Semiconductor material loading port

Abstract

The utility model discloses a semiconductor material loading port, and belongs to the field of semiconductor equipment. According to the design, the processing part is arranged on the side, facing the material box body, of the lifting door plate, and when the loading box transversely moves to be close to the processing part until the processing part abuts against the loading box, a sealed cavity is formed between the sealing cover and the lifting door plate; air in a closed space between the lifting door plate and the sealing cover can be emptied through the vacuum processing part. According to the invention, a closed space is formed between the loading box and the loading port when the butt joint part of the loading box and the machine moves close to each other; the vacuum extraction module can quickly exhaust gas in the closed space to form a vacuum clean environment, so that clean air in the machine table is mixed with clean air in the FOUP box after the lifting door plate is opened in the closed space, external unclean air is prevented from inrush, and it is ensured that wafers loaded in the FOUP box are not polluted when transferred.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, and more specifically to a semiconductor material loading port. Background Art

[0002] In the manufacturing process of large-size semiconductor wafers, in order to ensure that the wafers are not contaminated by the external environment during transportation, the wafers to be transported are often placed in a box for sealed transportation to separate the wafers from the external air and prevent the wafers from being contaminated. This box for carrying wafers is called a front-opening unified pod (FOUP). Figure 2 as shown).

[0003] The machine equipment is generally equipped with a loading port to work with the FOUP and other process machine equipment. The loading port serves to connect with the handling equipment to receive and distribute the FOUP box, as well as to open or close the FOUP door so that the process machine can smoothly and safely import the wafers in the FOUP into the interior or export the wafers in the process machine to the FOUP. In order to ensure a clean environment inside the FOUP, nitrogen will be filled inside the FOUP for protection. Therefore, once the door of the FOUP is opened by the loading port, the external atmosphere may rush into the box and contaminate the wafers inside, thereby reducing the manufacturing yield.

[0004] More specifically, when the loading port needs to open the door of the FOUP, how to prevent external air from entering the FOUP box after the door is opened during the opening process has become a requirement for improving the cleanliness of the FOUP box cavity. The commonly used means are: setting a blowing structure at the loading port, when the FOUP door is opened, blowing clean air into the box body, so that the atmospheric pressure in the FOUP is higher than the ambient pressure, and the external air cannot flow into the FOUP cavity to ensure the cleanliness of the wafers in the FOUP, but this method requires continuous long-term blowing of clean air at the loading port. Summary of the invention

[0005] In view of the problems existing in the prior art, the purpose of the utility model is to provide a semiconductor material loading port, which can safely and stably open the FOUP door panel to avoid the problem of external air suddenly rushing into the FOUP box and contaminating the internal wafers.

[0006] In order to solve the above problems, the utility model adopts the following technical solution: a semiconductor material loading port, comprising:

[0007] The loading box comprises a material box body with an opening on one side and a hollow structure inside, and a sealing cover for sealing the opening of the material box body;

[0008] The bearing part includes at least one bearing platform for placing the magazine body on the loading port, and a positioning plate for docking with the magazine body is slidably mounted on the upper end of the bearing platform;

[0009] The loading part includes a lifting door plate and a door plate driving part connected to the lifting door plate to drive the lifting door plate to lift and move laterally, the lifting door plate is arranged toward the opening side of the material box body to isolate the inside of the loading port from the external environment, the door plate driving part drives the lifting door to move laterally in the lateral movement direction so that the material box body approaches or moves away from the lifting door plate, and drives the lifting in the longitudinal movement direction so that the closing door plate drives the sealing cover to lift and lower, thereby realizing the sealing and opening and closing of the material box body;

[0010] A door lifter, arranged on a side of the lifting door plate facing the loading box, and cooperating with the sealing cover to engage or disengage the material box body;

[0011] A processing part is arranged on a side of the lifting door plate facing the material box body, and when the loading box moves laterally close to the processing part until it abuts against the processing part, a closed cavity is formed between the sealing cover and the lifting door plate;

[0012] The processing part includes a sealing rubber ring and a vacuum processing part installed inside the sealing rubber ring, and a negative pressure control end for controlling the start and stop of the vacuum processing part. When the loading box triggers the negative pressure control end, the vacuum processing part can exhaust the air in the closed space between the lifting door plate and the sealing cover;

[0013] A main controller is electrically connected to the electrical components of the device body and can control the start and stop of the electrical components of the device body.

