Foldable support for heat dissipation of semiconductor laser therapeutic instrument

Abstract

The utility model provides a foldable support for heat dissipation of a semiconductor laser therapeutic instrument, which comprises a first support assembly and a second support assembly which are hinged with each other, the first support assembly comprises a first support provided with a through hole, the semiconductor laser therapeutic instrument is hung in the through hole, and the first support is also provided with heat dissipation holes; the first bracket cover plate is covered on the first bracket; the heat conduction plate is installed on the first support and located between the first support and the first support cover plate, a heat conduction block is arranged on the side, facing the first support, of the heat conduction plate, the heat conduction block corresponds to the heat dissipation holes, and the heat conduction block penetrates through the heat dissipation holes and also corresponds to the semiconductor laser therapeutic instrument; the fan is installed on the side, facing the first support cover plate, of the heat conduction plate. Through the direct contact between the heat conduction block and the heating part in the therapeutic instrument and the auxiliary heat dissipation of the heat conduction plate and the fan, the heat generated by the laser therapeutic instrument in the working process can be transferred in time, and the therapeutic instrument is kept to continuously operate at the normal working temperature.

Description

Technical Field

[0001] The utility model relates to the technical field of medical tools, in particular to a foldable bracket for heat dissipation of a semiconductor laser therapeutic device. Background Art

[0002] When using a semiconductor laser therapy device for laser treatment, the treatment time may be extended due to the doctor's lack of proficiency or the complexity of the operation, which will cause the laser output time of the laser therapy device to become longer and longer, and the temperature of the laser will become higher and higher. The laser can only output the correct and effective power within a certain temperature range. Therefore, when the treatment device reaches a certain temperature, the laser output needs to be stopped and paused for one to two minutes to allow the temperature to return to the normal operating temperature range. This will also cause the operation time to be extended. Utility Model Content

[0003] In view of the defects in the prior art, the purpose of the utility model is to provide a foldable bracket for dissipating heat of a semiconductor laser therapeutic device. Through the direct contact between the heat conductive block in the first bracket component and the heat generating part in the semiconductor laser therapeutic device, and the joint action of the heat conductive plate and the fan, the heat generated by the laser therapeutic device during operation can be transferred in time, so as to keep the laser therapeutic device working at a normal operating temperature without stopping and continuously outputting laser.

[0004] The utility model provides a foldable bracket for heat dissipation of a semiconductor laser therapeutic device, comprising a first bracket component and a second bracket component hinged to each other, the foldable bracket having an unfolded state and a folded state, when the foldable bracket is in the unfolded state, the first bracket component is away from the second bracket component; when the foldable bracket is in the folded state, the first bracket component overlaps with the second bracket component;

[0005] The first bracket assembly comprises:

[0006] A first bracket, wherein at least one first through hole is formed on the first bracket, and the semiconductor laser therapeutic device is hung in the through hole, and a heat dissipation hole is also formed on the first bracket;

[0007] A first bracket cover plate, wherein the first bracket cover plate covers the first bracket;

[0008] A heat conducting plate, the heat conducting plate is mounted on the first bracket and is located between the first bracket and the first bracket cover plate, a heat conducting block is arranged on the side of the heat conducting plate facing the first bracket, the heat conducting block corresponds to the heat dissipation hole, and the heat conducting block passes through the heat dissipation hole and also corresponds to the semiconductor laser therapeutic device;

[0009] A fan is installed on a side of the heat conducting plate facing the first bracket cover.

[0010] In one embodiment, an air inlet and an air outlet are provided on the first bracket cover, the air inlet corresponds to the fan, and the air outlet is provided on a side of an area enclosed by the first bracket and the first bracket cover away from the fan.

[0011] In one embodiment, the first bracket assembly further includes an isolation column installed between the fan and the heat conducting plate.

[0012] In one embodiment, a receiving groove is further provided on the first bracket, a charging cable is placed in the receiving groove, and the charging cable provides electrical energy for the fan.

