Wave-soldering reflow baffle and wave-soldering equipment

Abstract

The utility model discloses a wave-soldering reflow baffle, which comprises a flow passing plate, a first flow passing part and a second flow passing part, the first flow passing part and the second flow passing part are bent and formed, a first flow passing channel is formed on the first flow passing part, and a second flow passing channel is formed on the second flow passing part; the bottom end of the blocking plate is arranged on the side, away from the second overflowing part, of the first overflowing part, and an assembling structure used for being connected with wave-soldering equipment is arranged on the blocking plate; the wave soldering reflow baffle can solve the problem that a large amount of tin slag is generated in a tin cylinder due to the fact that an existing wave soldering reflow baffle has a poor blocking effect on reflow soldering tin melt and the reflow soldering tin melt still has large impact force.

Description

Technical Field

[0001] The utility model relates to the technical field of wave soldering equipment, in particular to a wave soldering reflow baffle and wave soldering equipment. Background Art

[0002] Wave soldering is a process in which molten liquid solder is pumped into a solder wave of a specific shape on the surface of a solder tank. The PCB board with components inserted is placed on a conveyor chain and passes through the solder wave at a specific angle and a certain immersion depth to achieve soldering of solder points.

[0003] However, during the production process, when the solder melt at the crest flows back to the tin cylinder in both the forward and backward directions, the solder melt is not effectively buffered, causing the reflux solder melt with a greater impact force to directly flow into the tin cylinder. This process is similar to a falling waterfall. During this process, the reflux solder melt with a greater impact force will roll and carry more oxygen into the tin cylinder, so that a large amount of tin slag is formed in the tin cylinder, affecting the welding quality of the PCB board. The tin slag needs to be cleaned regularly, reducing the start-up rate of the wave soldering equipment. Utility Model Content

[0004] The utility model aims to solve the above technical problem, that is, the existing wave soldering reflow baffle has poor blocking effect on the reflowing solder melt, so that the reflowing solder melt still has a large impact force and causes a large amount of tin slag to be generated in the tin cylinder.

[0005] In a first aspect, the utility model provides a wave soldering reflow baffle, comprising:

[0006] A flow plate, the flow plate having a first flow portion and a second flow portion formed by bending, a first flow channel formed on the first flow portion, and a second flow channel formed on the second flow portion;

[0007] The baffle plate has a bottom end disposed on the first flow portion at a side away from the second flow portion, and an assembly structure for connecting to a wave soldering device is disposed on the baffle plate.

[0008] In the preferred technical solution of the above-mentioned wave soldering reflow baffle, the flow ratio of the solder melt passing through the first flow channel and the second flow channel is 1:0.8 to 1:1.2.

[0009] In the preferred technical solution of the above-mentioned wave soldering reflow baffle, the shape of the first flow channel and / or the second flow channel is one or more of circular, waist-shaped, square, triangular, serpentine, and U-shaped.

[0010] In the preferred technical solution of the wave soldering reflow baffle plate, a first fillet is formed at a portion of the current plate where the first current portion and the second current portion are bent and connected.

[0011] In the preferred technical solution of the wave soldering reflow baffle plate, the portion where the first flow-through portion is connected to the baffle plate forms a second fillet.

[0012] In the preferred technical solution of the wave soldering reflow baffle plate, the height of the baffle plate above the first flow-through portion is 10-15 cm.

[0013] In the preferred technical solution of the above wave soldering reflow baffle, the first flow portion extends out of the baffle by a distance of 4-8 cm, and the second flow portion extends out of the first flow portion by a distance of 4-8 cm.

[0014] In the preferred technical solution of the wave soldering reflow baffle plate, the thickness of the current overflow plate and the baffle plate is 1-2 mm.

[0015] In the preferred technical solution of the above-mentioned wave soldering reflow baffle, the reflow baffle is made of titanium alloy material.

[0016] In a second aspect, the utility model further provides a wave soldering device, which includes the above-mentioned wave soldering reflow baffle.

[0017] The beneficial effect of the utility model is that the present application blocks the reflowing solder melt by means of a blocking plate, and guides the solder melt through the first flow channel and the second flow channel on the flow plate, thereby effectively forming a buffer for the reflowing solder melt and reducing the impact force of the reflowing solder melt. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the front baffle plate and the rear baffle plate in the tin cylinder;

[0019] Figure 2 is a first structural schematic diagram of a backflow baffle;

[0020] Figure 3 is a cross-sectional view of a backflow baffle;

[0021] Figure 4 is a second structural schematic diagram of the backflow baffle;

[0022] Figure 5 A schematic diagram of a backflow baffle having a first rounded corner and a second rounded corner;

[0023] In the figure:

[0024] The guide tube 11, the solder wave 12, the front baffle 13, and the rear baffle 14;

