LED display module and LED display screen

Abstract

The utility model provides an LED display module, a pixel unit on a substrate comprises at least one LED chip, the substrate is provided with a first packaging adhesive layer and a second packaging adhesive layer, the first packaging adhesive layer covers the substrate, the top surface of the first packaging adhesive layer is not higher than the top surface of the LED chip, the second packaging adhesive layer is located on the first packaging adhesive layer and the LED chip, and the first packaging adhesive layer and the second packaging adhesive layer are arranged on the substrate. The transmittance of the second packaging adhesive layer is larger than that of the first packaging adhesive layer, the second packaging adhesive layer is provided with paddle-tumbles which are distributed transversely and longitudinally, and each pixel unit is surrounded by the paddle-tumbles. According to the LED display module, when the LED display module is spliced, a splicing seam and the surface of a product can achieve a visual effect similar to that of the splicing seam, the splicing effect is improved, the color consistency in the black screen process is improved, the adjacent pixel units can be separated through the paddle, the optical crosstalk problem between the adjacent pixel units can be solved, and the display effect is further improved. Correspondingly, the utility model further provides an LED display screen.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor preparation, in particular to an LED display module and an LED display screen. Background Art

[0002] With the development of display technology, people have higher and higher requirements for the display effect of LED display screens. In the manufacturing process of existing LED display modules, the differences in the ink color of the substrate pads, window openings and the substrate itself will affect the color consistency of the entire substrate, resulting in differences in displayed colors and affecting the display effect.

[0003] In order to avoid this problem, the current LED display module will mix melanin into the packaging glue during the packaging process to reduce the display color difference. However, the way of mixing melanin into the packaging glue will affect the light transmittance of the LED display module, thereby reducing the brightness of the LED display module. At the same time, in order to improve the defect of inconsistent lateral light emission of flip-chip LED chips, it is necessary to add diffusion powder to the packaging glue to achieve a light mixing effect. However, adding too much diffusion powder to the packaging glue will cause the contrast of the LED display module to deteriorate.

[0004] Furthermore, when multiple LED display modules are currently spliced ​​into a display screen, there will be more or less splicing lines between the LED display modules, resulting in poor visual effects. There will also be color differences between different LED display modules, resulting in poor color consistency of the LED display screen when the screen is black, and a mosaic-like phenomenon. Utility Model Content

[0005] The utility model aims to provide an LED display module and an LED display screen to solve the problems of low brightness, poor contrast, poor color consistency when the screen is black, etc. of the existing LED display module.

[0006] In order to achieve the above object, the utility model provides an LED display module, comprising:

[0007] substrate;

[0008] A plurality of pixel units are located on the substrate, and the pixel units include at least one LED chip;

[0009] A first packaging adhesive layer, located on the substrate, wherein the top surface of the first packaging adhesive layer is not higher than the top surface of the LED chip;

[0010] a second packaging glue layer, located on the first packaging glue layer and the LED chip, and the transmittance of the second packaging glue layer is greater than the transmittance of the first packaging glue layer; and

[0011] The grooves distributed horizontally and vertically are at least located in the second packaging glue layer, and each of the pixel units is surrounded by the grooves.

[0012] Optionally, the pixel unit includes three LED chips, namely a red LED chip, a green LED chip and a blue LED chip, and there is a gap between adjacent LED chips, and the gap is at least filled by the first packaging glue layer.

[0013] Optionally, the groove extends from the surface of the second encapsulation layer to the inside of the second encapsulation layer; or, the groove passes through the second encapsulation layer and exposes the first encapsulation layer; or, the groove extends from the surface of the second encapsulation layer to the inside of the first encapsulation layer.

[0014] Optionally, the depth of the groove is 0.1 mm to 0.6 mm.

[0015] Optionally, the width of the groove is less than 1 / 2 of the interval between two adjacent pixel units and is greater than or equal to 0.05 mm.

[0016] Optionally, also include:

[0017] The light-blocking coating at least covers the inner wall of the groove.

[0018] Optionally, the light-blocking coating also covers the surface of the second encapsulation adhesive layer.

[0019] Optionally, the transmittance of the light-blocking coating is 30% to 90%; and / or the thickness of the light-blocking coating is 10um to 50um; and / or the surface glossiness of the light-blocking coating is 5GU to 60GU.