[0014] Furthermore, the processing unit also includes an air pressure detection device installed on the inner side of the sealing rubber ring, and the air pressure detection device is an air pressure sensor for detecting the pressure of the enclosed space.

[0015] Furthermore, the negative pressure control end includes a pressure sensor installed on the outside of the sealing rubber ring. When the loading box moves laterally until it abuts against the outside of the sealing rubber ring and makes interference contact, the loading box can trigger the pressure sensor. The pressure sensor can transmit the pressure signal to the main controller to control the start and stop of the vacuum processing part.

[0016] Furthermore, the vacuum processing part includes an air pump, an air duct and an air extraction valve head. The air pump is arranged in the inner cavity of the machine body. At least one air extraction valve head is installed between the sealing strip and the lifting door panel, and the two are connected through the air duct.

[0017] Furthermore, a plurality of the air extraction valve heads are provided, and the plurality of air extraction valve heads are arranged facing each other and evenly.

[0018] Furthermore, the air extraction valve head is a one-way air valve.

[0019] Furthermore, the door panel driving unit includes a longitudinal driving unit for driving the lifting door to move longitudinally and a second transverse driving unit for driving the lifting door panel to move transversely.

[0020] Furthermore, a first transverse driving part is installed in the inner cavity of the support platform, and a movable end of the first transverse driving part is connected to the positioning plate 22. The first transverse driving part can drive the positioning plate to approach or move away from the sealing door plate.

[0021] Furthermore, an air charging connector for injecting protective gas into the material box body is installed on the sealing door plate, and the air charging connector and the sealing plate are matched to inject protective gas into the material box body to protect the wafers in the material box body.

[0022] Compared with the prior art, the advantages of the present invention are:

[0023] The utility model provides a semiconductor material loading port, in which an exhaust module is arranged at the joint between the loading box and the loading port. When the joint between the loading box and the machine moves closer, a closed space is formed between the loading box and the loading port. The vacuum extraction module arranged on the loading port side of the utility model can quickly exhaust the gas in the closed space to form a vacuum clean environment. Since the lifting door plate is a barrier separating the inside and outside of the machine, the air inside the machine and the air inside the FOUP box are both clean environments. Therefore, after the lifting door plate is opened in the closed space, the clean air inside the machine is mixed with the clean air in the FOUP box to avoid the influx of external unclean air, thereby ensuring that the wafers loaded in the FOUP box will not be contaminated when being transferred. Moreover, the vacuum extraction module can stop working after extracting the air in the closed space to reach a negative pressure condition to avoid long-term operation, thereby achieving the goal of reducing production costs and increasing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the application scenario structure of the utility model;

[0025] Figure 2 It is a schematic diagram of the structure of the utility model;

[0026] Figure 3 This is a schematic diagram of the loading box structure of the utility model;

[0027] Figure 4 for Figure 3 A schematic diagram of the partially enlarged structure at center A;

[0028] Figure 5 for Figure 2 A schematic diagram of a top view structure;

[0029] Figure 6 It is a schematic diagram of the structure of the utility model;

[0030] Figure 7 for Figure 2 A schematic diagram of a side view structure of the invention;

[0031] Figure 8 for Figure 2 A schematic diagram of a partial structure of FIG.

[0032] Fig. 9 for Figure 2 A schematic diagram of a cross-sectional structure of a structure;

[0033] Fig.10 for Fig. 9 A schematic diagram of the partially enlarged structure at B;

[0034] Fig.11 This is a schematic diagram of the structure of the first lateral driving part of the utility model;

[0035] Fig.12 This is a schematic diagram of the structure of the lifting door panel of the utility model;

[0036] Fig.13 for Fig.12 Schematic diagram of the front view structure.

