Semiconductor field effect transistor heat dissipation structure and method

Abstract

The invention relates to the technical field of electronic equipment, in particular to a semiconductor field effect transistor heat dissipation structure and method.The semiconductor field effect transistor heat dissipation structure comprises a semiconductor field effect transistor body, a heat dissipation assembly is arranged in the semiconductor field effect transistor body, and the heat dissipation assembly is used for absorbing heat in the semiconductor field effect transistor body; the heat dissipation assembly comprises a heat absorption pipe, cooling liquid is arranged in the heat absorption pipe, the heat absorption pipe is S-shaped, the two ends of the heat absorption pipe penetrate out of the semiconductor field effect tube body, a plurality of heat absorption pieces are fixedly connected to the middle of the heat absorption pipe at equal intervals, and a speed reduction module is arranged in the heat absorption pipe. The speed reduction module is used for reducing the flowing speed of cooling liquid in the heat absorption pipe, and a turbulent flow assembly is arranged on the inner top face of the semiconductor field effect tube body. Compared with the prior art, the semiconductor field effect transistor solves the problem that internal electronic components are easy to damage due to poor heat dissipation effect of the semiconductor field effect transistor in the prior art.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment, and in particular to a semiconductor field effect tube heat dissipation structure and method. Background Art

[0002] Semiconductor field effect transistors, especially metal oxide semiconductor field effect transistors (MOS transistors), play a vital role in modern electronic devices. They have the advantages of high input resistance, low noise, low power consumption, large dynamic range, easy integration, no secondary breakdown phenomenon, and wide safe working area. Therefore, they are widely used in electronic devices such as microprocessors, memories, and logic circuits.

[0003] During the operation of semiconductor field effect tubes, a certain amount of heat will be generated due to the passage of current and the action of the electric field. If the heat cannot be dissipated in time, the temperature of the device will rise, thereby affecting its performance and reliability. Especially in high-frequency and high-power application scenarios, the heat dissipation problem is particularly prominent. Therefore, as the performance of electronic equipment continues to improve, higher requirements are also placed on the heat dissipation performance of semiconductor field effect tubes.

[0004] However, most traditional semiconductor field effect tubes rely on the design of heat sinks to dissipate internal hot air, but this heat dissipation method is inefficient and difficult to complete the internal heat dissipation task in a timely and effective manner. What is more disadvantageous is that during long-term use, a large amount of dust often accumulates on the outer surface of the heat sink, causing the heat sink to be blocked, thereby further weakening its heat dissipation performance. This blockage phenomenon will cause the heat inside the semiconductor field effect tube to be unable to be discharged smoothly, and may eventually damage the internal electronic components due to excessively high temperatures.

[0005] Furthermore, we disclose a semiconductor field effect tube heat dissipation structure and method to meet the actual demand for the poor heat dissipation effect of semiconductor field effect tubes in the prior art, which causes the internal electronic components to be easily damaged. Summary of the invention

[0006] In view of this, the purpose of the present invention is to provide a semiconductor field effect tube heat dissipation structure and method to solve the problem in the prior art that the semiconductor field effect tube has poor heat dissipation effect and the internal electronic components are easily damaged.

[0007] Based on the above purpose, the present invention provides a semiconductor field effect tube heat dissipation structure, including a semiconductor field effect tube body, a heat dissipation component is arranged inside the semiconductor field effect tube body, the heat dissipation component is used to absorb the heat inside the semiconductor field effect tube body, the heat dissipation component includes a heat absorption tube, a cooling liquid is arranged inside the heat absorption tube, the heat absorption tube is serpentine and both ends pass through the outside of the semiconductor field effect tube body, a plurality of heat absorption sheets are evenly spaced and fixedly connected to the middle of the heat absorption tube, a speed reduction module is arranged inside the heat absorption tube, the speed reduction module is used to reduce the circulation speed of the cooling liquid inside the heat absorption tube, and a spoiler component is arranged on the inner top surface of the semiconductor field effect tube body, and the spoiler component is used to increase the circulation speed of the internal hot air.

