Device for glue dipping process

Abstract

The utility model relates to the technical field of machinery, in particular to a device for a glue dipping process, which comprises a robot butt joint module, positioning guide sleeves, a bottom plate and a glue dipping unit, the robot butt joint module is mounted in the center of the top of the bottom plate, the positioning guide sleeves are mounted on two sides of the top of the bottom plate, and the glue dipping unit is mounted at the bottom of the bottom plate. The glue dipping unit comprises guide pins, telescopic springs, a mounting plate and glue dipping pins, the two guide pins are mounted at the top of the mounting plate and connected with the bottom plate, the two telescopic springs are arranged between the two guide pins, the multiple glue dipping pins are arranged at the bottom of the mounting plate, and the lower ends of the multiple glue dipping pins are flush. Compared with the prior art, glue taking is achieved through the glue dipping pin of the glue dipping unit, the glue weight and the glue point form can be continuously qualified, meanwhile, through the positioning structure, the stability and accuracy of the device are guaranteed when large-batch continuous reciprocating motion is conducted from a glue disc to a workpiece, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of machinery, in particular to a device used in a glue dipping process. Background Art

[0002] On the ECU production assembly line, workpieces need to be glued, such as using a traditional Archimedean glue pump to dispense glue in a fixed time and quantity through the rotation of the internal screw. Since a large number of workpieces need to be glued, the glue dispensing method has the problem of production cycle not meeting the requirements and low production efficiency.

[0003] In order to improve production efficiency, the glue dipping process is considered to achieve continuous glue dispensing. The glue dipping process is as follows: the glue injection barrel injects glue into the glue disc through the air control valve, and the servo motor drives the glue disc to rotate continuously at a uniform speed. At the same time, the scraper is tangent to the glue disc at 90°, and the scraper scrapes the glue on the surface of the glue disc flat. When the robot reaches the glue disc area, the servo motor stops, and the glue dipping device immerses the glue disc in glue. At the same time, the lifting mechanism lifts the workpiece into place, and the robot moves the glue dipping device to the positioning device to dispense glue on the workpiece, and the entire glue dipping process is completed.

[0004] However, the existing glue dipping device is not suitable for ECU products. It is necessary to design a device for the glue dipping process to transfer the glue from the glue disc to the product, complete the product dipping process, and ensure high repeatability and high stability during continuous operation. Summary of the invention

[0005] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a device for a glue dipping process to transfer glue from a glue disc to a product, complete the product glue dipping process, and ensure high repetition accuracy and high stability during continuous operation.

[0006] In order to achieve the above-mentioned purpose, the utility model is a device for glue dipping process, including a robot docking module, a positioning guide sleeve, a base plate, and a glue dipping unit. The robot docking module is installed in the top center of the base plate, the positioning guide sleeves are installed on both sides of the top of the base plate, and the glue dipping unit is installed at the bottom of the base plate.

[0007] The glue dipping unit includes guide pins, telescopic springs, a mounting plate, and glue dipping pins. Two guide pins are installed on the top of the mounting plate, and the guide pins are connected to the bottom plate. Two telescopic springs are arranged between the two guide pins. The two ends of the telescopic springs respectively press against the mounting plate and the bottom plate. A number of glue dipping pins are arranged at the bottom of the mounting plate, and the lower ends of the several glue dipping pins are flush.

[0008] A robot module docking interface is arranged in the center of the bottom plate, and a positioning pin on the lower end surface of the robot docking module is inserted into the robot module docking interface.

[0009] The bottom plate is also provided with a glue dipping unit positioning hole, which is located around the robot module docking interface, and the upper end of the guide pin is inserted into the corresponding glue dipping unit positioning hole.

[0010] Guide sleeve positioning holes are arranged on both sides of the bottom plate, the positioning guide sleeve is installed in the guide sleeve positioning hole, and the positioning guide sleeve is connected with the positioning pin 2 on the positioning device of the glue dipping equipment.

[0011] Guide holes are arranged on both sides of the mounting plate, and the lower ends of the guide pins pass through the guide holes and are connected with the fasteners.

[0012] The fastener is a countersunk screw.

[0013] The mounting plate is also provided with a telescopic spring limiting hole, and the telescopic spring is located in the telescopic spring limiting hole.

[0014] The bottom of the mounting plate is provided with a plurality of pin mounting holes, and the upper ends of the glue-dipped pins are inserted into the corresponding pin mounting holes.