[0037] Description of the numbers in the figure:

[0038] 1. Loading box; 11. Sealing cover; 12. Material box body; 13. Stop edge; 14. Keyhole groove; 15. Sealing groove; 16. Material box cavity; 2. Carrying part; 21. Carrying platform; 22. Positioning plate; 23. First transverse driving part; 3. Loading part; 31. Lifting door panel; 32. Door panel driving part; 33. Second transverse driving part; 34. Longitudinal driving part; 4. Door opener; 41. Door opening joint; 5. Inflation joint; 6. Processing part; 61. Sealing rubber ring; 62. Pressure sensor; 63. Air pressure sensor; 64. Vacuum processing part; 65. Air extraction valve head; 66. Air pipe; 67. Air pump; 7. Main controller. Implementation

[0039] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model; it is obvious that the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the utility model without making creative work are within the scope of protection of the utility model.

[0040] Please refer to Figure 1 As shown: When processing semiconductor wafers, at least one loading port is usually set in front of the machine equipment as the first bridge connecting the machine equipment and the wafer. Since the wafers are placed in a specific transport carrier, such as a FOUP box, during transportation, and the interior of the loading box 1 as a carrier is a clean environment to prevent the wafers from being contaminated, when the loading port loads the wafers in the loading box 1, the door panel of the loading box 1 needs to be opened to take out the wafers inside. Therefore, during this process, the wafers in the loading box 1 will be contaminated by the influx of air from the outside of the machine. The commonly used method is to set a blowing structure at the loading port. When the door panel of the loading box 1 is opened, clean air is continuously blown into the loading box 1, so that the atmospheric pressure inside the loading box 1 is higher than the atmospheric pressure of the surrounding environment, and external air is prevented from influx into the inner cavity of the loading box 1.

[0041] Please refer to Figure 3 The content shows: In the design of the utility model: the loading box 1 includes a material box body 12 with an opening on one side and a hollow structure inside, and a sealing cover 11 for sealing the opening of the material box body 12; the loading box 1, which is used to protect wafers during transportation, is a standard carrier under the SEMI standard, and its size and structure have been standardized. It is worth mentioning that the opening of the material box body 12 is provided with a stop edge 13 extending outward, and a lock hole groove 14 and a sealing groove 15 for fixing the sealing cover 11. When the sealing cover 11 is embedded in the sealing groove 15, there will be a mechanism that cooperates with the sealing cover 11 to lock the sealing cover 11 to prevent the sealing cover 11 from falling off from the loading body during the cloud locking process. Among them, the opening of the body after sealing is flush with the low stop edge, or slightly lower than the stop edge 13.

[0042] Please refer to Figure 2 Contents shown and Figure 5 As shown: the carrying part 2 includes at least one carrying platform 21 for placing the magazine body 12 on the loading port, and a positioning plate 22 for docking with the magazine body 12 is slidably mounted on the upper end of the carrying platform 21;

[0043] The loading part 3 includes a lifting door plate 31 and a door plate driving part 32 connected to the lifting door plate 31 to drive the lifting door plate 31 to lift and move horizontally. The lifting door plate 31 is arranged toward the opening side of the material box body 12 to isolate the inside of the loading port from the external environment. The door plate driving part 32 drives the lifting door to move horizontally in the horizontal movement direction so that the material box body 12 approaches or moves away from the lifting door plate 31, and drives the lifting in the longitudinal movement direction so that the closing door plate drives the sealing cover 11 to lift and lower, thereby realizing the sealing and opening and closing of the material box body 12.

[0044] The door lifter 4 is disposed on the side of the lifting door plate 31 facing the loading box 1, and cooperates with the sealing cover 11 to engage or disengage the material box body 12;

[0045] The processing part 6 is arranged on the side of the lifting door plate 31 facing the material box body 12. When the loading box 1 moves laterally close to the processing part 6 until it abuts against the processing part 6, a closed cavity is formed between the sealing cover 11 and the lifting door plate 31.

[0046] The processing part 6 includes a sealing rubber ring 61, a vacuum processing part 64 installed inside the sealing rubber ring 61, and a negative pressure control end for controlling the start and stop of the vacuum processing part 64. When the loading box 1 triggers the negative pressure control end, the vacuum processing part 64 can exhaust the air in the closed space between the lifting door plate 31 and the sealing cover 11.

