Ultrasonic probe and ultrasonic imaging device

Abstract

The utility model relates to an ultrasonic probe and an ultrasonic imaging device. The ultrasonic probe comprises a shell with an accommodating cavity; the sound head assembly is arranged on the shell; the main board is arranged in the accommodating cavity and is connected with the sound head assembly; the power supply assembly is arranged in the accommodating cavity; and the wave absorbing part is arranged between the main board and the power supply assembly and is configured to absorb electromagnetic radiation signals between the main board and the power supply assembly. Therefore, the interference of the electromagnetic radiation signal on signal transmission in the ultrasonic probe is shielded through the wave absorbing piece, so that the stability of signal transmission can be improved, and the accuracy of an ultrasonic image is ensured.

Description

Technical Field

[0001] The present application relates to the technical field of medical devices, and in particular to an ultrasonic probe and an ultrasonic imaging device. Background Art

[0002] Ultrasonic probes are an important part of ultrasonic diagnostic equipment in medical devices. Ultrasonic probes are mainly used for ultrasonic diagnosis. They can convert electrical signals into ultrasonic signals and send them out, and convert ultrasonic echoes from the object to be detected into electrical signals and then send them to the ultrasonic host for subsequent processing. In related technologies, ultrasonic probes use cable transmission or wireless transmission to transmit data between the ultrasonic host and the probe. Before the data is transmitted to the ultrasonic host, the signal transmission in the ultrasonic probe may be interfered by the electromagnetic waves in the ultrasonic probe, resulting in poor signal transmission stability. Utility Model Content

[0003] The main technical problem to be solved by the present application is to provide an ultrasonic probe and an ultrasonic imaging device having the ultrasonic probe.

[0004] In order to solve the above technical problems, the present application provides an ultrasonic probe on the one hand, comprising: a shell having a receiving cavity; a sound head assembly arranged on the shell; a main board arranged in the receiving cavity and connected to the sound head assembly; a power supply assembly arranged in the receiving cavity; and an absorbing member arranged between the main board and the power supply assembly, and configured to absorb electromagnetic radiation signals between the main board and the power supply assembly.

[0005] In some embodiments, the power supply assembly includes a control board configured to control the power supply assembly to supply power to the ultrasound probe, and the absorber at least covers the control board in the orthographic projection of the power supply assembly.

[0006] In some embodiments, the ultrasound probe further includes an antenna assembly, which is disposed on the housing, electrically connected to the power supply assembly, and configured to transmit signals.

[0007] In some embodiments, the housing has a hand-holding area, and the antenna assembly is at least partially located outside the hand-holding area.

[0008] In some embodiments, the shell includes a first shell and a second shell, the first shell and the second shell are snap-fitted and connected to form the accommodating cavity together; the power supply component is located on a side of the mainboard adjacent to the second shell, and the antenna component is attached to the second shell and located at an end of the second shell away from the sound head component.

[0009] In some embodiments, a projection of the absorbing member on the mainboard and a projection of the antenna assembly on the mainboard at least partially do not overlap.

[0010] In some embodiments, the shape of the antenna assembly matches the shape of an end of the second housing away from the acoustic head assembly.

[0011] In some embodiments, the ultrasound probe also includes a mounting frame disposed in the shell; the power supply assembly is disposed on the mounting frame, and the power supply assembly has a connecting end, which is disposed on a side of the power supply assembly facing the antenna assembly and extends out of the mounting frame to connect with the antenna assembly.

[0012] In some embodiments, the ultrasound probe further includes: a heat insulation plate disposed between the main board and the absorbing member to reduce heat transfer between the main board and the power supply assembly; and / or a heat conductive structure disposed on a side of the main board away from the absorbing member to absorb heat within the ultrasound probe.

[0013] In some embodiments, the absorbing member includes: a ferrite absorbing layer and / or a carbon fiber absorbing layer.

[0014] On the other hand, the present application further provides an ultrasonic imaging device, comprising: an ultrasonic host; and an ultrasonic probe in any of the above embodiments, wherein the ultrasonic probe is connected to the ultrasonic host.

