Multi-chip splitting device for double blades
By using double-cut laser cutting and precision mechanical mechanism in the chip lobe device, the problem of low cutting efficiency in the prior art is solved, and efficient and accurate multi-chip cutting is achieved to meet different size requirements.
Patent Information
- Application Number
- CN202420672733.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-02
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-04-02
AI Technical Summary
When used, the existing chip lobe device has low cutting efficiency and cannot conveniently cut the chip into multiple small chips, which affects the working efficiency and quality.
A multi-chip lobe device for double-knife is designed, using a laser cutting knife and a precision mechanical mechanism, including moving components, cutting components, and placement mechanisms. The multi-axis adjustment of the laser cutting knife is achieved through the servo motor, cylinder and limiting plate. The chip is stable and fixed, improving cutting accuracy and efficiency.
It realizes efficient and precise cutting of the chip, improves processing speed and quality, can adjust the spacing and position of the cutting knife according to needs, adapt to chips of different sizes, and ensures the consistency of the size of each lobe.
Smart Images
Figure CN222176347U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip splitting, in particular to a double-blade multi-chip splitting device. Background Art
[0002] A chip, also known as an integrated circuit, is a way of miniaturizing circuits and is usually manufactured on the surface of a semiconductor wafer. It is an indispensable component of modern electronic devices and is responsible for performing various computing and control tasks. A chip splitting device is a key device used in the semiconductor manufacturing process. Its main function is to cut large semiconductor wafers into small chips. This process is usually called splitting or dicing, and is a very important step in semiconductor manufacturing. When the existing chip splitting device is in use, there is only one knife for cutting, and the cutting efficiency is low. In addition, no laser cutting knife is used during cutting, which affects the cutting work and quality. Most chip splitting devices cannot easily cut a chip into multiple small chips when in use, and multiple cuts are required to complete, resulting in low work efficiency. Utility Model Content
[0003] The utility model aims to provide a double-blade multi-chip splitting device to solve the problems raised in the above background technology.
[0004] To achieve the above object, the utility model provides the following technical solution: a double-blade multi-chip splitting device, comprising a splitting device body, a load-bearing frame fixedly connected to the top of the splitting device body, a cutting mechanism disposed on the top of the load-bearing frame, a placing mechanism disposed on the top of the load-bearing frame, and the placing mechanism is used to place chips;
[0005] The cutting mechanism comprises a moving assembly and a cutting assembly, wherein the moving assembly is arranged on the top of the load-bearing frame, and the cutting assembly is arranged inside the moving assembly.
[0006] The cutting component is used for cutting the chip, and the moving component is used for moving the cutting component.
[0007] Preferably, the moving component includes a first servo motor, which is fixedly connected to the front side of the load-bearing frame, a threaded rod is fixedly connected to the rear side of the first servo motor, the rear side of the threaded rod is rotatably connected to the inside of the load-bearing frame, the outer periphery of the threaded rod is threadedly connected to a moving frame, the inside of the moving frame is slidably connected to a sliding rod, the sliding rod is fixedly connected to the inside of the load-bearing frame, the top of the moving frame is fixedly connected to a single-axis cylinder, and the top of the single-axis cylinder is fixedly connected to a fixed plate.
[0008] Preferably, two single-axis cylinders are provided, and the two single-axis cylinders are respectively fixedly connected to the two sides of the top of the movable frame, so that when the fixed plate is raised and lowered to change the height position of the laser cutting knife, the two cylinders can make the lifting of the fixed plate more stable and more precise, thereby ensuring the stability of the laser cutting knife.
[0009] Preferably, the cutting assembly includes a limit plate, which is fixedly connected to the inside of the fixed plate, a load-bearing column is fixedly connected to the inside of the limit plate, a protective frame is fixedly connected to the bottom of the load-bearing column, a dual-axis cylinder is fixedly connected to the top of the protective frame, connecting blocks are fixedly connected to both sides of the dual-axis cylinder, a laser cutting knife is fixedly connected to the right side of the connecting block, and the load-bearing column is slidably connected to the inside of the mobile frame.
[0010] Preferably, a limiting groove is provided in the protective frame, and the connecting block is slidably connected in the limiting groove. Two laser cutting knives are provided, and the two laser cutting knives are respectively distributed on both sides of the dual-axis cylinder, so as to facilitate the connecting block to slide in the limiting groove. The connecting block can be limited to make it more stable when moving, and the provision of two laser cutting knives can improve the efficiency of chip splitting.
