Silicon wafer stepping carrying mechanism capable of effectively compressing height space

Abstract

The utility model discloses a silicon wafer stepping carrying mechanism capable of effectively compressing a height space. The silicon wafer stepping carrying mechanism comprises a first motor, a first supporting plate driven by the first motor to move horizontally, and at least one lifting module connected with the first supporting plate. The lifting and lifting module comprises a second supporting plate which is horizontally arranged in a sliding mode and fixedly connected with the first supporting plate, a second motor fixed to the second supporting plate, a rotating shaft which is driven by the second motor to rotate and is horizontally arranged, and a plurality of eccentric wheels which are fixedly arranged on the rotating shaft at intervals. The lifting supporting plate is arranged on the second supporting plate in an up-down sliding mode and driven by the eccentric wheel to move up and down; and the lifting grooves are formed in the lifting supporting plate in an arrayed mode. According to the utility model, the silicon wafers can be distributed and transferred one by one, the overall structural layout is compact, the space height is optimally compressed, the up-and-down movement distance during loading and unloading of the silicon wafers can be shortened, and the rhythm is improved.

Description

[Technical field]

[0001] The utility model belongs to the technical field of silicon wafer coating, and particularly relates to a silicon wafer stepping transport mechanism which can effectively compress the height space. [Background technology]

[0002] Before the cells enter the coating equipment, they need to be taken out of the basket one by one and placed in the hollow slots of the coating carrier for feeding; after the coating is completed, they need to be taken out of the coating carrier one by one and placed in the basket for collection. Before the cells are adsorbed and placed on the coating carrier, they are spread out one by one and placed on a support platform. At first, the silicon taken out of the basket is placed on the first support slot of the support platform. The stepping transport mechanism is needed to gradually transport the silicon wafers with equal steps to the last support slot. At the same time, the silicon wafers in all the support slots on the support platform are filled, and finally transported to the coating carrier by the adsorption transport mechanism.

[0003] However, the stepping transport mechanism in the prior art occupies a large space and has a high overall height, so that the adsorption transport mechanism needs to go through a long descent distance when placing the silicon wafer group on the coating carrier after adsorbing it from the supporting platform, which increases the time consumption of loading and transporting and is not conducive to improving the cycle time.

[0004] Therefore, it is necessary to provide a new silicon wafer stepping and transporting mechanism that effectively compresses the height space to solve the above technical problems. [Contents of the utility model]

[0005] The main purpose of the utility model is to provide a silicon wafer stepping transport mechanism which effectively compresses the height space, can realize the layout transfer of silicon wafers one by one, has a compact overall structure, and the spatial height is optimally compressed, which is beneficial to shortening the up and down movement distance of silicon wafers during loading and unloading and transporting, and improving the beat.

[0006] The utility model achieves the above-mentioned purpose through the following technical solutions: a silicon wafer stepping transport mechanism that effectively compresses the height space, which includes a first motor, a first support plate driven by the first motor to move horizontally, and at least one group of lifting and lifting modules connected to the first support plate; the lifting and lifting module includes a second support plate that is horizontally slidable and fixedly connected to the first support plate, a second motor fixed on the second support plate, a rotating shaft that is driven by the second motor to rotate and is horizontally arranged, a plurality of eccentric wheels fixedly arranged on the rotating shaft at intervals, a lifting support plate that is arranged on the second support plate to slide up and down and is driven by the eccentric wheels to move up and down, and a plurality of lifting slots arranged in an array on the lifting support plate.

[0007] Furthermore, the lifting support plate is provided with a support protrusion and a plurality of end limit blocks for limiting the positions of the two short sides of the silicon wafer.

[0008] Furthermore, the plurality of support protrusions and the plurality of end limit blocks together form a lifting groove; and the lifting support plate is provided with a plurality of the lifting grooves.

[0009] Furthermore, a sliding block is provided on the lower surface of the lifting support plate and is coaxially rotatably arranged with the eccentric wheel, and the outer periphery of the eccentric wheel is rotatably arranged in the installation groove of the sliding block through a bearing.

[0010] Furthermore, the installation slot has a sliding space for the eccentric wheel to slide horizontally relative to the slider.

