Gluing device for silicon wafer processing

Abstract

The utility model discloses a gluing device for silicon wafer processing, which comprises a base, the top of the base is provided with a separation net, the top of the separation net is provided with a silicon wafer positioning frame, one side of the back of the base is fixedly connected with a first mounting rack, and the top of the first mounting rack is provided with a first electric telescopic rod. A second electric telescopic rod is mounted at the output end of the first electric telescopic rod, a material box is mounted at the top end of the first mounting frame, a glue pump is mounted in the material box, a glue dripping head is mounted at the output end of the second electric telescopic rod, a second mounting frame is mounted on the other side of the back face of the base, and a third electric telescopic rod is mounted at the top of the second mounting frame. The output end of the third electric telescopic rod is connected with a glue brushing mechanism, a middle groove is formed in the middle of the base, a drainage hopper is installed in the middle of the middle groove, and a collecting box is connected to the bottom of the base in a clamped mode.

Description

Technical Field

[0001] The utility model relates to the field of silicon wafer processing, in particular to a glue coating device for silicon wafer processing. Background Art

[0002] With the development of production and technology in the semiconductor industry, the requirements for automation of production equipment are getting higher and higher. Silicon wafers are the materials used to manufacture semiconductor components. Generally, after polysilicon is remelted, pulled, sliced, chamfered, ground, polished, cleaned and other processes, chip-level silicon wafers with smooth surfaces and neat edges can be obtained. In the process of silicon wafer processing, glue coating is an essential process.

[0003] Existing glue coating equipment for silicon wafer processing usually drips glue onto the silicon wafer first, and then spreads the glue evenly through tools. However, when a large amount of material is added during the glue coating process, the excess glue will be pushed out and discarded, resulting in a waste of resources. Utility Model Content

[0004] The purpose of the utility model is to provide a glue coating device for silicon wafer processing to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a glue coating device for silicon wafer processing, comprising a base, a partition net is provided on the top of the base, a silicon wafer positioning frame is installed on the top of the partition net, a first mounting frame is fixedly connected to one side of the back side of the base, a first electric telescopic rod is installed on the top of the first mounting frame, a second electric telescopic rod is installed on the output end of the first electric telescopic rod, a material box is installed on the top of the first mounting frame, a glue pump is installed inside the material box, a glue drop head is installed on the output end of the second electric telescopic rod, a second mounting frame is installed on the other side of the back side of the base, a third electric telescopic rod is installed on the top of the second mounting frame, a glue brushing mechanism is connected to the output end of the third electric telescopic rod, a middle groove is provided in the middle of the base, a drainage bucket is installed in the middle of the middle groove, a collecting box is clamped on the bottom of the base, and a switch panel is installed on one side of the front side of the base.

[0006] Preferably, the first electric telescopic rod, the second electric telescopic rod, the glue pump and the third electric telescopic rod are all electrically connected to an external power supply through a switch panel, and the switch panel facilitates control of the first electric telescopic rod, the second electric telescopic rod, the glue pump and the third electric telescopic rod.

[0007] Preferably, the output end of the glue pump is connected to a material delivery pipe, and one end of the material delivery pipe is connected to a glue dripping head.

[0008] Preferably, the glue brushing mechanism includes a transverse shell, a screw rod rotatably installed inside the transverse shell, a sleeve threadedly connected to the surface of the screw rod and a fixed rod connected to the bottom of the sleeve, the bottom of the fixed rod is connected to a transverse rod, the transverse rod matches the silicon wafer positioning frame, a soft brush is provided at the bottom of the transverse rod, a drive motor is installed on one side of the transverse shell, the output end of the drive motor is connected to one end of the screw rod, and the glue brushing mechanism facilitates the even application of the dripped glue on the surface of the silicon wafer.

[0009] Preferably, the partition is installed on the top of the inner wall of the middle tank, the top of the drainage hopper corresponds to the bottom of the partition, the bottom of the drainage hopper corresponds to the collection box, and a feeding port is provided on the top of the material box.

[0010] Compared with the prior art, the beneficial effects of the utility model are:

[0011] The glue can be pumped out by the glue pump and dripped onto the surface of the silicon wafer through the glue dripping head. The glue brushing mechanism can be started to evenly spread the glue on the surface of the silicon wafer to complete the gluing work. In the gluing process, excess glue is brushed to the edge of the silicon wafer positioning frame and then falls onto the partition net along the silicon wafer positioning frame. Then, it passes through the partition net and enters the drainage hopper, and finally flows into the collection box for collection. The entire gluing device can collect excess glue that overflows during the gluing process, saving resources and reducing waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the structure of the utility model;

[0013] Figure 2 This is a structural diagram of the glue brushing mechanism of the utility model;

[0014] Figure 3 This is a middle structural diagram of the base of the utility model;

[0015] Figure 4 This is the internal structure diagram of the material box of the utility model.