[0020] Optionally, the transmittance of the first packaging adhesive layer is 3% to 25%; and / or the transmittance of the second packaging adhesive layer is 25% to 95%.

[0021] Optionally, the thickness of the first packaging adhesive layer is 0.03 mm to 0.15 mm, and the thickness of the second packaging adhesive layer is 0.1 mm to 0.5 mm.

[0022] The utility model also provides an LED display screen, comprising at least one LED display module.

[0023] In the LED display module provided by the utility model, the pixel unit on the substrate includes at least one LED chip, and the substrate has a first encapsulation glue layer and a second encapsulation glue layer, the first encapsulation glue layer covers the substrate, and the top surface is not higher than the top surface of the LED chip, the second encapsulation glue layer is located on the first encapsulation glue layer and the LED chip, and the transmittance of the second encapsulation glue layer is greater than the transmittance of the first encapsulation glue layer, and the second encapsulation glue layer has grooves distributed horizontally and vertically, and each of the pixel units is surrounded by the grooves. In the present invention, the first encapsulation adhesive layer has a lower transmittance, which can block the lateral light emission of the LED chip, improve the display effect, and no need to add too much diffusion powder, thereby ensuring the contrast of the LED display module; at the same time, because the first encapsulation adhesive layer can improve the color consistency of the substrate and reduce color difference, the second encapsulation adhesive layer can have a higher transmittance, ensuring that the LED display module has a higher brightness; further, when the LED display module is spliced, the grooves can make the splicing seam and the product surface achieve a similar visual effect, improve the splicing effect and improve the color consistency of the LED display screen when the screen is black, and the grooves can also separate the adjacent pixel units, which can improve the light crosstalk problem between the adjacent pixel units and further improve the display effect. Correspondingly, the present invention also provides an LED display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 to Figure 6 This is a schematic diagram of the structure corresponding to the corresponding steps of the method for manufacturing an LED display module provided in Embodiment 1 of the present utility model, wherein:

[0025] Figure 1 A schematic diagram of the structure of a substrate and a pixel unit provided in Embodiment 1 of the present utility model;

[0026] Figure 2 A schematic diagram of the structure of heating and pressurizing the packaging film using a vacuum heat press provided in the first embodiment of the utility model;

[0027] Figure 3 A schematic diagram of the structure after forming the first packaging adhesive layer provided in the first embodiment of the utility model;

[0028] Figure 4 A schematic diagram of the structure of forming a second encapsulation adhesive layer by a compression molding process provided in the first embodiment of the present utility model;

[0029] Figure 5 and Figure 6 This is a schematic diagram of the structure of the LED display module provided in the first embodiment of the utility model, wherein: Figure 5 for Figure 6 A schematic cross-sectional view of the LED display module along the AA direction;

[0030] Figure 7 A schematic diagram of a structure of an LED display screen formed by splicing LED display modules provided in the first embodiment of the utility model;

[0031] Wherein, the accompanying drawings are marked as follows:

[0032] 100-substrate; 100a-pixel unit; 101-LED chip; 111-gap; 200-packaging film; 201-release film; 300-first packaging layer; 400-second packaging layer; 401-groove. DETAILED DESCRIPTION

[0033] The following will describe the specific implementation of the utility model in more detail with reference to the schematic diagram. The advantages and features of the utility model will become clearer according to the following description. It should be noted that the drawings are all in a very simplified form and are not in exact proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model.

[0034] Embodiment 1

[0035] Figure 5 and Figure 6 This is a schematic diagram of the structure of the LED display module provided in this embodiment, wherein: Figure 5 for Figure 6 The cross-sectional diagram of the LED display module along the AA direction is shown in FIG. Figure 5 and Figure 6 As shown, the LED display module includes a substrate 100 , a plurality of pixel units 100 a , a first packaging adhesive layer 300 , a second packaging adhesive layer 400 and a scribe groove 401 .

[0036] Specifically, the pixel units 100a are arrayed on the substrate 100, and each of the pixel units 100a includes at least one LED chip 101, and the LED chip 101 can be a combination of one or more of a red LED chip, a green LED chip, and a blue LED chip. In this embodiment, the pixel unit 100a includes three LED chips 101, and the three LED chips 101 are respectively a red LED chip, a green LED chip, and a blue LED chip, and there is a gap 111 between adjacent LED chips 101.

