Surface mounting device for semiconductor laser

Abstract

The utility model discloses a surface mounting device for a semiconductor laser, which comprises a main body frame and a control panel, one end of the main body frame is provided with a semiconductor feeding assembly, one side of the semiconductor feeding assembly is provided with a tin sheet feeding assembly, and one side of one end of the main body frame is provided with the control panel. Dustproof structures are installed at the two ends of one side of the main body frame, a feeding assembly is arranged in one side of the main body frame, an anti-static structure penetrates through the other side of the main body frame, a wire penetrates through the interior of one side of the main body frame, and a mechanical clamp is arranged at one end in the main body frame. According to the utility model, through the arrangement of the anti-static structure, the magnet block is adsorbed to the outer side of equipment with a static electricity generation angle through magnetism, the rubber pad is attached to the ground so as to be in contact with the ground, and when static electricity is generated, the static electricity can be gradually guided to the ground along the wire, so that the static influence on semiconductor materials due to more static electricity is avoided; the anti-static effect of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor laser patch devices, in particular to a patch device for semiconductor lasers. Background Art

[0002] As a related equipment for optical processing of semiconductor chip materials, semiconductor lasers are often subjected to chip processing after production in order to effectively protect the semiconductor materials. The surface of the semiconductor materials is covered with a protective shell. In order to improve the chip processing of semiconductor materials, dedicated semiconductor laser chip processing devices are often used.

[0003] When a common semiconductor laser chip mounting device is in use, the mechanical gripper is controlled by the air control panel to carry out the gluing of the semiconductor material and the required protective sheet, and is accurately attached to the surface of the semiconductor material to complete the chip mounting process of the semiconductor material. The common semiconductor laser chip mounting device has good accuracy when in use, but there are still some problems:

[0004] When using common semiconductor laser chip mounting devices, static electricity has a significant impact on chip processing. Regardless of manual operation or friction between parts in the device, a certain amount of static electricity will be generated, and the use of a large amount of anti-static materials will also result in higher usage costs. Utility Model Content

[0005] The utility model aims to provide a chip mounting device for semiconductor lasers, so as to solve the defect that the anti-static measures of the existing semiconductor laser chip mounting devices have high use costs.

[0006] In order to solve the above technical problems, the utility model provides the following technical solutions: a patch device for a semiconductor laser, comprising a main frame and a control panel, a semiconductor loading assembly is arranged at one end of the main frame, a tin sheet loading assembly is arranged at one side of the semiconductor loading assembly, a control panel is installed on one side of one end of the main frame, dustproof structures are installed at both ends of one side of the main frame, a feeding assembly is arranged inside one side of the main frame, an anti-static structure is penetrated inside the other side of the main frame, the anti-static structure comprises a wire, a magnet block, a conductive block, a rubber pad and a metal sheet, the wire penetrates inside one side of the main frame, and a mechanical clamp is arranged at one end inside the main frame.

[0007] When in use, the control panel is coded in advance so that it can automatically drive the various equipment components in the device. Then, the materials for semiconductor patch processing are placed inside the semiconductor loading component, the tin sheet loading component and the feeding component respectively, so that the materials can enter the main frame in an orderly manner, and the mechanical clamps accurately stick the materials on the surface of the semiconductor material for patch operation.

[0008] Preferably, the dust-proof structure includes an air intake filter plate, an air intake groove, a cleaning block, a dust-proof net, a reciprocating screw, a connecting plate and an internal threaded sleeve, the air intake filter plate being installed inside one side of the main frame, the air intake filter plate being provided with an air intake groove inside, the air intake groove being slidably connected with a cleaning block inside, a dust-proof net being installed at one end of the air intake filter plate, a reciprocating screw being provided at the other end of the air intake filter plate, one end of the cleaning block being fixedly connected to a connecting plate, one end of the connecting plate being fixedly connected to an internal threaded sleeve, the reciprocating screw being driven to rotate by a motor, and at this time the internal threaded sleeve threadedly connected to the reciprocating screw will reciprocate laterally along the outer thread of the reciprocating screw.

[0009] Preferably, a plurality of the air inlet grooves are disposed inside the air inlet filter plate, and the plurality of the air inlet grooves are distributed at equal intervals inside the air inlet filter plate.

[0010] Preferably, the air intake filter plate and the reciprocating screw are in a rotating structure, and the reciprocating screw and the internal threaded sleeve are in a threaded connection structure, so that the cleaning block can reciprocate to clean the dust.