[0008] Preferably, one end of the heat absorption tube is fixedly connected to a micro water pump, one end of the heat absorption tube away from the micro water pump is fixedly connected to a micro condenser, and one end of the micro condenser away from the heat absorption tube is fixedly connected to the micro water pump.

[0009] Preferably, the speed reduction module includes a partition fixedly connected to the middle part of the heat absorption tube, and the upper and lower ends of the partition are fixedly connected with flow blocks, and the interior of the heat absorption tube is located in the middle of the upper and lower ends of the partition and is provided with a circulation groove for allowing the cooling liquid to circulate.

[0010] Preferably, a plurality of reflux grooves are evenly spaced apart on one side of the baffle block close to the circulation groove, one end of the reflux groove is connected to the circulation groove, and the other end is configured to be concave semicircular to achieve a reflux effect.

[0011] Preferably, a undulating block is fixedly connected to the middle of the upper end surface of the partition and the middle of the inner bottom surface of the heat absorbing tube, and the upper end of the undulating block is wavy to change the flow path of the cooling liquid.

[0012] Preferably, the spoiler assembly includes a sealing sleeve, a limiting plate is fixedly connected to one side of the middle part of the inner wall of the sealing sleeve, an airbag that can expand when heated is fixedly connected to one end face of the limiting plate, a connecting ring is fixedly connected to one end of the airbag away from the limiting plate, telescopic spring seats are fixedly connected to the upper and lower ends of the end face of the connecting ring away from the airbag, and the ends of the two telescopic spring seats away from the airbag are fixedly connected to the inner wall of the sealing sleeve.

[0013] Preferably, the outer wall of the sealing sleeve on one side of the limiting plate is evenly spaced and provided with a plurality of through holes, and the outer side of the middle portion of the limiting plate is evenly spaced and provided with a plurality of ventilation holes.

[0014] Preferably, a transfer tube is fixedly connected to the middle of one end surface of the sealing sleeve, the transfer tube is U-shaped, the diameter ratio of the transfer tube to the sealing sleeve is 1:8, and a plurality of mounting seats are evenly spaced and fixedly connected to the upper end of the transfer tube, and the upper ends of the plurality of mounting seats are fixedly connected to the semiconductor field effect tube body.

[0015] Preferably, one end of the transfer tube away from the sealing sleeve is engaged and rotatably connected with a rotating tube, a clamping block is fixedly connected to the outer side of the upper end surface of the rotating tube, the rotating tube is engaged and rotatably connected with the rotating tube via the clamping block, the lower end of the rotating tube is in a closed state, and a plurality of elbow nozzles are evenly spaced and fixedly connected to the outer wall of the rotating tube, the elbow nozzle is L-shaped, and the rotating tube is communicated with the transfer tube.

[0016] A semiconductor field effect tube heat dissipation method is applied to the semiconductor field effect tube heat dissipation structure, comprising the following steps: S1. When the semiconductor field effect tube body starts to work, the micro water pump starts synchronously, pumping the cooling liquid from one end of the micro water pump into the heat absorption tube. The cooling liquid flows along the serpentine path of the heat absorption tube and absorbs the heat inside the semiconductor field effect tube body through the heat absorption sheet; S2. When the cooling liquid flows through the middle of the heat absorbing tube, it will encounter the deceleration module. The baffle in the deceleration module and the flow blocks at the upper and lower ends will guide the flow direction of the cooling liquid, so that it flows slowly through the flow groove and the reflux groove. At the same time, the undulating blocks on the upper end surface of the baffle and the middle of the bottom surface of the heat absorbing tube will change the flow path of the cooling liquid, so that it flows in a wave shape; S3. The cooling liquid that has fully absorbed heat flows out of the heat absorption tube and enters the micro condenser. In the micro condenser, the cooling liquid is condensed, and the released heat is taken away by the external heat dissipation system. The condensed cooling liquid is sucked in by the micro water pump again, forming a closed loop circulation, which continuously dissipates heat for the semiconductor field effect tube body; S4. A spoiler assembly is provided on the inner top surface of the semiconductor field effect tube body. When the heat inside the semiconductor field effect tube body is high, the spoiler assembly starts to work, and the heat-expandable airbag expands when the temperature rises, pushing the connecting ring to move to the side of the transfer tube. As the airbag expands, the air in the sealing sleeve is squeezed into the rotating tube through the transfer tube. The rotating tube can be rotated relative to the transfer tube under the action of the clamping block, which enables the curved tube nozzle to spray air in different directions to form a spoiler effect to increase the heat absorption effect of the heat absorption tube.