[0037] In this embodiment, the substrate 100 has 4 rows and 4 columns, with a total of 16 pixel units 100 a , but this should not be limited to this. In other embodiments, the substrate 100 may also have other numbers of pixel units 100 a .

[0038] like Figure 5As shown, the first packaging glue layer 300 is located on the substrate 100 and fills the gap 111. Figure 5 As can be seen in the figure, the top surface of the substrate 100 is covered by the first encapsulation layer 300, and the side surface of each LED chip 101 is also covered by the first encapsulation layer 300. The second encapsulation layer 400 is located on the first encapsulation layer 300 and the LED chip 101, that is, the second encapsulation layer 400 covers the first encapsulation layer 300 and the top surface of the LED chip 101.

[0039] In this embodiment, the top surface of the first encapsulation adhesive layer 300 is flush with the top surface of the LED chip 101, but it should not be limited to this. The top surface of the first encapsulation adhesive layer 300 can also be lower than the top surface of the LED chip 101. At this time, the gap 111 is also filled by the second encapsulation adhesive layer 400.

[0040] Furthermore, the transmittance of the second encapsulation adhesive layer 400 is greater than the transmittance of the first encapsulation adhesive layer 300. Since the first encapsulation adhesive layer 300 has a lower transmittance, it can block the lateral light emission of the LED chip 101, improve the display effect, and no need to add too much diffusion powder, thereby ensuring the contrast of the LED display module; at the same time, since the first encapsulation adhesive layer 300 can improve the color consistency of the substrate 100 and reduce color difference, the second encapsulation adhesive layer 400 can have a higher transmittance, ensuring that the LED display module has a higher brightness.

[0041] Optionally, the transmittance of the first encapsulation adhesive layer 300 may be 3% to 25%, and the transmittance of the second encapsulation adhesive layer 400 may be 25% to 95%. Appropriate melanin may be added to the first encapsulation adhesive layer 300 and the second encapsulation adhesive layer 400 so that the transmittance of each meets the requirements. For example, 0.5% to 2% (mass) of melanin may be added to the first encapsulation adhesive layer 300, and 0.01% to 0.5% (mass) of melanin may be added to the second encapsulation adhesive layer 400.

[0042] Optionally, the thickness of the first encapsulation adhesive layer 300 may be 0.03 mm to 0.15 mm, and the thickness of the second encapsulation adhesive layer 400 may be 0.1 mm to 0.5 mm; the thickness of the LED display module may be 0.1 mm to 1 mm, but should not be limited thereto.

[0043] Furthermore, 0.1% to 15% (mass) of diffusion powder may be added to the first packaging adhesive layer 300 ; and 0.5% to 10% (mass) of diffusion powder may be added to the second packaging adhesive layer 400 , but the present invention should not be limited thereto.

[0044] The materials of the first packaging adhesive layer 300 and the second packaging adhesive layer 400 may be epoxy resin, modified epoxy resin, silica gel or organic silicon resin, etc., and the present invention does not impose any limitation thereto.

[0045] Please continue reading Figure 5 The scribe groove 401 is at least located in the second encapsulation glue layer 400 , and the scribe groove 401 is distributed horizontally and vertically on the substrate 100 , and each of the pixel units 100 a is surrounded by the scribe groove 401 . Figure 7 This is a schematic diagram of the structure of an LED display screen formed by splicing LED display modules provided in this embodiment. Figure 7 As shown, when the LED display module is spliced, the groove 401 can make the splicing seam and the product surface achieve a similar visual effect, thereby improving the splicing effect and improving the color consistency of the LED display when the screen is black, and the groove 401 can also separate the adjacent pixel units 100a, thereby improving the cross-light problem between the adjacent pixel units 100a (the first encapsulation glue layer 300 may not be able to completely block the lateral light output of the LED chip 101), further improving the display effect.

[0046] In this embodiment, the groove 401 is located in the second encapsulation adhesive layer 400 and extends downward from the surface of the second encapsulation adhesive layer 400 to the first encapsulation adhesive layer 300. When the groove 401 penetrates the second encapsulation adhesive layer 400 and exposes the first encapsulation adhesive layer 300, since the first encapsulation adhesive layer 300 has a low transmittance and a darker color, the splicing effect can be further improved and the color consistency of the LED display screen when the screen is black can be improved; at the same time, since there is no second encapsulation adhesive layer 400 with a high transmittance between adjacent pixel units 100a, the cross-light problem between adjacent pixel units 100a can be improved to a greater extent, and the problem of inconsistent side light output between LED display modules caused by the depth difference of the groove 401 can also be avoided.