[0015] The setting position of the pin needle mounting hole matches the arrangement position of the glue point of the ECU workpiece.

[0016] Compared with the prior art, the utility model realizes glue taking by means of the glue dipping pin of the glue dipping unit, which can meet the continuous qualified glue weight and glue dot shape. At the same time, the positioning structure ensures the stability and accuracy of the device when a large number of continuous reciprocating movements from the glue disc to the workpiece are carried out, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is the front view of the utility model.

[0018] Figure 2 It is the front view of the glue dipping unit of the utility model.

[0019] Figure 3 It is an axonometric view of the mounting plate of the glue dipping unit of the utility model.

[0020] Figure 4 This is a bottom view of the mounting plate of the glue dipping unit of the utility model.

[0021] Figure 5 It is an axonometric drawing of the base plate of the utility model. Implementation

[0022] The utility model is now further described with reference to the accompanying drawings.

[0023] See also Figure 1The utility model is a device for glue dipping process, including a robot docking module, a positioning guide sleeve, a base plate, and a glue dipping unit. A robot docking module 1 is installed at the top center of the base plate 3, positioning guide sleeves 2 are installed on both sides of the top of the base plate 3, and a glue dipping unit 4 is installed at the bottom of the base plate 3.

[0024] See also Figure 2 The glue dipping unit 4 includes a guide pin 41, a telescopic spring 42, a mounting plate 43, and a glue dipping pin needle 45. Two guide pins 41 are installed on the top of the mounting plate 43. The guide pins 41 are connected to the bottom plate 3. Two telescopic springs 42 are arranged between the two guide pins 41. The two ends of the telescopic spring 42 respectively abut against the mounting plate 43 and the bottom plate 3. A plurality of glue dipping pin needles 45 are arranged at the bottom of the mounting plate 43, and the lower ends of the plurality of glue dipping pin needles 45 are flush.

[0025] The robot docking module 1 is a prior art, and the robot docking module 1 matches the robot in the glue dipping device, and the upper end surface of the robot docking module 1 docks with the robot, so that the robot can lock or loosen the entire device. Figure 5 A robot module docking interface 31 is provided in the center of the bottom plate 3 , and a positioning pin on the lower end surface of the robot docking module 1 is inserted into the robot module docking interface 31 .

[0026] See also Figure 5 The bottom plate 3 is also provided with a glue unit positioning hole 33, which is located around the robot module docking interface 31, and the upper end of the guide pin 41 is inserted into the corresponding glue unit positioning hole 33. The glue unit positioning hole 33 is limited by the end surface of the guide pin 41 to ensure the position of the glue unit 4.

[0027] See also Figure 5 Guide sleeve positioning holes 32 are provided on both sides of the bottom plate 3, and the positioning guide sleeve 2 is installed in the guide sleeve positioning hole 32. The positioning guide sleeve 2 is connected to the positioning pin 2 on the positioning device of the dipping equipment to ensure the position accuracy of the entire device.

[0028] See also Figure 3 , Figure 4 Guide holes 433 are provided on both sides of the mounting plate 43, and the lower end of the guide pin 41 passes through the guide hole 433 and is connected to the fastener 44. The fastener 44 is a countersunk screw.

[0029] The mounting plate 43 is also provided with a telescopic spring limiting hole 431, and the telescopic spring 42 is located in the telescopic spring limiting hole 431. The telescopic spring 42 controls the vertical linear motion of the glue dipping unit 4, and the telescopic spring 42 is end-face limited in the telescopic spring limiting hole 431 to ensure that the height and position of the extension and compression are consistent.

[0030] The bottom of the mounting plate 43 is provided with a plurality of pin mounting holes 432, and the upper ends of the dipped glue pins 45 are inserted into the corresponding pin mounting holes 432. The installation depth and position accuracy of the dipped glue pins 45 are guaranteed by the bottom depth and aperture of the pin mounting holes 432.

[0031] The dipped glue pin 45 adopts the standard Misumi standard pin, which is pressed into the pin mounting hole 432 of the mounting plate 43 through the liquid nitrogen processing technology. After installation, the diameter deformation error of the dipped glue pin 45 is minimized and the installation position is accurate. Each time the dipped glue head soaks all the dipped glue pins 45 in the glue tray, the contact area is consistent, and the depth of the dipped glue pin 45 in the glue tray is consistent, ensuring that the volume of all dipped glue pins soaked in the glue tray is consistent each time, and the amount of dipped glue is consistent, ensuring the quantitative transfer amount of a single time, and the stability of the process is controlled. The use of liquid nitrogen installation can also avoid the change of the direction of the dipped glue pin 45, so that the mechanical properties are significantly improved, thereby increasing the service life of the dipped glue pin 45.