[0015] In the structural design of the ultrasonic probe in the embodiment of the present application, the wave absorbing member is arranged between the power supply assembly and the mainboard to absorb the electromagnetic radiation signal between the power supply assembly and the mainboard, thereby shielding the interference of the electromagnetic radiation signal on the signal transmission in the ultrasonic probe. As a result, the ultrasonic probe in the present application can improve the stability of signal transmission and ensure the accuracy of the ultrasonic image. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present application will illustrate the implementation methods in conjunction with the accompanying drawings. The accompanying drawings of the present application are only used to describe the embodiments for the purpose of demonstration. Without departing from the principles of the present application, those skilled in the art can easily make other embodiments according to the steps described below through the following description.

[0017] Figure 1 is a schematic diagram of the three-dimensional structure of an ultrasound probe provided in an embodiment of the present application;

[0018] Figure 2 This application Figure 1 An exploded perspective view of the ultrasound probe in the illustrated embodiment;

[0019] Figure 3 This application Figure 1 A cross-sectional view of the ultrasonic probe along the X direction in the illustrated embodiment;

[0020] Figure 4 This application Figure 1A schematic diagram of the local structure of the ultrasonic probe in the embodiment shown in the figure after the shell is removed;

[0021] Figure 5 This application Figure 1 A schematic diagram of a partial structure of the ultrasonic probe after removing the first shell in the illustrated embodiment;

[0022] Figure 6 It is a schematic diagram of the structure of the ultrasonic imaging device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It will be appreciated that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some but not all structures related to the present application are shown in the drawings. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the art without making creative work are within the scope of protection of the present application.

[0024] The terms "first", "second", etc. in this application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0025] It is understandable that the names such as "first shell" and "second shell" can be interchanged in some embodiments. For example, in one embodiment, the "first shell" in other embodiments can be called "second shell", and correspondingly, the "second shell" in other embodiments can be called "first shell".

[0026] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0027] Please also read Figures 1 to 3 , Figure 1 FIG. 1 shows a schematic diagram of the three-dimensional structure of an ultrasound probe in an embodiment of the present application. Figure 2 Shows this application Figure 1an exploded perspective view of the ultrasound probe in the illustrated embodiment, and Figure 3 Shows this application Figure 1 A cross-sectional view of the ultrasonic probe along the X direction in the illustrated embodiment.

[0028] In some embodiments, Figures 1 to 3 As shown, the ultrasonic probe 100 may include a housing 10, an acoustic head assembly 20, a mainboard 30, a power supply assembly 40, and an absorber 50. The housing 10 has a receiving cavity 101, the acoustic head assembly 20 is disposed on the housing 10, the mainboard 30 is disposed in the receiving cavity 101 and connected to the acoustic head assembly 20, the power supply assembly 40 is disposed in the receiving cavity 101, and the absorber 50 is disposed between the mainboard 30 and the power supply assembly 40, and the absorber 50 is configured to absorb electromagnetic radiation signals between the mainboard 30 and the power supply assembly 40.

[0029] In the structural design of the ultrasonic probe in the embodiment of the present application, the wave absorbing member is arranged between the power supply assembly and the mainboard to absorb the electromagnetic radiation signal (or electromagnetic wave) between the power supply assembly and the mainboard, thereby shielding the interference of the electromagnetic radiation signal on the signal transmission in the ultrasonic probe. As a result, the ultrasonic probe in the present application can improve the stability of signal transmission and ensure the accuracy of the ultrasonic image.

[0030] In some embodiments, the housing 10 has a hand-held area, for example, the hand-held area can be disposed on an outer wall of the housing 10. During use, the user can operate the ultrasound probe 100 by holding the hand-held area of ​​the housing 10.

[0031] In some embodiments, the housing 10 includes a first housing 11 and a second housing 12, which are snap-fitted and connected to form a receiving cavity 101. The receiving cavity 101 can be used to accommodate functional components of the ultrasound probe 100, such as a mainboard 30, a power supply assembly 40, an absorber 50, etc.

[0032] In some embodiments, Figure 2 and Figure 3As shown, the acoustic head assembly 20 is respectively connected to the first end 111 of the first shell 11 (also referred to as the head of the first shell 11) and the first end 121 of the second shell 12 (also referred to as the head of the second shell 12), the mainboard 30 can be roughly arranged in the receiving cavity 101 at a position corresponding to the snap-fit ​​connection between the first shell 11 and the second shell 12, and the power supply assembly 40 and the absorbing member 50 can be stacked in the second shell 12. In other words, the power supply assembly 40 and the absorbing member 50 can be stacked in the second shell 12. Of course, in other embodiments, the power supply assembly 40 and the absorbing member 50 can also be stacked in the first shell 11. Among them, the first shell 11 and the second shell 12 can be symmetrically arranged with respect to the plane where the mainboard 30 is located (or with respect to the plane where the snap-fit ​​connection between the first shell 11 and the second shell 12 is located).

