Bonding device

Abstract

The utility model relates to the technical field of semiconductor packaging, in particular to bonding equipment. The bonding equipment comprises a chip supply assembly and at least two groups of bonding assemblies, a bonding handover position exists between any group of bonding assembly and the chip supply assembly, and the chip supply assembly can transfer a chip to be bonded to any bonding handover position; the bonding assembly comprises a substrate wafer carrying platform module, the substrate wafer carrying platform module is used for carrying a substrate wafer and transferring the substrate wafer to be bonded to a bonding position, and the bonding assembly is used for picking up a chip at the bonding connection position and bonding the chip to the substrate wafer at the bonding position. According to the bonding equipment provided by the utility model, the at least two groups of bonding assemblies can share the same chip supply assembly, the production efficiency is relatively high, in addition, the improvement of the structure compactness is facilitated, and the occupied space of the equipment is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a bonding device. Background Art

[0002] In the semiconductor packaging process, bonding equipment is generally required to bond the chip to the base wafer.

[0003] However, the existing bonding equipment has a set of functional structures, that is, each functional structure needs to be run once each time a group of chips is bonded to the base wafer. Different process steps take different amounts of time, which causes some functional structures to be idle for a long time and not be fully utilized, resulting in waste. Utility Model Content

[0004] The utility model aims to provide a bonding device to alleviate the technical problem that some functional structures of the bonding device in the prior art are not fully utilized.

[0005] The bonding equipment provided by the utility model comprises a chip supply component and at least two groups of bonding components.

[0006] There is a bonding handover position between any group of the bonding components and the chip supply components, and the chip supply components can transfer the chip to be bonded to any of the bonding handover positions; the bonding component includes a base wafer stage module, and the base wafer stage module is used to carry the base wafer and transfer the base wafer to be bonded to the bonding position, and the bonding component is used to pick up the chip at the bonding handover position and bond the chip to the base wafer at the bonding position.

[0007] Preferably, as an implementable embodiment, the bonding assembly also includes a bonding head module and a laser heating module, the bonding head module is used to pick up the chip at the bonding joint position and press the chip to the base wafer at the bonding position, and the laser heating module is used to emit laser towards the chip pressed at the bonding position.

[0008] Preferably, as an implementable embodiment, the bonding head module includes a bonding head having a hollow cavity running through two ends, and the laser heating module and the base wafer stage module are respectively opposite to two ends of the hollow cavity.

[0009] A light-transmitting press head is fixedly provided at one end of the bonding press head opposite to the base wafer stage module, and the light-transmitting press head is used to pick up and press the chip.

[0010] Preferably, as an implementable embodiment, the laser heating module includes a laser and a first driving mechanism, wherein the first driving mechanism is connected to the laser and is used to drive the laser to move toward or away from the bonding head.

[0011] Preferably, as an implementable embodiment, the bonding head module also includes a second driving mechanism, which is connected to the bonding head and is used to drive the bonding head to move toward or away from the base wafer carrier module; and / or, the bonding head module also includes a third driving mechanism, which is connected to the bonding head and is used to drive the bonding head to rotate around the central axis.

[0012] Preferably, as an implementable embodiment, the bonding components are in two groups and are respectively arranged on two opposite sides of the chip supply component;

[0013] And / or, the base wafer stage module includes a heating plate, and the heating plate is used to heat the base wafer.

[0014] Preferably, as an implementable embodiment, the chip supply component includes a wafer ring carrier module, a pick-up and flipping module and a chip transfer module, the wafer ring carrier module is used to carry the wafer ring with the chip attached and transfer the chip to be bonded to the flipping handover position, the pick-up and flipping module is used to pick up the chip at the flipping handover position and flip the picked chip 180°, and the chip transfer module is used to transfer the flipped chip to the bonding handover position.

[0015] Preferably, as an implementable embodiment, the picking and flipping module includes a visual detection component, and the visual detection component is used to obtain the chip image on the wafer ring stage module. The visual detection component is communicatively connected with the wafer ring stage module, and is used to control the wafer ring stage module to transfer the chip to be bonded to the flipping handover position.

[0016] Preferably, as an implementable embodiment, the picking and flipping module also includes a picking and flipping component and a ejector component, and the picking and flipping component and the ejector component are respectively arranged on opposite sides of the wafer ring carrier module, the ejector component is used to lift the chip, and the picking and flipping component is used to pick up the lifted chip and flip the picked chip 180°.