[0025] A flow plate 1 , a first flow portion 2 , a first flow channel 21 , a second flow portion 3 , a second flow channel 31 , a blocking plate 4 , an assembly structure 5 , a first fillet 6 , and a second fillet 7 . DETAILED DESCRIPTION

[0026] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0027] It should be noted that in the description of the present invention, the terms "upper", "lower", "left", "right", "front", "rear" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0028] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "disposed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] See also Figure 1 A conventional tin cylinder has a guide tube 11, which is connected to a pump body. Under the action of the pump body, the molten solder forms a specific solder wave 12 (λ wave) on the liquid surface of the tin cylinder, and refluxed molten solder is formed on both sides of the solder wave 12. A front baffle plate 13 and a rear baffle plate 14 are respectively arranged on both sides of the solder wave 12 to reduce the impact force of the refluxed molten solder, thereby reducing the chance of oxygen contacting the molten solder and reducing the generation of tin slag.

[0030] like Figures 2 to 5 As shown, the wave soldering reflow baffle of the utility model comprises: a flow plate 1 and a baffle plate 4, the flow plate 1 has a first flow portion 2 and a second flow portion 3 which are bent into shape, a first flow channel 21 is formed on the first flow portion 2, and a second flow channel 31 is formed on the second flow portion 3; the bottom end of the baffle plate 4 is arranged on the side of the first flow portion 2 away from the second flow portion 3, and the baffle plate 4 is arranged with an assembly structure 5 for connecting with the wave soldering equipment.

[0031] See also Figures 2 to 5, the first flow portion 2 and the second flow portion 3 are arranged perpendicular to each other, the first flow channel 21 vertically penetrates the first flow portion 2, the second flow channel 31 penetrates the second flow portion 3, a plurality of first flow channels 21 are arranged along the length direction of the first flow portion 2, and a plurality of second flow channels 31 are arranged along the length direction of the second flow portion 3. Several first flow channels 21 and several second flow channels 31 may correspond one to one, or may not correspond, or may be arranged in a manner of first flow channel 21-second flow channel 31-first flow channel 21 intervals, and there is no specific limitation. In other possible embodiments, the first flow portion 2 and the second flow portion 3 may also be inclined to each other, and the angle between the two may range from 60 to 120°.

[0032] See also Figures 2 to 5 The baffle plate 4 is a plate-shaped structure, and the bottom end of the baffle plate 4 is installed on the first flow portion 2 of the flow plate 1, so that when the refluxed solder molten liquid flows through the flow plate 1 to the baffle plate 4, the solder molten liquid can be blocked, so that the solder molten liquid can flow back into the tin cylinder through the first flow channel 21 and the second flow channel 31; the present application blocks the refluxed solder molten liquid through the baffle plate 4, and guides the solder molten liquid through the first flow channel 21 and the second flow channel 31 on the flow plate 1, thereby reducing the impact force of the refluxed solder molten liquid.

[0033] See also Figures 2 to 5 The assembly structure 5 configured on the bottom side of the baffle plate 4 can be a plug-in board, and the plug-in board is configured at the bottom of the sides at both ends of the length direction of the baffle plate 4. When the assembly structure 5 is a plug-in board, the wave soldering equipment is correspondingly configured with a plug-in slot matching the plug-in board. When installing the reflow baffle, the plug-in board on the reflow baffle can be inserted into the plug-in slot on the wave soldering equipment. It has the characteristics of convenient plugging and unplugging and easy replacement.

[0034] Alternatively, the assembly structure 5 disposed on the bottom side of the baffle plate 4 can be an "L"-shaped mounting plate, and the mounting plate is provided with screw holes or pin holes. When the reflow baffle is mounted on the wave soldering equipment, bolts or pins are passed through the holes on the mounting plate and connected to the wave soldering equipment. This arrangement makes the reflow baffle have higher stability when in use.

[0035] In one or more embodiments, the flow ratio of the first flow channel 21 to the second flow channel 31 through which the solder melt flows is 1:0.8 to 1:1.2.

[0036] See also Figure 2, the flow rate ratio of the first flow channel 21 and the second flow channel 31 through the solder melt can be 1:0.8, 1:1, or 1:1.2. It should be noted that the flow rate ratio of the first flow channel 21 and the second flow channel 31 through the solder melt represents the size or number of the first flow channel 21 and the second flow channel 31. When the number of the first flow channels 21 and the number of the second flow channels 31 are the same, and the flow rate ratio of the two is 1:0.8, the flow volume of the solder melt in the first flow channel 21 is greater than that in the second flow channel 31. Through the above settings, the flow path of the solder melt can be selected by limiting the flow rate to meet different usage environments.

[0037] In one or more embodiments, the shape of the first flow channel 21 and / or the second flow channel 31 is one or more of a circular shape, a waist shape, a square shape, a triangle shape, a serpentine shape, and a U shape.