[0033] It is understandable that the shape, material and other designs of the shell 10 in the present application can refer to the existing designs of ultrasound probes in the relevant technology. For example, the shell 10 can be made of metal, which is not limited in the present application.

[0034] In some embodiments, the acoustic head assembly 20 may include an acoustic head. The acoustic head is used to emit ultrasonic signals and receive ultrasonic echo signals. The mainboard 30 is connected to the acoustic head to exchange data with the acoustic head. For example, the mainboard 30 can transmit an electrical signal to the acoustic head, and based on the transmitted electrical signal, the acoustic head generates an ultrasonic signal. Furthermore, the mainboard 30 can also receive a signal fed back by the acoustic head to obtain ultrasonic signal detection information. Similarly, the structure of the acoustic head assembly 20 and the acoustic head in the present application can also refer to the structure of the acoustic head in the ultrasonic probe in the related art, and is not limited in the present application.

[0035] Please continue reading Figure 2 and Figure 3 The main board 30 is also referred to as the ultrasound main board 30, which serves as the control unit of the ultrasound probe 100 and may include various chips. In some embodiments, the chips provided on the main board 30 include, but are not limited to, field programmable gate array (FPGA) chips, signal transceiver chips, and power supply chips. Among them, the signal transceiver chip may be an integrated structure, or may be divided into a signal receiving chip and a signal sending chip. The power supply chip may be used to control the power supply of the ultrasound probe 100. In some embodiments, the main board 30 may also include an echo processing unit (not shown in the figure), which is used to perform digital pre-processing on the ultrasound echo signal so that the processed digital signal can be transmitted through the antenna assembly 60 (such as Figure 2 , Figure 4 , Figure 5The digital signal may include a detection signal, an image signal, etc. generated according to the ultrasonic signal of the acoustic head assembly.

[0036] In some embodiments, the shape of the mainboard 30 can be adapted to the shape of the first shell 11 / the second shell 12. Of course, the structure and material type of the mainboard 30 in this application can also refer to the structure of the mainboard 30 in the ultrasound probe in the related art, and are not limited in this application.

[0037] Please refer again Figure 2 and Figure 3 In some embodiments, the power supply assembly 40 may be disposed on a side of the mainboard 30 adjacent to the second housing 12, and is used to provide power to the ultrasonic probe 100, for example, it may power components such as the mainboard 30 and the acoustic head assembly 20. The power supply assembly 40 may include a control board 41, which is used to control the power supply assembly 40 to supply power to components such as the mainboard 30 and the acoustic head assembly 20. The control board 41 may be disposed on the surface of the power supply assembly 40 facing the mainboard 30, and the positive projection of the absorbing member 50 on the power supply assembly 40 at least covers the control board 41, that is, the minimum area of ​​the absorbing member 50 is not less than the area of ​​the area occupied by the control board 41 on the surface of the power supply assembly 40. Thus, the absorbing member 50 may cover the control board 41 on the power supply assembly 40, so that the electromagnetic waves formed between the circuit structure of the control board 41 and the circuit structure of the mainboard 30 may be absorbed by the absorbing member 50, and then the absorbing member 50 may shield the interference of the electromagnetic waves between the control board 41 and the mainboard 30 on the signal transmission in the ultrasonic probe 100, thereby improving the stability of the signal transmission and ensuring the accuracy of the ultrasonic image.

[0038] In some embodiments, the control board 41 is disposed on the surface of the power supply assembly 40 and can be located away from the sound head assembly 20 or close to the sound head assembly 20 , and can be specifically disposed according to actual needs.

[0039] In some embodiments, the power supply assembly 40 may be a detachable and replaceable battery or a rechargeable battery. The power supply assembly 40 is also provided with a connection terminal 42 for electrically connecting to the components of the ultrasound probe 100 .