[0047] The main controller 7 is electrically connected to the electrical components of the device body and can control the start and stop of the electrical components of the device body.

[0048] For details, please refer to Figure 6 and Figure 7As shown in the content: when it is necessary to place the loading box 1 on the loading port, since the opening of the loading box 1 has a retaining edge 13 extending outward, when the loading box 1 is placed on the carrier 21 on the loading port, it will be positioned and fixed with the positioning plate 22 on the carrier 21; when the positioning plate 22 drives the loading box 1 close to the loading part 3, the opening surface of the loading box 1 will abut against the processing part 6, and the opening of the sealing rubber ring 61 is larger than the sealing cover 11 and smaller than the retaining edge 13, so the retaining edge 13 can be tightly fitted with the sealing rubber ring 61 of the processing part 6, while the inner sealing cover 11 can be exposed without affecting the opening; when it is necessary to open the sealing cover 11 to take out the wafer in the material box cavity 16, the retaining edge 13 contacts the sealing rubber ring 61 and triggers the negative pressure control end set on the sealing rubber ring 61 to evacuate the enclosed space, so that the lifting door plate 31 A vacuum environment is formed between the sealing cover 11, and the door opener 4 cooperates with the sealing cover 11 to unlock it. When the sealing cover 11 is removed from the material box body 12 and fixed on the lifting door plate 31, the door plate drive unit 32 first moves horizontally. In this state, the inner cavity of the equipment machine, the enclosed space and the material box cavity 16 are connected, and the vacuum environment in the enclosed space is destroyed. However, since the inner cavity of the machine and the inner cavity of the material box are both clean environments, no outside air will flow into the material box cavity 16 to contaminate the wafer during this process; then, the door plate drive unit 32 moves longitudinally again to fully open the loading port opening, so that the robot inside the equipment can smoothly take out the wafer from the material box body 12; when the door plate drive unit 32 moves horizontally, the vacuum processing unit 64 stops working to avoid the vacuum processing unit 64 from running for a long time.

[0049] Through the loading port of this design, when the loading box 1 is docked with the equipment, the wafers in the material box body 12 are completely out of contact with the external environment during the process of opening the door to take out the wafers, thereby ensuring the cleanliness and integrity of the wafers during the transmission process.

[0050] Please refer to Fig. 9 As shown in the content: Preferably, the processing unit 6 also includes an air pressure detection device installed on the inner side of the sealing rubber ring 61, and the air pressure detection device is an air pressure sensor 63 for detecting the pressure of the enclosed space.

[0051] Preferably, the negative pressure control end includes a pressure sensor 62 installed on the outside of the sealing rubber ring 61. When the loading box 1 moves laterally until it abuts against the outside of the sealing rubber ring 61 and makes interference contact, the loading box 1 can trigger the pressure sensor 62. The pressure sensor 62 can transmit the pressure signal to the main controller 7 to control the start and stop of the vacuum processing part 64.

[0052] Specifically, in order to prevent the vacuum processing unit 64 from being able to start and stop work in time and avoid long-term operation, a pressure sensor 62 is provided at the matching position of the sealing rubber ring 61 and the retaining edge 13 to detect the contact state between the two. When the retaining edge 13 on the loading box 1 contacts and interferes with the sealing rubber ring 61, the pressure sensor 62 will be triggered to generate an electrical signal, and this signal will be transmitted to the main controller 7 to control the operation of the vacuum processing unit 64 to extract and discharge the air in its enclosed space; at this time, the air pressure sensor 63 can detect the air pressure change in the enclosed space until the lifting door panel 31 drives the sealing cover 11 to move horizontally, connecting the inside of the machine with the material box cavity 16. At this time, the value of the pressure sensor 62 will suddenly change, and the sudden change signal will be sent to the main controller 7 to identify the open state of the door panel and control the vacuum processing unit 64 to stop extracting the air in the enclosed space, thereby avoiding the vacuum processing unit 64 from running for a long time.

[0053] Please refer to Fig. 9 and Fig.10 The content shows: Preferably, the vacuum processing part 64 includes an air pump 67, an air duct 66 and an exhaust valve head 65, the air pump 67 is arranged in the inner cavity of the machine body, at least one exhaust valve head 65 is installed between the sealing strip and the lifting door panel 31, and the two are connected through the air duct 66.

