Heat dissipation device and heat dissipation system
By designing highly targeted heat dissipation devices in electronic devices, using heat dissipation components and passive heat dissipation structures with different heat dissipation capabilities, the problem of uneven heat dissipation in the existing technology is solved, and more efficient heat dissipation effect and longer service life are achieved. .
Patent Information
- Application Number
- CN202420456761.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-10
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-03-10
AI Technical Summary
Existing heat dissipation devices cannot perform targeted heat dissipation for high-heating and low-heating areas in electronic devices, resulting in unsatisfactory heat dissipation effects.
A heat dissipation device is designed, by setting a heat dissipation component with different heat dissipation capabilities to thermally connect with the high-heat zone and low-heat zone of the heating assembly, and a passive heat dissipation structure is provided between the heat dissipation components to improve the heat dissipation effect. The device includes a phase change heat dissipation structure and a passive heat dissipation structure, and uses components such as thermal conduction plates and inflation plate components to achieve efficient heat dissipation.
It effectively improves the temperature uniformity and heat dissipation effect of the heating components, extends the service life of the heating components, and improves the heat dissipation efficiency by reducing interference between the heat dissipation components and increasing the heat dissipation area.
Smart Images
Figure CN222170270U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic heat dissipation, in particular to a heat dissipation device and a heat dissipation system. Background Art
[0002] The heating components in some existing electronic devices include high heating areas and low heating areas. In order to solve the heating problem of the electronic equipment, a heat sink is generally provided to be thermally connected to the heating components in the electronic equipment. However, since the existing heat sink has a single heat dissipation method, it cannot dissipate heat to different heating areas of the heating components in a targeted manner, resulting in unsatisfactory heat dissipation effect. Utility Model Content
[0003] In view of this, the utility model is dedicated to providing a heat dissipation device, which effectively improves the heat dissipation effect by arranging heat dissipation components with different heat dissipation capabilities to be thermally connected to the high heat generation area and the low heat generation area of the heat generation component. In addition, the utility model also provides a heat dissipation system including the above heat dissipation device.
[0004] In order to achieve the above object, the utility model provides the following technical solutions:
[0005] A heat dissipation device, comprising:
[0006] A heat dissipation frame having a first fixing position and a second fixing position;
[0007] A first heat dissipation portion, mounted at the first fixing position, comprising a phase change heat dissipation structure;
[0008] A second heat dissipation portion, installed at the second fixing position, includes a first passive heat dissipation structure;
[0009] A second passive heat dissipation structure is provided between the first fixing position and the second fixing position, and the first heat dissipation portion and the second heat dissipation portion can be thermally connected to the high heat generation area and the low heat generation area of the heat generation component respectively.
[0010] Preferably, the heat dissipation frame includes a frame body having a U-shaped groove structure, and the second passive heat dissipation structure, the first heat dissipation portion and the second heat dissipation portion are all located in the groove cavity of the frame body.
[0011] Preferably, the side of the bottom wall of the frame body facing away from the slot cavity is the installation side of the heating component;
[0012] The first fixing position and the second fixing position are formed by opening holes at the bottom of the slot cavity, so that a part of the first heat dissipation part and a part of the second heat dissipation part can be embedded in the bottom of the slot cavity and contact the heat generating component.
[0013] Preferably, the first heat dissipation portion comprises a first heat conducting plate, the first heat conducting plate passes through the first fixing position and is thermally connected to the high heat generation area of the heat generating component and the phase change heat dissipation structure at the same time;
[0014] The second heat dissipation portion includes a second heat conducting plate, which passes through the second fixing position and is thermally connected to the low heat generation area of the heat generating component and the first passive heat dissipation structure.
[0015] Preferably, the phase change heat dissipation structure comprises:
[0016] A blowing plate assembly, comprising a plurality of blowing plates arranged in parallel, wherein the blowing plates have a phase change cavity inside, and the phase change cavity comprises a heat absorption zone and a phase change zone;
[0017] The cover plate is arranged on one side of the blowing plate close to the heat absorption area and is thermally connected to the high heating area of the heating component. The cover plate has a cooling cavity inside that is connected to the phase change cavities of the multiple blowing plates.