[0017] Beneficial effects of the present invention: 1. The semiconductor field effect tube heat dissipation structure realizes efficient heat dissipation through the built-in heat dissipation component. Specifically, the cooling liquid filled in the heat absorption tube can effectively absorb and take away the heat inside the semiconductor field effect tube body, and the heat absorption tube is designed in a serpentine shape and is equipped with a plurality of evenly spaced heat absorption plates, which increases the heat exchange area and further improves the heat dissipation efficiency. In addition, the application of the speed reduction module slows down the circulation speed of the coolant in the heat absorption tube, prolongs the heat exchange time between the coolant and the heat absorption tube and the heat absorption plate, thereby ensuring more sufficient heat transfer. At the same time, the spoiler component arranged on the inner top surface accelerates the circulation of hot air inside the semiconductor field effect tube, contributes to the heat absorption effect of the heat absorption tube, and further improves the overall heat dissipation performance. The combined effect of this series of designs significantly improves the heat dissipation effect of the semiconductor field effect tube, ensures its stable operation and prolongs its service life.

[0018] 2. The semiconductor field effect tube heat dissipation method significantly improves the thermal management efficiency of the semiconductor field effect tube. When the semiconductor field effect tube is working, the micro water pump starts immediately to pump the cooling liquid into the heat absorption tube, efficiently absorbs the heat in the tube along the serpentine path, and effectively transfers the internal heat of the semiconductor field effect tube through the heat absorption sheet. When the cooling liquid flows through the middle of the heat absorption tube, the ingenious design of the speed reduction module slows down the liquid flow rate, and forms a wavy flow path through the guidance of the partition, the flow block and the undulating block, which further improves the heat exchange efficiency. Subsequently, the cooling liquid after absorbing heat enters the micro condenser and is condensed. The heat released by condensation is taken away by the external cooling system, and the condensate is re-absorbed by the micro water pump to form a closed-loop circulation, ensuring a continuous and stable heat dissipation effect. In addition, the built-in spoiler component automatically starts when the heat inside the semiconductor field effect tube is high, and promotes the air flow through the expansion of the airbag, and uses the curved pipe nozzle to spray air in different directions to form a spoiler, which not only accelerates the circulation of hot air inside the semiconductor field effect tube, but also significantly enhances the heat absorption effect of the heat absorption tube, thereby achieving more efficient and comprehensive heat dissipation, extending the service life of the semiconductor field effect tube, and improving its working performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only for the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the internal three-dimensional structure of the present invention; Figure 3 It is a schematic diagram of the three-dimensional structure of the heat dissipation component of the present invention; Figure 4 It is a schematic diagram of the three-dimensional structure of the spoiler assembly of the present invention; Figure 5 for Figure 2 The enlarged view of point A in the middle; Figure 6 for Figure 2 The enlarged view of point B in the middle; Figure 7 This is a schematic diagram of the cross-sectional three-dimensional structure of the speed reduction module of the present invention; Figure 8 This is a schematic diagram of the internal three-dimensional structure of the speed reduction module of the present invention; Fig. 9 It is a partial top view schematic diagram of the internal structure of the speed reduction module of the present invention.

[0021] The markings in the figure are: 1. Semiconductor field effect tube body; 2. Micro water pump; 3. Micro condenser; 4. Heat absorption tube; 5. Heat absorption plate; 6. Transfer tube; 7. Mounting seat; 8. Sealing sleeve; 9. Through hole; 10. Rotating tube; 11. Bend nozzle; 12. Air bag; 13. Limit plate; 14. Vent; 15. Block; 16. Flow block; 17. Partition; 18. Up and down block; 19. Telescopic spring seat; 20. Reflux groove; 21. Circulation groove; 22. Connecting ring. DETAILED DESCRIPTION

[0022] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments.

