nozzle 732 are arranged inside the adsorption cavity 72, and a plurality of miniLED board top pillars 733 are fixedly installed inside the adsorption cavity 72. By using a plurality of anti-static traceless suction nozzles inside the adsorption cavity, it is compatible with the adsorption of miniLED boards of various sizes, and a top pillar is installed in the adsorption cavity to ensure complete bonding during the bonding process without bubbles.

[0029] As an optional technical solution of the present invention, the miniLED board CCD camera positioning module 8 includes a fourth module mounting base plate 81 and two sliding seats, a second X-axis adjustment drive motor 83 is fixedly installed on one side of the fourth module mounting base plate 81, a high-precision guide rail 87 is fixedly installed on one side of the fourth module mounting base plate 81 and the sliding seat, a second Y-axis adjustment drive motor 86 is fixedly installed on one side of the sliding seat, a third high-precision grinding screw 85 is fixedly installed on one side of the second X-axis adjustment drive motor 83 and the second Y-axis adjustment drive motor 86 through a coupling, the surface of the third high-precision grinding screw 85 is respectively threadedly connected to two sliding seats and two CCD cameras 82, and a CCD light source 84 is fixedly installed on one end of the CCD camera 82. The miniLED board CCD camera positioning module uses N (N≥1) cameras to simultaneously position a miniLED board. When multi-camera positioning is used, each camera can automatically adjust the XY direction, and can be quickly changed for miniLED boards of different sizes.

[0030] As an optional technical solution of the present invention, the miniLED board limiting baffle mechanism 4 includes a jig base plate 41, which is fixedly installed on the top of the mounting substrate 2, and miniLED board baffles 42 of different sizes are fixedly installed on one side of the jig base plate 41. The miniLED board limiting baffle mechanism can meet production requirements according to various sizes of miniLED boards.

[0031] A fully automatic prism bonding device for miniLED, the working principle is as follows:

[0032] Step 1: First, manually or by a robot, place the miniLED board to be bonded on the miniLED board limit stop bar mechanism, and let the miniLED board material picking and bonding alignment lifting module descend to absorb the miniLED board to be bonded.

[0033] Step 2: Move the material-picking and laminating module horizontally to the top of the miniLED board CCD camera positioning module for positioning.

[0034] Step 3: After positioning is completed, the miniLED board is corrected through the miniLED board alignment platform module, and at the same time, the material picking and bonding horizontal movement module is moved to the top of the prism fixture positioning module to complete the bonding.

[0035] Step 4: Finally, the laminating miniLED board is transported by the material picking and laminating transverse shifting module and placed on the platform above the material unloading and transplanting module.

[0036] To sum up, the fully automatic prism bonding equipment for miniLED, through the cooperation between the lower frame 1, the mounting substrate 2, the material picking and bonding transverse movement module 3, the miniLED board limiting baffle mechanism 4, the miniLED board material picking and bonding alignment lifting module 5, the miniLED board alignment platform module 6, the miniLED board adsorption module 7, the miniLED board CCD camera positioning module 8, the prism fixture positioning module 9 and the material unloading and transplanting module 10, realizes the replacement of manual operation, improves production efficiency and yield, and is conducive to the comprehensive development of the industry. The fully automatic miniLED board high-precision position bonding technology breaks the traditional mechanical and manual alignment methods, adopts a new CCD camera positioning method and a high-precision alignment platform position correction alignment method, which can effectively avoid problems such as inaccurate bonding position, bubbles and poor contact, and poor bonding quality during the bonding process. At the same time, the fully automatic prism bonding equipment for miniLED boards can cover full-size miniLED boards, improve the bonding efficiency and accuracy of miniLED boards, and reduce manufacturing costs.

Claims

1. A miniLED fully automatic prism bonding device, comprising a lower frame (1), a mounting base plate (2), a material bonding transverse movement module (3), a miniLED board limit stop bar mechanism (4), a miniLED board material bonding alignment lifting module (5), a miniLED board alignment platform module (6), a miniLED board adsorption module (7), a miniLED board CCD camera positioning module (8), a prism fixture positioning module (9) and a material blanking and transplanting module (10), characterized in that: The lower frame (1) is arranged on the ground, the mounting substrate (2) is arranged above the lower frame (1), the material picking and pasting transverse shifting module (3) is arranged on the mounting substrate (2), the miniLED board limit stop bar mechanism (4) is arranged above the mounting substrate (2) and on the left side, the miniLED board material picking and pasting alignment lifting module (5) is fixedly mounted on the material picking and pasting transverse shifting module (3), the miniLED board alignment platform module (6) is fixedly mounted above the miniLED board material picking and pasting alignment lifting module (5), the miniLED board adsorption module (7) is fixedly mounted below the miniLED board alignment platform module (6), the miniLED board CCD camera positioning module (8) is arranged below the mounting substrate (2), the prism fixture positioning module (9) is arranged above the mounting substrate (2) and on the right side, and the material unloading and transplanting module (10) is arranged on the right side of the device.