[0040] In some embodiments, the ultrasound probe 100 further includes: a mounting frame 70, which is disposed in the housing 10, for example, in the second housing 12, for example, disposed together with the power supply assembly 40 on a side of the mainboard 30 adjacent to the second housing 12. The power supply assembly 40 can be disposed on the mounting frame 70, and the connection end 42 of the power supply assembly 40 can extend out of the mounting frame 70 and be electrically connected to the components of the ultrasound probe 100. The shape of the mounting frame 70 can be adapted to the shape of the power supply assembly 40, and its specific shape can be set according to actual needs, as long as the power supply assembly 40 can be mounted thereon. It can be understood that in the structure of the ultrasound probe 100 shown in the drawings of the present application, the mounting frame 70 can be disposed in the second housing 12, but this is not necessary. In specific applications, the setting position of the mounting frame 70 can be adjusted accordingly with the setting position of the power supply assembly 40. For example, when the power supply assembly 40 is disposed in the first housing 11, the mounting frame 70 can also be correspondingly disposed in the first housing 11, for example, disposed together with the power supply assembly 40 on a side of the mainboard 30 adjacent to the second housing 12.

[0041] In some embodiments, the absorbing member 50 of the ultrasonic probe 100 in the embodiment of the present application may refer to a component that absorbs the electromagnetic waves between the mainboard 30 and the power supply assembly 40 and converts them into heat energy or other forms of heat to reduce / shield the electromagnetic interference inside the ultrasonic probe 100, thereby shielding the electromagnetic wave radiation signal from interfering with the transmission of signals such as ultrasonic signals, ultrasonic echo signals, and digital signals processed by the mainboard 30. It can be understood that in the structure of the ultrasonic probe 100 shown in the drawings of the present application, the absorbing member 50 can be arranged between the mainboard 30 and the power supply assembly 40, but this is not necessary and can be determined according to the actual application requirements. For example, in some embodiments, the control board 41 can also be arranged on the surface of the power supply assembly 40 away from the mainboard 30, and accordingly, the absorbing member 50 is also arranged on the side of the power supply assembly 40 away from the mainboard 30, and the positive projection of the absorbing member 50 on the power supply assembly 40 at least covers the control board 41 of the power supply assembly 40. In other words, the location of the absorbing member 50 can be changed accordingly with the location of the control board 41 on the power assembly 40, as long as the location of the absorbing member 50 satisfies the following condition: the orthographic projection of the absorbing member 50 on the power assembly 40 at least covers the control board 41 of the power assembly 40, so as to absorb the electromagnetic radiation signal between the mainboard 30 and the power assembly 40. In other words, as long as the absorbing member 50 can cover the control board 41 of the power assembly 40 and can absorb the electromagnetic radiation signal between the power assembly 40 and the mainboard 30.

[0042] In some embodiments, the absorbing member 50 may be roughly rectangular in shape, and may include: at least one of a ferrite absorbing layer and a carbon fiber absorbing layer. That is, the absorbing member 50 may be a single-layer absorbing structure, that is, it may include a ferrite absorbing layer or a carbon fiber absorbing layer. The absorbing member 50 may also be a composite absorbing structure, that is, it may include a composite absorbing structure formed by a ferrite absorbing layer and a carbon fiber absorbing layer. Of course, the absorbing member 50 may also include other types of absorbing layers, for example, it may include but is not limited to: at least one of a nano absorbing layer, a chiral absorbing layer, a polycrystalline iron fiber absorbing layer, and a conductive polymer absorbing layer. Similarly, the above-mentioned absorbing layers may also be formed into a single-layer absorbing structure, or at least two of the above-mentioned absorbing layers may be formed into a composite absorbing structure, which may be determined according to the actual application requirements.

[0043] Please refer again Figure 2 and Figure 4 In conjunction with Figure 4 and Figure 5 , Figure 4 Shows this application Figure 1 A schematic diagram of the partial structure of the ultrasonic probe in the embodiment shown in the figure after the shell is removed, and Figure 5 Shows this application Figure 1 The schematic diagram of the partial structure of the ultrasound probe after removing the first shell in the illustrated embodiment. In some embodiments, the ultrasound probe 100 may further include an antenna assembly 60. The antenna assembly 60 is disposed on the shell 10, and is electrically connected to the power supply assembly 40 through the connection terminal 42, and is configured to transmit signals.

[0044] In some embodiments, the signal transmitted by the antenna assembly 60 may include: a digital signal processed by the mainboard 30, such as a detection signal, etc.

[0045] The digital signal processed by the mainboard 30 of the ultrasound probe 100 in the present application can be transmitted wirelessly via the antenna assembly 60, for example, to an ultrasound host, or to a terminal device such as a mobile phone or a handheld computer. It is understandable that the antenna assembly 60 can also be called a wireless transmission module.