[0017] Preferably, as an implementable embodiment, the chip transfer module includes a transfer head and a fourth driving mechanism, the transfer head is used to pick up the chip that has been flipped on the picking and flipping module, and the fourth driving mechanism is connected to the transfer head and is used to drive the transfer head to move along three mutually orthogonal axes;

[0018] And / or, the wafer ring carrier module includes a carrier body and a fifth driving mechanism, the carrier body is used to carry the wafer ring with chips attached, and the fifth driving mechanism is connected to the carrier body and is used to drive the carrier body to move in a direction parallel to the carrying surface.

[0019] Compared with the prior art, the beneficial effects of the utility model are:

[0020] The bonding equipment provided by the utility model can first control the chip supply component to transfer the chip to be bonded to a bonding handover position corresponding to one group of bonding components (for the convenience of description, it is defined as the first bonding component) when bonding a chip to a base wafer, so that the first bonding component can pick up the chip to be bonded at the corresponding bonding handover position; at the same time, the base wafer carrier module in the first bonding component will transfer the base wafer to be bonded to the bonding position, so that after the first bonding component picks up the chip to be bonded, the chip can be bonded to the base wafer at the bonding position, completing the bonding work of a pair of chips and the base wafer. After the first bonding component picks up the chip to be bonded at the corresponding bonding handover position, it can control the chip supply component to transfer the next chip to be bonded to the corresponding bonding handover position of another bonding component (for the sake of ease of description, it is defined as the second bonding component), so that the other bonding component can pick up another chip to be bonded at the corresponding bonding handover position; at the same time, the base wafer carrier module in the second bonding component will transfer another base wafer to be bonded to the bonding position, so that after the second bonding component picks up another chip to be bonded, it can bond the chip to the base wafer at the bonding position, completing the bonding work of another pair of chips and base wafers, and so on.

[0021] It should be noted that the bonding work takes longer time than the chip supply-related work. In the bonding equipment provided by the present invention, at least two groups of bonding components can share the same chip supply component, and at least two groups of bonding components can simultaneously perform bonding work on at least two pairs of chips and base wafers respectively, which is equivalent to that during the period when a certain group of bonding components is performing bonding work, the chip supply component can complete at least two chip supply-related tasks. Therefore, the chip supply component can be more fully utilized, thereby improving the production efficiency of the bonding equipment. In addition, it is also beneficial to improve the compactness of the structure and reduce the space occupied by the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0023] Figure 1 A front view structural schematic diagram of a bonding device provided in an embodiment of the utility model;

[0024] Figure 2 A schematic top view of the main structure of the bonding device provided by an embodiment of the utility model;

[0025] Figure 3 A schematic side view of the main structure of the bonding device provided by an embodiment of the utility model;

[0026] Figure 4 A schematic diagram of the structure of the main bonding structure in the bonding device provided by the embodiment of the utility model in a state of pressing the chip;

[0027] Figure 5 A schematic diagram of the structure of a pick-up flip module and a transfer head in a bonding device provided by an embodiment of the utility model in a state ready to flip;

[0028] Figure 6 A schematic diagram of the main process of the bonding equipment provided in an embodiment of the utility model.

[0029] Description of reference numerals:

[0030] 100-chip supply assembly; 110-wafer ring stage module; 120-pick-up and flip module; 121-visual inspection component; 122-pick-up and flip component; 123-throw pin component; 130-chip transfer module; 131-transfer head;

[0031] 200-bonding assembly; 210-substrate wafer stage module; 220-bonding pressure head; 221-hollow cavity; 222-light-transmitting pressure head; 223-first baffle; 224-second baffle; 225-negative pressure area; 230-laser;

[0032] 300-chip;

[0033] 400-substrate wafer;

[0034] 500-Blue film. DETAILED DESCRIPTION

[0035] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0036] The present invention will be further described in detail below through specific implementation examples in conjunction with the accompanying drawings.

[0037] See also Figure 1-Figure 6 The present embodiment provides a bonding device, which includes a chip supply component 100 and at least two groups of bonding components 200: there is a bonding handover position between any group of bonding components 200 and the chip supply component 100, and the chip supply component 100 can transfer the chip 300 to be bonded to any bonding handover position; the bonding component 200 includes a base wafer stage module 210, and the base wafer stage module 210 is used to carry the base wafer 400 and transfer the base wafer 400 to be bonded to the bonding position, and the bonding component 200 is used to pick up the chip 300 at the bonding handover position and bond the chip 300 to the base wafer 400 at the bonding position.

