ICP (Inductively Coupled Plasma) etching machine convenient for discharging etching reactants

Abstract

The utility model discloses an ICP plasma etching machine convenient to discharge etching reactants, and relates to the technical field of etching machines, the ICP plasma etching machine comprises an etching main body and an electrostatic chuck, the top inside the etching main body is provided with a gas distribution chamber, the front end of the gas distribution chamber is provided with a connecting plate, the inside of the connecting plate is provided with a joining clamping plate in a clamping manner, and the joining clamping plate is provided with a clamping groove. A bottom plate is installed at the top of the connection clamping plate, a dispersion assembly used for assisting uniform dispersion of gas is arranged in the bottom plate, the dispersion assembly comprises a dispersion disc, a built-in groove, a connecting shaft and dispersion pieces, the built-in groove is formed in the dispersion disc, and the connecting shaft is rotatably installed in the built-in groove. According to the ICP plasma etching machine convenient to discharge the etching reactants, through the design of the dispersion assembly, gas is dispersed and discharged while auxiliary gas is rapidly guided out, the reaction chamber of the whole etching main body is conveniently and uniformly filled with the gas, etching is prevented from being affected by different etching gas concentrations, and the ICP plasma etching machine convenient to discharge the etching reactants has good stability.

Description

Technical Field

[0001] The utility model relates to the technical field of etching machines, in particular to an ICP plasma etcher which is convenient for discharging etching reactants. Background Art

[0002] Plasma etcher, also known as plasma etcher, plasma plane etcher, plasma etcher, plasma surface treatment instrument, plasma cleaning system, etc. Plasma etching is the most common form of dry etching. Its principle is that the gas exposed to the electron area forms plasma, and the resulting ionized gas and the gas composed of released high-energy electrons form plasma or ions. When the ionized gas atoms are accelerated by the electric field, they will release enough force to tightly bond the material or etch the surface with the surface expulsion force. To some extent, plasma cleaning is essentially a milder case of plasma etching. The equipment for dry etching process includes a reaction chamber, a power supply, and a vacuum part. The workpiece is sent into the reaction chamber evacuated by a vacuum pump. The gas is introduced and exchanged with the plasma. The plasma reacts on the surface of the workpiece, and the volatile byproducts of the reaction are pumped away by the vacuum pump.

[0003] However, when gas is introduced into the reaction chamber of an existing plasma etcher, the etching intensity is easily affected due to uneven gas discharge concentration.

[0004] Therefore, in view of this, research and improvement are conducted on the existing structure and defects, and an ICP plasma etcher is provided which is convenient for discharging etching reactants. Utility Model Content

[0005] The utility model aims to provide an ICP plasma etcher which is convenient for discharging etching reactants, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an ICP plasma etcher that is convenient for discharging etching reactants, comprising an etching body and an electrostatic chuck, a gas distribution chamber is arranged at the top of the interior of the etching body, and a connecting plate is installed at the front end of the gas distribution chamber, a connecting card plate is arranged inside the connecting plate, a bottom plate is installed on the top of the connecting card plate, and a dispersion component for assisting the uniform dispersion of gas is arranged inside the bottom plate, the dispersion component comprises a dispersion disk, a built-in groove, a connecting shaft and a dispersion sheet, and a built-in groove is opened inside the dispersion disk, a connecting shaft is rotatably installed inside the built-in groove, and dispersion sheets are distributed in an annular manner on the outer surface of the connecting shaft, a wafer is arranged at the bottom of the etching body, and focusing rings are installed on both sides of the wafer, the electrostatic chuck is arranged at the bottom of the wafer, a tube body is arranged on the right side of the etching body, and a vacuum pump is installed at the end of the tube body.

[0007] Furthermore, a vacuum tube is arranged inside the tube body, and needles are distributed in a ring shape on the outer surface of the vacuum tube.

[0008] Furthermore, the tube body is in a middle frame structure, and the diameter of the tube body is larger than the diameter of the vacuum tube.

[0009] Furthermore, threaded rods are threadedly installed on the left and right sides of the rear of the etching body, and two groups of threaded rods are provided.

[0010] Furthermore, an auxiliary component for assisting the discharge of etching reactants is arranged on the left side of the etching body, and the auxiliary component includes an auxiliary frame, an auxiliary pipe and an air pump. An auxiliary pipe is arranged inside the auxiliary frame, and an air pump is installed at the left end of the auxiliary pipe.