[0018] Preferably, a protective plate for protecting the phase-change heat dissipation structure is provided on a side of the phase-change heat dissipation structure away from the first heat conducting plate.
[0019] Preferably, a comb plate is provided between the protective plate and the blowing plate assembly, and a plurality of mounting grooves for fixing the blowing plate are provided on one side of the comb plate close to the blowing plate assembly, and the mounting grooves are arranged one-to-one with the blowing plates.
[0020] Preferably, a plurality of through holes are provided on the protective plate so that gas can pass through the protective plate.
[0021] Preferably, the first passive heat dissipation structure comprises a plurality of first heat dissipation fins, and the plurality of first heat dissipation fins are arranged in parallel on the second heat conducting plate;
[0022] The second passive heat dissipation structure includes a plurality of second heat dissipation fins, and the plurality of second heat dissipation fins are arranged in parallel at the bottom of the slot cavity of the frame body.
[0023] A heat dissipation system, comprising:
[0024] Heat generating components, including high heat generating areas and low heat generating areas;
[0025] The heat dissipation device is the heat dissipation device mentioned above.
[0026] It can be seen from the above technical scheme that the heat dissipation device provided by the utility model has a first heat dissipation part and a second heat dissipation part with different heat dissipation capabilities, and the first heat dissipation part with relatively strong heat dissipation capability is thermally connected to the high heat area of the heat generating component, and the second heat dissipation part with relatively weak heat dissipation capability is thermally connected to the low heat area of the heat generating component. In this way, the uniformity of the overall temperature of the heat generating component can be effectively improved, thereby improving the heat dissipation effect. At the same time, it can also alleviate the situation where the heat in the high heat area of the heat generating component is transferred to the low heat area, thereby helping to increase the service life of the heat generating component. In addition, a second passive heat dissipation structure is provided between the first heat dissipation part and the second heat dissipation part. On the one hand, this can reduce the mutual interference between the first heat dissipation part and the second heat dissipation part to ensure that the first heat dissipation part and the second heat dissipation part can both achieve the expected heat dissipation effect; on the other hand, the second passive heat dissipation structure can also increase the overall heat dissipation area of the heat dissipation device, thereby improving the heat dissipation efficiency and heat dissipation effect of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 Shown is a schematic structural diagram of a heat dissipation device provided in an embodiment of the utility model;
[0028] Figure 2 The figure shows a schematic structural diagram of a heat dissipation frame provided in an embodiment of the utility model;
[0029] Figure 3 The figure is a schematic structural diagram of a first heat dissipation part provided in an embodiment of the utility model;
[0030] Figure 4 Shown Figure 3 An exploded view of the first heat dissipation part;
[0031] Figure 5 Shown is a structural schematic diagram of a second heat dissipation portion provided in an embodiment of the utility model.
[0032] exist Figure 1-Figure 5 middle:
[0033] 1- heat dissipation frame, 2- first heat dissipation part, 3- second heat dissipation part;
[0034] 11-frame, 12-second passive heat dissipation structure;
[0035] 21-protection plate, 22-comb plate, 23-liquid injection pipe, 24-blowing plate, 25-cover plate, 26-first heat conduction plate;
[0036] 31 - second heat conducting plate, 32 - first passive heat dissipation structure. DETAILED DESCRIPTION
[0037] The embodiment of the utility model provides a heat dissipation device, and also provides a heat dissipation system including the heat dissipation device.
[0038] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0039] First, it should be noted that the heat dissipation device in the present invention is suitable for dissipating heat from devices or electronic devices with uneven heating, where the uneven heating refers to the presence of high heating areas and low heating areas in the device or electronic device during operation. For example, the heat dissipation device in the present invention is suitable for dissipating heat from outdoor communication equipment.