[0032] The setting position of the pin installation hole 432 matches the glue point arrangement position of the ECU workpiece. Different types of glue dipping units 4 can be processed according to different product models. When changing to other products, only the glue dipping unit 4 and accessories need to be replaced. The required cost is low, the compatibility is strong, and it can be widely used.

[0033] When the utility model is working, the robot of the glue dipping device is connected to the robot docking module 1, the positioning device of the glue dipping device is connected to the positioning guide sleeve 2, the robot moves the device above the glue tray, the robot drives the glue dipping unit 4 to descend, and the glue dipping pin 45 dips the glue in the glue tray. The robot drives the glue dipping unit 4 to move above the ECU workpiece, and the glue dipping pin 45 dipped in glue dispenses glue at the glue point arrangement position of the ECU workpiece, and so on and so forth between the glue tray and the ECU workpiece.

[0034] The utility model realizes glue taking by the glue dipping pin of the glue dipping unit, which can meet the continuous qualified glue weight and glue point shape. At the same time, the positioning structure ensures the stability and accuracy of the device when a large number of continuous reciprocating movements from the glue disc to the workpiece are carried out, thereby improving production efficiency.

Claims

1. A device for a glue dipping process, comprising a robot docking module, a positioning guide sleeve, a bottom plate, and a glue dipping unit, characterized in that: A robot docking module (1) is installed at the center of the top of the bottom plate (3), positioning guide sleeves (2) are installed on both sides of the top of the bottom plate (3), and a glue dipping unit (4) is installed at the bottom of the bottom plate (3). The glue dipping unit (4) comprises a guide pin (41), a telescopic spring (42), a mounting plate (43), and a glue dipping pin needle (45). Two guide pins (41) are mounted on the top of the mounting plate (43). The guide pins (41) are connected to the bottom plate (3). Two telescopic springs (42) are arranged between the two guide pins (41). Two ends of the telescopic spring (42) respectively abut against the mounting plate (43) and the bottom plate (3). A plurality of glue dipping pin needles (45) are arranged at the bottom of the mounting plate (43). The lower ends of the plurality of glue dipping pin needles (45) are flush with each other.

2. The device for the glue dipping process according to claim 1, characterized in that: A robot module docking interface (31) is provided in the center of the bottom plate (3), and a positioning pin on the lower end surface of the robot docking module (1) is inserted into the robot module docking interface (31).

3. The device for the glue dipping process according to claim 2, characterized in that: The bottom plate (3) is further provided with a glue dipping unit positioning hole (33), the glue dipping unit positioning hole (33) being located around the robot module docking interface (31), and the upper end of the guide pin (41) is inserted into the corresponding glue dipping unit positioning hole (33).

4. The device for the glue dipping process according to claim 1, characterized in that: Guide sleeve positioning holes (32) are provided on both sides of the bottom plate (3), the positioning guide sleeve (2) is installed in the guide sleeve positioning hole (32), and the positioning guide sleeve (2) is connected to a positioning pin 2 on a positioning device of the glue dipping equipment.

5. The device for the glue dipping process according to claim 1, characterized in that: Guide holes (433) are provided on both sides of the mounting plate (43), and the lower end of the guide pin (41) passes through the guide hole (433) and is connected to the fastener (44).

6. The device for the glue dipping process according to claim 5, characterized in that: The fastener (44) is a countersunk screw.

7. The device for the glue dipping process according to claim 5, characterized in that: The mounting plate (43) is further provided with a telescopic spring limiting hole (431), and the telescopic spring (42) is located in the telescopic spring limiting hole (431).

8. The device for the glue dipping process according to claim 1, characterized in that: A plurality of pin mounting holes (432) are provided at the bottom of the mounting plate (43), and the upper ends of the glue-coated pins (45) are inserted into the corresponding pin mounting holes (432).

9. The device for the glue dipping process according to claim 8, characterized in that: The setting position of the pin mounting hole (432) matches the arrangement position of the glue points of the ECU workpiece.

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