Heat dissipation structure and industrial control equipment
By designing a sliding connection between the heat dissipation body and the heat conductor in the industrial control equipment and using elastic parts and heat conducting medium, the problem of poor heat dissipation effect in the prior art is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202323517950.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-22
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2033-12-22
AI Technical Summary
The existing industrial control equipment has problems such as large thermal resistance and limited heat dissipation effect in the heat dissipation methods of heating devices such as CPUs. The thermal pad fills the gap and the thermal resistance is large, and the spring screw fixes the radiator size and weight are limited. It is impossible to achieve better heat dissipation.
A heat dissipation structure is designed, including a heat dissipation body on one side of the motherboard, and a first inclined surface is provided to the motherboard, and the heat conductor slides on the inclined surface to connect to the motherboard, and closely abuts through the first elastic member to adjust the heat conductor and The distance of the main board is to reduce thermal resistance, while filling the heat conducting medium between the heat conductor and the heat dissipation body to improve thermal conductivity.
By fully contacting the main board by sliding the heat conductor, thermal resistance is reduced, and the heat dissipation effect is improved through elastic connection and heat conducting medium, achieving more efficient heat transfer and heat dissipation effect.
Smart Images
Figure CN222167554U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of industrial control, in particular to a heat dissipation structure and industrial control equipment. Background Art
[0002] Currently, there are two main ways to dissipate heat for heat-generating components such as CPUs in industrial control equipment: one is to set the radiator and the heat-generating component at an interval, and fill the gap between the two with a thermal pad or the like; the other is to fix the radiator to the motherboard with spring screws so that the radiator elastically contacts the heat-generating component.
[0003] However, both methods have disadvantages. In the first method, in order to ensure that the heating device is not over-pressurized, the distance between the heat sink and the heating device is large, which leads to a large thermal resistance between the heat sink and the heating device, affecting the heat dissipation effect. In the second method, in order to prevent the heat sink from exerting too much pressure on the heating device, the size and weight of the heat sink are limited, which also leads to limited heat dissipation effect of this method. In summary, the existing industrial control equipment currently does not have a structure with better heat dissipation effect. Utility Model Content
[0004] The main purpose of the utility model is to provide a heat dissipation structure and industrial control equipment, aiming to improve the heat dissipation effect of the industrial control equipment.
[0005] In order to achieve the above object, the utility model proposes a heat dissipation structure for heat dissipation of a mainboard, characterized in that the heat dissipation structure comprises:
[0006] A heat sink is disposed on one side of the mainboard and is used to dissipate heat from the mainboard. The heat sink is provided with a first inclined surface on the side facing the mainboard. The first inclined surface has a first end close to the mainboard and a second end away from the mainboard.
[0007] a heat conductor, slidably disposed on the first inclined surface to slide between the first end and the second end, wherein the mainboard and the heat sink are thermally connected via the heat conductor; and
[0008] The first elastic member elastically connects the heat conductor and the heat sink so that the heat conductor and the heat sink are in close contact with each other.
[0009] Optionally, the first elastic member includes a spring screw, and the spring screw is arranged perpendicular to the first inclined surface.
[0010] Optionally, the heat dissipation structure further includes a connector, one end of which is connected to the heat conductor, and the other end of which extends away from the heat conductor, and the spring screw is provided on the connector.
[0011] Optionally, the connector is provided with a position adjustment hole, the position adjustment hole extends along the sliding direction of the heat conductor, and the spring screw is slidably disposed in the position adjustment hole.
[0012] Optionally, two spring screws are provided, and the two spring screws are arranged on opposite sides of the sliding direction of the heat conductor.
[0013] Optionally, the heat dissipation structure further includes a heat-conducting medium, and the heat-conducting medium is filled between the mainboard and the heat conductor and / or between the heat conductor and the heat dissipation body.
[0014] Optionally, the heat dissipation structure includes a second elastic member, and the second elastic member is connected to the heat conductor so that the heat conductor has a tendency to slide toward the first end.