[0011] Preferably, the placement mechanism includes a second servo motor, the second servo motor is fixedly connected to the top of the splitting device body, the top of the second servo motor is fixedly connected to a rotating rod, the rotating rod is rotatably connected to the inside of the load-bearing frame, the top of the rotating rod is fixedly connected to a placing table, the top of the placing table is plugged with an insertion rod, and the top of the insertion rod is fixedly connected to a limiting plate.
[0012] Preferably, the placement table is square, and slots with equal spacing are provided on the top of the placement table. The insertion rods are inserted into the slots. Soft protective pads are provided on the top of the placement table and the bottom of the limiting plate to facilitate the insertion of the insertion rod into the slot. The chip can be limited by the limiting plate to ensure the stability of the chip during the splitting operation, and the soft protective pad can protect the chip.
[0013] Compared with the prior art, the utility model provides a dual-blade multi-chip splitting device, which has the following beneficial effects:
[0014] 1. The dual-blade multi-chip splitting device can realize the chip splitting work by two laser cutting knives through the cutting mechanism, thereby improving the processing speed and accuracy, and the laser cutting knife can improve the cutting quality. At the same time, the distance between the two laser cutting knives can be adjusted to meet different cutting requirements. At the same time, the front and back and up and down positions of the laser cutting knives can be adjusted during the cutting process to improve the cutting efficiency. When cutting, the fixed plate is first driven to rise and fall by the single-axis cylinder. When the fixed plate is lifted and lowered, the load-bearing plate is driven by the limit plate. The column is raised and lowered inside the mobile frame. When the load-bearing column is raised and lowered, the laser cutting knife is driven to rise and fall through the protective frame, and the laser cutting knife is lifted and lowered to a suitable position on the top of the limit plate, and then the threaded rod is driven to rotate by the first servo motor, so that the threaded rod drives the mobile frame to move forward and backward, and the laser cutting knife is driven to move to the front or rear side of the limit plate through the mobile frame, and then the laser cutting knife is started, and the mobile frame continues to move forward or backward to cut the chip inside the two limit plates, and the connecting block can be driven to move left and right in the limit slot by the dual-axis cylinder as needed to change the distance between the two laser cutting knives.
[0015] 2. The double-blade multi-chip splitting device can fix chips of different sizes through the placement mechanism when splitting rectangular chips, and can adjust the distance between the limit plates according to the requirements of the size of the chips, so that the laser cutting knife can split the chips between the two limit plates, which can not only ensure that the size of each chip is the same, but also fix the chip. First, the chip is placed on the top of the placement table, and then the insertion rod is inserted into the slot so that the limit plate fixes the chip on the top of the chip, and the number of limit plates can be increased and decreased as needed. When the longitudinal cutting of the chip is completed, it is only necessary to drive the rotating rod to rotate through the servo motor, so that the rotating rod drives the placement table to rotate, and drives the chip that has been completed in the longitudinal cutting to rotate to a horizontal position, and the limit plate is re-inserted into the slot through the insertion rod so that the limit plate is still in the longitudinal direction, and the chip is continued to be cut to complete the splitting work. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative labor:
[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;
[0018] Figure 2 It is a schematic diagram of the cutting mechanism structure;
[0019] Figure 3 It is a schematic diagram of the structure of the mobile component;
[0020] Figure 4 It is a schematic diagram of the cutting component structure;
[0021] Figure 5 It is a schematic diagram of the internal structure of the protection frame;
[0022] Figure 6 It is a schematic diagram of the placement mechanism structure;
[0023] Figure 7 Schematic diagram of the top structure of the placement table.
[0024] In the figure: 1. the main body of the splitting device; 2. the load-bearing frame; 3. the cutting mechanism; 4. the placing mechanism; 31. the moving assembly; 32. the cutting assembly; 311. the first servo motor; 312. the moving frame; 313. the threaded rod; 314. the sliding rod; 315. the single-axis cylinder; 316. the fixing plate; 321. the limiting plate; 322. the load-bearing column; 323. the protective frame; 324. the double-axis cylinder; 325. the connecting block; 326. the laser cutting knife; 41. the second servo motor; 42. the rotating rod; 43. the placing table; 44. the inserting rod; 45. the limiting plate. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0026] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0027] The utility model provides the following technical solutions:
[0028] Embodiment 1
[0029] See also Figure 1-7The utility model provides a technical solution: a multi-chip splitting device for double knives, including a splitting device body 1, a load-bearing frame 2 is fixedly connected to the top of the splitting device body 1, a cutting mechanism 3 is arranged on the top of the load-bearing frame 2, a placing mechanism 4 is arranged on the top of the load-bearing frame 2, the placing mechanism 4 is used to place chips, the cutting mechanism 3 includes a moving component 31 and a cutting component 32, the moving component 31 is arranged on the top of the load-bearing frame 2, the cutting component 32 is arranged on the inner side of the moving component 31, the cutting component 32 is used to cut chips, and the moving component 31 is used to move the cutting component 32.