[0011] Furthermore, the auxiliary component also includes an electromagnetic valve and a protective outer frame. The auxiliary tube and the top of the vacuum tube are both provided with an electromagnetic valve, and a protective outer frame is installed on the outside of the air pump.

[0012] Furthermore, the built-in grooves, connecting shafts and dispersion sheets are distributed in a one-to-one correspondence, and eight groups of built-in grooves, connecting shafts and dispersion sheets are provided.

[0013] Furthermore, the auxiliary frame is a semi-hollow structure, and the auxiliary frame and the etching body are an integrated structure, and a visual window is provided on the right side of the bottom of the etching body.

[0014] The utility model provides an ICP plasma etcher which is convenient for discharging etching reactants, and has the following beneficial effects:

[0015] 1. The utility model adopts the design of dispersion components to quickly guide the auxiliary gas out while dispersing the gas out, so that the gas can evenly fill the reaction chamber of the entire etching body, avoid the influence of different etching gas concentration on etching, and have good stability.

[0016] 2. The utility model adopts the auxiliary component design, the auxiliary tube is a closed bellows, after the gas enters the auxiliary tube, the end portion will extend toward the inside of the etching body, thereby touching the etching area of ​​the etchant, causing it to vibrate and assist the discharge of the etching reactants;

[0017] 3. The tube body of the utility model is made of transparent PVC and is provided with colored liquid inside. Therefore, when the vacuum tube is evacuated and the joint is not well sealed, the tube body will shrink and fit to the vacuum tube. When fitting, the tube body can be punctured by the design of the puncture needle, so that the liquid inside the tube body can seep out, which is convenient for the user to find out in time and use the electromagnetic valve to shut down the use of the vacuum pump. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1This is a schematic diagram of the overall structure of an ICP plasma etcher that is convenient for discharging etching reactants according to the utility model;

[0019] Figure 2 This is a schematic diagram of a top view of an ICP plasma etcher that facilitates the discharge of etching reactants according to the utility model;

[0020] Figure 3 This is a schematic diagram of a bottom plate of an ICP plasma etcher for facilitating the discharge of etching reactants according to the utility model;

[0021] Figure 4 The utility model is a schematic diagram of the local structure inside the tube body of an ICP plasma etcher which is convenient for discharging etching reactants.

[0022] In the figure: 1. Etching body; 2. Gas distribution chamber; 3. Connecting plate; 4. Connecting card plate; 5. Bottom plate; 6. Tube body; 7. Vacuum pump; 8. Wafer; 9. Electrostatic suction cup; 10. Focusing ring; 11. Auxiliary components; 1101. Auxiliary frame; 1102. Solenoid valve; 1103. Auxiliary tube; 1104. Air pump; 1105. Protective outer frame; 12. Threaded rod; 13. Visual window; 14. Dispersion component; 1401. Dispersion disk; 1402. Built-in groove; 1403. Connecting shaft; 1404. Dispersion sheet; 15. Vacuum tube; 16. Needle. DETAILED DESCRIPTION

[0023] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0024] like Figure 1 and Figure 3As shown, an ICP plasma etcher for facilitating the discharge of etching reactants includes an etching body 1, a gas distribution chamber 2, a connecting plate 3, a connecting card plate 4, a bottom plate 5, a tube body 6, a vacuum pump 7, a wafer 8, an electrostatic chuck 9, a focusing ring 10, an auxiliary component 11, an auxiliary frame 1101, an electromagnetic valve 1102, an auxiliary pipe 1103, an air pump 1104, a protective outer frame 1105, a threaded rod 12, a visual window 13, a dispersion component 14, a dispersion plate 1401, a built-in groove 1402, a connecting shaft 1403, and a dispersion sheet 1 404, vacuum tube 15 and needle 16, a gas distribution chamber 2 is arranged at the top of the etching body 1, and a connecting plate 3 is installed at the front end of the gas distribution chamber 2, a connecting card plate 4 is arranged inside the connecting plate 3, a bottom plate 5 is installed on the top of the connecting card plate 4, and a dispersion component 14 for assisting the uniform dispersion of gas is arranged inside the bottom plate 5, and the dispersion component 14 includes a dispersion disk 1401, a built-in groove 1402, a connecting shaft 1403 and a dispersion sheet 1404, and the dispersion disk 1401 is provided with a built-in groove 1402, The internal rotation of the built-in groove 1402 is equipped with a connecting shaft 1403, and the outer surface of the connecting shaft 1403 is annularly distributed with dispersion sheets 1404. The built-in groove 1402, the connecting shaft 1403 and the dispersion sheets 1404 are distributed one by one, and the built-in groove 1402, the connecting shaft 1403 and the dispersion sheets 1404 are arranged in eight groups. The gas is ejected from the gas distribution chamber 2. The pressure generated by the gas during the ejection can make the dispersion sheets 1404 rotate around the connecting shaft 1403, which assists the rapid extraction of the gas while dispersing the gas out. , which makes it easier for the gas to evenly fill the reaction chamber of the entire etching body 1, avoids the influence of different etching gas concentrations on etching, and has good stability. A wafer 8 is arranged at the bottom of the etching body 1, and focusing rings 10 are installed on both sides of the wafer 8. An electrostatic suction cup 9 is arranged at the bottom of the wafer 8. A tube body 6 is arranged on the right side of the etching body 1, and a vacuum pump 7 is installed at the end of the tube body 6. Through the design of the tube body 6 and the vacuum pump 7, the etching reaction gas of the etching body 1 can be extracted after the reaction is completed, so as to facilitate the use of the etching body 1 again.