[0038] The bonding device provided in this embodiment can first control the chip supply component 100 to transfer the chip 300 to be bonded to a bonding handover position corresponding to one group of bonding components 200 (for the convenience of description, it is defined as the first bonding component) when bonding the chip 300 and the base wafer 400, so that the first bonding component can pick up the chip 300 to be bonded at the corresponding bonding handover position; at the same time, the base wafer carrier module 210 in the first bonding component will transfer the base wafer 400 to be bonded to the bonding position, so that after the first bonding component picks up the chip 300 to be bonded, the chip 300 can be bonded to the base wafer 400 at the bonding position, thereby completing the bonding work of a pair of chips 300 and the base wafer 400. After the first bonding component picks up the chip 300 to be bonded at the corresponding bonding handover position, the chip supply component 100 can be controlled to transfer the next chip 300 to be bonded to the corresponding bonding handover position of another bonding component 200 (for the sake of ease of description, it is defined as the second bonding component), so that the other bonding component 200 can pick up another chip 300 to be bonded at the corresponding bonding handover position; at the same time, the base wafer carrier module 210 in the second bonding component will transfer another base wafer 400 to be bonded to the bonding position, so that after the second bonding component picks up another chip 300 to be bonded, the chip 300 can be bonded to the base wafer 400 at the bonding position, completing the bonding work of another pair of chips 300 and the base wafer 400, and so on.

[0039] It should be noted that the bonding work takes longer time than the chip supply related work. In the bonding equipment provided in this embodiment, at least two groups of bonding components 200 can share the same chip supply component 100, and at least two groups of bonding components 200 can simultaneously perform bonding work on at least two pairs of chips 300 and the base wafer 400, which is equivalent to that during the period when a certain group of bonding components 200 performs bonding work, the chip supply component 100 can complete at least two chip supply related work, thereby making full use of the chip supply component 100 and improving the production efficiency of the bonding equipment. In addition, it is also conducive to improving the compactness of the structure and reducing the space occupied by the equipment. Specifically, the number of bonding components 200 can be determined according to the time taken for the bonding work and the time taken for the chip supply related work, so as to ensure the working time of the bonding component 200 while minimizing the idle time of the chip supply component 100.

[0040] See also Figure 1 and Figure 4 The above-mentioned bonding assembly 200 may specifically include a bonding head module and a laser heating module, wherein the bonding head module can be used to pick up the chip 300 at the bonding junction position and press the chip 300 onto the base wafer 400 at the bonding position. At this time, the chip 300 and the base wafer 400 are both in the bonding position, and the laser heating module can emit a laser toward the chip 300 at the bonding position to use the laser to efficiently heat the chip 300. Combined with the pressure of the bonding head module, the bonding of the chip 300 and the base wafer 400 can be completed in a short time. It should be noted that by using the shaped flat-top laser to generate local high temperature in the bonding area, the flux can be melted. This local heating method can reduce the heat-affected area and help reduce the warping of the chip 300 after bonding. Laser heating can also achieve precise control of energy, avoiding the problem of uneven energy transfer that may occur during thermal reflow, improving the controllability of the process, and achieving high-precision, non-contact bonding process, which can improve the connection quality between the chip 300 and the base wafer 400. In addition, the rapid temperature rise and fall characteristics of the laser can also be used to improve the bonding efficiency.

[0041] See also Figure 4The specific structure of the above-mentioned bonding head module may include a bonding head 220, and the bonding head 220 is set to have a hollow cavity 221 running through both ends, and the laser heating module and the base wafer carrier module 210 are respectively arranged opposite to the two ends of the hollow cavity 221. At the same time, a transparent head 222 is fixed at the end of the bonding head 220 opposite to the base wafer carrier module 110, and the transparent head 222 is used to pick up and press the chip 300. In this way, the laser emitted by the laser heating module can pass through the hollow cavity 221 of the bonding head 220 and the transparent head 222, and be projected onto the chip 300 that is pressed on the base wafer 400. Specifically, the bonding head 220 presses the chip 300 onto the base wafer 400 and then stops moving. At this time, the bonding head 220 will apply a certain compressive stress to the chip 300. At the same time, the laser heating module quickly heats the chip 300 to the melting temperature of the solder ball. During the melting process of the solder ball, the bonding head 220 is controlled to move slightly toward the base wafer 400 to ensure the connection of the bumps, and is maintained for a certain time (several seconds) to ensure that the solder ball is completely melted and infiltrates the connection point between the chip 300 and the base wafer 400. When the solder ball is molten, the bonding head 220 is lifted upward to the expected welding height, and then the laser heating module is turned off to allow the melted solder ball to cool down rapidly, so that the solder becomes a solid phase, thereby completing the bonding of the chip 300 and the base wafer 400.