[0013] In one embodiment, the second bracket assembly comprises:

[0014] A second bracket, a boss is fixedly mounted on one side of the second bracket, and a first groove is formed on the boss;

[0015] An angle support member, wherein the angle support member is slidably mounted on the second bracket, a second groove is formed on a side of the angle support member facing the boss, and a first through groove is formed below the second groove;

[0016] A spring is placed between the first groove and the second groove; when the first bracket assembly and the second bracket assembly are in the expanded state, the spring is in a natural state; when the first bracket assembly and the second bracket assembly are in the folded state, the spring is in a compressed state.

[0017] In one embodiment, the boss is provided with a second through slot, the hinge shaft is arranged in the second through slot, and screws and dust plugs are arranged at both ends of the hinge shaft in sequence.

[0018] In one embodiment, the second bracket assembly further includes a limiting rod, and the boss further includes two second through holes. The limiting rod passes through one of the second through holes, the first through slot, and another of the second through holes and is then slidably disposed in the first through slot.

[0019] In one embodiment, two locking screw through holes corresponding to the two ends of the limiting rod are formed on the back side of the second bracket, and the locking screws pass through the locking screw through holes and are fixed to the two ends of the limiting rod.

[0020] In one embodiment, four anti-slip pads are further disposed on the back of the second bracket.

[0021] Compared with the prior art, the utility model has the following beneficial effects:

[0022] 1. The foldable bracket for heat dissipation of semiconductor laser therapeutic device provided by the utility model comprises two bracket assemblies hinged to each other. The heat conductive block in the first bracket assembly is in direct contact with the heat generating part in the semiconductor laser therapeutic device. With the joint action of the heat conductive plate and the fan, the heat generated by the laser therapeutic device during operation can be transferred in time, and the laser therapeutic device can be kept working at a normal operating temperature without stopping and continuously outputting laser. On the one hand, the continuity of the entire treatment process is guaranteed. On the other hand, for the patient, the continuity of the entire treatment process also reduces the patient's pain time.

[0023] 2. In the foldable bracket for heat dissipation of semiconductor laser therapy device provided by the utility model, the angle support member cooperates with the two bracket components to prop up the bracket component to an unfolded state, and the laser therapy device can be stably placed on the bracket to perform laser treatment; when the treatment process is completed, the two bracket components can also be overlapped and folded through the angle support member, which can be more easily stored without occupying the surrounding space. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0025] Figure 1 An exploded view of the overall structure of a foldable bracket for heat dissipation of a semiconductor laser therapeutic device provided in an embodiment of the utility model;

[0026] Figure 2 An exploded view of a first bracket component in a foldable bracket for heat dissipation of a semiconductor laser therapeutic device provided in an embodiment of the utility model;

[0027] Figure 3 An exploded view of a second bracket assembly in a foldable bracket for heat dissipation of a semiconductor laser therapeutic device provided in an embodiment of the utility model;

[0028] Figure 4 A schematic diagram of a heat conducting plate in a foldable bracket for heat dissipation of a semiconductor laser therapeutic device provided by an embodiment of the utility model, with the heat conducting plate facing away from the first bracket;

[0029] Figure 5 A schematic diagram of a second bracket in a foldable bracket for heat dissipation of a semiconductor laser therapeutic device provided by an embodiment of the utility model, with the second bracket facing away from the boss;

[0030] Figure 6 A schematic diagram of an angle support member in a foldable bracket for heat dissipation of a semiconductor laser therapeutic device provided by an embodiment of the utility model;

[0031] Figure 7 A schematic diagram of a first bracket component in a foldable bracket for heat dissipation of a semiconductor laser therapeutic device provided in an embodiment of the utility model;

[0032] In the figure: 1-first bracket assembly; 2-second bracket assembly; 3-dust plug; 4-screw; 5-hinge shaft; 101-first bracket; 102-first through hole; 103-heat dissipation hole; 104-accommodation groove; 105-charging cable; 106-heat conductive plate; 107-heat conductive block; 108-isolation column; 109-fan; 110-first bracket cover; 111-air outlet; 112-air inlet; 201-boss; 202-second bracket; 203-angle support; 204-spring; 205-second through groove; 206-limit rod; 207-first groove; 208-anti-slip pad; 209-locking screw; 210-locking screw through hole; 211-first through groove; 212-second groove; 213-second through hole. DETAILED DESCRIPTION

[0033] The utility model is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the utility model, but do not limit the utility model in any form. It should be pointed out that for those of ordinary skill in the art, several changes and improvements can be made without departing from the concept of the utility model. These all belong to the protection scope of the utility model.