[0015] Optionally, the slope of the first inclined surface is A, 11 degrees ≤ A < 90 degrees.
[0016] Optionally, the second elastic member includes:
[0017] A connecting portion, disposed at the second end of the heat sink;
[0018] An abutting portion, spaced apart at one side of the connecting portion and abutting against the heat conductor;
[0019] The deformation portion elastically connects the connection portion and the abutment portion.
[0020] The utility model also provides an industrial control device, comprising the heat dissipation structure described above.
[0021] 14. The method of claim 13 wherein the heat dissipation mechanism is configured to be coupled to the heat dissipation mechanism, wherein the first end of the heat dissipation mechanism is configured to be closer to the base frame than the first end of the heat dissipation mechanism, and the second end of the heat dissipation mechanism is coupled to the base frame than the first end of the heat dissipation mechanism. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0023] Figure 1 It is a structural schematic diagram of the heat dissipation structure of the utility model;
[0024] Figure 2 This is another structural schematic diagram of the heat dissipation structure of the utility model.
[0025] Description of Figure Numbers:
[0026] Label name Label name 10 Motherboard 100 Heat sink 200 Thermal Conductor 300 The first elastic member 400 Connector 500 The second elastic member 600 Heat transfer medium 510 Connection 520 Butt part 530 Deformation
[0027] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0029] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0030] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0031] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0032] In order to improve the heat dissipation of the mainboard 10 in the industrial control equipment, the present technical solution proposes a heat dissipation structure for heat dissipation of the mainboard 10, and the heat dissipation structure includes:
[0033] The heat sink 100 is disposed on one side of the mainboard 10 and is used to dissipate heat from the mainboard 10. The heat sink 100 is provided with a first inclined surface on the side facing the mainboard 10. The first inclined surface has a first end close to the mainboard 10 and a second end away from the mainboard 10.
[0034] The heat conductor 200 is slidably disposed on the first inclined surface to slide between the first end and the second end, and the mainboard 10 and the heat sink 100 are thermally connected via the heat conductor 200; and
[0035] The first elastic member 300 elastically connects the heat conductor 200 and the heat sink 100 so that the heat conductor 200 and the heat sink 100 are in close contact with each other.
[0036] In the technical solution of the utility model, the heat dissipation structure is used for heat dissipation of the mainboard 10. The heat dissipation structure includes a heat sink 100. The heat sink 100 is arranged on one side of the mainboard 10 for dissipating heat for the mainboard 10. The heat sink 100 is provided with a first inclined surface on the side facing the mainboard 10. The first inclined surface has a first end close to the mainboard 10 and a second end away from the mainboard 10. The heat conductor 200 is slidably arranged on the first inclined surface and slides between the first end and the second end. The heat conductor 200 connects the mainboard 10 with the heat sink 100 through thermal conduction. The heat conductor 200 can be adjusted by sliding. The distance between the heat conductor 200 and the main board 10 allows the heat conductor 200 to be adjusted to a position that fully contacts the main board 10, thereby reducing the thermal resistance between the main board 10 and the heat conductor 200, ensuring that the heat can be fully transferred to the heat conductor 200 and dissipated through the heat sink 100, which is beneficial to improving the heat dissipation effect; in addition, in the present embodiment, the heat conductor 200 and the heat sink 100 are also elastically connected by the first elastic member 300, so that the heat conductor 200 and the heat sink 100 are closely abutted, thereby reducing the thermal resistance between the heat conductor 200 and the heat sink 100, which is also beneficial to improving the heat dissipation effect.