[0042] The laser heating module may specifically include a laser 230 and a first driving mechanism, and the first driving mechanism is connected to the laser 230, so as to use the first driving mechanism to drive the laser 230 to move toward or away from the bonding head 220, so that the laser emitted by the laser can be accurately focused on the surface of the chip 300 at the bonding position to ensure the heating effect of the laser on the chip 300. Among them, the first driving mechanism may be a linear motor; the laser emitted by the laser is preferably an infrared laser, and the laser 230 is preferably a homogenizing laser.

[0043] The bonding head module may specifically include a second driving mechanism, which is connected to the bonding head 220, so that the second driving mechanism drives the bonding head 220 to move toward or away from the base wafer stage module 210. In this way, the second driving mechanism can drive the bonding head 220 to press the picked-up chip 300 onto the base wafer 400 on the base wafer stage module 210, and can also drive the bonding head 220 to lift up to detach from the chip 300 after the laser heating module is turned off, so that the bonding head 220 can successfully complete the pressing and releasing of the chip 300. The second driving mechanism may be a linear motor.

[0044] The bonding head module may further include a third driving mechanism, which is connected to the bonding head 220, so as to drive the bonding head 220 to rotate around its own axis by the third driving mechanism, so that the bonding head 220 can drive the picked-up chip 300 to rotate around its own axis, thereby adjusting the rotation angle of the chip 300, so that the chip 300 can be attached to the base wafer 400 at a correct angle. The third driving mechanism may be a direct-drive rotary motor.

[0045] In fact, the bonding head 220 can be installed on a moving table, and the second driving mechanism and the third driving mechanism can be arranged on the moving table, so as to realize the movement and rotation of the bonding head 220 by using the moving table.

[0046] The hollow cavity 221 of the bonding head 220 can be set to a straight cylinder shape, so that the laser emitted by the laser heating module can smoothly pass through the hollow cavity 221 of the bonding head 220 and project onto the chip 300 at the bonding position. The light-transmitting head 222 can be made of a quartz head, which has a very low absorption rate for lasers, which can not only avoid the problem of overheating of the bonding head 220, but also improve the utilization rate of the laser; of course, the bonding head 220 can also be made of other light-transmitting materials that meet the requirements of laser feeding loss. The light-transmitting press head 222 can absorb the chip 300 by vacuum adsorption to pick up the chip 300, which can not only ensure the flatness of the chip 300 after being sucked up by the light-transmitting press head 222, but also will not affect the pressure applied by the bonding press head 220 to the chip 300; the end of the hollow cavity 221 of the bonding press head 220 away from the light-transmitting press head 220 can be closed by the first baffle 223; there is a negative pressure area 225 in the hollow cavity 221 of the bonding press head 220, one end of the negative pressure area 225 is the light-transmitting press head 222, which is used to provide negative pressure for the light-transmitting press head 222, and the other end of the negative pressure area 225 can be sealed by the second baffle 224. Among them, the first baffle 223 and the second baffle 224 are both made of transparent materials (such as quartz).

[0047] See also Figure 1 and Figure 2 It is preferred to arrange the bonding components 200 into two groups, and arrange the two groups of bonding components 200 on opposite sides of the chip supply component 100, which is equivalent to adopting a symmetrical gantry design for the bonding equipment, which ensures a compact structure while ensuring the flexibility and efficiency of the production line.

[0048] A heating plate may be provided in the specific structure of the base wafer stage module 210 to heat the base wafer 400 so that the base wafer 400 can reach the preheating temperature, thereby improving the subsequent bonding efficiency.

[0049] A linear motor may also be provided in the base wafer stage module 210 to utilize the linear motor to realize the transfer of the base wafer 400 , thereby ensuring the accurate positioning of the base wafer 400 .

[0050] See also Figure 1 In the specific structure of the chip supply component 100, a wafer ring stage module 110, a pick-up flip module 120 and a chip transfer module 130 can be set, wherein the wafer ring stage module 110 can carry the wafer ring with the chip 300 attached and transport the chip 300 to be bonded to the flipping and handing position; then, the pick-up flip module 120 can pick up the chip 300 attached to the wafer ring from the flipping and handing position, and flip the picked-up chip 300 180°; then, the chip transfer module 130 can transfer the flipped chip 300 to the bonding handing position, so that the bonding head module can pick up the chip 300 from the bonding handing position. Among them, the pick-up flip module 120 can use mechanical means such as suction cups or clamps to pick up the chip 300 from the blue film 500 tightened on the wafer ring, and keep the chip 300 fixed during the flipping process.