[0023] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the present invention should be understood by people with ordinary skills in the field to which the present invention belongs. The "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0024] like Figures 1 to 9As shown, a semiconductor field effect tube heat dissipation structure includes a semiconductor field effect tube body 1, a heat dissipation component is arranged inside the semiconductor field effect tube body 1, and the heat dissipation component is used to absorb the heat inside the semiconductor field effect tube body 1. The heat dissipation component includes a heat absorption tube 4, and a cooling liquid is arranged inside the heat absorption tube 4. The heat absorption tube 4 is serpentine and both ends penetrate the outside of the semiconductor field effect tube body 1. A plurality of heat absorption sheets 5 are evenly spaced and fixedly connected to the middle of the heat absorption tube 4. A speed reduction module is arranged inside the heat absorption tube 4, and the speed reduction module is used to reduce the circulation speed of the cooling liquid inside the heat absorption tube 4. The inner top surface of the semiconductor field effect tube body 1 is provided with a spoiler component, and the spoiler component is used to increase the circulation speed of the internal hot air. The heat dissipation structure achieves efficient heat dissipation through built-in heat dissipation components. Specifically, the cooling liquid filled in the heat absorption tube 4 can effectively absorb and take away the heat inside the semiconductor field effect tube body 1, and the heat absorption tube 4 is designed to be serpentine and is equipped with a plurality of evenly spaced heat absorption plates 5, which increases the heat exchange area and further improves the heat dissipation efficiency. In addition, the application of the speed reduction module slows down the circulation speed of the coolant in the heat absorption tube 4, prolongs the heat exchange time between the coolant and the heat absorption tube 4 and the heat absorption plates 5, thereby ensuring more sufficient heat transfer. At the same time, the spoiler component arranged on the inner top surface accelerates the circulation of hot air inside the semiconductor field effect tube, contributes to the heat absorption effect of the heat absorption tube 4, and further improves the overall heat dissipation performance. The combined effect of this series of designs significantly improves the heat dissipation effect of the semiconductor field effect tube, ensures its stable operation and prolongs its service life.

[0025] Further, such as Figure 1 As shown, one end of the heat absorption tube 4 is fixedly connected to the micro water pump 2, the end of the heat absorption tube 4 away from the micro water pump 2 is fixedly connected to the micro condenser 3, and the end of the micro condenser 3 away from the heat absorption tube 4 is fixedly connected to the micro water pump 2; When the semiconductor field effect tube body 1 starts to work, the micro water pump 2 starts to drive the cooling liquid to flow in from the end of the heat absorption tube 4 close to the micro water pump 2. The cooling liquid flows along the serpentine path of the heat absorption tube 4, and in this process absorbs the heat inside the semiconductor field effect tube body 1 through the heat absorption sheet 5. The cooling liquid that has fully absorbed heat then flows out of the heat absorption tube 4 and enters the micro condenser 3. In the micro condenser 3, the cooling liquid is cooled, thereby releasing the previously absorbed heat. The condensed cooling liquid is sucked in by the micro water pump 2 again to form a closed loop, and enters the heat absorption tube 4 again to continue to absorb heat. This cycle continues, constantly taking away the heat inside the semiconductor field effect tube body 1 and dissipating it to the external environment.

