Clamping tool for semiconductor device production

By designing a clamping tool containing motor drive, using screw rods and sliders to drive the connecting ring and connecting rod, and setting the clamping stroke in the prior art, the silicon crystal rod clamp in the prior art is solved The problem of poor holding effect achieves stable clamping and protection of wafers.

CN222168375UActive Publication Date: 2024-12-13深圳市联润丰电子科技有限公司
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Patent Information

Application Number
CN202420791646.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-17
Publication Date
2024-12-13
Estimated Expiration
2034-04-17

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    Figure CN222168375U_ABST
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Abstract

The utility model discloses a clamping tool for semiconductor device production, and relates to the technical field of semiconductor device production. A controller is arranged at the lower end of the front face of the base. A motor is arranged in the center of the bottom of the base. A lead screw is arranged on an output shaft of the motor. A sliding block is arranged on the lead screw. A connecting ring is arranged at the lower end of the sliding block. A fixed shaft is arranged at the outer end of the fixed frame, a movable shaft is arranged at the outer end of the movable beam, transmission frames are arranged on the two sides of the fixed shaft and the two sides of the movable shaft, and clamps are arranged at the upper ends of the transmission frames. And the upper limit and the lower limit of the clamping stroke can be set according to the diameter of the wafer, so that the wafer is prevented from being damaged by too large clamping force, and the practicability of the wafer clamping device is improved.
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Description

Technical Field

[0001] The present application relates to the field of semiconductor devices, and in particular to a clamping tool for producing semiconductor devices. Background Art

[0002] Semiconductor devices are electronic devices with conductivity between good conductors and insulators. They use the special electrical properties of semiconductor materials to complete specific functions. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The semiconductor materials of semiconductor devices are silicon, germanium or gallium arsenide, which can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment. In order to distinguish them from integrated circuits, they are sometimes called discrete devices. The basic structure of most two-terminal devices (i.e. crystal diodes) is a PN junction. Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. Domestic wafer production lines are mainly 8 inches and 12 inches.

[0003] In the prior art, due to the large mass and volume of silicon crystal rods and their cylindrical shape, the clamping effect of the silicon crystal rods commonly used in the current clamping tooling is poor. Utility Model Content

[0004] The purpose of the present application is to solve the problem that the currently commonly used clamping tooling has a poor clamping effect on silicon crystal rods in the above background. The present application provides a clamping tooling for semiconductor device production.

[0005] In order to achieve the above-mentioned purpose, the present application specifically adopts the following technical solutions: A clamping tool for semiconductor device production, comprising a base, characterized in that a support column is arranged at the lower end of the base, a controller is arranged at the lower end of the front of the base, a start button and a close button are arranged on the left and right sides of the front of the controller respectively, and a motor is arranged at the center of the bottom of the base;

[0006] A screw rod is provided on the motor output shaft, a slider is provided on the screw rod, a connecting ring is provided at the lower end of the slider, a connecting rod is provided on the connecting ring, a movable beam is provided at the upper end of the connecting rod, a fixed frame is provided at the upper end of the screw rod, a fixed shaft is provided at the outer end of the fixed frame, a movable shaft is provided at the outer end of the movable beam, transmission frames are provided on both sides of the fixed shaft and the movable shaft, a clamp is provided at the upper end of the transmission frame, the start button, the close button and the motor are electrically connected to an external power supply and the controller, and are controlled by the controller.

[0007] Furthermore, a lower limit block is provided at the lower end of the screw rod, the lower limit block is provided on the base, and the lower limit block is connected to the screw rod bearing.

[0008] Furthermore, an upper limit block is arranged at the upper end of the screw rod, the upper limit block is arranged at the lower end of the fixing frame, and the upper limit block is connected to the screw rod bearing.

[0009] Furthermore, a positioning angle is provided at the upper end of the fixing frame, and the connecting rod is connected to the positioning angle and the movable beam by bolts.

[0010] Furthermore, the upper and lower ends of the transmission frame are respectively connected to the fixed shaft and the movable shaft.

[0011] The beneficial effects of the present application are as follows: First, since the utility model is provided with a screw rod, a slider, a connecting ring, a connecting rod, a movable beam, a fixed frame, a movable shaft and a fixed shaft, the utility model can clamp the wafer through a motor-controlled fixture, which is convenient for subsequent polishing or cutting of the wafer; secondly, since the utility model is provided with a lower limit block and an upper limit block, the utility model can set the upper and lower limits of the clamping stroke according to the wafer diameter, avoiding damage to the wafer due to excessive clamping force, thereby improving the practicality of the utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is the overall first-view structural diagram of this application;

[0013] Figure 2 This is the overall second-view structural diagram of this application;

[0014] Figure 3 This is the overall third-view structural diagram of this application;

[0015] Figure 4 This application is attached Figure 2 Partial view at point A in the middle;

[0016] Figure 5 This application is attached Figure 2 Partial view at point B in the middle;

[0017] Figure 6 This application is attached Figure 3 Partial view at center C;