[0054] Preferably, a plurality of the air extraction valve heads 65 are provided, and the plurality of air extraction valve heads 65 are arranged facing each other and evenly.

[0055] Preferably, the air extraction valve head 65 is a one-way air valve.

[0056] Specifically, multiple one-way exhaust valve heads 65 are arranged on the inner side, and are connected to the air pump 67 through the air duct 66, so that one air pump 67 can drive multiple one-way air valves to operate at the same time, and can quickly discharge the air in the enclosed space to form a negative pressure environment, which can greatly reduce the waiting time before opening the sealing cover 11, increase the introduction efficiency of the loading port, avoid the long-term waiting time of the machine for processing wafers, and increase the utilization rate of the whole machine.

[0057] Please refer to Figure 8 Content shown: Preferably, the door panel driving unit 32 includes a longitudinal driving unit 34 for driving the lifting door to move longitudinally and a second transverse driving unit 33 for driving the lifting door panel 31 to move transversely.

[0058] Preferably, a first transverse driving part 23 is installed in the inner cavity of the supporting platform 21, and a movable end of the first transverse driving part 23 is connected to the positioning plate 22, and the first transverse driving part 23 can drive the positioning plate 22 to approach or move away from the sealing door plate.

[0059] Specifically, the specific actions for loading the loading box 1 are as follows: first, the loading box 1 is placed on the positioning plate 22 on the carrying platform 21, and the bottom of the positioning plate 22 is Fig.11 The first lateral driving unit 23 drives the loading box 1 to approach the loading port until it is in interference contact with the sealing rubber ring 61; after the vacuum processing unit 64 exhausts the air in the enclosed space, please refer to Fig.12 As shown in the content, the second transverse drive unit 33 drives the lifting door plate 31 to approach the sealing cover 11 until the door opening joint 41 on the lifting door plate 31 cooperates with the sealing cover 11 and completes the unlocking action of the sealing cover 11; then, the second transverse drive unit drives the sealing cover 11 plate and the lifting door plate 31 to move away from the material box door body until the equipment platform for processing the wafer is connected to the material box cavity 16; finally, the longitudinal drive unit 34 drives the second transverse drive unit 33, the lifting door plate 31 and the sealing cover 11 to move downward together, and fully opens the opening of the loading port, so that the equipment for processing the wafer can directly take out the wafer from the material box body 12.

[0060] Please refer to Fig.12 and Fig.13 The content shows: Preferably, an inflation connector 5 for injecting protective gas into the material box body 12 is installed on the sealing door plate, and the inflation connector 5 and the sealing plate are matched to inject protective gas into the material box body 12 to protect the wafers in the material box body 12.

[0061] Specifically, since the loading port is responsible for loading and unloading wafers, a clean environment needs to be maintained inside the material box cavity 16 during the unloading process. Protective gas is introduced into the material box cavity 16 through the inflation connector 5 designed on the lifting door panel 31 to protect the wafers inside and avoid contamination.

[0062] When using the loading port designed by the utility model: first, the loading box 1 needs to be placed on the positioning plate 22; then, the first transverse driving part 23 will drive the loading box 1 on the positioning plate 22 to move toward the lifting door plate 31 until the retaining edge 13 on the material box body 12 is in interference contact with the sealing rubber ring 61, and a closed environment is formed between the lifting door plate 31 and the sealing cover 11 to prevent the entry of external air; at the same time, when the retaining edge 13 is in interference contact with the sealing rubber ring 61, the pressure sensor 62 preset in the sealing rubber ring 61 will be triggered and an electrical signal will be generated and transmitted to the main controller 7, and the main controller 7 will start the air pump 67 to exhaust the air in the closed space through the exhaust valve head 65 to maintain the cleanliness of the sealed space; Next, the second transverse driving part 33 drives the lifting door plate 31 to approach the sealing cover 11 until the door opening joint 41 cooperates with the locking mechanism on the sealing cover 11 to complete the unlocking action; thereafter, the second transverse driving part 33 drives the lifting door plate 31 and the sealing cover 11 to move to the side away from the material box body 12 until the equipment port is connected with the material box body 12. At this time, the preset air pressure sensor 63 can accurately detect the sudden change of air pressure in the enclosed space, and generate an electrical signal to the main controller 7 to control the air pump 67 to stop working; then the longitudinal lifting part drives the second transverse moving part, the lifting door plate 31 and the sealing cover 11 to move downward together, and fully opens the docking port, so that the equipment can take out the wafer from the material box body 12 for processing.