[0034] Example

[0035] Reference Figure 1 to Figure 3 As shown, this embodiment provides a foldable bracket for heat dissipation of a semiconductor laser therapy device, including a first bracket assembly 1 and a second bracket assembly 2 hinged to each other. When the first bracket assembly 1 and the second bracket assembly 2 are away from each other, the foldable bracket is in an unfolded state, at which time the laser therapy device can be stably placed on the bracket to perform a laser treatment process; when the first bracket assembly 1 and the second bracket assembly 2 overlap with each other, the foldable bracket is in a folded state, at which time the foldable bracket can be stored and does not occupy space.

[0036] On the one hand, specifically, the first bracket assembly 1 includes: a first bracket 101, a first bracket cover 110, a heat conducting plate 106, a fan 109, and an isolation column 108, wherein the first bracket 101 is provided with at least one first through hole 102 for hanging a semiconductor laser therapeutic device. In this embodiment, two first through holes 102 are provided, and the semiconductor laser therapeutic device can be more stably fixed on the first bracket 101 to avoid falling over during treatment and causing unnecessary injuries; the first bracket cover 110 is detachably installed on the first bracket 101, and a heat conducting plate 106, an isolation column 108 and a fan 109 are provided between the first bracket 101 and the first bracket cover 110, wherein a heat conducting block 107 is installed on the side of the heat conducting plate 106 facing the first bracket 101, and the heat conducting block 107 and the heat dissipation hole 103 provided on the first bracket 101 are connected. Corresponding to and able to pass through the heat dissipation hole 103 and be coplanar with the first bracket 101, the heat conductive block 107 is in direct contact with the heating part of the laser therapy device, and can quickly transfer the heat generated by the laser therapy device during operation, ensuring that the laser therapy device can operate within the normal temperature range; the fan 109 is installed on the side of the heat conductive plate 106 facing the first bracket cover 110, and the position of the fan 109 corresponds to the heat conductive plate 106, which assists in transferring and diffusing the heat generated by the laser therapy device during operation, further ensuring the timeliness and efficiency of heat dissipation; the isolation column 108 is installed between the heat conductive plate 106 and the fan 109, so that a gap is left between the heat conductive plate 106 and the fan 109, thereby increasing the fluidity of the airflow and better achieving the purpose of heat dissipation. In this embodiment, four isolation columns 108 are provided, which are respectively installed on the four corners of the heat conductive plate 106.

[0037] Reference Figure 2 , Figure 4 and Figure 7 As shown, the first bracket cover 110 is provided with an air inlet 112 and an air outlet 111, the air inlet 112 corresponds to the position of the fan 109, and the air outlet 111 is arranged on the side of the enclosed area of ​​the first bracket 101 and the first bracket cover 110 away from the fan 109; the heat conducting plate 106 is provided with heat dissipation fins on the side away from the heat conducting block 107, which can increase the contact area with the air and increase the heat dissipation efficiency; the heat dissipation principle of the foldable bracket for heat dissipation of the semiconductor laser therapy device provided in this embodiment is: the heat conducting block 107 is directly in contact with the heat source of the laser therapy device, and the heat is quickly transferred to the heat conducting block 107. On the one hand, the heat conducting block 107 is in close contact with the first bracket 101, and then transferred to the entire first bracket assembly 1 to assist in heat dissipation; on the other hand, a fan 109 is installed above the heat conducting block 107, and the fan 109 draws cold air from the air inlet 112 and blows it on the heat conducting block 107, so as to take the heat away from the foldable bracket from the air outlet 111.