[0018] Attached figures: 1. base; 11. support column; 12. lower limit block; 2. controller; 21. start button; 22. close button; 3. motor; 31. screw rod; 32. slider; 33. connecting ring; 34. upper limit block; 35. positioning angle; 36. connecting rod; 37. movable beam; 4. fixed frame; 41. fixed shaft; 42. transmission frame; 43. movable shaft; 44. clamp. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0020] like Figure 1-Figure 6 As shown, a clamping tool for semiconductor device production proposed in one embodiment of the present application includes a base 1, characterized in that a support column 11 is provided at the lower end of the base 1, a controller 2 is provided at the lower end of the front of the base 1, a start button 21 and a close button 22 are respectively provided on the left and right sides of the front of the controller 2, and a motor 3 is provided at the center of the bottom of the base 1;

[0021] A screw rod 31 is provided on the output shaft of the motor 3, a slider 32 is provided on the screw rod 31, a connecting ring 33 is provided at the lower end of the slider 32, a connecting rod 36 is provided on the connecting ring 33, a movable beam 37 is provided at the upper end of the connecting rod 36, a fixed frame 4 is provided at the upper end of the screw rod 31, a fixed shaft 41 is provided at the outer end of the fixed frame 4, a movable shaft 43 is provided at the outer end of the movable beam 37, transmission frames 42 are provided on both sides of the fixed shaft 41 and the movable shaft 43, and a clamp 44 is provided at the upper end of the transmission frame 42. The start button 21, the close button 22 and the motor 3 are electrically connected to the external power supply and the controller 2, and are controlled by the controller 2.

[0022] A lower limit block 12 is disposed at the lower end of the screw rod 31 . The lower limit block 12 is disposed on the base 1 , and the lower limit block 12 is connected to a bearing of the screw rod 31 .

[0023] An upper limit block 34 is disposed at the upper end of the screw rod 31 . The upper limit block 34 is disposed at the lower end of the fixing frame 4 . The upper limit block 34 is connected to the bearing of the screw rod 31 .

[0024] A positioning angle 35 is provided at the upper end of the fixing frame 4 , and a connecting rod 36 is connected to the positioning angle 35 and the movable beam 37 by bolts.

[0025] The upper and lower ends of the transmission frame 42 are connected to the fixed shaft 41 and the movable shaft 43 respectively.

[0026] The working principle of the present application is as follows: when using the present invention, first place the present invention at the lower end of the wafer, start the motor 3, the motor 3 drives the screw 31 to rotate, the slider 32 engages with the screw 31 to drive the connecting ring 33 to move upward, the connecting ring 33 drives the positioning angle 35 to move upward, the inner side of the connecting rod 36 moves outward as the positioning angle 35 moves upward, the outward movement of the connecting rod 36 drives the movable beam 37 to move outward, the outward movement of the movable beam 37 drives the movable shaft 43 to rotate inward, the movable shaft 43 drives the lower end of the transmission frame 42 to move outward, and the upper end of the transmission frame 42 drives the clamp 44 to move inward to clamp the wafer.

[0027] The beneficial technical effects of implementing the present application are as follows: First, since the utility model is provided with a screw 31, a slider 32, a connecting ring 33, a connecting rod 36, a movable beam 37, a fixing frame 4, a movable shaft 43 and a fixed shaft 41, the utility model can control the clamp 44 to clamp the wafer through the motor 3, which is convenient for subsequent polishing or cutting of the wafer; secondly, since the utility model is provided with a lower limit block 12 and an upper limit block 34, the utility model can set the upper and lower limits of the clamping stroke according to the wafer diameter to avoid damage to the wafer due to excessive clamping force, thereby improving the practicality of the utility model.

[0028] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A clamping tool for producing semiconductor devices, comprising a base (1), characterized in that: A support column (11) is provided at the lower end of the base (1); a controller (2) is provided at the lower end of the front face of the base (1); a start button (21) and a stop button (22) are provided on the left and right sides of the front face of the controller (2), respectively; and a motor (3) is provided at the center of the bottom of the base (1); A screw rod (31) is arranged on the output shaft of the motor (3), a slider (32) is arranged on the screw rod (31), a connecting ring (33) is arranged at the lower end of the slider (32), a connecting rod (36) is arranged on the connecting ring (33), a movable beam (37) is arranged at the upper end of the connecting rod (36), a fixing frame (4) is arranged at the upper end of the screw rod (31), a fixing shaft (41) is arranged at the outer end of the fixing frame (4), a movable shaft (43) is arranged at the outer end of the movable beam (37), a transmission frame (42) is arranged on both sides of the fixed shaft (41) and the movable shaft (43), and a clamp (44) is arranged at the upper end of the transmission frame (42), and the start button (21), the stop button (22) and the motor (3) are electrically connected to an external power supply and the controller (2), and are controlled by the controller (2).

2. A clamping tool for semiconductor device production according to claim 1, characterized in that: A lower limit block (12) is provided at the lower end of the screw rod (31); the lower limit block (12) is arranged on the base (1); and the lower limit block (12) is connected to a bearing of the screw rod (31).

3. A clamping tool for semiconductor device production according to claim 1, characterized in that: An upper limit block (34) is provided at the upper end of the screw rod (31), the upper limit block (34) is arranged at the lower end of the fixing frame (4), and the upper limit block (34) is connected to a bearing of the screw rod (31).

4. A clamping tool for semiconductor device production according to claim 1, characterized in that: A positioning angle (35) is provided at the upper end of the fixing frame (4), and the connecting rod (36) is bolted to the positioning angle (35) and the movable beam (37).

5. A clamping tool for semiconductor device production according to claim 1, characterized in that: The upper and lower ends of the transmission frame (42) are respectively connected to the fixed shaft (41) and the movable shaft (43).