[0040] like Figure 1-Figure 5 As shown, the heat dissipation device in the embodiment of the utility model includes a heat dissipation frame 1, a first heat dissipation part 2 and a second heat dissipation part 3, wherein the heat dissipation frame 1 has a first fixed position and a second fixed position, the first heat dissipation part 2 is installed at the first fixed position, and includes a phase change heat dissipation structure (i.e., a heat dissipation structure that utilizes a phase change of a substance to absorb or release a large amount of heat, the above-mentioned phase change of a substance refers to the mutual transformation of a substance between a solid state and a liquid state, or the mutual transformation of a substance between a liquid state and a gas state), the second heat dissipation part 3 is installed at the second fixed position, and includes a first passive heat dissipation structure 32 (i.e., a heat dissipation structure that does not rely on external energy input, but only relies on natural physical processes such as heat conduction, heat convection and radiation to achieve heat dissipation); in addition, a heat dissipation device 32 is installed between the first fixed position and the second fixed position. There is a second passive heat dissipation structure 12 (the heat dissipation principle is consistent with the above-mentioned first passive heat dissipation structure 32, which will not be repeated here), and the first heat dissipation part 2 and the second heat dissipation part 3 can be thermally connected to the high heat generation area (i.e., the area with higher heat generation and / or heat generation efficiency) and low heat generation area (i.e., the area with lower heat generation and / or heat generation efficiency) of the heat generating component (the heat generating component refers to a device or electronic device that generates heat during operation, such as outdoor communication equipment) respectively; when the heat dissipation device is in working state, the heat generated by the heat generating component is transferred to the heat dissipation device along the temperature gradient, and is quickly transferred to the external environment under the action of the first heat dissipation part 2, the second heat dissipation part 3 and the heat dissipation frame 1 of the heat dissipation device, so that the heat generating component can be prevented from working abnormally due to excessive temperature.
[0041] As described above, since the heat dissipation device has the first heat dissipation part 2 and the second heat dissipation part 3 with different heat dissipation capabilities, and the first heat dissipation part 2 with relatively strong heat dissipation capability is thermally connected to the high heat area of the heat dissipation component, and the second heat dissipation part 3 with relatively weak heat dissipation capability is thermally connected to the low heat area of the heat dissipation component, the uniformity of the temperature of the entire heat dissipation component can be effectively improved, thereby improving the heat dissipation effect. At the same time, it can also alleviate the situation where the heat from the high heat area of the heat dissipation component is transferred to the low heat area, thereby helping to increase the service life of the heat dissipation component. In addition, a second passive heat dissipation structure 12 is provided between the first heat dissipation part 2 and the second heat dissipation part 3. On the one hand, this can reduce the mutual interference between the first heat dissipation part 2 and the second heat dissipation part 3 to ensure that the first heat dissipation part 2 and the second heat dissipation part 3 can both achieve the expected heat dissipation effect; on the other hand, the second passive heat dissipation structure 12 can also increase the overall heat dissipation area of the heat dissipation device, thereby improving the heat dissipation efficiency and heat dissipation effect of the heat dissipation device.
[0042] like Figure 1 and Figure 2 As shown, the heat dissipation frame 1 includes a frame 11 with a U-shaped groove structure, and the second passive heat dissipation structure 12, the first heat dissipation part 2 and the second heat dissipation part 3 are all located in the groove cavity of the frame 11. In this way, the frame 11 with a U-shaped groove structure can be used as a protective structure for the second passive heat dissipation structure 12, the first heat dissipation part 2 and the second heat dissipation part 3 to prevent the above heat dissipation structure from being damaged under the action of external force. In addition, since the U-shaped groove structure has openings in three directions, it can also reduce the influence of the frame wall of the frame 11 on the gas flow, thereby ensuring the heat dissipation capacity of the above heat dissipation part. Of course, the frame 11 in the utility model is not limited to the U-shaped groove structure. During specific implementation, the frame 11 can also be set to other shapes such as L-shaped and straight plate-shaped structures according to heat dissipation and structural requirements.