[0026] Further, such as Figures 7 to 9As shown, the deceleration module includes a baffle 17 fixedly connected to the middle part of the heat absorbing tube 4, and the upper and lower ends of the baffle 17 are fixedly connected with a baffle block 16. The inner part of the heat absorbing tube 4 is located in the middle of the upper and lower ends of the baffle 17. A flow groove 21 for circulating the cooling liquid is opened, and a plurality of reflux grooves 20 are evenly spaced on one side of the baffle block 16 close to the flow groove 21. One end of the reflux groove 20 is connected to the flow groove 21, and the other end is set to be concave semicircular to achieve a reflux effect. The middle part of the upper end surface of the baffle 17 and the middle part of the inner bottom surface of the heat absorbing tube 4 are fixedly connected with an undulating block 18, and the upper end of the undulating block 18 is wavy to change the flow path of the cooling liquid. A partition 17 is fixedly connected to the middle of the inner part of the heat absorption tube 4. The partition 17 divides the heat absorption tube 4 into two upper and lower areas. The upper and lower ends of the partition 17 are fixedly connected to the baffle blocks 16. The function of these baffle blocks 16 is to guide the flow direction of the cooling liquid. In the middle of the upper and lower ends of the partition 17, a flow groove 21 is opened on the heat absorption tube 4. These grooves allow the cooling liquid to flow between the upper and lower sides of the partition 17. However, the flow of the cooling liquid does not simply pass through the flow groove 21. On the side of the baffle block 16 close to the flow groove 21, a plurality of reflux grooves 20 are evenly spaced. One end of these reflux grooves 20 is connected to the flow groove 21, and the other end is designed to be concave semicircular. This design allows the cooling liquid to reflux along the concave semicircular path of the reflux groove 20 after flowing through the flow groove 21, thereby slowing down the flow rate of the cooling liquid. In addition, in order to further In order to enhance the deceleration effect and improve the heat exchange efficiency, the middle part of the upper end surface of the partition 17 and the middle part of the inner bottom surface of the heat absorption tube 4 are fixedly connected with the undulating blocks 18, and the upper ends of these undulating blocks 18 are designed to be wavy. When the cooling liquid flows through these undulating blocks 18, its flow path will be continuously changed, causing the cooling liquid to continuously impact the inner wall of the heat absorption tube 4 inside the heat absorption tube 4. This impact not only further reduces the flow speed of the cooling liquid, but also increases the contact area and contact time between the cooling liquid and the inner wall of the heat absorption tube 4 and the heat absorption plate 5, thereby improving the heat exchange efficiency. In summary, the deceleration module effectively reduces the circulation speed of the cooling liquid inside the heat absorption tube 4 through the combined action of the baffle block 16, the reflux groove 20 and the undulating blocks 18, and increases the heat exchange area and contact time between the cooling liquid and the inner wall of the heat absorption tube 4 and the heat absorption plate 5, thereby improving the heat dissipation efficiency of the entire heat dissipation structure.