[0047] Of course, in some embodiments, the groove 401 may be located only in the second encapsulation adhesive layer 400 or just pass through the second encapsulation adhesive layer 400, that is, the groove 401 may extend from the surface of the second encapsulation adhesive layer 400 to the inside of the second encapsulation adhesive layer 400; or, the groove 401 may pass through the second encapsulation adhesive layer 400 and expose the surface of the first encapsulation adhesive layer 300.

[0048] Optionally, the depth of the groove 401 may be 0.1 mm to 0.6 mm, and the width of the groove 401 may be less than 1 / 2 of the distance between two adjacent pixel units 100 a . For ease of processing, the width of the groove 401 may also be greater than 0.05 mm, but should not be limited thereto.

[0049] Furthermore, the LED display module also includes a light-blocking coating ( Figure 5 (not shown), the light-blocking coating at least covers the inner wall of the groove 401, thereby blocking the lateral light emission of the pixel unit 100a, and avoiding light crosstalk between adjacent pixel units 100a, thereby improving the display effect.

[0050] It should be understood that the light-blocking coating can also cover the surface of the second encapsulation adhesive layer 400. At this time, although the light-blocking coating will lose the brightness of the LED display module, it can improve the appearance consistency of the LED display module. At the same time, the light-blocking coating has higher coating efficiency and is easy to mass produce.

[0051] Optionally, the transmittance of the light-blocking coating may be 30% to 90%, and appropriate melanin and matte powder may be added to the light-blocking coating so that the transmittance and surface gloss meet the requirements.

[0052] Optionally, the thickness of the light-blocking coating may be 10 um to 50 um, and the surface glossiness of the light-blocking coating may be 5GU to 60GU (the measurement angle of the gloss meter is 60 degrees), but it should not be limited thereto.

[0053] Furthermore, the material of the light-blocking coating may be epoxy resin, modified epoxy resin, silicone resin or the like, and the present invention does not impose any limitation thereto.

[0054] Based on this, this embodiment also provides a method for manufacturing an LED display module. Figure 1 to Figure 6 The following is a schematic diagram of the structure corresponding to the corresponding steps of the manufacturing method of the LED display module provided in this embodiment. Figure 1 to Figure 6 The manufacturing method of the LED display module provided in this embodiment is described in detail.

[0055] like Figure 1As shown, step S100 is performed to provide a substrate 100, on which a plurality of pixel units 100a are fixed (three pixel units 100a are schematically shown in this embodiment). In this embodiment, each of the pixel units 100a includes three LED chips 101, and the three LED chips 101 are respectively a red LED chip, a green LED chip, and a blue LED chip, and there is a gap 111 between adjacent LED chips 101. The substrate 100 can be a PCB board, and the LED chip 101 can be fixed on the substrate 100 by eutectic welding.

[0056] Please continue reading Figure 1 , perform step S200, provide a packaging film 200, in order to protect the packaging film 200 during transportation and storage, and to ensure that the packaging film 200 is free of pollution during production, release films 201 are attached to the upper and lower surfaces of the packaging film 200. Tear off any of the release films 201 of the packaging film 200, and then place the packaging film 200 above the LED chip 101, with the surface of the packaging film 200 with the release film 201 torn off facing the LED chip 101.

[0057] like Figure 2 As shown, the packaging film 200 is heated and pressurized by a vacuum hot press. The packaging film 200 softens (becomes semi-solid) after being heated, and is attached to the substrate 100 and embedded in the gap 111 under the action of pressure. In a vacuum environment (for example, less than -0.09Mpa), the packaging film 200 can better fill the gap 111 and avoid the appearance of holes in the gap 111. It should be noted that when the packaging film 200 is pressed, it is necessary to ensure that the packaging film 200 flows onto the substrate 100 and into the gap 111 as much as possible, and will not remain on the top surface of the LED chip 101, so as to avoid the difference in light brightness caused by the residual packaging film 200 on the top surface of the LED chip 101, and at the same time omit the step of removing residual glue, thereby increasing production efficiency and reducing production costs. In this embodiment, an airbag is used to pressurize the packaging film 200. The airbag contacts the release film 201 and applies pressure to the packaging film 200 through the release film 201. Since the airbag is elastic, the problem of uneven force on the LED chip 101 during film pressing due to the height difference of the top surface of the LED chip 101 can be solved, and it can ensure that the packaging film 200 will not remain on the top surface of the LED chip 101, and at the same time protect the LED chip 101 and the packaging film 200 from being damaged and contaminated by the airbag.