[0043] In addition, regarding the connection mode between the second passive heat dissipation structure 12, the first heat dissipation part 2, the second heat dissipation part 3 and the frame 11, an adaptive design can be performed according to needs during specific implementation, and the present utility model does not make specific limitations on this.
[0044] In some embodiments, the heat dissipation frame 1 is prepared by die-casting, and the second passive heat dissipation structure 12 is integrally formed with the frame body 11; the first heat dissipation portion 2 is non-detachably connected to the frame body 11. Specifically, taking the U-shaped groove structure of the frame body 11 as an example, the first heat dissipation portion 2 and the side wall of the frame body 11 are welded (for example, friction welding) to fix the first heat dissipation portion 2 to the first fixed position of the heat dissipation frame 1; the second heat dissipation portion 3 is detachably connected to the frame body 11 through a threaded structure. Specifically, a plurality of screw holes for screws to pass through are provided on the second fixed position of the frame body 11, and threaded holes are provided at positions corresponding to the screw holes on the second heat dissipation portion 3, and the threads of the threaded holes match the threads of the above-mentioned screws. In this way, the second heat dissipation portion 3 can be fixed to the second fixed position of the frame body 11 by screws. Under this setting, on the one hand, the second passive heat dissipation structure 12 is integrally formed with the frame 11, which can effectively enhance the structural strength of the frame 11 itself and reduce the probability of deformation thereof under the action of external force, thereby being able to better install and protect the first heat dissipation part 2 and the second heat dissipation part 3; on the other hand, the second heat dissipation part 3 is detachably connected to the frame 11, which is conducive to the disassembly, maintenance and replacement of the second heat dissipation part 3. In this way, in specific applications, the heat dissipation efficiency of the heat dissipation device can be adjusted according to the heat generation of the heat-generating component, or the second heat dissipation part 3 with different heat dissipation efficiencies can be replaced according to the heat generation of the heat-generating component, thereby improving the application scope of the heat dissipation device (it should be clarified here that the first heat dissipation part 2 includes a phase change heat dissipation structure, which can adjust the heat dissipation efficiency by adjusting the heat dissipation medium in the phase change heat dissipation structure. Therefore, even if the first heat dissipation part 2 is non-detachably connected to the heat dissipation frame 1, its heat dissipation efficiency can still be adjusted).
[0045] In other embodiments, different from the above embodiments, the first heat dissipation part 2 and the frame 11 are also detachably connected through a threaded structure. The specific setting method can refer to the connection method between the second heat dissipation part 3 and the heat dissipation frame 1 above, which will not be repeated here. Under this setting method, the composition of the heat dissipation device is more flexible, and different heat dissipation structures can be adjusted at any time according to heat dissipation needs. Therefore, its design flexibility is higher, and better heat dissipation effect can be achieved.
[0046] In addition, in some other embodiments, the second passive heat dissipation structure 12 can also be set as a heat dissipation structure relatively independent of the frame 11, and the second passive heat dissipation structure 12 is detachably connected to the frame 11; the second heat dissipation part 3 can also be fixed to the heat dissipation frame 1 by other non-detachable connection methods such as welding.
[0047] As mentioned above, the first heat dissipation part 2 and the second heat dissipation part 3 can be thermally connected to the high-heating area and the low-heating area of the heating component respectively. In some embodiments, the heating component is installed on the side of the bottom wall of the frame 11 away from the groove cavity; on this basis, the first heat dissipation part 2 and the second heat dissipation part 3 can be thermally connected to the heating component through the bottom wall of the frame 11, but under this setting, the heat dissipation capacity of the first heat dissipation part 2 and the second heat dissipation part 3 will be affected by the frame 11, and thus the best heat dissipation effect cannot be achieved. To address this problem, in some preferred embodiments, the first fixed position and the second fixed position are formed by opening a hole at the bottom of the groove cavity, so that a part of the first heat dissipation part 2 and a part of the second heat dissipation part 3 can be embedded in the bottom of the groove cavity and contact the heating component; in this way, the heat generated by the heating component can be directly transferred to the first heat dissipation part 2 and the second heat dissipation part 3, and then the heat dissipation capacity of the first heat dissipation part 2 and the second heat dissipation part 3 can be fully exerted, and the heat dissipation effect and heat dissipation efficiency of the heat dissipation device can be improved.