[0027] Further, such as Figures 4 to 6As shown, the spoiler assembly includes a sealing sleeve 8, a limiting plate 13 is fixedly connected to one side of the middle of the inner wall of the sealing sleeve 8, a heat-expandable airbag 12 is fixedly connected to one end face of the limiting plate 13, a connecting ring 22 is fixedly connected to one end of the airbag 12 away from the limiting plate 13, and a telescopic spring seat 19 is fixedly connected to the upper and lower ends of the end face of the connecting ring 22 away from the airbag 12, and the ends of the two telescopic spring seats 19 away from the airbag 12 are fixedly connected to the inner wall of the sealing sleeve 8, a plurality of through holes 9 are evenly spaced on the outer wall of the sealing sleeve 8 on one side of the limiting plate 13, a plurality of vent holes 14 are evenly spaced on the outer side of the middle part of the limiting plate 13, and a plurality of air vents 14 are evenly spaced on the middle of one end face of the sealing sleeve 8 A transfer tube 6 is fixedly connected, and the transfer tube 6 is U-shaped. The diameter ratio of the transfer tube 6 to the sealing sleeve 8 is 1:8. A plurality of mounting seats 7 are evenly spaced and fixedly connected to the upper end of the transfer tube 6. The upper ends of the plurality of mounting seats 7 are all fixedly connected to the semiconductor field effect tube body 1. The end of the transfer tube 6 away from the sealing sleeve 8 is engaged and rotatably connected to a rotating tube 10. A clamping block 15 is fixedly connected to the outer side of the upper end surface of the rotating tube 10. The rotating tube 10 is engaged and rotatably connected to the rotating tube 10 through the clamping block 15. The lower end of the rotating tube 10 is in a closed state. A plurality of elbow nozzles 11 are evenly spaced and fixedly connected to the outer wall of the rotating tube 10. The elbow nozzle 11 is L-shaped. The rotating tube 10 is connected to the transfer tube 6; The spoiler assembly is mainly composed of a sealing sleeve 8 and a series of structures inside it. These structures work together on the internal space of the semiconductor field effect tube body 1 to accelerate the circulation of hot air and enhance the heat absorption effect of the heat absorption tube 4. When the semiconductor field effect tube body 1 is working, heat will be generated inside it, causing the temperature to rise. At this time, the heated expandable airbag 12 in the sealing sleeve 8 will expand due to the temperature increase. When the airbag 12 expands due to the heat, it will push the connecting ring 22 to slide along the inner wall of the sealing sleeve 8. This sliding action not only compresses the telescopic spring seat 19, but also causes the restricted air inside the sealing sleeve 8 to be squeezed into the transfer tube 6 through the vent hole 14 on the limiting plate 13 and the through hole 9 on the outer wall of the sleeve. Due to the design of the diameter ratio of the transfer tube 6 and the sealing sleeve 8, the air can be effectively concentrated and guided to the rotating tube 10. The rotating tube 10 is flexibly connected by the clamping block 15. The lower end of the rotating tube 10 is closed and the outer wall is evenly distributed with L-shaped elbow nozzles 11. As the air flows from the transfer tube 6 into the rotating tube 10, it is finally ejected through the elbow nozzle 11. This turbulent effect not only accelerates the circulation speed of the hot air inside the semiconductor field effect tube body 1, but also helps to distribute the heat more evenly to the entire space, thereby improving the heat absorption efficiency of the heat absorption tube 4. Under the action of the speed reduction module, the cooling liquid inside the heat absorption tube 4 can more fully exchange the heat inside the semiconductor field effect tube body 1, thereby achieving a more efficient heat dissipation effect.

[0028] The embodiment of the present invention further provides a semiconductor field effect tube heat dissipation method, which is applied to the semiconductor field effect tube heat dissipation structure described above, and includes the following steps: S1. When the semiconductor field effect tube body 1 starts to work, the micro water pump 2 starts synchronously, and the cooling liquid is pumped from one end of the micro water pump 2 into the heat absorption tube 4. The cooling liquid flows along the serpentine path of the heat absorption tube 4 and absorbs the heat inside the semiconductor field effect tube body 1 through the heat absorption sheet 5; S2. When the cooling liquid flows through the middle of the heat absorbing tube 4, it will encounter the deceleration module. The baffle 17 in the deceleration module and the flow blocks 16 at the upper and lower ends thereof will guide the flow direction of the cooling liquid, so that it will flow slowly through the flow groove 21 and the reflux groove 20. At the same time, the undulating block 18 on the upper end surface of the baffle 17 and the middle part of the inner bottom surface of the heat absorbing tube 4 will change the flow path of the cooling liquid, so that it will flow in a wave shape; S3. The cooling liquid that has fully absorbed heat flows out of the heat absorbing tube 4 and enters the micro condenser 3. In the micro condenser, the cooling liquid is condensed, and the released heat is taken away by the external heat dissipation system. The condensed cooling liquid is sucked in by the micro water pump 2 again, forming a closed loop, and continuously dissipating heat for the semiconductor field effect tube body 1; S4. A spoiler assembly is provided on the inner top surface of the semiconductor field effect tube body 1. When the heat inside the semiconductor field effect tube body 1 is high, the spoiler assembly starts to work, and the heat-expandable airbag 12 expands when the temperature rises, pushing the connecting ring 22 to move toward the side of the transfer tube 6. As the airbag 12 expands, the air in the sealing sleeve 8 is squeezed into the rotating tube 10 through the transfer tube 6. The rotating tube 10 can be engaged and rotated relative to the transfer tube 6 under the action of the clamping block 15, which enables the curved pipe nozzle 11 to spray air in different directions to form a spoiler effect to increase the heat absorption effect of the heat absorption tube 4.