[0038] Reference Figure 1 and Figure 2As shown, in the foldable bracket for heat dissipation of a semiconductor laser therapy device provided in this embodiment, a first bracket 101 is further provided with a receiving groove 104, in which a charging cable 105 is placed, and the charging cable 105 provides power for the normal operation of a fan 109.

[0039] On the other hand, specifically, the second bracket assembly 2 includes: a second bracket 202, an angle support 203, and a spring 204, wherein a boss 201 is fixedly installed on one side of the second bracket 202, and a first groove 207 is provided on the boss 201 to accommodate one end of the spring 204; the angle support 203 is used to limit the angle between the first bracket 101 and the second bracket 202, on the one hand to prevent the angle from being too large and causing the laser therapy device to slip on the first bracket 101 and cause unnecessary medical accidents, and on the other hand to limit the angle from being too small and affecting the heat dissipation effect of the entire foldable bracket on the laser therapy device. The angle support 203 is slidably installed on the second bracket 202, The sliding direction is toward or away from the boss 201. A second groove 212 is provided on the side of the angle support 203 facing the boss 201 to accommodate the other end of the spring 204. A first through groove 211 is provided directly below the second groove 212, and the first through groove 211 is not connected to the second groove 212. As mentioned above, the two ends of the spring 204 are respectively placed in the first groove 207 and the second groove 212. When the first bracket assembly 1 and the second bracket assembly 2 are in a folded state, the spring 204 is squeezed between the first groove 207 and the second groove 212 and is in a compressed state. When the first bracket assembly 1 and the second bracket assembly 2 are in an unfolded state, the spring 204 is in a natural state.

[0040] Reference Figure 3 and Figure 6 As shown, a second through slot 205 is further provided on the boss 201, and the hinge shaft 5 is arranged in the second through slot 205 to hinge the first bracket assembly 1 and the second bracket assembly 2. Screws 4 and dust plugs 3 are respectively provided on both sides of the hinge shaft 5 in sequence. The screws 4 play a locking and fixing role for the hinge shaft 5, and the dust plugs 3 maintain a clean environment in the second through slot 205 to prevent external dust or other small particles from entering the second through slot 205, thereby affecting the normal hinge process and causing the foldable bracket to be used smoothly during the folding and / or unfolding process.

[0041] In the foldable bracket for heat dissipation of semiconductor laser therapeutic apparatus provided in this embodiment, the second bracket assembly 2 also includes a limit rod 206, which assists the angle support member 203 to ensure that the first bracket 101 and the second bracket 202 are maintained within a specific angle range in the unfolded state; Figure 3 and Figure 5As shown, two second through holes 213 are also provided on the boss 201, and the limiting rod 206 passes through a second through hole 213, a first through slot 211, and another second through hole 213 in sequence, and then is slidably set in the first through slot 211; on the back side of the second bracket 202, that is, the surface of the second bracket 202 away from the boss 201, two locking screw through holes 210 corresponding to the positions of the two ends of the limiting rod 206 are provided, and the locking screws 209 pass through the locking screw through holes 210 and are fixed to the two ends of the limiting rod 206, further enhancing the stability of the limiting rod 206 in the first through slot 211, and ensuring the stability of the two bracket assemblies in the unfolded state.

[0042] Reference Figure 3 and Figure 5 As shown, four anti-slip pads 208 are installed on the back side of the second bracket 202, that is, the side of the second bracket 202 away from the boss 201, respectively arranged at the four corners of the back side of the second bracket 202, so as to maintain the stability of the foldable bracket in the unfolded state and prevent the laser therapy device from tipping over during operation and causing unnecessary medical accidents.

[0043] The method of using the foldable support for heat dissipation of a semiconductor laser therapeutic device provided in this embodiment to perform laser treatment includes the following steps:

[0044] When the foldable bracket is opened, the operator holds the first bracket 101, and the second bracket 202 will open naturally under the action of gravity. The angle support 203 slides away from the boss 201 on the second bracket 202 under the action of the spring 204, and the limit rod 206 also slides in the first through groove 211. When the angle support 203 and the limit rod 206 slide to a certain distance, they stop sliding, and the first bracket 101 and the second bracket 202 are in the unfolded state. At this time, the laser therapy device can be hung in the first through hole 102 of the first bracket 101 for laser therapy;

[0045] When the entire treatment process is completed, the angle support 203 is slid toward the boss 201, and the spring 204 is compressed between the first groove 207 and the second groove 212, so that the first bracket 101 overlaps with the second bracket 202 and is in a folded state.