[0016] In the figure: 1. base; 2. partition net; 3. silicon wafer positioning frame; 4. first mounting frame; 5. first electric telescopic rod; 6. second electric telescopic rod; 7. material box; 8. glue drop head; 9. switch panel; 10. second mounting frame; 11. third electric telescopic rod; 12. glue brushing mechanism; 13. collecting box; 14. transverse shell; 15. screw rod; 16. sleeve; 17. fixing rod; 18. transverse rod; 19. soft brush; 20. driving motor; 21. middle trough; 22. drainage bucket; 23. glue pump; 24. material delivery pipe. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] See also Figure 1-4 The utility model provides a glue coating device for silicon wafer processing, comprising a base 1, a partition net 2 is provided on the top of the base 1, a silicon wafer positioning frame 3 is installed on the top of the partition net 2, a first mounting frame 4 is fixedly connected to one side of the back side of the base 1, a first electric telescopic rod 5 is installed on the top of the first mounting frame 4, a second electric telescopic rod 6 is installed on the output end of the first electric telescopic rod 5, a material box 7 is installed on the top of the first mounting frame 4, a glue pump 23 is installed inside the material box 7, a glue drop head 8 is installed on the output end of the second electric telescopic rod 6, a second mounting frame 10 is installed on the other side of the back side of the base 1, a third electric telescopic rod 11 is installed on the top of the second mounting frame 10, and a glue brushing mechanism 12 is connected to the output end of the third electric telescopic rod 11,

[0019] A middle groove 21 is provided in the middle of the base 1, a drainage hopper 22 is installed in the middle of the middle groove 21, a collecting box 13 is clamped at the bottom of the base 1, the partition net 2 is installed at the top of the inner wall of the middle groove 21, the top of the drainage hopper 22 corresponds to the bottom of the partition net 2, the bottom of the drainage hopper 22 corresponds to the collecting box 13, a feeding port is provided at the top of the material box 7, a switch panel 9 is installed on one side of the front of the base 1, and the first electric telescopic rod 5, the second electric telescopic rod 6, the glue pump 23 and the third electric telescopic rod 11 are all electrically connected to the external power supply through the switch panel 9;

[0020] In this embodiment, during the gluing process, excess glue is brushed to the edge of the silicon wafer positioning frame 3 and then falls along the silicon wafer positioning frame 3 onto the partition net 2, then passes through the partition net 2 into the drainage hopper 22, and finally flows into the collection box 13 for collection, thereby reducing waste.

[0021] See also Figure 1-4 The output end of the glue pump 23 is connected with a feed pipe 24, and one end of the feed pipe 24 is connected with a glue drop head 8. In this embodiment, the silicon wafer is placed inside the silicon wafer positioning frame 3, and the silicon wafer positioning frame 3 corresponds to the size of the processed silicon wafer. When applying glue, the first electric telescopic rod 5 is started to move the second electric telescopic rod 6 and the glue drop head 8 downward, and the second electric telescopic rod 6 is started to extend the glue drop head 8 above the silicon wafer. Starting the glue pump 23 inside the material box 7 can extract the glue and drip it onto the surface of the silicon wafer through the glue drop head 8.

[0022] See also Figure 1-4The glue brushing mechanism 12 includes a transverse shell 14, a screw rod 15 rotatably installed inside the transverse shell 14, a sleeve 16 threadedly connected to the surface of the screw rod 15, and a fixed rod 17 connected to the bottom of the sleeve 16. The bottom of the fixed rod 17 is connected to a transverse rod 18, which matches the silicon wafer positioning frame 3. A soft brush 19 is provided at the bottom of the transverse rod 18. A driving motor 20 is installed on one side of the transverse shell 14, and the output end of the driving motor 20 is connected to one end of the screw rod 15.

[0023] In this embodiment, after the glue dripping is completed, the third electric telescopic rod 11 on the top of the glue brushing mechanism 12 is started, and the transverse rod 18 and the soft brush 19 are moved down to the surface of the silicon wafer. The driving motor 20 of the glue brushing mechanism 12 is started to drive the screw rod 15 to rotate. When the screw rod 15 rotates, the sleeve 16 moves to pull the fixed rod 17 and the transverse rod 18 to move. The soft brush 19 at the bottom of the transverse rod 18 can evenly apply the glue on the surface of the silicon wafer.

