Wave-soldering reflow baffle and wave-soldering equipment

Abstract

The utility model discloses a wave soldering reflow baffle plate, which comprises a main body plate, two ends of the main body plate are bent towards the same direction to form bending parts, the main body plate is provided with a partition plate connected with the bending parts, the main body plate is provided with a first channel and a second channel at two sides of the partition plate respectively, and the partition plate is provided with a third channel; the side plate is arranged on the main body plate and is positioned on one side close to the second channel relative to the partition plate; according to the tin cylinder, the problem that the tin slag generation rate in the tin cylinder is high due to the fact that a tin soldering melt backflow baffle in a traditional tin cylinder cannot effectively buffer tin soldering melt can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of wave soldering equipment, in particular to a wave soldering reflow baffle and wave soldering equipment. Background Art

[0002] Wave soldering is a process in which molten liquid solder is pumped into a solder wave of a specific shape on the surface of a solder tank. The PCB board with components inserted is placed on a conveyor chain and passes through the solder wave at a specific angle and a certain immersion depth to achieve soldering of solder points.

[0003] However, in the actual production process, when the molten solder at the crest flows back to the tin cylinder in the forward and backward directions, the molten solder is not effectively buffered, resulting in the refluxed molten solder with a greater impact force directly flowing into the tin cylinder. In this process, the refluxed molten solder with a greater impact force will mix more oxygen in the air, thereby causing the molten solder inside the tin cylinder to be oxidized and produce a large amount of tin slag. This will not only lead to a decrease in welding quality, but also require regular cleaning of the tin slag, reducing the start-up rate of the wave soldering equipment. Utility Model Content

[0004] The utility model aims to solve the above technical problem, that is, the molten solder reflow baffle in the traditional tin cylinder cannot effectively buffer the molten solder, resulting in a high rate of tin slag generation inside the tin cylinder.

[0005] In a first aspect, the utility model provides a wave soldering reflow baffle, comprising:

[0006] The main body plate has two ends bent in the same direction to form a bent portion, the main body plate is provided with a partition connected to the bent portion, the main body plate is provided with a first channel and a second channel on both sides of the partition, and the partition is provided with a third channel;

[0007] The side plate is arranged on the main body plate and is located at a side close to the second channel relative to the partition plate.

[0008] In the preferred technical solution of the above-mentioned wave soldering reflow baffle, a buffer plate is installed at the bottom of the main plate through an extension plate, wherein the extension plate is located between the first channel and the second channel, and the buffer plate has a fourth channel below the first channel.

[0009] In the preferred technical solution of the wave soldering reflow baffle, the shapes of the first channel, the second channel, the third channel and the fourth channel are one or more of circular, waist-shaped, rectangular, triangular and serpentine.

[0010] In the preferred technical solution of the above wave soldering reflow baffle, at least one end of the extension plate extends toward the fourth channel to form an extension portion.

[0011] In the preferred technical solution of the wave soldering reflow baffle, the height of the connection between the partition and the bending portion is 4-10 cm.

[0012] In the preferred technical solution of the wave soldering reflow baffle, the height of the extension plate is 5-15 cm.

[0013] In the preferred technical solution of the wave soldering reflow baffle, both ends of the buffer plate extend toward a side away from the bending portion to form a mounting portion having a mounting hole.

[0014] In the preferred technical solution of the wave soldering reflow baffle, a polytetrafluoroethylene coating is sprayed on the surface of the reflow baffle.

[0015] In the preferred technical solution of the wave soldering reflow baffle, the reflow baffle is made of titanium alloy material.

[0016] In a second aspect, the utility model further provides a wave soldering device, which includes the above-mentioned wave soldering reflow baffle.

[0017] The beneficial effect of the utility model is that after the reflowing solder melt is buffered once by the main body plate, the partition plate, the side plate and the buffer plate are used in combination to achieve secondary buffering of the solder melt, which greatly reduces the impact force of the solder melt, thereby avoiding the problem of the solder melt rushing oxygen in the air into the tin cylinder due to the large impact force, thereby preventing the generation of tin slag inside the tin cylinder, thereby reducing the generation of tin slag in the tin cylinder. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the front baffle and the rear baffle in the tin cylinder;

[0019] Figure 2 This is a first structural schematic diagram of the utility model;

[0020] Figure 3 It is a cross-sectional view of the utility model;

[0021] Figure 4 It is a second structural schematic diagram of the utility model;

[0022] Figure 5 It is a top view of the utility model;

[0023] In the figure:

[0024] The guide tube 11, the solder wave 12, the front baffle 13, and the rear baffle 14;

[0025] The main plate 1 , the bending portion 10 , the partition plate 2 , the first channel 3 , the second channel 4 , the third channel 5 , the side plate 6 , the extension plate 7 , the extension portion 71 , the buffer plate 8 , the mounting portion 81 , the mounting hole 82 , and the fourth channel 9 . DETAILED DESCRIPTION

[0026] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0027] It should be noted that in the description of the present invention, the terms "upper", "lower", "left", "right", "front", "rear" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0028] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "disposed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] See also Figure 1 A conventional tin cylinder has a guide tube 11, which is connected to a pump body. Under the action of the pump body, the molten solder forms a specific solder wave 12 (λ wave) on the liquid surface of the tin cylinder, and refluxed molten solder is formed on both sides of the solder wave 12. A front baffle plate 13 and a rear baffle plate 14 are respectively arranged on both sides of the solder wave 12 to reduce the impact force of the refluxed molten solder, thereby reducing the chance of oxygen contacting the molten solder and reducing the generation of tin slag.