2. The fully automatic prism bonding device for miniLED according to claim 1, characterized in that: The miniLED board material picking, laminating, aligning and lifting module (5) comprises a first module mounting base plate (51), the first module mounting base plate (51) being arranged on one side of the material picking, laminating and lateral movement module (3), a high-precision guide rail 1 (53) being fixedly mounted on one side of the first module mounting base plate (51), a lifting drive motor (55) being fixedly mounted on the top of the first module mounting base plate (51), a first high-precision grinding screw (52) being fixedly mounted on the bottom of the lifting drive motor (55) via a coupling, a first connecting plate (54) being slidably connected to the surface of the high-precision guide rail 1 (53), and the first high-precision grinding screw (52) being threadedly connected to the first connecting plate (54).

3. The fully automatic prism bonding device for miniLED according to claim 2, characterized in that: The miniLED board alignment platform module (6) comprises a second module mounting base plate (61), the second module mounting base plate (61) being fixedly mounted on one side of the first connecting plate (54), two first X-direction adjustment drive motors (63), two first Y-direction adjustment drive motors (65) and four high-precision micro guide rails (62) being fixedly mounted on the bottom of the second module mounting base plate (61), the surfaces of the four high-precision micro guide rails (62) being slidably connected with a rotating bearing seat (66), a second high-precision grinding screw (64) being fixedly mounted on one side of the two first X-direction adjustment drive motors (63) and the two first Y-direction adjustment drive motors (65) via a coupling, the second high-precision grinding screw (64) being threadedly connected to the rotating bearing seat (66), a second connecting plate (67) being rotatably connected to one side of the four rotating bearing seats (66), the second connecting plate (67) being rotatably connected to a corner of one side of the rotating bearing seat (66) away from the center of a circle.

4. The fully automatic prism bonding device for miniLED according to claim 3, characterized in that: The miniLED board adsorption module (7) comprises two third module mounting base plates (71) and a high-precision micro vertical guide rail (74); one of the third module mounting base plates (71) is fixedly mounted on the bottom of the second connecting plate (67); the two third module mounting base plates (71) are slidably connected via the high-precision micro vertical guide rail (74); an adsorption cavity (72) is arranged inside the two third module mounting base plates (71); an adsorption cavity plate sealing plate (73), a pressure sensor (75), a compression spring (76) and a linear bearing (77) are arranged between the two third module mounting base plates (71); a vacuum pressure digital display (79) is fixedly mounted on one side of one of the third module mounting base plates (71); and negative pressure air inlets (78) are provided on the surfaces of the two third module mounting base plates (71).

5. The fully automatic prism bonding device for miniLED according to claim 4, characterized in that: A plurality of small anti-static non-permanent suction nozzles (731) and a large anti-static non-permanent suction nozzle (732) are arranged inside the adsorption cavity (72), and a plurality of miniLED board top columns (733) are fixedly installed inside the adsorption cavity (72).

6. The fully automatic prism bonding device for miniLED according to claim 5, characterized in that: The miniLED board CCD camera positioning module (8) comprises a fourth module mounting base plate (81) and two sliding seats, a second X-direction adjustment drive motor (83) is fixedly mounted on one side of the fourth module mounting base plate (81), a high-precision guide rail 2 (87) is fixedly mounted on one side of the fourth module mounting base plate (81) and the sliding seat, a second Y-direction adjustment drive motor (86) is fixedly mounted on one side of the sliding seat, a third high-precision grinding screw (85) is fixedly mounted on one side of the second X-direction adjustment drive motor (83) and the second Y-direction adjustment drive motor (86) via a coupling, two sliding seats and two CCD cameras (82) are respectively threadedly connected on the surface of the third high-precision grinding screw (85), and a CCD light source (84) is fixedly mounted on one end of the CCD camera (82).

7. The fully automatic prism bonding device for miniLED according to claim 6, characterized in that: The miniLED board limiting stop bar mechanism (4) comprises a jig base plate (41), the jig base plate (41) being fixedly mounted on the top of the mounting substrate (2), and miniLED board stop bars (42) of different sizes being fixedly mounted on one side of the jig base plate (41).

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