[0058] It should be noted that the thickness of the packaging film 200 needs to be less than or equal to the thickness of the LED chip 101 , so that after lamination, the top surface of the packaging film 200 is not higher than the top surface of the LED chip 101 .

[0059] like Figure 3 As shown, the remaining release film 201 of the packaging film 200 is torn off, and then the packaging film 200 is cured to form the first packaging layer 300. At this time, the top surface of the first packaging layer 300 is not higher than the top surface of the LED chip 101.

[0060] In this embodiment, the packaging film 200 is cured by heating, but it should not be limited to this. The packaging film 200 can also be cured by other methods. The curing method and curing conditions of the packaging film 200 can be determined according to its characteristics.

[0061] Furthermore, compared with the dispensing process, the present embodiment adopts a vacuum hot press to heat and pressurize the packaging adhesive film 200 to form the first packaging adhesive layer 300, which has higher production efficiency, consistency and yield.

[0062] like Figure 4 As shown, the second encapsulation adhesive layer 400 is formed by a molding process. Specifically, firstly, the glue corresponding to the second encapsulation adhesive layer 400 is prepared, and then the substrate 100 is placed in the upper mold of the molding machine, and glue is applied to the lower mold of the molding machine, and then the molds are closed and heated and pressurized, so as to form the second encapsulation adhesive layer 400 on the first encapsulation adhesive layer 300 and the LED chip 101.

[0063] Afterwards, the second encapsulation adhesive layer 400 is cured. In this embodiment, the second encapsulation adhesive layer 400 is cured by heating, but it should not be limited to this. The second encapsulation adhesive layer 400 can also be cured by other methods. The curing method and curing conditions of the second encapsulation adhesive layer 400 can be determined according to its characteristics.

[0064] like Figure 5 and Figure 6 As shown, the grooves 401 distributed in the horizontal and vertical directions are processed in the second encapsulation adhesive layer 400, so that the grooves 401 separate the individual pixel units 100a, and each pixel unit 100a is surrounded by the grooves 401. For example, the second encapsulation adhesive layer 400 (or the second encapsulation adhesive layer 400 and a part of the depth of the first encapsulation adhesive layer 300) can be cut by laser scribing, mechanical scribing or other processes to form the grooves 401.

[0065] Next, a layer of the light blocking coating may be coated on the scribe groove 401 and the second encapsulation adhesive layer 400 by using a process such as spraying or nano-coating.

[0066] It can be seen that by adopting the manufacturing method of the LED display module in this embodiment, the first encapsulation adhesive layer 300 and the second encapsulation adhesive layer 400 have clear adhesive layer boundaries, good product consistency, flexible and controllable process technology, high production efficiency, and better product effect and yield rate.

[0067] Furthermore, this embodiment also provides an LED display screen, comprising at least one LED display module. For example, Figure 7 The LED display screen is composed of 16 LED display modules, and the 16 LED display modules are arranged in 4 rows and 4 columns. Figure 7 As can be seen in the figure, the groove 401 can make the joint seam between the LED display modules achieve a similar visual effect as the product surface, thereby improving the joint effect and the color consistency of the LED display screen when the screen is black.

[0068] In summary, in the LED display module provided in the embodiment of the utility model, the pixel unit on the substrate includes at least one LED chip, and the substrate has a first encapsulation glue layer and a second encapsulation glue layer, the first encapsulation glue layer covers the substrate, and the top surface is not higher than the top surface of the LED chip, the second encapsulation glue layer is located on the first encapsulation glue layer and the LED chip, and the transmittance of the second encapsulation glue layer is greater than the transmittance of the first encapsulation glue layer, and the second encapsulation glue layer has grooves distributed horizontally and vertically, and each of the pixel units is surrounded by the grooves. In the utility model, the first encapsulation adhesive layer has a low transmittance, which can block the lateral light output of the LED chip, improve the display effect, and no longer need to add too much diffusion powder, thereby ensuring the contrast of the LED display module; at the same time, because the first encapsulation adhesive layer can improve the color consistency of the substrate and reduce color difference, the second encapsulation adhesive layer can have a high transmittance, ensuring that the LED display module has a high brightness; further, when the LED display module is spliced, the grooves can make the splicing seam and the product surface achieve a similar visual effect, improve the splicing effect and improve the color consistency of the LED display screen when the screen is black, and the grooves can also separate the adjacent pixel units, which can improve the cross-light problem between the adjacent pixel units and further improve the display effect. Correspondingly, this embodiment also provides an LED display screen.