[0038] See also Figures 2 to 5 The first flow channel can be one or more of the above shapes, and the second flow channel can be one or more of the above shapes. Specifically, the first flow channel is circular, and the second flow channel is arched. The arched second flow channel can adapt to the flow path of the reflowing solder melt, so that the solder melt is easier to pass through the second flow channel 31, forming a buffer for the reflowing solder melt.

[0039] In one or more embodiments, a first fillet 6 is formed at a portion of the flow plate 1 where the first flow portion 2 and the second flow portion 3 are bent and connected.

[0040] See also Figure 5 The formation of the first fillet 6 can make the reflowing solder melt easier to flow to the top of the first flow portion 2, forming a buffer for the reflowing solder melt, reducing the impact force of the reflowing solder melt, and then reducing the tin slag formed in the tin cylinder, thereby improving the use effect of the present application.

[0041] In one or more embodiments, the portion where the first flow portion 2 is connected to the blocking plate 4 forms a second rounded corner 7 .

[0042] See also Figure 5 The second fillet 7 can also form a buffer for the reflow solder melt, thereby reducing the impact force of the reflow solder melt.

[0043] In one or more embodiments, the height of the blocking plate 4 above the first flow portion 2 is 10-15 cm. The distance that the blocking plate 4 extends out of the first flow portion 2 can be 10 cm, 12 cm, 15 cm, etc., which is determined according to actual production needs. The blocking plate 4 can completely block the reflowing solder melt.

[0044] In one or more embodiments, the first flow portion 2 extends out of the baffle plate 4 by a distance of 4-8 cm, and the second flow portion 3 extends out of the first flow portion 2 by a distance of 4-8 cm.

[0045] Specifically, the width of the first flow portion 2 of the flow plate 1 is 5 cm, and the width of the second flow portion 3 is 5 cm, which are selected according to actual production needs.

[0046] In one or more embodiments, the thickness of the flow plate 1 and the blocking plate 4 is 1-2 mm.

[0047] In one or more embodiments, the backflow baffle is made of titanium alloy material. The backflow baffle made of titanium alloy material can reduce the possibility of being corroded by high-temperature solder melt and extend the service life of the backflow baffle.

[0048] In other possible implementations, the surface of the reflow baffle is sprayed with a polytetrafluoroethylene coating. It should be noted that the polytetrafluoroethylene coating has a certain self-lubricating effect, which can enable the solder melt to move quickly on the surface of the reflow baffle, and indirectly form a buffer for the solder melt.

[0049] In addition, the utility model also provides a wave soldering device, the wave soldering device includes the above-mentioned wave soldering reflow baffle. Figure 1 In the wave soldering equipment, the above-mentioned wave soldering reflow baffle can be used as a front baffle 13 or a rear baffle 14, without any specific limitation.

[0050] The above implementation modes are only for illustrating the technical concept and features of the utility model, and their purpose is to allow people familiar with this technology to understand the content of the utility model and implement it. It cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A wave soldering reflow baffle, characterized in that: include: A flow plate, the flow plate having a first flow portion and a second flow portion formed by bending, a first flow channel formed on the first flow portion, and a second flow channel formed on the second flow portion; The baffle plate has a bottom end disposed on the first flow portion at a side away from the second flow portion, and an assembly structure for connecting to a wave soldering device is disposed on the baffle plate.

2. The wave soldering reflow baffle according to claim 1, characterized in that: The flow rate ratio of the first flow channel to the second flow channel through which the solder melt flows is 1:0.8 to 1:1.

2.

3. The wave soldering reflow baffle according to claim 1, characterized in that: The shape of the first flow passage and / or the second flow passage is one or more of a circular shape, a waist shape, a square shape, a triangle shape, a serpentine shape, and a U shape.

4. The wave soldering reflow baffle according to claim 1, characterized in that: The portion of the flow plate where the first flow portion and the second flow portion are bent and connected forms a first fillet.

5. The wave soldering reflow baffle according to claim 1, characterized in that: A portion where the first flow portion is connected to the blocking plate forms a second fillet.

6. The wave soldering reflow baffle according to claim 1, characterized in that: The height of the baffle plate above the first flow portion is 10-15 cm.

7. The wave soldering reflow baffle according to claim 1, characterized in that: The first flow portion extends out of the baffle plate by a distance of 4-8 cm, and the second flow portion extends out of the first flow portion by a distance of 4-8 cm.

8. The wave soldering reflow baffle according to claim 1, characterized in that: The thickness of the flow plate and the baffle plate is 1-2 mm.

9. The wave soldering reflow baffle according to any one of claims 1 to 8, characterized in that: The backflow baffle is made of titanium alloy material.

10. A wave soldering equipment, characterized in that: The invention comprises the wave soldering reflow baffle as described in any one of claims 1 to 9.

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