[0030] like Figures 2 to 5 As shown, the utility model provides a wave soldering reflow baffle comprising: a main body plate 1, both ends of which are bent in the same direction to form a bending portion 10, a partition plate 2 connected to the bending portion 10 is arranged on the main body plate 1, a first channel 3 and a second channel 4 are respectively opened on both sides of the partition plate 2 of the main body plate 1, and the partition plate 2 is opened with a third channel 5; a side plate 6, which is arranged on the main body plate 1 and is located on the side close to the second channel 4 relative to the partition plate 2.

[0031] See also Figure 2 , Figure 4The two ends of the main plate 1 are vertically bent upward, thereby forming bending portions 10 at the two ends of the main plate 1, and a partition 2 is connected between the two bending portions 10, and the bottom end of the partition 2 is connected to the upper surface of the main plate 1, and the main plate 1 has a plurality of first channels 3 and second channels 4 opened on both sides of the partition 2 along the length direction of the main plate 1, that is, when the solder melt reflows to the reflux baffle, it can enter the tin cylinder through the first channel 3 or the second channel 4. By setting a plurality of first channels 3 and a plurality of second channels 4, the efficiency of the solder melt passing through the main plate 1 can be effectively improved, and the phenomenon of secondary impact of the solder melt at the main plate 1 can be avoided.

[0032] See also Figures 2 to 4 The third channel 5 which penetrates through the side surface of the partition 2 perpendicular to the main plate 1 can connect the first channel 3 and the second channel 4, so that when the solder melt first passes through the first channel 3, the solder melt can enter the partition 2 at the second channel 4 through the third channel 5 on the partition 2, further alleviating the impact force generated by the solder melt when it refluxes and falls, thereby reducing the oxygen carried by the refluxed solder melt and reducing the generation of tin slag in the tin cylinder.

[0033] See also Figures 2 to 4 , the side plate 6 is mounted on the side of the main plate 1, and the two ends of the side plate 6 are mounted on the bent portions 10 at the two ends of the main plate 1, so that the side plate 6, the main plate 1, the bent portion 10 and the partition 2 form a receiving space with only the top opening, wherein the second channel 4 is located between the side plate 6 and the partition 2. Through this arrangement, the solder melt entering the receiving space through the third channel 5 can be blocked by the side plate 6, so that the solder melt slowly flows into the tin cylinder through the second channel 4, reducing the impact force generated when the solder melt flows back to the tin cylinder, and then further reducing the oxygen carried by the refluxed solder melt, further reducing the generation of tin slag in the tin cylinder, and improving the welding quality of the PCB board.

[0034] In a possible implementation manner, the partition plate 2 may be arranged at an angle between the two bending portions 10 , or the partition plate 2 may be perpendicular to the two bending portions respectively.

[0035] In a possible implementation manner, the plurality of first channels 3 and the plurality of second channels 3 are symmetrically arranged one by one with the partition plate 2 as the center; in other possible implementation manners, the plurality of first channels 3 and the plurality of second channels 4 are not symmetrical.

[0036] In one or more embodiments, a buffer plate 8 is installed at the bottom of the main plate 1 through an extension plate 7, wherein the extension plate 7 is located between the first channel 3 and the second channel 4, and the buffer plate 8 opens a fourth channel 9 below the first channel 3.

[0037] See also Figure 2 , Figure 4The buffer plate 8 is installed at the bottom of the main plate 1 through the extension plate 7. The buffer plate 8 is parallel to the main plate 1, and the extension plate 7 is located between the first channel 3 and the second channel 4, so as to divert the solder melt flowing from the first channel 3 and the second channel 4 to the bottom of the main plate 1, and further reduce the impact force of the solder melt when it flows back; there are several fourth channels 9 opened on the buffer plate 8, so that the solder melt flowing from the first channel 3 to the buffer plate 8 can be buffered twice under the action of the buffer plate 8, and enter the tin cylinder through the fourth channel 9; after the main plate 1 is used to buffer the refluxed solder melt once, the partition plate 2, the side plate 6 and the buffer plate 8 are used in combination to achieve secondary buffering of the solder melt, which greatly reduces the impact force of the solder melt, and then avoids the problem of the solder melt rushing oxygen in the air into the tin cylinder due to the large impact force, thereby causing tin slag to be generated inside the tin cylinder.

[0038] In one possible implementation, the plurality of first channels 3 and the plurality of fourth channels 9 are not coaxial in the vertical direction. In other possible implementations, the plurality of first channels 3 and the plurality of fourth channels 9 are all coaxial in the vertical direction.