[0069] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description.

[0070] It should also be noted that, although the present invention has been disclosed as a preferred embodiment, the above embodiment is not intended to limit the present invention. For any technician familiar with the art, without departing from the scope of the technical solution of the present invention, the above disclosed technical content can be used to make many possible changes and modifications to the technical solution of the present invention, or modified into equivalent embodiments of equivalent changes. Therefore, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of protection of the technical solution of the present invention.

[0071] It should also be understood that, unless otherwise specified or indicated, the terms "first", "second", "third", etc. in the specification are merely used to distinguish between the various components, elements, steps, etc. in the specification, and are not used to indicate the logical relationship or sequential relationship between the various components, elements, steps, etc.

[0072] It should also be recognized that the terms described herein are only used to describe specific embodiments and are not used to limit the scope of the utility model. It must be noted that the singular forms "one" and "a kind" used herein and in the appended claims include plural references unless the context clearly indicates the opposite meaning. For example, a reference to "a step" or "a device" means a reference to one or more steps or devices, and may include secondary steps and secondary devices. All conjunctions used should be understood in the broadest sense. And, the word "or" should be understood to have a logical "or" definition, rather than a logical "exclusive or" definition, unless the context clearly indicates the opposite meaning. In addition, the implementation of the method and / or device in the embodiment of the utility model may include performing the selected task manually, automatically, or in combination.

Claims

1. An LED display module, characterized in that: include: substrate; A plurality of pixel units are located on the substrate, and the pixel units include at least one LED chip; A first packaging adhesive layer, located on the substrate, wherein the top surface of the first packaging adhesive layer is not higher than the top surface of the LED chip; A second packaging glue layer is located on the first packaging glue layer and the LED chip, and the transmittance of the second packaging glue layer is greater than the transmittance of the first packaging glue layer; as well as, The grooves distributed horizontally and vertically are at least located in the second packaging glue layer, and each of the pixel units is surrounded by the grooves.

2. The LED display module according to claim 1, characterized in that: The pixel unit includes three LED chips, namely a red LED chip, a green LED chip and a blue LED chip. There is a gap between adjacent LED chips, and the gap is at least filled by the first packaging glue layer.

3. The LED display module according to claim 1 or 2, characterized in that: The groove extends from the surface of the second encapsulation layer to the inside of the second encapsulation layer; or, the groove passes through the second encapsulation layer and exposes the first encapsulation layer; or, the groove extends from the surface of the second encapsulation layer to the inside of the first encapsulation layer.

4. The LED display module according to claim 1 or 2, characterized in that: The depth of the groove is 0.1 mm to 0.6 mm.

5. The LED display module according to claim 1 or 2, characterized in that: The width of the groove is less than 1 / 2 of the interval between two adjacent pixel units and is greater than or equal to 0.05 mm.

6. The LED display module according to claim 1 or 2, characterized in that: Also includes: The light-blocking coating at least covers the inner wall of the groove.

7. The LED display module according to claim 6, characterized in that: The light-blocking coating also covers the surface of the second packaging adhesive layer.

8. The LED display module according to claim 6, characterized in that: The transmittance of the light-blocking coating is 30% to 90%; and / or the thickness of the light-blocking coating is 10um to 50um; and / or the surface glossiness of the light-blocking coating is 5GU to 60GU.

9. The LED display module according to claim 1 or 2, characterized in that: The transmittance of the first packaging adhesive layer is 3% to 25%; and / or the transmittance of the second packaging adhesive layer is 25% to 95%.

10. The LED display module according to claim 1 or 2, characterized in that: The thickness of the first packaging adhesive layer is 0.03 mm to 0.15 mm, and the thickness of the second packaging adhesive layer is 0.1 mm to 0.5 mm.

11. An LED display screen, characterized in that: The invention comprises at least one LED display module as claimed in any one of claims 1 to 10.

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