[0011] Furthermore, a plurality of guide rods are arranged on the lower surface of the lifting support plate, and a guide sleeve cooperating with the guide rods is arranged on the second support plate.

[0012] Furthermore, a pair of support seats are provided on the second support plate at positions corresponding to the eccentric wheel, the rotating shaft is rotatably provided on the support seats via bearings, and axial limit rings are provided on the rotating shaft at two opposite axial ends of the eccentric wheel.

[0013] Compared with the prior art, the utility model has the beneficial effect of a silicon wafer stepping transport mechanism that effectively compresses the height space. The lifting drive motor in the lifting and supporting module is arranged in a lying form, and a rotating shaft is arranged in combination, and multiple sets of eccentric wheel structures are arranged on the rotating shaft. The eccentric wheel is used to drive the lifting support plate to perform lifting movement, which greatly compresses the overall height of the stepping transport mechanism, shortens the lifting stroke of the silicon wafer loading and adsorption transport mechanism, and is conducive to improving the loading and transport rhythm.

Brief Description of the Drawings

[0014] Figure 1 It is a three-dimensional structural schematic diagram of an embodiment of the utility model;

[0015] Figure 2 It is a partial main structural schematic diagram of an embodiment of the utility model;

[0016] Figure 3 It is a partial structural schematic diagram of the lifting and lifting module in the embodiment of the utility model;

[0017] Figure 4 This is a schematic diagram of a partial explosion structure of a lifting and lifting module in an embodiment of the utility model;

[0018] The numbers in the figure represent:

[0019] 100-Silicon wafer stepping and transporting mechanism that effectively compresses the height space;

[0020] 200-silicon wafer;

[0021] 1- first motor;

[0022] 2- first support plate;

[0023] 3-lifting and supporting module, 31-second supporting plate, 32-second motor, 33-lifting and supporting plate, 331-supporting protrusion, 332-end limiting block, 34-lifting groove, 35-rotating shaft, 36-eccentric wheel, 37-slider, 371-installing notch, 372-sliding space, 38-guide rod, 39-guide sleeve, 310-support seat, 311-axial limiting ring. [Specific implementation method]

[0024] Embodiment 1:

[0025] Please refer to Figure 1-Figure 4 The present embodiment is a silicon wafer stepping and transporting mechanism 100 that effectively compresses the height space, which includes a first motor 1, a first support plate 2 driven by the first motor 1 to move horizontally, and at least one set of lifting and lifting modules 3 connected to the first support plate 2. In the present embodiment, two sets of lifting and lifting modules 3 are provided, corresponding to two rows of silicon wafer support platforms respectively, and the stepping and transporting and transferring of silicon wafers can be realized by cooperating with the silicon wafer support platforms.

[0026] The lifting and supporting module 3 includes a second support plate 31 which is horizontally slidably arranged and fixedly connected to the first support plate 2, a second motor 32 fixed on the second support plate 31, a lifting support plate 33 which is driven by the second motor 32 to move up and down, and a plurality of supporting slots 34 arranged on the lifting support plate 33.

[0027] The lifting support plate 33 is provided with a supporting protrusion 331 and a plurality of end limit blocks 332 for limiting the positions of the two short sides of the silicon wafer. In this embodiment, the six supporting protrusions 331 form six supporting points to support the bottom of the silicon wafer, the four end limit blocks 3321 form two sides to limit the positions of the two short sides of the silicon wafer respectively, and the six supporting protrusions 331 and the four end limit blocks 3321 together form a lifting groove 34. The lifting support plate 33 is provided with a plurality of lifting grooves 34, which correspond to the positions of the supporting grooves on the silicon wafer support platform.

[0028] In order to reduce the overall height of the silicon wafer stepping transport mechanism 100 that effectively compresses the height space, thereby reducing the up and down movement path of the silicon wafer loading and transporting mechanism when transporting silicon wafers, and then improving the working rhythm, this embodiment optimizes the driving mode of the second motor 32 driving the lifting and lowering support plate 33 to move up and down. Specifically, a horizontally extending rotating shaft 35 is fixedly provided at the rotating end of the second motor 32, and a plurality of eccentric wheels 36 are fixedly provided on the rotating shaft 35. A sliding block 37 that is coaxially arranged with the eccentric wheel 36 and is rotatably arranged on the lower surface of the lifting and lowering support plate 33 is provided. The outer periphery of the eccentric wheel 36 is rotatably arranged in the mounting notch 371 of the sliding block 37 through a bearing, and the mounting notch 371 has a sliding space 372 for the eccentric wheel 36 to slide horizontally relative to the sliding block 37.