[0011] Preferably, one end of the outer wall of the wire is fixedly connected to a magnet block, the interior of the magnet block is wrapped with a conductive block, the other end of the outer wall of the wire is fixedly connected to a rubber pad, the interior of one end of the rubber pad is wrapped with a metal sheet, and when static electricity is generated, the static electricity will gradually be guided to the ground along the wire, so as to avoid the static influence of excessive static electricity on the semiconductor material.

[0012] Preferably, the wire and the conductive block are in a linear connection structure, and the rubber pad and the metal sheet are in an inlaid structure, so that the metal sheet can be in close contact with the ground.

[0013] Preferably, the wire and the metal sheet are connected in a linear structure, so that static electricity can be conducted to the ground.

[0014] The utility model provides a patch device for a semiconductor laser, which has the advantages that: by providing an anti-static structure, a magnet block is magnetically adsorbed on the outside of a device at an angle where static electricity is generated, and a rubber pad is attached to the ground so that the rubber pad is in contact with the ground. When static electricity is generated, the static electricity is gradually guided to the ground along a wire, thereby avoiding static influence of excessive static electricity on semiconductor materials, thereby improving the anti-static effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0016] Figure 2 It is a schematic diagram of the three-dimensional cross-sectional structure of the utility model;

[0017] Figure 3 It is a schematic diagram of the three-dimensional partial structure of the dustproof structure of the utility model;

[0018] Figure 4 For the utility model Figure 3 A partial cross-section at the center is an enlarged structural diagram;

[0019] Figure 5 It is a schematic diagram of the three-dimensional structure of the anti-static structure of the utility model.

[0020] In the figure: 1. Main frame; 2. Semiconductor feeding assembly; 3. Tin sheet feeding assembly; 4. Control panel; 5. Dust-proof structure; 501. Air intake filter plate; 502. Air intake slot; 503. Cleaning block; 504. Dust-proof net; 505. Reciprocating screw rod; 506. Connecting plate; 507. Internal thread sleeve; 6. Feeding assembly; 7. Anti-static structure; 701. Wire; 702. Magnet block; 703. Conductive block; 704. Rubber pad; 705. Metal sheet; 8. Mechanical clamp. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-Figure 5The utility model provides a patch device for a semiconductor laser, comprising a main frame 1 and a control panel 4, wherein a semiconductor loading component 2 is arranged at one end of the main frame 1, a tin sheet loading component 3 is arranged at one side of the semiconductor loading component 2, a control panel 4 is installed at one side of one end of the main frame 1, a feeding component 6 is arranged inside one side of the main frame 1, a mechanical clamp 8 is arranged at one end inside the main frame 1, an anti-static structure 7 is penetrated inside the other side of the main frame 1, the anti-static structure 7 comprises a wire 701, a magnet block 702, a conductive block 703, a rubber pad 704 and a metal sheet 705, the wire 701 penetrates inside one side of the main frame 1, one end of the outer wall of the wire 701 is fixedly connected to the magnet block 702, the conductive block 703 is wrapped inside the magnet block 702, the other end of the outer wall of the wire 701 is fixedly connected to the rubber pad 704, one end of the rubber pad 704 is wrapped inside the metal sheet 705, and the wire 701 and the metal sheet 705 are in a linear connection structure.

[0023] See attached Figure 2 and Figure 5 When the device is used, the control panel 4 is coded and input in advance so that it can automatically drive the various equipment components in the device. Then, the materials for semiconductor patch processing are placed in the semiconductor loading component 2, the tin sheet loading component 3 and the feeding component 6 respectively, so that the materials can enter the main frame 1 in an orderly manner, and the mechanical clamp 8 accurately sticks the materials on the surface of the semiconductor material for patch operation. When the device is used for a long time, the friction between the internal materials and manual operation are likely to generate a certain amount of static electricity, and the processing of semiconductor materials is easily affected by static electricity. For this reason, when the device is used, the magnet block 702 can be magnetically adsorbed on the outside of the device at the static electricity generating angle, and the rubber pad 704 can be attached to the ground so that the rubber pad 704 is in contact with the ground. When static electricity is generated, the static electricity will gradually be guided to the ground along the wire 701, so as to avoid the static influence of excessive static electricity on the semiconductor material.

