Visual inspection device for subfissure of silicon wafer

Abstract

The utility model relates to the technical field of silicon wafer detection, and discloses a silicon wafer hidden crack visual detection device, which comprises a blanking middle bedplate, and a silicon wafer conveying assembly and a visual detection system are respectively arranged on the blanking middle bedplate. The visual detection system comprises a first supporting frame, a broken detection camera mounting plate, a broken detection camera body, a second supporting frame and a hidden crack detection camera body, the first supporting frame is connected to the top of the discharging middle platen through bolts, and the broken detection camera mounting plate is connected to the first supporting frame through bolts; the broken inspection camera body is fixedly installed at the bottom of the broken inspection camera installation plate, and the second supporting frame is connected to the top of the discharging middle platen through bolts. According to the silicon wafer hidden crack visual detection device, hidden crack and broken wafer detection is carried out on the silicon wafer through the camera, removal is achieved in combination with existing equipment of a client side, the manual operation intensity is reduced, the influence of defective wafers on the next procedure is reduced, and the production efficiency and the productivity are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer detection, in particular to a visual detection device for hidden cracks in silicon wafers. Background Art

[0002] Crystalline silicon solar cell technology is the mainstream technology with absolute advantages in the field of photovoltaic power generation. Crystalline silicon solar cells are mainly composed of solar-grade silicon wafers.

[0003] In order to ensure that the conversion efficiency of crystalline silicon solar cells meets the technical indicators, the geometric parameters, electrical parameters, internal defects and other parameters of silicon wafers must be tested and sorted during the production process to meet the technical indicators of the solar industry or customers. Among the above indicators, the misjudgment rate of silicon wafer hidden crack detection in the internal defects of silicon wafers is very high, and many non-hidden crack silicon wafers will be misjudged as hidden crack wafers, and the number is relatively large, which greatly reduces the factory yield of silicon wafers.

[0004] The current solution of silicon wafer manufacturers is to have workers hold the edge of all the cracked silicon wafers sorted by the equipment and shake them to check whether there are any cracks inside the silicon wafers. If the workers shake the wafers with the right strength, the silicon wafers with cracks inside will be damaged, otherwise the silicon wafers will not be damaged. This detection method has very high technical requirements for workers, and it is difficult to ensure the long-term consistency of the strength used by workers to shake the silicon wafers, which may lead to misjudgment. In addition, this method is very inefficient and can no longer meet current production needs. Utility Model Content

[0005] 1. Technical issues to be solved

[0006] In view of the shortcomings of the existing technology, the utility model provides a visual inspection device for silicon wafer cracks. Its advantages are that it uses a camera to detect cracks and broken pieces in silicon wafers, combines the existing equipment of the client to achieve rejection, reduces the intensity of manual work, reduces the impact of defective wafers on subsequent processes, and improves production efficiency and capacity.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a visual inspection device for silicon wafer cracks, comprising an unloading intermediate platen, on which a silicon wafer conveying component and a visual inspection system are respectively arranged, and the silicon wafer conveying component is driven by a stepping motor;

[0009] The visual inspection system comprises: a support frame 1, a crushed inspection camera mounting plate, a crushed inspection camera body, a support frame 2, and a hidden crack inspection camera body, wherein the support frame 1 is bolted to the top of the middle platform of the material unloading, the crushed inspection camera mounting plate is bolted to the support frame 1, the crushed inspection camera body is fixedly installed at the bottom of the crushed inspection camera mounting plate, the support frame 2 is bolted to the top of the middle platform of the material unloading and is located on the right side of the support frame 1, and the hidden crack inspection camera body is fixedly installed on the support frame 2;

[0010] The silicon wafer conveying assembly includes at least: a front station, a rear station, and a kicking station, which are connected in an "I" shape on the top of the middle platform for unloading. A camera is used to detect hidden cracks and broken pieces of silicon wafers, and they are removed in combination with the client's existing equipment, thereby reducing the intensity of manual labor, reducing the impact of defective wafers on subsequent processes, and improving production efficiency and capacity.

[0011] Preferably, the support frame one and the support frame two are both arranged in an "H" shape, and the silicon wafer conveying assembly is located in the inner cavity of the support frame one and the support frame two.

[0012] Preferably, there should be at least one position between the visual detection system and the equipment kicking level.

[0013] Preferably, a limiting block of the debris inspection camera is connected to the bottom of the debris inspection camera mounting plate and is close to the right side of the debris inspection camera mounting plate.

[0014] Preferably, there are two hidden crack detection camera bodies, and the two hidden crack detection camera bodies are arranged opposite to each other.

[0015] Preferably, the visual inspection system is connected to an external production machine signal.

[0016] (III) Beneficial effects

[0017] Compared with the prior art, the utility model provides a visual detection device for silicon wafer hidden cracks, which has the following beneficial effects:

[0018] 1. This device is a visual inspection device for silicon wafer cracks. It uses a camera to detect cracks and broken pieces on silicon wafers, and combines with the client's existing equipment to eliminate them, thereby reducing the intensity of manual work, reducing the impact of defective wafers on subsequent processes, and improving production efficiency and capacity.

[0019] 2. This silicon wafer hidden crack visual inspection device is easy to operate, has a fast inspection speed, a modular product design, occupies a small space, can be installed in a wide area, and can be equipped with a kick-off structure according to needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0021] Figure 1 It is a three-dimensional diagram of the utility model;

[0022] Figure 2 It is a left view of the utility model;

[0023] Figure 3 It is a top view of the utility model.

