Water cooling device for aging of high-power laser

Abstract

The utility model relates to a water cooling device for aging of a high-power laser, which belongs to the technical field of optical fiber lasers and comprises a water cooling plate, a rectangular cavity is formed by long protective plates and short protective plates on the periphery above the water cooling plate, a water cooling cross beam is connected between the two short protective plates at an opening above the cavity, and radiating fins are arranged on the top surface of the water cooling plate. A first shielding piece and a second shielding piece are obliquely arranged on the inner wall of the long protection plate, the first shielding piece is located on the inner side of the upper edge of the long protection plate, the second shielding piece is located below the first shielding piece, and the first shielding piece and the second shielding piece incline towards the bottom of the center of the cavity. A cross beam water channel is arranged in the water-cooling cross beam, and a first through hole is formed in the water-cooling cross beam and used for being connected with an optical fiber output port. A relatively closed cavity is defined by the protective plate and the shielding piece, reflection is generated, the laser is blocked back into the device, and equipment or operators are prevented from being damaged by the high-energy laser.

Description

Technical Field

[0001] The utility model relates to a water cooling device for high-power laser aging, belonging to the technical field of optical fiber lasers. Background Art

[0002] As the power of semiconductor fiber lasers increases, the need for aging also increases. The high-energy laser emitted by semiconductor fiber lasers during aging needs to be irradiated on a special water-cooling plate to take away the heat generated by the laser. As the power of semiconductor fiber lasers increases, the energy generated also increases, from one kilowatt to more than ten kilowatts. The original ordinary water-cooling plate cannot meet the aging needs of high-power semiconductor fiber lasers. The main heat generated is the heat generated by the laser beam and the temperature at the laser output port. Ordinary water-cooling plates cannot quickly dissipate the heat generated by the laser, and the temperature at the fiber output head is very high, and the heat dissipates slowly. Users basically build simple aging devices by themselves to shorten the aging time and reduce the number of aging, which has a certain impact on product quality. In addition, the high-energy beam generated by high-power semiconductor fiber lasers is invisible light and is very dangerous.

[0003] In summary, the energy generated by the laser beam of the existing high-power semiconductor laser is large when it ages, the heat of the ordinary water-cooling plate is slow to dissipate, and the high-energy beam generated by the high-power semiconductor fiber laser is invisible light, which is very dangerous; and the fiber output head has defects such as high temperature, which leads to the present utility model. Summary of the invention

[0004] In view of the deficiencies in the prior art, the utility model provides a water cooling device for high-power laser aging, which effectively dissipates the heat generated by the laser beam during laser aging through a water cooling plate and effectively protects the safety of the operator.

[0005] The technical solution of the utility model is as follows:

[0006] A water cooling device for high-power laser aging, comprising a water cooling plate, a rectangular cavity formed by long and short guard plates on the upper and lower sides of the water cooling plate, a water cooling crossbeam connected between two short guard plates at the upper opening of the cavity, and a heat sink on the top of the water cooling plate;

[0007] The inner wall of the long guard plate is inclined to be provided with a first shielding piece and a second shielding piece. The first shielding piece is located on the inner side of the upper edge of the long guard plate, and the second shielding piece is located below the first shielding piece. The first shielding piece and the second shielding piece are inclined toward the center bottom of the cavity.

[0008] A water channel is provided inside the water-cooled beam, and a first through hole is provided through the water-cooled beam, and the first through hole is used to connect the optical fiber output port. The high-power semiconductor laser optical fiber output head will generate a lot of heat during operation, which will burn out if not dissipated in time. The water-cooled beam dissipates the heat generated by the high-power semiconductor laser optical fiber output head, and the distance between the water-cooled beam and the heat dissipation is relatively high, which reduces the secondary heating of the beam by the reflected laser.

[0009] The laser beam output by the high-power semiconductor laser optical fiber hits the heat sink, and the long guard plate, short guard plate, first shielding plate, and second shielding plate will generate reflection to block the laser back into the device to prevent damage to the equipment or operators.

[0010] Preferably, the length of the first shielding piece is greater than the length of the second shielding piece.