[0046] In some embodiments, the power supply assembly 40 is located on a side of the mainboard 30 adjacent to the second shell 12, the antenna assembly 60 is attached to the second shell 12 and is located at an end of the second shell 12 away from the sound head assembly 20, and the connection end 42 is disposed on a side of the power supply assembly 40 facing the antenna assembly 60, and extends out of the mounting bracket 70 to connect with the antenna assembly 60. It is understandable that the antenna assembly 60 can be disposed at an end of the first shell 11 or the second shell 12 close to the sound head assembly 20, that is, the antenna assembly 60 can also be disposed in the shell 10 and close to the sound head assembly 20. In other words, in the structural design of the ultrasound probe 100 provided in the embodiment of the present application, the setting position of the antenna assembly 60 can be flexibly set according to actual needs, as long as the function of signal transmission can be achieved. Figure 5 As shown, in some embodiments, the antenna assembly 60 is at least partially located outside the handheld area, that is, the antenna assembly 60 can be entirely or at least partially attached to an end of the second shell 12 away from the sound head assembly 20 (also referred to as the second end 122 of the second shell 12, or the tail of the second shell 12). The second end 122 of the second shell 12 is arranged opposite to the first end 121 of the second shell 12. The antenna assembly 60 is arranged outside the handheld area. When the user holds the ultrasound probe 100, the antenna assembly 60 is still outside the user's holding area, and the antenna assembly 60 is not shielded, thereby reducing the contact between the antenna assembly 60 and the terminal device (for example, the ultrasound host 200 (such as Figure 6 That is to say, the antenna assembly 60 is arranged outside the hand-held area, for example, at the tail or head of the second shell, and during use, the contact between the user's fingers or palms and the antenna assembly 60 can be reduced, thereby reducing the influence of the user's fingers or palms on the wireless signal and enhancing the quality of the antenna assembly 60 receiving and sending signals.

[0047] In some embodiments, the shape of the antenna assembly 60 matches the shape of the end of the second housing 12 away from the acoustic head assembly 20. For example, the antenna assembly 60 can be arranged in an arc shape. By matching the shapes of the two, fixed installation is facilitated.

[0048] It is understandable that the antenna assembly 60 may also be disposed in the first shell 11 according to the way the antenna assembly 60 is disposed in the second shell 12 . The specific way of disposing the antenna assembly 60 may refer to the description of disposing the antenna assembly 60 in the second shell 12 .

[0049] In some embodiments, the projection of the absorbing member 50 on the mainboard 30 and the projection of the antenna assembly 60 on the mainboard 30 at least partially do not overlap. That is, the absorbing member 50 and the antenna assembly 60 can be separately arranged. By separating the absorbing member 50 and the antenna assembly 60, the space of the receiving cavity 101 can be reasonably utilized, and the absorbing member 50 will not block the antenna assembly 60, which is conducive to ensuring the transmission and reception of antenna signals. Of course, the projections of the two on the mainboard 30 can also partially overlap, as long as it does not affect the respective functions of the two.

[0050] In some embodiments, the antenna assembly 60 may include a WiFi antenna, for example, a 4G antenna, a 5G antenna, etc. Of course, the antenna assembly 60 may also include components such as a signal transmitting module and a signal receiving module. The specific structures of these components may refer to the structures of antennas in the relevant technology, and this application does not make any specific restrictions.

[0051] In some embodiments, the ultrasound probe 100 in the present application may be a wireless ultrasound probe. The wireless ultrasound probe can be connected to the ultrasound host 200 through wireless signals, and is more portable and convenient to use. The working principle of the wireless ultrasound probe is as follows.

[0052] The wireless ultrasonic probe can use the piezoelectric effect to convert the excitation electrical pulse signal of the ultrasonic device into an ultrasonic signal that enters the patient's body, and then converts the ultrasonic echo signal reflected by the tissue into an electrical signal, thereby realizing the detection of the tissue. The wireless ultrasonic probe uses wireless transmission to transmit data between the ultrasonic host and the probe. Since the numerous connecting cables on the ultrasound machine are removed, it is convenient for the operator to perform ultrasonic examinations. In specific applications, the ultrasonic probe 100 provided in this application can be applied to the human body and various animals.