[0051] See also Figure 5 In the specific structure of the above-mentioned picking and flipping module 120, a visual inspection component 121 can be set to use the visual inspection component 121 to obtain the image of the chip 300 on the wafer ring stage module 110, determine the position of the chip 300 to be bonded on the wafer ring stage module 110, and connect the visual inspection component 121 to the wafer ring stage module 110 so that the visual inspection component 121 can control the action of the wafer ring stage module 110 according to the current position of the chip 300 to be bonded, so that the wafer ring stage module 110 can transfer the chip 300 to be bonded to the flipping and handing position, so that the picking and flipping module 120 can pick up the chip 300 from the flipping and handing position. Specifically, the visual inspection component 121 can include a camera.

[0052] In the specific structure of the above-mentioned pick-up flip module 120, a pick-up flip component 122 and a pin component 123 can be provided, and the pick-up flip component 122 and the pin component 123 are respectively provided on opposite sides of the wafer ring stage module 110. Specifically, the pin component 123 can lift up the chip 300, and the pick-up flip component 120 can pick up the lifted chip 300 and flip the picked-up chip 300 by 180°. In fact, the pin component 123 will connect with the blue film 500 attached with the chip 300 to lift up together. After the chip 300 is lifted up, the difficulty of the pick-up flip component 120 picking up the chip 300 can be reduced, so that the chip 300 can be picked up smoothly. Among them, the pick-up flip component 120 can pick up the chip 300 by vacuum adsorption.

[0053] The chip transfer module 130 may specifically include a transfer head 131 and a fourth drive mechanism, wherein the transfer head 131 may pick up the chip 300 that has been flipped on the flip module 120, and the fourth drive mechanism may be connected to the transfer head 131, so that the fourth drive mechanism may be used to drive the transfer head 131 to move along three mutually orthogonal axes, thereby enabling the transfer head 131 to move in space, which is conducive to the transfer head 131 to smoothly pick up the flipped chip 300 and transfer it to the bonding handover position. The transfer head 131 may pick up the chip 300 by vacuum adsorption; the fourth drive mechanism may include a linear motor, a stepper motor and a lead screw module.

[0054] In the specific structure of the wafer ring stage module 110, a stage body and a fifth driving mechanism may be provided, wherein the stage body may be used to carry the wafer ring with the chip 300 attached thereto, and the fifth driving mechanism may be connected to the stage body, so as to use the fifth driving mechanism to drive the stage body to move in a direction parallel to the carrying surface, so as to ensure that the chip 300 that needs to be picked up and flipped is accurately moved to the flipping handover position. The fifth driving mechanism may be a linear motor.

[0055] See also Figure 6 The bonding equipment provided in this embodiment has the following main processes: substrate wafer loading → chip picking and flipping → chip transfer → chip and substrate wafer alignment → laser-assisted bonding → substrate wafer unloading.

[0056] In fact, in the horizontal direction, the two groups of bonding components 200 are respectively located on the left and right sides of the chip supply component 100, preferably symmetrically arranged; in the vertical direction, the bonding equipment is divided into three layers: upper, middle and lower. The bonding head module, laser heating module and chip transfer module 130 are located in the upper layer, the picking and flipping module 120 and the base wafer carrier module 210 are located in the middle layer, and the wafer ring carrier module 110 is located in the lower layer.

[0057] The laser 230 is located above the bonding head 220, the transparent head 222 is installed at the bottom of the bonding head 220 and is located in the hollow cavity 221, the base wafer carrier module 210 is located below the bonding head 220, the picking and flipping component 122 is located above the wafer ring carrier module 110, the ejector component 123 is located below the wafer ring carrier module 110, the transfer head 131 is located above the picking and flipping module 120, and the visual inspection module 121 is located above the wafer ring carrier module 110. The moving directions of the laser 230 and the bonding head 220 are both Z-direction (i.e., vertical direction), the rotation axis of the bonding head 220 is the Z-axis (i.e., vertical axis), the base wafer stage module 210 drives the base wafer 400 to move in a horizontal direction (including X-direction and Y-direction), the wafer ring stage module 110 drives the wafer ring to move in a horizontal direction (including X-direction and Y-direction), and the moving directions of the transfer head 131 include X-direction, Y-direction and Z-direction.