[0039] In one or more embodiments, the shapes of the first channel 3, the second channel 4, the third channel 5 and the fourth channel 9 are one or more of circular, waist-shaped, rectangular, triangular and serpentine.

[0040] See also Figure 2 , the drawings only show that the first channel 3, the second channel 4, the third channel 5 and the fourth channel 9 present a circular hole structure, and the first channel 3, the second channel 4, the third channel 5 and the fourth channel 9 can also be waist-shaped, rectangular, triangular, serpentine, or a combination of one or more of the shapes of the shape, waist-shaped, rectangular, triangular, and serpentine. It should be noted that the shape and size of the first channel 3, the second channel 4, the third channel 5 and the fourth channel 9 can be determined according to the flow rate of the refluxed solder melt, for example, the aperture of the circular hole can be 1-1.5 cm.

[0041] In one or more embodiments, at least one end of the extension plate 7 extends toward the fourth channel 9 to form an extension portion 71 .

[0042] See also Figures 2 to 4 One end of the extension plate 7 is bent and extended to form an extension portion 71, and the extension portion 71 is set at 90 degrees with the extension plate 7. The extension portion 71 can gather the solder melt flowing down through the first channel 3 to avoid the turbulence caused by the molten solder scattered in the tin cylinder, improve the stability of the flow of the reflux solder melt, and improve the use effect of the present application. In other possible implementations, both ends of the extension portion 71 are bent toward the fourth channel 9 to form the extension portion 71.

[0043] In one or more embodiments, the height of the partition 2 and the bent portion 10 is 4-10 cm. The height of the partition 2 and the bent portion is the height that can block the reflowing solder melt, which can be 5 cm, 6 cm, 7 cm, 8 cm, etc. according to actual selection.

[0044] In one or more embodiments, the height of the extension plate 7 is 5-15 cm. The height of the extension plate 7 is the height between the buffer plate 8 and the main plate 1, which can be selected according to actual conditions, such as 5 cm, 8 cm, 10 cm, 12 cm, etc.

[0045] In one or more embodiments, two ends of the buffer plate 8 extend toward a side away from the bent portion 10 to form a mounting portion 81 having a mounting hole 82 .

[0046] See also Figure 2 The mounting hole 82 may be a waist-shaped hole, a bolt hole, etc. The mounting portion 81 is used to mount the reflow baffle as a whole on the tin cylinder of the wave soldering equipment.

[0047] In one or more embodiments, a polytetrafluoroethylene coating is sprayed on the surface of the reflow baffle. The polytetrafluoroethylene coating has a certain self-lubricating effect, which can make the solder melt flow quickly on the surface of the reflow baffle.

[0048] In one or more embodiments, the backflow baffle is made of titanium alloy material. This arrangement can reduce the corrosion of the backflow baffle by high-temperature solder melt and extend the service life of the backflow baffle.

[0049] In addition, the utility model also provides a wave soldering equipment, which includes the above-mentioned wave soldering reflow baffle. In the wave soldering equipment, the wave soldering reflow baffle can be used as a front baffle or a rear baffle of the solder melt; in other possible ways, the wave soldering reflow baffle can also be used as a front baffle and a rear baffle of the solder melt.

[0050] The above implementation modes are only for illustrating the technical concept and features of the utility model, and their purpose is to allow people familiar with this technology to understand the content of the utility model and implement it. It cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A wave soldering reflow baffle, characterized in that: include: The main body plate has two ends bent in the same direction to form a bent portion, the main body plate is provided with a partition connected to the bent portion, the main body plate is provided with a first channel and a second channel on both sides of the partition, and the partition is provided with a third channel; The side plate is arranged on the main body plate and is located at a side close to the second channel relative to the partition plate.

2. The wave soldering reflow baffle according to claim 1, characterized in that: A buffer plate is installed at the bottom of the main body plate through an extension plate, wherein the extension plate is located between the first channel and the second channel, and the buffer plate is provided with a fourth channel below the first channel.

3. The wave soldering reflow baffle according to claim 2, characterized in that: The shapes of the first channel, the second channel, the third channel and the fourth channel are one or more of circular, waist-shaped, rectangular, triangular and serpentine.

4. The wave soldering reflow baffle according to claim 2, characterized in that: At least one end of the extension plate extends toward the fourth channel to form an extension portion.

5. The wave soldering reflow baffle according to claim 1, characterized in that: The height of the connection between the partition and the bending portion is 4-10 cm.

6. The wave soldering reflow baffle according to claim 2, characterized in that: The height of the extension plate is 5-15 cm.

7. The wave soldering reflow baffle according to claim 2, characterized in that: Two ends of the buffer plate extend toward a side away from the bent portion to form a mounting portion with a mounting hole.

8. The wave soldering reflow baffle according to any one of claims 1 to 7, characterized in that: The surface of the reflux baffle is sprayed with a polytetrafluoroethylene coating.

9. The wave soldering reflow baffle according to any one of claims 1 to 7, characterized in that: The reflux baffle is made of titanium alloy material.

10. A wave soldering equipment, comprising the wave soldering reflow baffle according to any one of claims 1 to 9.

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