[0048] Further, in some embodiments, a heat conducting plate is provided to enable the first heat dissipation portion 2 and the second heat dissipation portion 3 to penetrate the bottom wall of the frame 11 and contact the heat generating component. Specifically, in an exemplary embodiment, the first heat dissipation portion 2 includes a first heat conducting plate 26, which penetrates the first fixed position and is thermally connected to the high heat generating area and the phase change heat dissipation structure of the heat generating component; the second heat dissipation portion 3 includes a second heat conducting plate 31, which penetrates the second fixed position and is thermally connected to the low heat generating area and the first passive heat dissipation structure 32 of the heat generating component.
[0049] In addition, in some embodiments, the phase change heat dissipation structure includes a blowing plate 24 assembly and a cover plate 25, wherein the blowing plate 24 assembly includes a plurality of blowing plates 24 arranged in parallel, the blowing plate 24 has a phase change cavity inside, and the phase change cavity includes a heat absorption zone and a phase change zone; the cover plate 25 is arranged on the side of the blowing plate 24 close to the heat absorption zone, and is thermally connected to the high heat generation zone of the heat generating assembly, and the cover plate 25 has a cooling cavity inside that is connected to the phase change cavities of the plurality of blowing plates 24. Specifically, as Figure 1As shown, when the heat dissipation device is in use, the heat absorption zone and cooling chamber of the phase change cavity have a heat dissipation medium that can change between gas and liquid states, and the phase change zone of the phase change cavity is located above the heat absorption zone. In this way, after the heating component generates heat, a temperature gradient will be generated between the heating component and the above-mentioned heat dissipation medium. The heat is transferred from the heating component to the heat dissipation medium under the above-mentioned temperature gradient. After the heat dissipation medium absorbs the heat, part of the heat dissipation medium is transformed from liquid to gas, and rises to the phase change zone of the phase change cavity. It exchanges heat with the external environment in the phase change zone, and falls back to the heat absorption zone to participate in the next cycle after heat dissipation and liquefaction. In addition, it should be noted that although the heat dissipation medium dissipates heat and liquefies in the phase change zone, this does not mean that only the phase change zone of the phase change cavity of the entire first heat dissipation part 2 is exchanging heat with the outside world. In fact, during the heat dissipation process, after the liquid heat dissipation medium absorbs heat, as long as its temperature is greater than the temperature of the external environment, it will exchange heat with the external environment.
[0050] Further, such as Figure 4 As shown, the first heat dissipation part 2 includes an L-shaped liquid injection pipe 23, and the liquid injection pipe 23 is connected to the cooling cavity of the cover plate 25, so as to introduce the heat dissipation medium into the cooling cavity and the phase change cavity.
[0051] Further, such as Figure 3 and Figure 4 As shown, a protective plate 21 for protecting the phase-change heat dissipation structure is provided on one side of the phase-change heat dissipation structure away from the first heat conducting plate 26, so as to reduce the probability of damage to the phase-change heat dissipation structure under the action of external force. It should be understood that in order to ensure the heat dissipation efficiency, the cavity wall of the phase-change cavity is relatively thin, which also makes it easy to be damaged under the action of external force. The provision of the protective plate 21 can reduce the probability of external force directly acting on the phase-change heat dissipation structure, thereby reducing the probability of damage to the phase-change heat dissipation structure, thereby effectively improving the service life of the heat dissipation device.