[0024] Dust-proof structures 5 are installed at both ends of one side of the main frame 1. The dust-proof structure 5 includes an air intake filter plate 501, an air intake groove 502, a cleaning block 503, a dust-proof net 504, a reciprocating screw rod 505, a connecting plate 506 and an internal threaded sleeve 507. The air intake filter plate 501 is installed inside one side of the main frame 1. An air intake groove 502 is opened inside the air intake filter plate 501. The cleaning block 503 is slidably connected inside the air intake groove 502. A dust-proof net 504 is installed at one end of the air intake filter plate 501. A reciprocating screw 505 is provided at the other end of the air intake filter plate 501, one end of the cleaning block 503 is fixedly connected to a connecting plate 506, one end of the connecting plate 506 is fixedly connected to an internal threaded sleeve 507, a plurality of air intake grooves 502 are provided inside the air intake filter plate 501, and the plurality of air intake grooves 502 are evenly spaced and distributed inside the air intake filter plate 501, the air intake filter plate 501 and the reciprocating screw 505 are in a rotating structure, and the reciprocating screw 505 and the internal threaded sleeve 507 are in a threaded connection structure.

[0025] See attached Figure 1 , Figure 2 , Figure 3 and Figure 4 When semiconductor materials are processed, external factors such as temperature, humidity, dust, etc. in the processing environment are likely to affect the processing of semiconductor materials. For this reason, an air intake filter plate 501 is installed at a ventilation point opened on one side of the main frame 1 for ventilation and heat dissipation, and the reciprocating screw 505 is driven by a motor to rotate when the device is in use. At this time, the internal threaded sleeve 507 threadedly connected to the reciprocating screw 505 will reciprocate and move laterally along the outer thread of the reciprocating screw 505, and drive the cleaning block 503 to move along the inside of the air intake groove 502 through the connecting plate 506. When the air flows to dissipate heat, external dust will be adsorbed on the surface of the dustproof net 504. If dust accumulates, it will be mixed into the device due to air flow, and the heat dissipation of the device will be affected. When the cleaning block 503 reciprocates along the air intake groove 502, the dust adsorbed on the dustproof net 504 will be scraped and cleaned.

[0026] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A chip placement device for a semiconductor laser, comprising a main frame (1) and a control panel (4); Features: A semiconductor loading assembly (2) is disposed at one end of the main frame (1), a tin sheet loading assembly (3) is disposed at one side of the semiconductor loading assembly (2), and a control panel (4) is installed at one side of one end of the main frame (1); Dust-proof structures (5) are installed at both ends of one side of the main frame (1), and a feeding assembly (6) is arranged inside one side of the main frame (1); An antistatic structure (7) is passed through the interior of the other side of the main frame (1), and the antistatic structure (7) comprises a wire (701), a magnet block (702), a conductive block (703), a rubber pad (704) and a metal sheet (705). The wire (701) passes through the interior of one side of the main frame (1), and a mechanical clamp (8) is provided at one end of the interior of the main frame (1).

2. A chip mounting device for a semiconductor laser according to claim 1, characterized in that: The dustproof structure (5) comprises an air intake filter plate (501), an air intake groove (502), a cleaning block (503), a dustproof net (504), a reciprocating screw rod (505), a connecting plate (506) and an internal threaded sleeve (507); the air intake filter plate (501) is installed inside one side of the main frame (1); an air intake groove (502) is provided inside the air intake filter plate (501); the cleaning block (503) is slidably connected inside the air intake groove (502); a dustproof net (504) is installed at one end of the air intake filter plate (501); a reciprocating screw rod (505) is provided at the other end of the air intake filter plate (501); one end of the cleaning block (503) is fixedly connected to the connecting plate (506); and one end of the connecting plate (506) is fixedly connected to the internal threaded sleeve (507).

3. A chip mounting device for a semiconductor laser according to claim 2, characterized in that: A plurality of the air inlet grooves (502) are disposed inside the air inlet filter plate (501), and the plurality of the air inlet grooves (502) are distributed at equal intervals inside the air inlet filter plate (501).

4. A chip mounting device for a semiconductor laser according to claim 2, characterized in that: The air intake filter plate (501) and the reciprocating screw rod (505) are in a rotating structure, and the reciprocating screw rod (505) and the internal thread sleeve (507) are in a threaded connection structure.

5. The chip mounting device for semiconductor laser according to claim 1, characterized in that: One end of the outer wall of the wire (701) is fixedly connected to a magnet block (702), the interior of the magnet block (702) is wrapped with a conductive block (703), the other end of the outer wall of the wire (701) is fixedly connected to a rubber pad (704), and one end of the rubber pad (704) is wrapped with a metal sheet (705).

6. A chip mounting device for semiconductor laser according to claim 5, characterized in that: The conductive wire (701) and the conductive block (703) are in a linear connection structure, and the rubber pad (704) and the metal sheet (705) are in an inlaid structure.

7. The chip mounting device for semiconductor laser according to claim 5, characterized in that: The conductive wire (701) and the metal sheet (705) are in a linear connection structure.

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