[0029] The second motor 32 drives the rotating shaft 35 to rotate around the horizontal axis, thereby driving the eccentric wheel 36 to rotate. Since the axis of the eccentric wheel 36 is not colinear with the axis of the rotating shaft 35, the eccentric wheel 36 will have a height change relative to the rotating shaft 35, thereby driving the lifting support plate 33 to move up and down. The height difference between the lifting support plate 33 and the second support plate 31 is small, and only the eccentric wheel 36 needs to rotate; the second motor 32 can be set to lie down, which greatly shortens the overall height of the stepping transport mechanism compared to the vertical setting of the motor to drive the lifting.

[0030] In order to ensure the stability of the up and down movement of the lifting support plate 33 , a plurality of guide rods 38 are provided on the lower surface of the lifting support plate 33 , and a guide sleeve 39 matched with the guide rods 38 is provided on the second support plate 31 .

[0031] As the overall length of the lifting support plate 33 is relatively long, in order to ensure the synchronization and stability of the lifting, a pair of support seats 310 are provided on the second support plate 31 at the position corresponding to the eccentric wheel 36. The rotating shaft 35 is rotatably set on the support seat 310 through a bearing. An axial limit ring 311 is provided on the rotating shaft 35 at two opposite axial ends of the eccentric wheel 36 to ensure that the axial position of the eccentric wheel 26 on the rotating shaft 35 is accurate and stable, thereby ensuring the effective and reliable cooperation between the eccentric wheel 36 and the slider 37.

[0032] For ordinary technicians in this field, several modifications and improvements can be made without departing from the creative concept of the utility model, which all fall within the protection scope of the utility model.

Claims

1. A silicon wafer stepping and transporting mechanism that effectively compresses height space, characterized in that: It includes a first motor, a first support plate driven by the first motor to move horizontally, and at least one set of lifting and supporting modules connected to the first support plate; The lifting and supporting module includes a second support plate which is horizontally slidable and fixedly connected to the first support plate, a second motor fixed on the second support plate, a horizontally arranged rotating shaft which is driven by the second motor to rotate, a plurality of eccentric wheels which are fixedly arranged on the rotating shaft at intervals, a lifting support plate which is vertically slidable on the second support plate and driven by the eccentric wheels to move up and down, and a plurality of supporting slots arranged in an array on the lifting support plate.

2. The silicon wafer stepping and transporting mechanism with effective height compression as claimed in claim 1, characterized in that: The lifting support plate is provided with a support protrusion and a plurality of end limit blocks for limiting the positions of the two short sides of the silicon wafer.

3. The silicon wafer stepping and transporting mechanism with effective height compression as claimed in claim 2, characterized in that: The plurality of support protrusions and the plurality of end limit blocks together form a lifting slot; and the lifting support plate is provided with a plurality of the lifting slots.

4. The silicon wafer stepping and transporting mechanism with effective height compression as claimed in claim 1, characterized in that: A sliding block is disposed on the lower surface of the lifting support plate and is coaxially rotatably disposed with the eccentric wheel. The outer periphery of the eccentric wheel is rotatably disposed in the mounting notch of the sliding block via a bearing.

5. The silicon wafer stepping and transporting mechanism with effectively compressed height space as claimed in claim 4, characterized in that: The installation slot has a sliding space for the eccentric wheel to slide horizontally relative to the sliding block.

6. The silicon wafer stepping and transporting mechanism with effectively compressed height space as claimed in claim 1, characterized in that: A plurality of guide rods are arranged on the lower surface of the lifting support plate, and a guide sleeve cooperating with the guide rods is arranged on the second support plate.

7. The silicon wafer stepping and transporting mechanism with effective height compression as claimed in claim 1, characterized in that: A pair of support seats are arranged on the second support plate at positions corresponding to the eccentric wheel. The rotating shaft is rotatably arranged on the support seats via bearings. Axial limit rings are arranged on the rotating shaft at two opposite shaft ends of the eccentric wheel.

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