[0011] Preferably, C-shaped brackets are provided below both ends of the water-cooling beam, and the water-cooling beam is fixedly connected to the water-cooling plate through the C-shaped brackets.

[0012] Further preferably, second through holes are provided at both ends of the water-cooling cross beam, and the water-cooling cross beam is fixedly connected to the C-shaped bracket through the second through holes.

[0013] Preferably, two U-shaped water channels are provided inside the water cooling plate to increase the water flow and reduce the time that the cooling water stays in the water channel, thereby improving the cooling effect and quickly dissipating the energy (heat) generated by the laser beam when the high-power semiconductor laser ages through the water cooling plate. If there is only one water channel, with one inlet and one outlet, the internal water channel will be long and the heat dissipation effect will be poor. Therefore, two U-shaped water channels are designed, the water channels are shorter and the heat dissipation is better.

[0014] Preferably, the heat sink includes a bottom plate, and heat dissipation teeth are arranged on the bottom plate. The teeth on the heat sink increase the contact area with the laser beam and reduce the laser reflection. The heat is no longer a point but a surface. When the laser beam hits the teeth, it is not a mirror reflection. The heat sink plays a role in diffusion and reducing laser reflection. The energy generated by the laser beam when the high-power semiconductor laser ages is transferred to the water cooling plate through the heat sink to dissipate the heat.

[0015] The beneficial effects of the utility model are:

[0016] The water cooling device for high-power laser aging in the present application is designed with double water channels and heat sinks, which can quickly dissipate the high energy generated by the laser beam when the high-power semiconductor laser is aged.

[0017] The water cooling device for high-power laser aging in the present application effectively protects the laser through the design of a guard plate and a shielding sheet to prevent high-energy laser from damaging equipment or operators.

[0018] The water cooling device for high-power laser aging in the present application can dissipate the heat generated by the optical fiber output head of the high-power semiconductor laser through the design of the water cooling beam. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of a cross section of the utility model;

[0020] Figure 2 It is a schematic diagram of the three-dimensional structure of the device of the utility model;

[0021] Figure 3 This is a top view schematic diagram of the water cooling plate of the utility model;

[0022] Figure 4 It is a schematic diagram of a water-cooled beam of the utility model;

[0023] Figure 5 A schematic diagram of the heat sink of the utility model;

[0024] Figure 6 It is a schematic diagram of a C-shaped bracket of the utility model;

[0025] Figure 7 This is a schematic diagram of the structure of the utility model with a laser optical fiber added;

[0026] Among them: 1 water-cooling plate, 2 heat sink, 3 long guard plate, 4 short guard plate, 5 first shielding plate, 6 second shielding plate, 7 water-cooling crossbeam, 8 C-type bracket; 101 first water channel; 102 second water channel; 201 heat dissipation teeth, 202 bottom film; 701 crossbeam water channel; 702 first through hole; 703 second through hole; 9 high-power semiconductor laser fiber output head. DETAILED DESCRIPTION

[0027] The present invention will be further described below through embodiments and in conjunction with the accompanying drawings, but is not limited thereto.

[0028] like Figure 1-7 shown.

[0029] Embodiment 1:

[0030] A water cooling device for high power laser aging, such as Figure 2 As shown, it includes a water-cooled plate 1, and a rectangular cavity is formed by long guard plates 3 and short guard plates 4 on the top and bottom of the water-cooled plate. A water-cooled crossbeam 7 is connected between the two short guard plates at the opening above the cavity, and a heat sink 2 is provided on the top surface of the water-cooled plate.

[0031] The inner wall of the long guard plate is inclined with a first shielding piece 5 and a second shielding piece 6. The first shielding piece is located on the inner side of the upper edge of the long guard plate, and the second shielding piece is located below the first shielding piece. The first shielding piece and the second shielding piece are inclined toward the center bottom of the cavity.