[0024] In the figure: 1. Middle plate for unloading; 2. Wafer conveying assembly; 21. Front station; 22. Rear station; 23. Kick-off station; 3. Visual inspection system; 31. Support frame 1; 32. Shatter detection camera mounting plate; 33. Shatter detection camera body; 34. Shatter detection camera limit block; 35. Support frame 2; 36. Hidden crack detection camera body. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0026] like Figure 1-3As shown, the utility model provides a visual inspection device for silicon wafer cracks, including an unloading intermediate platform 1, on which a silicon wafer conveying component 2 and a visual inspection system 3 are respectively arranged, the silicon wafer conveying component 2 is driven by a stepper motor, and the visual inspection system 3 is connected to the external production machine signal; the visual inspection system 3 includes: a support frame 1 31, a crack inspection camera mounting plate 32, a crack inspection camera body 33, a support frame 2 35, and a crack inspection camera body 36, the support frame 1 31 is bolted to the top of the unloading intermediate platform 1, and the crack inspection camera mounting plate 32 is bolted to the On the support frame 1 31, the broken inspection camera body 33 is fixedly installed at the bottom of the broken inspection camera mounting plate 32. The bottom of the broken inspection camera mounting plate 32 is connected with a broken inspection camera limit block 34, and is close to the right side of the broken inspection camera mounting plate 32. The support frame 2 35 is bolted to the top of the blanking middle table 1 and is located on the right side of the support frame 1 31. The hidden crack detection camera body 36 is fixedly installed on the support frame 2 35. There are two hidden crack detection camera bodies 36, and the two hidden crack detection camera bodies 36 are arranged opposite to each other; the support frame 1 31 and the support frame 2 35 are both arranged in an "H" shape. The silicon wafer conveying assembly 2 is located in the inner cavity of the support frame 1 31 and the support frame 2 35; the silicon wafer conveying assembly 2 at least includes: a front station 21, a rear station 22, and a kicking station 23, which are connected to the top of the middle platform 1 of the unloading material in a "one" shape; there must be at least one interval between the visual inspection system 3 and the equipment kicking station 23; the product flows to the front station 21 and stops, and before the next round of stepping movement starts, the machine sends a collection signal to the visual inspection system 3, and the visual inspection system 3 starts to collect images of the product after receiving the collection signal. The product flows to the back workstation 22, and the image acquisition is synchronized with the product movement. After the image acquisition is completed, the visual inspection system 3 detects and judges the product image, identifies defects such as hidden cracks, broken edges, and broken pieces, and sends the result signal to the production machine. The production machine performs the next round of stepping movement, and the product flows to the kicking position 23. The production machine removes defective products based on the bad signals given by the visual inspection system 3, and then repeats the previous steps to detect defects on all products, reduce the intensity of manual work, reduce the impact of defective pieces on subsequent processes, and improve production efficiency and capacity.

[0027] In this embodiment, a camera is used to detect hidden cracks and broken pieces of silicon wafers, and the chips are removed in combination with the client's existing equipment, thereby reducing the intensity of manual work, reducing the impact of defective chips on subsequent processes, and improving production efficiency and capacity.

[0028] The working principle of this device for visually detecting hidden cracks in silicon wafers will be described in detail below.

[0029] like Figure 1-3As shown, when in use, the product flows to the front station 21 and stops. Before the next round of stepping movement starts, the machine sends a collection signal to the visual inspection system 3. After receiving the collection signal, the visual inspection system 3 starts to collect images of the product. At the same time, the product flows to the rear station 22. The image collection is synchronized with the product movement. After the image collection is completed, the visual inspection system 3 detects and judges the product image, identifies defects such as hidden cracks, broken edges, and broken pieces, and sends the result signal to the production machine. The production machine performs the next round of stepping movement, and the product flows to the kicking position 23. The production machine removes defective products according to the bad signals given by the visual inspection system 3, and then repeats the previous steps to perform defect detection on all products.

Claims

1. A visual inspection device for silicon wafer cracks, comprising an intermediate blanking plate (1), Features: The unloading intermediate platen (1) is provided with a silicon wafer conveying component (2) and a visual inspection system (3); The visual inspection system (3) comprises: a support frame 1 (31), a shatter detection camera mounting plate (32), a shatter detection camera body (33), a support frame 2 (35), and a hidden crack detection camera body (36); the support frame 1 (31) is bolted to the top of the intermediate platform (1) for material unloading; the shatter detection camera mounting plate (32) is bolted to the support frame 1 (31); the shatter detection camera body (33) is fixedly mounted on the bottom of the shatter detection camera mounting plate (32); the support frame 2 (35) is bolted to the top of the intermediate platform (1) for material unloading and is located on the right side of the support frame 1 (31); and the hidden crack detection camera body (36) is fixedly mounted on the support frame 2 (35); The silicon wafer conveying assembly (2) comprises at least: a front station (21), a rear station (22), and a kicking station (23); the front station (21), the rear station (22), and the kicking station (23) are connected to the top of the unloading middle platform (1) in a straight line.

2. A visual inspection device for silicon wafer cracks according to claim 1, Features: The support frame 1 (31) and the support frame 2 (35) are both arranged in an "H" shape, and the silicon wafer conveying component (2) is located in the inner cavity of the support frame 1 (31) and the support frame 2 (35).

3. A visual inspection device for silicon wafer cracks according to claim 1, Features: There should be at least one position between the visual inspection system (3) and the equipment kicking position (23).

4. A silicon wafer hidden crack visual detection device according to claim 1, Features: A shatter detection camera limit block (34) is connected to the bottom of the shatter detection camera mounting plate (32) and is close to the right side of the shatter detection camera mounting plate (32).

5. The device for visually detecting hidden cracks in silicon wafers according to claim 1, Features: There are two hidden crack detection camera bodies (36), and the two hidden crack detection camera bodies (36) are arranged opposite to each other.

6. A silicon wafer hidden crack visual detection device according to claim 1, Features: The visual inspection system (3) is connected to an external production machine signal.

Images