[0029] The above heat dissipation method is adopted to significantly improve the thermal management efficiency of the semiconductor field effect tube. When the semiconductor field effect tube is working, the micro water pump 2 is immediately started to pump the cooling liquid into the heat absorption tube 4, efficiently absorb the heat in the tube along the serpentine path, and effectively transfer the internal heat of the semiconductor field effect tube through the heat absorption sheet 5. When the cooling liquid flows through the middle of the heat absorption tube 4, the ingenious design of the speed reduction module slows down the liquid flow rate, and forms a wavy flow path through the guidance of the partition 17, the shelf block and the undulating block 18, which further improves the heat exchange efficiency. Subsequently, the cooling liquid after absorbing heat enters the micro condenser 3 to be condensed. The heat released by condensation is taken away by the external heat dissipation system, and the condensate is re-absorbed by the micro water pump 2 to form a closed loop circulation, ensuring a continuous and stable heat dissipation effect. In addition, the built-in spoiler component is automatically started when the heat inside the semiconductor field effect tube is high, and the air flow is promoted by the expansion of the airbag 12. The curved pipe nozzle 11 is used to spray air in different directions to form a spoiler, which not only accelerates the circulation of hot air inside the semiconductor field effect tube, but also significantly enhances the heat absorption effect of the heat absorption tube 4, thereby achieving more efficient and comprehensive heat dissipation, extending the service life of the semiconductor field effect tube, and improving its working performance.

[0030] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present invention (including the claims) is limited to these examples. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity.

[0031] The present invention is intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor field effect tube heat dissipation structure, comprising a semiconductor field effect tube body (1), characterized in that: A heat dissipation component is arranged inside the semiconductor field effect tube body (1), and the heat dissipation component is used to absorb the heat inside the semiconductor field effect tube body (1). The heat dissipation component comprises a heat absorption tube (4), and cooling liquid is arranged inside the heat absorption tube (4). The heat absorption tube (4) is serpentine-shaped and both ends penetrate the outside of the semiconductor field effect tube body (1). A plurality of heat absorption sheets (5) are evenly spaced and fixedly connected to the middle of the heat absorption tube (4). A speed reduction module is arranged inside the heat absorption tube (4), and the speed reduction module is used to reduce the circulation speed of the cooling liquid inside the heat absorption tube (4). A spoiler component is arranged on the inner top surface of the semiconductor field effect tube body (1), and the spoiler component is used to increase the circulation speed of the internal hot air.

2. A semiconductor field effect tube heat dissipation structure according to claim 1, characterized in that: One end of the heat absorption tube (4) is fixedly connected to the micro water pump (2), one end of the heat absorption tube (4) away from the micro water pump (2) is fixedly connected to the micro condenser (3), and one end of the micro condenser (3) away from the heat absorption tube (4) is fixedly connected to the micro water pump (2).

3. A semiconductor field effect tube heat dissipation structure according to claim 2, characterized in that: The speed reduction module comprises a baffle (17) fixedly connected to the middle of the heat absorption tube (4), the upper and lower ends of the baffle (17) being fixedly connected to flow blocks (16), and the inside of the heat absorption tube (4) is provided with a circulation groove (21) for circulating cooling liquid at the middle of the upper and lower ends of the baffle (17).

4. The semiconductor field effect tube heat dissipation structure according to claim 3, characterized in that: A plurality of reflow grooves (20) are evenly spaced apart on one side of the baffle block (16) close to the circulation groove (21); one end of the reflow groove (20) is connected to the circulation groove (21), and the other end is arranged in a concave semicircular shape to achieve a reflow effect.

5. The semiconductor field effect tube heat dissipation structure according to claim 4, characterized in that: The middle part of the upper end surface of the partition (17) and the middle part of the inner bottom surface of the heat absorption tube (4) are both fixedly connected with an undulating block (18), and the upper end of the undulating block (18) is wavy to change the flow path of the cooling liquid.