[0058] In the description of the present invention, it should be noted that the terms "up", "down", "left", "right", "vertical", "horizontal", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0059] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A bonding device, It is characterized in that It comprises a chip supply component (100) and at least two groups of bonding components (200): There is a bonding handover position between any group of the bonding components (200) and the chip supply component (100), and the chip supply component (100) can transfer the chip (300) to be bonded to any of the bonding handover positions; the bonding component (200) includes a base wafer stage module (210), and the base wafer stage module (210) is used to carry the base wafer (400) and transfer the base wafer (400) to be bonded to the bonding position, and the bonding component is used to pick up the chip (300) at the bonding handover position and bond the chip (300) to the base wafer (400) at the bonding position.

2. The bonding device according to claim 1, It is characterized in that The bonding assembly (200) further comprises a bonding head module and a laser heating module, wherein the bonding head module is used to pick up the chip (300) at the bonding junction position and press the chip (300) onto the base wafer (400) at the bonding position, and the laser heating module is used to emit laser light toward the chip (300) pressed onto the bonding position.

3. The bonding device according to claim 2, It is characterized in that The bonding head module comprises a bonding head (220), the bonding head (220) having a hollow cavity (221) penetrating two ends, the laser heating module and the base wafer stage module (210) respectively facing two ends of the hollow cavity (221); A light-transmitting press head (222) is fixedly provided at one end of the bonding press head (220) opposite to the base wafer stage module (210), and the light-transmitting press head (222) is used to pick up and press the chip (300).

4. The bonding device according to claim 3, It is characterized in that The laser heating module comprises a laser (230) and a first driving mechanism, wherein the first driving mechanism is connected to the laser (230) and is used to drive the laser (230) to move in a direction approaching or away from the bonding head (220).

5. The bonding device according to claim 3, It is characterized in that The bonding head module further comprises a second driving mechanism, which is connected to the bonding head (220) and is used to drive the bonding head (220) to move towards or away from the base wafer carrier module (210); and / or the bonding head module further comprises a third driving mechanism, which is connected to the bonding head (220) and is used to drive the bonding head (220) to rotate around a central axis.

6. The bonding device according to claim 1, It is characterized in that The bonding components (200) are in two groups and are respectively arranged on two opposite sides of the chip supply component (100); And / or, the base wafer stage module (210) comprises a heating plate, and the heating plate is used to heat the base wafer (400).

7. The bonding device according to any one of claims 1 to 6, It is characterized in that The chip supply component (100) comprises a wafer ring carrier module (110), a picking and flipping module (120) and a chip transfer module (130); the wafer ring carrier module (110) is used to carry a wafer ring with a chip (300) attached thereto and transfer the chip (300) to be bonded to a flipping and handing-over position; the picking and flipping module (120) is used to pick up the chip (300) at the flipping and handing-over position and flip the picked up chip (300) by 180°; and the chip transfer module (130) is used to transfer the flipped chip (300) to the bonding and handing-over position.

8. The bonding device according to claim 7, It is characterized in that The picking and flipping module (120) comprises a visual detection component (121), wherein the visual detection component (121) is used to obtain an image of a chip on the wafer ring carrier module (110), and the visual detection component (121) is communicatively connected with the wafer ring carrier module (110) to control the wafer ring carrier module (110) to transfer the chip (300) to be bonded to the flipping and handing over position.

9. The bonding device according to claim 7, It is characterized in that The pick-up flip module (120) further comprises a pick-up flip component (122) and a pin component (123), wherein the pick-up flip component (122) and the pin component (123) are respectively arranged on opposite sides of the wafer ring carrier module (110), wherein the pin component (123) is used to lift up the chip (300), and the pick-up flip component (122) is used to pick up the lifted chip (300) and flip the picked-up chip (300) by 180°.

10. The bonding device according to claim 7, It is characterized in that The chip transfer module (130) comprises a transfer head (131) and a fourth driving mechanism, wherein the transfer head (131) is used to pick up the chip (300) that has been flipped on the picking and flipping module (120), and the fourth driving mechanism is connected to the transfer head (131) and is used to drive the transfer head (131) to move along three mutually orthogonal axes; And / or, the wafer ring carrier module (110) comprises a carrier body and a fifth driving mechanism, the carrier body is used to carry the wafer ring with the chip (300) attached thereto, and the fifth driving mechanism is connected to the carrier body and is used to drive the carrier body to move in a direction parallel to the carrying surface.

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