[0037] Specifically, Figure 1 and Figure 2In this solution, the heat dissipation structure can be used for heat dissipation of heat-generating devices such as the CPU on the mainboard 10. The heat dissipation structure includes a heat sink 100. The heat sink 100 can be arranged inside the industrial computer and on the heat dissipation duct inside the industrial computer. The heat sink 100 can be a heat dissipation fin structure. The heat sink 100 is arranged at intervals on one side of the mainboard 10, and the heat sink 100 can be fixed to the mainboard 10 through a hexagonal threaded copper column part. The heat sink 100 is provided with a first inclined surface on one side facing the mainboard 10. The first inclined surface is provided on the first side of the mainboard 10. A slope has a first end close to the motherboard 10 and a second end away from the motherboard 10. A heat conductor 200 is slidably arranged on the first slope. The heat conductor 200 can slide between the first end and the second end to adjust the gap between the heat conductor 200 and the motherboard 10. In this solution, the heat conductor 200 can slide until it contacts both the motherboard 10 and the heat sink 100. At this time, a heat conduction connection is achieved between the motherboard 10 and the heat sink 100. The heat conductor 200 can be a heat conductive pad structure with elasticity. 0 can be fixed at the first end or the second end. When the motherboard 10 and the heat sink 100 are connected and fixed, the motherboard 10 and the heat sink 100 can compress the heat conductor 200. At this time, the heat conductor 200 can slide toward the second end under the pressure and undergo elastic deformation. The elastic deformation can make the heat conductor 200 fully contact with the motherboard 10 and the heat sink 100, thereby ensuring that heat can be fully transferred from the motherboard 10 to the heat sink 100 for dissipation. Compared with the method in the prior art where the heat sink is fixed to the motherboard 10 by spring screws, this scheme has a fixed distance between the heat sink 100 and the motherboard 10, so the heat sink 100 can be designed with a larger size as needed. While improving the heat dissipation effect, there is no need to consider the pressure of the heat sink 100 on the motherboard 10. Since the pressure is applied by the heat conductor 200 to the motherboard 10, the distance between the heat conductor 200 and the motherboard 10 and the pressure on the motherboard 10 can be flexibly adjusted by adjusting the position of the heat conductor 200 on the first inclined surface, thereby improving the versatility of the heat dissipation structure. In addition, in order to further improve the heat dissipation effect, the heat dissipation structure also includes a first elastic member 300, which can be a spring structure that elastically clamps the heat conductor 200 and the heat sink 100. Through the first elastic member 300, the heat conductor 200 and the heat sink 100 are elastically and tightly abutted against each other, which can increase the pressure between the heat conductor 200 and the heat sink 100 and reduce the interface contact thermal resistance between the heat conductor 200 and the heat sink 100, thereby improving the thermal conductivity between the heat sink 100 and the heat conductor 200 and improving the heat dissipation effect of the heat dissipation structure.
[0038] Furthermore, the first elastic member 300 includes a spring screw, and the spring screw is arranged perpendicular to the first inclined surface.
[0039] Specifically, Figure 1In the present embodiment, the first elastic member 300 comprises a spring screw, which comprises a screw body and a spring sleeved on the screw body, the screw body is arranged perpendicular to the first inclined surface and is threadedly connected to the first inclined surface, one end of the spring abuts against the head of the screw body, and the other end can abut against the edge of the heat conductor 200, so that the heat conductor 200 can be pressed against the first inclined surface under the action of the spring, thereby achieving the effect of improving the heat dissipation effect in the above-mentioned embodiment; since the spring screw is a standard part commonly used on the market, the use of the spring screw to connect the heat conductor 200 and the heat sink 100 can avoid the work of separately designing and processing the first elastic member 300, which is beneficial to reducing the cost of the heat dissipation structure and improving the compatibility of the heat dissipation structure.
[0040] Furthermore, the heat dissipation structure further includes a connector 400 , one end of which is connected to the heat conductor 200 , and the other end of which extends away from the heat conductor 200 . A spring screw is disposed on the connector 400 .
[0041] Furthermore, the connector 400 is provided with a position adjustment hole, the position adjustment hole extends along the sliding direction of the heat conductor 200, and the spring screw is slidably disposed in the position adjustment hole.