[0046] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essence of the present invention. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other at will.

Claims

1. A foldable bracket for heat dissipation of semiconductor laser therapeutic apparatus, characterized in that: It comprises a first bracket assembly and a second bracket assembly which are hinged to each other, the foldable bracket has an unfolded state and a folded state, and when the foldable bracket is in the unfolded state, the first bracket assembly is away from the second bracket assembly; When the foldable support is in the folded state, the first support assembly overlaps the second support assembly; The first bracket assembly comprises: A first bracket, wherein at least one first through hole is formed on the first bracket, and the semiconductor laser therapeutic device is hung in the through hole, and a heat dissipation hole is also formed on the first bracket; A first bracket cover plate, wherein the first bracket cover plate covers the first bracket; A heat conducting plate, the heat conducting plate is mounted on the first bracket and is located between the first bracket and the first bracket cover plate, a heat conducting block is arranged on the side of the heat conducting plate facing the first bracket, the heat conducting block corresponds to the heat dissipation hole, and the heat conducting block passes through the heat dissipation hole and also corresponds to the semiconductor laser therapeutic device; A fan is installed on a side of the heat conducting plate facing the first bracket cover.

2. The foldable bracket for heat dissipation of semiconductor laser therapeutic apparatus according to claim 1, characterized in that: An air inlet and an air outlet are provided on the first bracket cover, the air inlet corresponds to the fan, and the air outlet is provided on a side of an area enclosed by the first bracket and the first bracket cover away from the fan.

3. The foldable bracket for heat dissipation of semiconductor laser therapeutic apparatus according to claim 1, characterized in that: The first bracket assembly also includes an isolation column installed between the fan and the heat conducting plate.

4. The foldable bracket for heat dissipation of semiconductor laser therapeutic apparatus according to claim 1, characterized in that: The first bracket is also provided with a receiving groove, in which a charging cable is placed, and the charging cable provides electrical energy for the fan.

5. The foldable bracket for heat dissipation of semiconductor laser therapeutic apparatus according to claim 1, characterized in that: The second bracket assembly comprises: A second bracket, a boss is fixedly mounted on one side of the second bracket, and a first groove is formed on the boss; An angle support member, wherein the angle support member is slidably mounted on the second bracket, a second groove is formed on a side of the angle support member facing the boss, and a first through groove is formed below the second groove; A spring is placed between the first groove and the second groove; when the first bracket assembly and the second bracket assembly are in the expanded state, the spring is in a natural state; when the first bracket assembly and the second bracket assembly are in the folded state, the spring is in a compressed state.

6. The foldable bracket for heat dissipation of semiconductor laser therapeutic apparatus according to claim 5, characterized in that: The boss is provided with a second through slot, the hinge shaft is arranged in the second through slot, and screws and dust plugs are arranged at both ends of the hinge shaft in sequence.

7. The foldable bracket for heat dissipation of semiconductor laser therapeutic apparatus according to claim 5, characterized in that: The second bracket assembly also includes a limiting rod. The boss is provided with two second through holes. The limiting rod passes through one of the second through holes, the first through slot, and another of the second through holes and is then slidably disposed in the first through slot.

8. The foldable bracket for heat dissipation of semiconductor laser therapeutic apparatus according to claim 7, characterized in that: Two locking screw through holes corresponding to the two ends of the limiting rod are formed on the back side of the second bracket, and the locking screws pass through the locking screw through holes and are fixed to the two ends of the limiting rod.

9. The foldable bracket for heat dissipation of semiconductor laser therapeutic apparatus according to claim 5, characterized in that: Four anti-slip pads are also arranged on the back of the second bracket.

Images