[0053] It should be noted that the wireless ultrasound probe can also be connected to a terminal device such as a mobile phone or a PDA via a wireless signal to transmit ultrasound image information to the terminal device via the antenna assembly 60. The following takes the ultrasound probe 100 communicating with the ultrasound host 200 via the antenna assembly 60 as an example to specifically describe the working process of the ultrasound probe 100 of the present application.

[0054] The ultrasound probe 100 in the embodiment of the present application can be connected to the ultrasound host 200 through the antenna assembly 60 to transmit the digital signal processed by the mainboard 30, such as the detection signal, image signal and other signals, to the antenna assembly 60 via the mainboard 30, and then to the ultrasound host 200, so as to collect two-dimensional / three-dimensional image data. Among them, the ultrasound host 200 is used to calculate and process the received two-dimensional / three-dimensional image data, and finally obtain an ultrasound image. It can be understood that when the ultrasound probe 100 is connected to a terminal device such as a mobile phone or a handheld computer, its working process is similar to that when the ultrasound probe 100 is connected to the ultrasound host 200, and the specific content can refer to the description of the relevant content.

[0055] Since electromagnetic waves, i.e., electromagnetic radiation signals, are formed between the circuit structure of the mainboard 30 and the circuit structure of the power supply assembly 40 (e.g., the circuit structure of the control board 41), the electromagnetic waves will interfere with the transmission of the digital signal in the process of transmitting the digital signal processed by the mainboard 30 to the antenna assembly 60 via the mainboard 30. In this way, the interference of electromagnetic waves will affect the stability of signal transmission in the ultrasonic probe 100 and reduce the accuracy of the ultrasonic image. Therefore, in the structural design of the ultrasonic probe 100 in the embodiment of the present application, the absorbing member 50 is arranged between the power supply assembly 40 and the mainboard 30 to absorb the electromagnetic radiation signal between the power supply assembly 40 and the mainboard 30, thereby shielding the electromagnetic radiation signal from interfering with the transmission of the digital signal. Therefore, in the process of transmitting the digital signal to the antenna assembly 60 via the mainboard 30, the absorbing member 50 can shield the interference of electromagnetic waves on the signal transmission, and can improve the stability of signal transmission, thereby ensuring the accuracy of the ultrasonic image.

[0056] In addition, since the ultrasound probe 100 generates heat during operation, for example, the FPGA chip, signal transceiver chip, and power chip on the mainboard 30 are the main heat sources, which in turn causes the temperature inside the ultrasound probe 100 to rise. The performance of the power supply component 40 is highly affected by temperature. In order to reduce the impact of the heat generated by the mainboard 30 on the power supply component 40, the ultrasound probe 100 in the embodiment of the present application is also provided with a heat insulation board 80. Figure 2 and Figure 3 In some embodiments, the heat insulation board 80 is disposed between the mainboard 30 and the absorbing member 50 to reduce the heat transfer between the mainboard 30 and the power supply assembly 40. The orthographic projection area of ​​the heat insulation board 80 on the mainboard 30 may be approximately equal to the orthographic projection area of ​​the power supply assembly 40 on the mainboard 30. Of course, the orthographic projection areas of the two on the mainboard 30 may not be equal, and may be set according to actual needs. It should be noted that the number of heat insulation boards 80 may also be set according to actual needs. For example, a layer of heat insulation board 80 may be provided, or two or more layers of heat insulation boards 80 may be stacked between the absorbing member 50 and the mainboard 30.

[0057] Please refer again Figure 2 and Figure 3 In order to further reduce the influence of the heat generated by the mainboard 30 on the power supply component 40 and improve the heat dissipation performance in the ultrasound probe 100, in some embodiments, the ultrasound probe 100 may further include a heat-conducting structure 90, which is disposed on the side of the mainboard 30 away from the wave-absorbing member 50 to absorb the heat in the ultrasound probe 100. The heat-conducting structure 90 has a heat storage function, that is, it can absorb and store the heat in the ultrasound probe 100, and then gradually dissipate the heat.