[0042] Specifically, Figure 1 In this embodiment, the heat dissipation structure includes a connector 400, which is a plate-shaped structural member. One end of the connector 400 is connected to the heat conductor 200, and the other end extends in a sliding direction away from the heat conductor 200. In this solution, the connector 400 can be a lug structure integrally formed with the heat conductor 200. The connector 400 is also slidably connected to the first inclined surface. The spring screw can be passed through the connector 400 and connected to the first inclined surface. Through the arrangement of the connector 400, the connection of the first elastic member 300 is facilitated, and the heat conduction area can be increased to improve the heat dissipation effect. In addition, in the present embodiment, a position adjustment hole is provided on the connector 400, and the position adjustment hole is an oblong hole. The position adjustment hole extends along the sliding direction of the heat conductor 200, and the spring screw is passed through the position adjustment hole and is slidably connected to the position adjustment hole. In this way, while the heat conductor 200 and the heat sink 100 are elastically connected, the heat conductor 200 can also slide freely along its sliding direction, which facilitates the position adjustment of the heat conductor 200.
[0043] Furthermore, two spring screws are provided, and the two spring screws are provided on opposite sides of the sliding direction of the heat conductor 200. Figure 1In order to further improve the heat conduction effect between the heat conductor 200 and the heat sink 100, two spring screws can be provided, and the two spring screws are provided on opposite sides of the heat conductor 200 along its sliding direction. This can improve the pressure and heat conduction efficiency between the heat conductor 200 and the heat sink 100. In addition, the heat conductor 200 is subjected to more uniform force under the action of the two spring screws, which is conducive to ensuring smooth sliding.
[0044] Furthermore, the heat dissipation structure further includes a heat conducting medium 600, and the heat conducting medium 600 is filled between the mainboard 10 and the heat conductor 200 and / or between the heat conductor 200 and the heat dissipation body 100. Figure 2 In order to further improve the heat dissipation effect, the heat dissipation structure also includes a heat-conducting medium 600, which is a material used for heat transfer such as a thermal pad or silicone grease. The heat-conducting medium 600 can be arranged between the mainboard 10 and the heat conductor 200, and between the heat conductor 200 and the heat sink 100. The heat-conducting medium 600 can fill the microscopic gap between the mainboard 10 and the heat conductor 200 and the microscopic gap between the heat conductor 200 and the heat sink 100, thereby increasing the contact area between the mainboard 10 and the heat conductor 200 and the contact area between the heat conductor 200 and the heat sink 100, thereby improving the efficiency of heat transfer and improving the heat dissipation effect.
[0045] Furthermore, the heat dissipation structure includes a second elastic member 500, and the second elastic member 500 is connected to the heat conductor 200 so that the heat conductor 200 has a tendency to slide toward the first end. Figure 1 and Figure 2 In order to ensure that the heat conductor 200 fits tightly with the heat sink 100 and the mainboard 10, the heat dissipation structure also includes a second elastic member 500. The second elastic member 500 can be a compression spring. One end of the second elastic member 500 is fixed to the heat sink 100 or the mainboard 10, and the other end is elastically in contact with the heat conductor 200, so that the heat conductor 200 has a tendency to slide toward the first end. In this way, the heat conductor 200 can always fit tightly with the mainboard 10 and the heat sink 100 to ensure the stability of the heat dissipation effect.
[0046] Further, the slope of the first inclined plane is A, 11 degrees ≤ A < 90 degrees. Specifically, in order to ensure that the heat conductor 200 can slide smoothly, in this solution, the slope A of the first inclined plane can be not less than 11 degrees and less than 90 degrees, and the heat conductor 200 and the heat sink 100 are made of copper or aluminum. Through design and experimental verification, the slope of the first inclined plane within this range can ensure that when the mainboard 10 and the heat sink 100 are assembled, the pressure applied by the mainboard 10 to the heat conductor 200 can overcome the friction between the heat conductor 200 and the first inclined plane and the elastic force of the second elastic member 500 so that the heat conductor 200 can slide to a predetermined position.