[0024] When used specifically, the utility model is a glue coating device for silicon wafer processing. The material box 7 is filled with glue for coating, and the silicon wafer is placed in the silicon wafer positioning frame 3 during use. The silicon wafer positioning frame 3 corresponds to the size of the processed silicon wafer and is set according to actual needs. When coating, the first electric telescopic rod 5 is started to move the second electric telescopic rod 6 and the glue drop head 8 downward, and the second electric telescopic rod 6 is started to extend the glue drop head 8 above the silicon wafer. The glue pump 23 inside the material box 7 is started to extract the glue and drip it onto the surface of the silicon wafer through the glue drop head 8. Then, the third electric telescopic rod 11 on the top of the glue brushing mechanism 12 is started to move the traverse rod 18 and the soft brush 19 downward to On the surface of the silicon wafer, the driving motor 20 that starts the glue brushing mechanism 12 can drive the screw 15 to rotate. While the screw 15 rotates, the sleeve 16 moves to pull the fixed rod 17 and the transverse rod 18 to move. The soft brush 19 at the bottom of the transverse rod 18 can evenly spread the glue on the surface of the silicon wafer to complete the gluing work. In the process of gluing, the excess glue is brushed to the edge of the silicon wafer positioning frame 3 and then falls onto the partition net 2 along the silicon wafer positioning frame 3, and then passes through the partition net 2 into the drainage bucket 22, and finally flows into the collection box 13 for collection. The entire gluing device can collect the overflowed excess glue during the gluing process, saving resources and reducing waste.

[0025] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A glue coating device for silicon wafer processing, comprising a base (1), characterized in that: The top of the base (1) is provided with a partition net (2), the top of the partition net (2) is installed with a silicon wafer positioning frame (3), one side of the back of the base (1) is fixedly connected with a first mounting frame (4), the top of the first mounting frame (4) is installed with a first electric telescopic rod (5), the output end of the first electric telescopic rod (5) is installed with a second electric telescopic rod (6), the top of the first mounting frame (4) is installed with a material box (7), the inside of the material box (7) is installed with a glue pump (23), the output end of the second electric telescopic rod (6) is installed with a second electric telescopic rod (6), and the top of the first mounting frame (4) is installed with a glue pump (23). A glue dripping head (8) is installed at the end, a second mounting frame (10) is installed on the other side of the back of the base (1), a third electric telescopic rod (11) is installed on the top of the second mounting frame (10), and the output end of the third electric telescopic rod (11) is connected to a glue brushing mechanism (12), a middle groove (21) is provided in the middle of the base (1), a drainage bucket (22) is installed in the middle of the middle groove (21), a collecting box (13) is clamped at the bottom of the base (1), and a switch panel (9) is installed on one side of the front of the base (1).

2. The glue coating device for silicon wafer processing according to claim 1, characterized in that: The first electric telescopic rod (5), the second electric telescopic rod (6), the glue pump (23) and the third electric telescopic rod (11) are all electrically connected to an external power source via a switch panel (9).

3. The glue coating device for silicon wafer processing according to claim 1, characterized in that: The output end of the glue pump (23) is connected to a material delivery pipe (24), and one end of the material delivery pipe (24) is connected to a glue dripping head (8).

4. The glue coating device for silicon wafer processing according to claim 1, characterized in that: The glue brushing mechanism (12) comprises a transverse shell (14), a screw rod (15) rotatably mounted inside the transverse shell (14), a sleeve (16) threadedly connected to the surface of the screw rod (15), and a fixed rod (17) connected to the bottom of the sleeve (16); the bottom of the fixed rod (17) is connected to a transverse rod (18), the transverse rod (18) matches the silicon wafer positioning frame (3), and the bottom of the transverse rod (18) is provided with a soft brush (19).

5. The glue coating device for silicon wafer processing according to claim 4, characterized in that: A driving motor (20) is installed on one side of the transverse shell (14), and an output end of the driving motor (20) is connected to one end of the screw rod (15).

6. The glue coating device for silicon wafer processing according to claim 1, characterized in that: The partition net (2) is installed on the top of the inner wall of the middle tank (21), and the top of the drainage hopper (22) corresponds to the bottom of the partition net (2).

7. The glue coating device for silicon wafer processing according to claim 1, characterized in that: The bottom of the drainage hopper (22) corresponds to the collecting box (13), and the top of the material box (7) is provided with a feeding port.

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