[0025] like Figure 1 and Figure 4 As shown, a vacuum tube 15 is arranged inside the tube body 6, and needles 16 are distributed in a ring shape on the outer surface of the vacuum tube 15. The tube body 6 is in a middle frame structure, and the diameter of the tube body 6 is larger than the diameter of the vacuum tube 15. The tube body 6 is made of transparent PVC, and a colored liquid is arranged inside, so that when the vacuum tube 15 is evacuated and the joint is not well sealed, the tube body 6 will shrink and fit to the vacuum tube 15, so that the needle 16 can be used to puncture the tube body 6 when fitting, so that the liquid inside the tube body 6 will seep out, which is convenient for the user to find out in time and use the electromagnetic valve 1102 to turn off the use of the vacuum pump 7.

[0026] like Figure 1 and Figure 2As shown, threaded rods 12 are threadedly installed on the left and right sides of the rear of the etching body 1, and two groups of threaded rods 12 are provided. By rotating the threaded rods 12 clockwise or counterclockwise, the vacuum suction port leading to the etching body 1 and the through hole of the auxiliary tube 1103 on the other side can be closed, so as to facilitate the etching treatment of the etching body 1. An auxiliary component 11 for assisting the discharge of etching reactants is provided on the left side of the etching body 1, and the auxiliary component 11 includes an auxiliary frame 1101, an auxiliary tube 1103 and an air pump 1104. The auxiliary frame 1101 is provided with an auxiliary tube 1103 inside, and the left end of the auxiliary tube 1103 is installed with an air pump 1104. The auxiliary component 11 also includes an electromagnetic valve 1102 and a protective outer frame 1105, the auxiliary tube 1103 and the top of the vacuum tube 15 are both provided with an electromagnetic valve 1102, the protective outer frame 1105 is installed on the outside of the air pump 1104, the auxiliary frame 1101 is a semi-hollow structure, and the auxiliary frame 1101 and the etching body 1 are an integrated structure, and a visual window 13 is provided on the right side of the bottom of the etching body 1. Through the design of the air pump 1104, a proper amount of gas can be blown into the auxiliary tube 1103. The auxiliary tube 1103 is a closed bellows. After the gas enters the auxiliary tube 1103, the end portion will extend toward the inside of the etching body 1, thereby touching the etching area of ​​the etching object, causing it to vibrate to assist the discharge of the etching reactants.