[0052] Further, such as Figure 4 As shown, a comb plate 22 is provided between the protective plate 21 and the blowing plate 24 assembly, and a plurality of mounting grooves for fixing the blowing plate 24 are provided on one side of the comb plate 22 close to the blowing plate 24 assembly, and the mounting grooves are arranged one-to-one with the blowing plate 24. In this way, on the one hand, there is a gap between the protective plate 21 and the blowing plate 24, and when the protective plate 21 is subjected to external force, there is a space between the protective plate 21 and the blowing plate 24 that allows the protective plate 21 to deform, thereby reducing the force transmitted from the protective plate 21 to the blowing plate 24 and improving the protective effect of the protective plate 21; on the other hand, the setting of the mounting groove cooperates with the opening on the cover plate 25 that is connected to the phase change cavity, so as to limit the blowing plate 24 and improve the assembly accuracy of the blowing plate 24, so as to improve the heat dissipation effect of the phase change heat dissipation structure and reduce the assembly difficulty of the phase change heat dissipation structure.
[0053] It should be noted that the protective plate 21 can be directly connected to the blowing plate 24 or the comb plate 22 to be fixedly arranged on the side of the phase change heat dissipation structure away from the first heat conducting plate 26; in addition, the protective plate 21 can also be connected to the frame 11 to be fixedly arranged on the side of the phase change heat dissipation structure away from the first heat conducting plate 26. For example, Figure 1 As shown, when the frame 11 is a U-shaped groove structure, the protective plate 21 can be directly fixedly connected to the side wall of the frame 11 by welding or the like. Of course, when the frame 11 is of other shapes and cannot be directly connected to the protective plate 21, a connector can also be provided to connect the protective plate 21 and the frame 11.
[0054] Further preferably, Figure 3 and Figure 4 As shown, the protective plate 21 is provided with a plurality of through holes so that the gas can pass through the protective plate 21. In this way, the influence of the setting of the protective plate 21 on the gas flow can be reduced to ensure the heat dissipation efficiency and heat dissipation effect of the first heat dissipation part 2. It should be noted that the number and diameter of the above-mentioned through holes can be adaptively designed according to needs during specific implementation, but it should be ensured that the protective plate 21 can achieve the preset protection effect.
[0055] like Figure 5 As shown, the first passive heat dissipation structure 32 includes a plurality of first heat dissipation fins, and the plurality of first heat dissipation fins are arranged in parallel on the second heat conducting plate 31; the second passive heat dissipation structure 12 includes a plurality of second heat dissipation fins, and the plurality of second heat dissipation fins are arranged in parallel at the bottom of the slot cavity of the frame body 11. The arrangement of the first heat dissipation fins and the second heat dissipation fins can effectively increase the heat dissipation area of the heat dissipation device, and at the same time, the heat dissipation fins arranged in parallel can reduce the resistance of the gas flow, thereby effectively improving the heat dissipation efficiency of the heat dissipation device.
[0056] Further preferably, Figure 1 As shown, in the assembled state, the first heat sink fin and the second heat sink fin both extend in a direction away from the bottom of the groove cavity, and under the premise that the frame 11 is a U-shaped groove structure, the first heat sink fin and the second heat sink fin are both parallel to the groove wall of the U-shaped groove. In this way, when the heat sink is in the working state, the gas can flow into and / or out of the area where the first heat sink fin and the second heat sink fin are located from the U-shaped end surface of the frame 11, thereby ensuring the fluidity of the gas and thereby improving the heat dissipation effect of the heat sink.
[0057] It should be noted that the distance between adjacent first heat dissipation fins and the distance between adjacent second heat dissipation fins can be adaptively designed according to heat dissipation needs during specific implementation, and the present invention does not make specific limitations on this.
[0058] In addition, the utility model also provides a heat dissipation system, including a heating component and a heat dissipation device, wherein the heating component includes a high heating area and a low heating area, and the heat dissipation device is the above-mentioned heat dissipation device, including a first heat dissipation part 2 and a second heat dissipation part 3, and the first heat dissipation part 2 is thermally connected to the high heating area of the heating component, and the second heat dissipation part 3 is thermally connected to the low heating area of the heating component. It should be noted here that since the heat dissipation system includes the above-mentioned heat dissipation device, the beneficial effects of the heat dissipation system caused by the heat dissipation device are detailed in the above discussion and will not be repeated here.