6. The semiconductor field effect tube heat dissipation structure according to claim 5, characterized in that: The spoiler assembly comprises a sealing sleeve (8), a limiting plate (13) is fixedly connected to one side of the middle part of the inner wall of the sealing sleeve (8), an end surface of one side of the limiting plate (13) is fixedly connected to an airbag (12) that can expand when heated, an end of the airbag (12) away from the limiting plate (13) is fixedly connected to a connecting ring (22), and the upper and lower ends of the end surface of the side of the connecting ring (22) away from the airbag (12) are fixedly connected to telescopic spring seats (19), and the ends of the two telescopic spring seats (19) away from the airbag (12) are fixedly connected to the inner wall of the sealing sleeve (8).

7. A semiconductor field effect tube heat dissipation structure according to claim 6, characterized in that: The outer wall of the sealing sleeve (8) on one side of the limiting plate (13) is provided with a plurality of through holes (9) at even intervals, and the outer side of the middle portion of the limiting plate (13) is provided with a plurality of vent holes (14) at even intervals.

8. The semiconductor field effect tube heat dissipation structure according to claim 7, characterized in that: A transfer tube (6) is fixedly connected to the middle of one end surface of the sealing sleeve (8); the transfer tube (6) is U-shaped; the diameter ratio of the transfer tube (6) to the sealing sleeve (8) is 1:8; a plurality of mounting seats (7) are evenly spaced and fixedly connected to the upper end of the transfer tube (6); the upper ends of the plurality of mounting seats (7) are all fixedly connected to the semiconductor field effect tube body (1).

9. The semiconductor field effect tube heat dissipation structure according to claim 8, characterized in that: One end of the transfer tube (6) away from the sealing sleeve (8) is engaged and rotatably connected to a rotating tube (10); a clamping block (15) is fixedly connected to the outer side of the upper end surface of the rotating tube (10); the rotating tube (10) is engaged and rotatably connected to the rotating tube (10) via the clamping block (15); the lower end of the rotating tube (10) is in a closed state; a plurality of elbow nozzles (11) are evenly spaced and fixedly connected to the outer wall of the rotating tube (10); the elbow nozzles (11) are L-shaped; and the rotating tube (10) is in communication with the transfer tube (6).

10. A semiconductor field effect tube heat dissipation method, applied to the semiconductor field effect tube heat dissipation structure according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1. When the semiconductor field effect tube body (1) starts to work, the micro water pump (2) is started synchronously to pump cooling liquid from one end of the micro water pump (2) into the heat absorption tube (4). The cooling liquid flows along the serpentine path of the heat absorption tube (4) and absorbs the heat inside the semiconductor field effect tube body (1) through the heat absorption sheet (5); S2. When the cooling liquid flows through the middle of the heat absorbing tube (4), it encounters a deceleration module. The baffle (17) in the deceleration module and the flow blocks (16) at the upper and lower ends thereof guide the flow direction of the cooling liquid, causing it to flow slowly through the flow groove (21) and the reflux groove (20). At the same time, the undulating blocks (18) at the upper end surface of the baffle (17) and the middle of the inner bottom surface of the heat absorbing tube (4) change the flow path of the cooling liquid, causing it to flow in a wave shape; S3. The cooling liquid that has fully absorbed heat flows out of the heat absorbing tube (4) and enters the micro condenser (3). In the micro condenser, the cooling liquid is condensed and the released heat is taken away by the external heat dissipation system. The condensed cooling liquid is sucked into the micro water pump (2) again, forming a closed loop circulation, and continuously dissipating heat for the semiconductor field effect tube body (1); S4. A spoiler assembly is provided on the inner top surface of the semiconductor field effect tube body (1). When the heat inside the semiconductor field effect tube body (1) is high, the spoiler assembly starts to work, and the heat-expandable airbag (12) expands when the temperature rises, pushing the connecting ring (22) to move toward the side of the transfer tube (6). As the airbag (12) expands, the air in the sealing sleeve (8) is squeezed into the rotating tube (10) through the transfer tube (6). The rotating tube (10) can be engaged and rotated relative to the transfer tube (6) under the action of the clamping block (15), so that the curved tube nozzle (11) can spray air in different directions to form a spoiler effect to increase the heat absorption effect of the heat absorption tube (4).

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