[0027] In summary, the ICP plasma etcher that facilitates the discharge of etching reactants is firstly based on Figure 1-Figure 4In the structure shown in , gas is ejected from the gas distribution chamber 2. The pressure generated by the gas during ejection can make the dispersion sheet 1404 rotate around the connecting shaft 1403. The auxiliary gas is quickly extracted and the gas is dispersed and discharged, so that the gas can evenly fill the reaction chamber of the entire etching body 1 to avoid the influence of different etching gas concentrations on etching. Then, through the design of the air pump 1104, a proper amount of gas can be blown into the auxiliary tube 1103. The auxiliary tube 1103 is a closed bellows. After the gas enters the auxiliary tube 1103, the end portion will extend toward the inside of the etching body 1, thereby touching the etching area of ​​the etchant, causing it to vibrate and assist in the discharge of the etching reactants. Then, through the design of the tube body 6 and the vacuum pump 7, the etching reaction gas of the etching body 1 can be extracted after the reaction is completed. It is convenient to use the etching main body 1 again. Secondly, the tube body 6 is made of transparent PVC and has a colored liquid inside. When the vacuum tube 15 is evacuated and the joint is not well sealed, the tube body 6 will shrink and fit to the vacuum tube 15. When fitting, the tube body 6 can be pierced by the design of the puncture needle 16 to make the liquid inside the tube body 6 seep out, which is convenient for the user to find out in time and use the electromagnetic valve 1102 to turn off the vacuum pump 7. In addition, by rotating the threaded rod 12 clockwise or counterclockwise, the vacuum suction port leading to the etching main body 1 and the through hole of the auxiliary tube 1103 on the other side can be closed, which is convenient for etching the etching main body 1. When there is a problem with the sealing of the joint between the tube body 6 and the vacuum tube 15, it is possible to perform a blocking operation in time to facilitate the inspection of the joint.

[0028] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. An ICP plasma etcher for facilitating the discharge of etching reactants, comprising an etching body (1) and an electrostatic chuck (9), characterized in that: The etching body (1) is provided with a gas distribution chamber (2) at the top thereof, and a connecting plate (3) is installed at the front end of the gas distribution chamber (2), and a connecting card plate (4) is provided inside the connecting plate (3), and a bottom plate (5) is installed on the top of the connecting card plate (4), and a dispersing assembly (14) for assisting the uniform dispersion of gas is provided inside the bottom plate (5), and the dispersing assembly (14) comprises a dispersing disk (1401), a built-in groove (1402), a connecting shaft (1403) and a dispersing sheet (1404), and the dispersing disk A built-in groove (1402) is provided inside (1401), a connecting shaft (1403) is rotatably installed inside the built-in groove (1402), and a dispersion sheet (1404) is distributed in an annular shape on the outer surface of the connecting shaft (1403). A wafer (8) is arranged at the bottom of the etching body (1), and focusing rings (10) are installed on both sides of the wafer (8). The electrostatic suction cup (9) is arranged at the bottom of the wafer (8). A tube body (6) is arranged on the right side of the etching body (1), and a vacuum pump (7) is installed at the end of the tube body (6).

2. An ICP plasma etcher for facilitating the discharge of etching reactants according to claim 1, characterized in that: A vacuum tube (15) is arranged inside the tube body (6), and needles (16) are distributed in an annular manner on the outer surface of the vacuum tube (15).

3. An ICP plasma etcher for facilitating the discharge of etching reactants according to claim 2, characterized in that: The tube body (6) is in a middle frame structure, and the diameter of the tube body (6) is greater than the diameter of the vacuum tube (15).

4. The ICP plasma etcher for facilitating the discharge of etching reactants according to claim 1, characterized in that: Threaded rods (12) are threadedly mounted on the left and right sides of the rear of the etching body (1), and two groups of threaded rods (12) are provided.

5. The ICP plasma etcher for facilitating the discharge of etching reactants according to claim 1, characterized in that: An auxiliary component (11) for assisting the discharge of etching reactants is arranged on the left side of the etching body (1), and the auxiliary component (11) comprises an auxiliary frame (1101), an auxiliary tube (1103) and an air pump (1104); an auxiliary tube (1103) is arranged inside the auxiliary frame (1101), and an air pump (1104) is installed at the left end of the auxiliary tube (1103).

6. The ICP plasma etcher for facilitating the discharge of etching reactants according to claim 5, characterized in that: The auxiliary component (11) further comprises an electromagnetic valve (1102) and a protective outer frame (1105); the auxiliary tube (1103) and the top of the vacuum tube (15) are both provided with an electromagnetic valve (1102); and the outside of the air pump (1104) is provided with a protective outer frame (1105).

7. The ICP plasma etcher for facilitating the discharge of etching reactants according to claim 1, characterized in that: The built-in grooves (1402), the connecting shafts (1403) and the dispersion sheets (1404) are distributed in a one-to-one correspondence, and eight groups of the built-in grooves (1402), the connecting shafts (1403) and the dispersion sheets (1404) are provided.

8. The ICP plasma etcher for facilitating the discharge of etching reactants according to claim 5, characterized in that: The auxiliary frame (1101) is a semi-hollow structure, and the auxiliary frame (1101) and the etching body (1) are an integrated structure. A visible window (13) is provided on the right side of the bottom of the etching body (1).

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