[0059] The basic principle of the present invention is described above in conjunction with specific embodiments. However, it should be pointed out that the advantages, strengths, effects, etc. mentioned in the present invention are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. must be possessed by each embodiment of the present invention. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not limitation, and the above details do not limit the present invention to be implemented by adopting the above specific details.
[0060] It should also be noted that in the device, apparatus and method of the present invention, each component or each step can be decomposed and / or reassembled, and such decomposition and / or reassembly shall be regarded as an equivalent solution of the present invention.
[0061] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present invention. Therefore, the present invention is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.
[0062] It should be understood that the limiting terms "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present invention are only used to more clearly explain the technical solutions and cannot be used to limit the scope of protection of the present invention.
[0063] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the utility model to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.
Claims
1. A heat dissipation device, characterized in that: include: The heat dissipation frame has a first fixing position and a second fixing position; A first heat dissipation portion, mounted at the first fixing position, comprising a phase change heat dissipation structure; A second heat dissipation portion, mounted at the second fixing position, comprising a first passive heat dissipation structure; A second passive heat dissipation structure is provided between the first fixing position and the second fixing position, and the first heat dissipation portion and the second heat dissipation portion can be thermally connected to the high heat generation area and the low heat generation area of the heat generation component respectively.
2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation frame includes a frame body with a U-shaped groove structure, and the second passive heat dissipation structure, the first heat dissipation part and the second heat dissipation part are all located in the groove cavity of the frame body.
3. The heat dissipation device according to claim 2, characterized in that: The side of the bottom wall of the frame body away from the slot cavity is the installation side of the heating component; The first fixing position and the second fixing position are formed by opening holes at the bottom of the slot cavity, so that a part of the first heat dissipation part and a part of the second heat dissipation part can be embedded in the bottom of the slot cavity and contact the heat generating component.
4. The heat dissipation device according to claim 3, characterized in that: The first heat dissipation portion includes a first heat conducting plate, which passes through the first fixing position and is thermally connected to the high heat generation area of the heat generating component and the phase change heat dissipation structure at the same time; The second heat dissipation portion includes a second heat conducting plate, which passes through the second fixing position and is thermally connected to the low heat generation area of the heat generating component and the first passive heat dissipation structure.
5. The heat dissipation device according to claim 4, characterized in that: The phase change heat dissipation structure comprises: A blowing plate assembly, comprising a plurality of blowing plates arranged in parallel, wherein the blowing plates have a phase change cavity inside, and the phase change cavity comprises a heat absorption zone and a phase change zone; The cover plate is arranged on one side of the blowing plate close to the heat absorption area and is thermally connected to the high heating area of the heating component. The cover plate has a cooling cavity inside that is connected to the phase change cavities of the multiple blowing plates.
6. The heat dissipation device according to claim 5, characterized in that: A protection plate for protecting the phase-change heat dissipation structure is arranged on a side of the phase-change heat dissipation structure away from the first heat conducting plate.
7. The heat dissipation device according to claim 6, characterized in that: A comb plate is arranged between the protective plate and the blowing plate assembly, and a plurality of mounting grooves for fixing the blowing plate are arranged on one side of the comb plate close to the blowing plate assembly, and the mounting grooves are arranged one to one with the blowing plate.
8. The heat dissipation device according to claim 6, characterized in that: The protective plate is provided with a plurality of through holes so that gas can pass through the protective plate.
9. The heat dissipation device according to claim 4, characterized in that: The first passive heat dissipation structure includes a plurality of first heat dissipation fins, and the plurality of first heat dissipation fins are arranged in parallel on the second heat conducting plate; The second passive heat dissipation structure includes a plurality of second heat dissipation fins, and the plurality of second heat dissipation fins are arranged in parallel at the bottom of the slot cavity of the frame body.
10. A heat dissipation system, characterized in that: include: Heat generating components, including high heat generating areas and low heat generating areas; The heat dissipation device is the heat dissipation device according to any one of claims 1 to 9.