[0032] A beam water channel 701 is provided in the water-cooled beam 7, and a first through hole 702 is provided through the water-cooled beam. The first through hole is used to connect the optical fiber output port. Figure 4 The structure after connecting with optical fiber is as shown in Figure 7 As shown. The high-power semiconductor laser fiber output head will generate a lot of heat when working, which will burn out if not dissipated in time. The water-cooled beam dissipates the heat generated by the high-power semiconductor laser fiber output head, and the distance between the water-cooled beam and the heat dissipation is high, which reduces the secondary heating of the beam by the reflected laser.

[0033] The length of the first shielding sheet is greater than the length of the second shielding sheet. Figure 1 As shown, the laser beam output by the high-power semiconductor laser fiber hits the heat sink. The long guard plate, the short guard plate, the first shielding plate, and the second shielding plate surround a relatively closed cavity, which will produce reflection and block the laser back into the device. Figure 1 As shown by the arrow in the middle, avoid damage to equipment or operators.

[0034] The heat sink 2 includes a bottom plate 202, on which heat dissipation teeth 201 are arranged. Figure 5 As shown. The purpose is to reduce the reflection of the laser and increase the contact area so that the concentrated laser has a larger area in contact with the heat sink. The heat sink also plays a role in diffusing the temperature. When the laser hits the heat sink, the heat sink is heated as a whole, and the heat is transferred to the water cooling plate through the heat sink, which increases the area of ​​heat dissipation and can quickly transfer the heat to the water cooling plate.

[0035] Embodiment 2:

[0036] A water cooling device for high power laser aging, the structure of which is as described in Example 1, except that a C-shaped bracket 8 is provided below both ends of the water cooling beam 7. Figure 6 As shown, the water-cooling beam is fixedly connected to the water-cooling plate through a C-shaped bracket. Second through holes 703 are provided at both ends of the water-cooling beam, and the water-cooling beam is fixedly connected to the C-shaped bracket through the second through holes.

[0037] Embodiment 3:

[0038] A water cooling device for high power laser aging, the structure of which is as described in Example 1, except that two U-shaped water channels are provided inside the water cooling plate 1, such as Figure 3The first water channel 101 and the second water channel 102 shown have inlets and outlets on the same side, which is convenient for connecting external water cooling equipment. The two water channels can increase the water flow rate and reduce the time that the cooling water stays in the water channel, improve the cooling effect, and quickly dissipate the energy (heat) generated by the laser beam when the high-power semiconductor laser ages through the water cooling plate. If there is only one water channel, with one inlet and one outlet, the internal water channel will be long and the heat dissipation effect will be poor. Therefore, two U-shaped water channels are designed, the water channels are shorter and the heat dissipation is good.

Claims

1. A water cooling device for high power laser aging, characterized in that: It includes a water-cooling plate, and a rectangular cavity is formed by long guard plates and short guard plates on the upper and lower sides of the water-cooling plate. A water-cooling crossbeam is connected between the two short guard plates at the opening above the cavity, and a heat sink is provided on the top surface of the water-cooling plate; The inner wall of the long guard plate is inclined with a first shielding sheet and a second shielding sheet, the first shielding sheet is located on the inner side of the upper edge of the long guard plate, the second shielding sheet is located below the first shielding sheet, and the first shielding sheet and the second shielding sheet are inclined toward the center bottom of the cavity; A beam water channel is arranged in the water-cooling beam, and a first through hole is arranged through the water-cooling beam. The first through hole is used for connecting the optical fiber output port.

2. The water cooling device for high power laser aging according to claim 1, characterized in that: The length of the first shielding piece is greater than the length of the second shielding piece.

3. The water cooling device for high power laser aging according to claim 1, characterized in that: C-shaped brackets are provided below both ends of the water-cooling beam, and the water-cooling beam is fixedly connected to the water-cooling plate through the C-shaped brackets.

4. The water cooling device for high power laser aging according to claim 3, characterized in that: Second through holes are provided at both ends of the water-cooling crossbeam, and the water-cooling crossbeam is fixedly connected to the C-shaped bracket through the second through holes.

5. The water cooling device for high power laser aging according to claim 1, characterized in that: There are two U-shaped water channels inside the water cooling plate.

6. The water cooling device for high power laser aging according to claim 1, characterized in that: The heat sink comprises a bottom plate, on which heat dissipation teeth are arranged.

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