[0047] Further, the second elastic member 500 includes:
[0048] The connecting portion 510 is disposed at the second end of the heat sink 100;
[0049] The abutting portion 520 is spaced apart at one side of the connecting portion 510 and abuts against the heat conductor 200;
[0050] The deformation portion 530 elastically connects the connection portion 510 and the abutting portion 520 .
[0051] Specifically, Figure 1 In the present embodiment, the second elastic member 500 includes a connecting portion 510, which is arranged at the second end of the heat sink 100. The connecting portion 510 can be fixedly connected to the heat sink 100 by screws. A deformation portion 530 extending perpendicular to the sliding direction of the heat conductor 200 is provided on the connecting portion 510. The deformation portion 530 is an elastic plate-like structure. An abutting portion 520 is convexly provided on one end of the deformation portion 530 away from the connecting portion 510 toward the side of the heat conductor 200. The abutting portion 520 abuts against the heat conductor 200. After the heat dissipation structure is assembled, the heat conductor 200 can cause the deformation portion 530 to deform. At this time, the elastic force generated after the deformation of the deformation portion 530 can make the heat conductor 200 always have a tendency to slide toward the first end. In addition, two deformation parts 530 can be provided and extend in opposite directions. Accordingly, each deformation part 530 is respectively provided with an abutment part 520. In this way, the abutment of the two abutment parts 520 with the heat conductor 200 can increase the force of the second elastic member 500 on the heat conductor 200, and further improve the heat dissipation effect between the heat dissipation structure and the mainboard 10.
[0052] The utility model also proposes an industrial control device, which includes a mainboard 10 and a heat dissipation structure. The heat dissipation structure is thermally connected to the mainboard 10 and dissipates heat for the mainboard 10. The specific structure of the heat dissipation structure refers to the above embodiment. Since the industrial control device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.
[0053] The above description is only an optional embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A heat dissipation structure for heat dissipation of a mainboard, characterized in that: The heat dissipation structure comprises: A heat sink is disposed on one side of the mainboard and is used to dissipate heat from the mainboard. The heat sink is provided with a first inclined surface on the side facing the mainboard. The first inclined surface has a first end close to the mainboard and a second end away from the mainboard. a heat conductor, slidably disposed on the first inclined surface to slide between the first end and the second end, wherein the mainboard and the heat sink are thermally connected via the heat conductor; and The first elastic member elastically connects the heat conductor and the heat sink so that the heat conductor and the heat sink are in close contact with each other.
2. The heat dissipation structure according to claim 1, characterized in that: The first elastic member includes a spring screw, and the spring screw is arranged perpendicular to the first inclined surface.
3. The heat dissipation structure according to claim 2, characterized in that: The heat dissipation structure further includes a connector, one end of which is connected to the heat conductor, and the other end of which extends in a direction away from the heat conductor. The spring screw is arranged on the connector.
4. The heat dissipation structure according to claim 3, characterized in that: The connecting body is provided with a position adjustment hole, the position adjustment hole extends along the sliding direction of the heat conductor, and the spring screw is slidably arranged in the position adjustment hole.
5. The heat dissipation structure according to any one of claims 2 to 4, characterized in that: There are two spring screws, and the two spring screws are arranged on opposite sides of the sliding direction of the heat conductor.
6. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure further includes a heat-conducting medium, and the heat-conducting medium is filled between the mainboard and the heat conductor and / or between the heat conductor and the heat dissipation body.
7. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure includes a second elastic member connected to the heat conductor so that the heat conductor has a tendency to slide toward the first end.
8. The heat dissipation structure according to claim 7, characterized in that: The slope of the first inclined surface is A, 11 degrees ≤ A < 90 degrees.
9. The heat dissipation structure according to claim 7, characterized in that: The second elastic member comprises: A connecting portion, provided at the second end of the heat sink; An abutting portion, spaced apart at one side of the connecting portion and abutting against the heat conductor; The deformation portion elastically connects the connection portion and the abutment portion.
10. An industrial control device, characterized in that: The heat dissipation structure comprises any one of claims 1 to 9.