[0058] In some embodiments, the heat-conducting structure 90 may include a heat-conducting plate 91, a heat-conducting member 92, and a heat-conducting block 93, which are stacked in sequence from top to bottom along the Y direction between the first housing 11 and the main board 30. Of course, the heat-conducting plate 91, the heat-conducting member 92, and the heat-conducting block 93 may also be stacked in sequence from bottom to top along the Y direction between the first housing 11 and the main board 30. It should be noted that the heat-conducting structure 90 may also be a single heat-conducting structure 90 formed by one of the heat-conducting plate 91, the heat-conducting member 92, and the heat-conducting block 93, or may be a composite heat-conducting structure 90 formed by at least two of the heat-conducting plate 91, the heat-conducting member 92, and the heat-conducting block 93. Among them, the heat-conducting member 92 may include a silicone layer and a silicone grease layer. The silicone layer and the silicone grease layer may be arranged side by side along the X direction / Y direction on the side of the heat-conducting plate 91 facing the main board 30. Among them, the X direction is arranged substantially perpendicular to the Y direction.

[0059] It is understandable that the ultrasound probe 100 may also include other functional elements, such as internal cables, display screens, buttons, etc. These elements may refer to the structure of ultrasound probes in the relevant technology and are not limited in this application.

[0060] In some embodiments of the present application, an ultrasonic imaging device 300 is also provided. Figure 6 , Figure 6 FIG. 2 shows a schematic diagram of the structure of an ultrasonic imaging device 300 in an embodiment of the present application. Figure 6 As shown, an ultrasonic imaging device 300 disclosed in the present application includes: an ultrasonic host 200 connected to an ultrasonic probe 100. The ultrasonic probe 100 may be the ultrasonic probe 100 described in any of the above embodiments. In a specific application, the digital signal processed by the mainboard 30 may be transmitted to the ultrasonic host 200 in a wireless transmission manner, for example, it may be transmitted to the ultrasonic host 200 via an antenna assembly 60, or the digital signal processed by the mainboard 30 may also be transmitted to the ultrasonic host 200 via a cable. The ultrasonic imaging device 300 of this embodiment has the same beneficial effects as the ultrasonic probe 100 provided in this embodiment, which will not be described in detail herein.

[0061] The above are only preferred implementations of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An ultrasonic probe, characterized in that: include: A shell having a receiving cavity; A sound head assembly is arranged on the shell; A main board, disposed in the receiving cavity and connected to the acoustic head assembly; A power supply component is disposed in the receiving cavity; as well as The wave absorbing member is arranged between the mainboard and the power supply assembly and is configured to absorb the electromagnetic radiation signal between the mainboard and the power supply assembly.

2. The ultrasonic probe according to claim 1, characterized in that: The power supply assembly includes a control board configured to control the power supply assembly to supply power to the ultrasound probe, and the wave absorbing member at least covers the control board in the orthographic projection of the power supply assembly.

3. The ultrasonic probe according to claim 2, characterized in that: The ultrasonic probe further includes an antenna assembly, which is disposed on the housing, electrically connected to the power supply assembly, and configured to transmit signals.

4. The ultrasonic probe according to claim 3, characterized in that: The housing has a hand-holding area, and the antenna assembly is at least partially located outside the hand-holding area.

5. The ultrasonic probe according to claim 4, characterized in that: The housing comprises a first housing and a second housing, wherein the first housing and the second housing are buckled and connected to form the receiving cavity; The power supply component is located on one side of the mainboard adjacent to the second shell, and the antenna component is attached to the inside of the second shell and located at one end of the second shell away from the acoustic head component.

6. The ultrasonic probe according to claim 3, characterized in that: The projection of the absorbing member on the mainboard and the projection of the antenna assembly on the mainboard at least partially do not overlap.

7. The ultrasonic probe according to claim 5, characterized in that: The shape of the antenna assembly matches the shape of the end of the second housing away from the acoustic head assembly.

8. The ultrasonic probe according to claim 3, characterized in that: Also included is a mounting frame, which is disposed in the housing; The power supply component is arranged on the mounting frame, and the power supply component has a connecting end, which is arranged on a side of the power supply component facing the antenna component and extends out of the mounting frame to be connected with the antenna component.

9. The ultrasonic probe according to claim 1, characterized in that: Also includes: A heat insulation plate is arranged between the main board and the wave absorbing member to reduce heat transfer between the main board and the power supply component; and / or The heat-conducting structure is arranged on a side of the main board away from the wave-absorbing member to absorb the heat in the ultrasonic probe.

10. The ultrasonic probe according to claim 1, characterized in that: The wave absorbing component comprises: a ferrite wave absorbing layer and / or a carbon fiber wave absorbing layer.

11. An ultrasonic imaging device, characterized in that: include: Ultrasound host; and The ultrasound probe according to any one of claims 1 to 10, wherein the ultrasound probe is connected to the ultrasound host.

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