[0063] The above is only a preferred specific implementation of the utility model; however, the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and improved ideas of the utility model within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model.

Claims

1. A semiconductor material loading port, characterized in that ,include: The loading box comprises a material box body with an opening on one side and a hollow structure inside, and a sealing cover for sealing the opening of the material box body; The bearing part includes at least one bearing platform for placing the magazine body on the loading port, and a positioning plate for docking with the magazine body is slidably mounted on the upper end of the bearing platform; The loading part includes a lifting door plate and a door plate driving part connected to the lifting door plate to drive the lifting door plate to lift and move laterally, the lifting door plate is arranged toward the opening side of the material box body to isolate the inside of the loading port from the external environment, the door plate driving part drives the lifting door plate to move laterally in the lateral movement direction so that the material box body approaches or moves away from the lifting door plate, and drives the lifting in the longitudinal movement direction so that the lifting door plate drives the sealing cover to lift and lower, thereby realizing the sealing and opening and closing of the material box body; A door lifter, arranged on a side of the lifting door plate facing the loading box, and cooperating with the sealing cover to engage or disengage the material box body; A processing part is arranged on a side of the lifting door plate facing the material box body, and when the loading box moves laterally close to the processing part until it abuts against the processing part, a closed cavity is formed between the sealing cover and the lifting door plate; The processing part includes a sealing rubber ring and a vacuum processing part installed inside the sealing rubber ring, and a negative pressure control end for controlling the start and stop of the vacuum processing part. When the loading box triggers the negative pressure control end, the vacuum processing part can exhaust the air in the closed space between the lifting door plate and the sealing cover; A main controller is electrically connected to the electrical components of the device body and can control the start and stop of the electrical components of the device body.

2. A semiconductor material loading port according to claim 1, characterized in that: The processing unit further comprises an air pressure detection device installed inside the sealing rubber ring, and the air pressure detection device is an air pressure sensor for detecting the pressure of the enclosed space.

3. A semiconductor material loading port according to claim 1, characterized in that: The negative pressure control end includes a pressure sensor installed on the outside of the sealing rubber ring. When the loading box moves laterally until it abuts against the outside of the sealing rubber ring and makes interference contact, the loading box can trigger the pressure sensor. The pressure sensor can transmit the pressure signal to the main controller to control the start and stop of the vacuum processing part.

4. A semiconductor material loading port according to claim 1, characterized in that: The vacuum processing part includes an air pump, an air duct and an air extraction valve head. The air pump is arranged in the inner cavity of the machine body. At least one air extraction valve head is installed between the sealing strip and the lifting door panel, and the two are connected through the air duct.

5. A semiconductor material loading port according to claim 4, characterized in that: A plurality of the air extraction valve heads are provided, and the plurality of air extraction valve heads are arranged facing each other and evenly.

6. A semiconductor material loading port according to claim 4, characterized in that: The air extraction valve head is a one-way air valve.

7. A semiconductor material loading port according to claim 1, characterized in that: The door panel driving unit includes a longitudinal driving unit for driving the lifting door to move longitudinally and a second transverse driving unit for driving the lifting door panel to move transversely.

8. A semiconductor material loading port according to claim 1, characterized in that: A first transverse driving part is installed in the inner cavity of the supporting platform, and a movable end of the first transverse driving part is connected to the positioning plate 22. The first transverse driving part can drive the positioning plate to approach or move away from the sealing door plate.

9. A semiconductor material loading port according to claim 1, characterized in that: The sealing door plate is provided with an air charging connector for injecting protective gas into the material box body. The air charging connector and the sealing plate are matched to inject protective gas into the material box body to protect the wafers in the material box body.

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