[0030] The moving assembly 31 includes a first servo motor 311, which is fixedly connected to the front side of the load-bearing frame 2, and a threaded rod 313 is fixedly connected to the rear side of the first servo motor 311, and the rear side of the threaded rod 313 is rotatably connected to the inside of the load-bearing frame 2, and the outer periphery of the threaded rod 313 is threadedly connected to a moving frame 312, and a sliding rod 314 is slidably connected to the inside of the moving frame 312, and the sliding rod 314 is fixedly connected to the inside of the load-bearing frame 2, and a single-axis cylinder 315 is fixedly connected to the top of the moving frame 312, and a fixed plate 316 is fixedly connected to the top of the single-axis cylinder 315. Two single-axis cylinders 315 are provided, and the two single-axis cylinders 315 are respectively fixedly connected to the two sides of the top of the moving frame 312, so that when the fixed plate 316 is lifted and lowered to change the height position of the laser cutting knife 326, the two cylinders can make the lifting of the fixed plate 316 more stable and with higher precision, thereby ensuring the stability of the laser cutting knife 326.
[0031] See also Figure 1-7 The utility model provides a technical solution: the cutting assembly 32 includes a limit plate 321, the limit plate 321 is fixedly connected to the inside of the fixed plate 316, a load-bearing column 322 is fixedly connected to the limit plate 321, a protective frame 323 is fixedly connected to the bottom of the load-bearing column 322, a double-axis cylinder 324 is fixedly connected to the top of the protective frame 323, connecting blocks 325 are fixedly connected to both sides of the double-axis cylinder 324, a laser cutting knife 326 is fixedly connected to the right side of the connecting block 325, the load-bearing column 322 is slidably connected to the inside of the movable frame 312, a limit groove is provided in the protective frame 323, the connecting block 325 is slidably connected to the limit groove, and two laser cutting knives 326 are provided, which are respectively distributed on both sides of the double-axis cylinder 324, so that the connecting block 325 can slide in the limit groove, and the connecting block 325 can be limited to make it more stable when moving, and the provision of two laser cutting knives 326 can improve the efficiency of chip splitting.
[0032] Embodiment 2
[0033] See also Figure 1-7, and on the basis of the first embodiment, the placement mechanism 4 further comprises a second servo motor 41, the second servo motor 41 is fixedly connected to the top of the splitting device body 1, the second servo motor 41 is fixedly connected to the top of a rotating rod 42, the rotating rod 42 is rotatably connected to the inside of the load-bearing frame 2, the top of the rotating rod 42 is fixedly connected to a placement table 43, the top of the placement table 43 is plugged with an insertion rod 44, the top of the insertion rod 44 is fixedly connected to a limiting plate 45, the placement table 43 is square, the top of the placement table 43 is provided with slots with equal spacing, the insertion rod 44 is plugged into the slots, and soft protective pads are provided on the top of the placement table 43 and the bottom of the limiting plate 45 to facilitate the insertion of the insertion rod 44 into the slot, the chip can be limited by the limiting plate 45 to ensure the stability of the chip during the splitting operation, and the soft protective pad can protect the chip.
[0034] During actual operation, when this device is used, the chip is first placed on the top of the placement table 43, and then the insertion rod 44 is inserted into the slot, so that the limit plate 45 fixes the chip on the top of the chip, and the number of limit plates 45 can be increased or decreased as needed, and the fixed plate 316 is driven to rise and fall by the single-axis cylinder 315. When the fixed plate 316 is lifted and lowered, the limit plate 321 drives the load-bearing column 322 to rise and fall inside the movable frame 312. When the load-bearing column 322 rises and falls, the protective frame 323 drives the laser cutting knife 326 to rise and fall, and the laser cutting knife 326 is lifted and lowered to a suitable position on the top of the limit plate 45, and then the first servo motor 311 drives the threaded rod 313 to rotate, so that the threaded rod 313 drives the movable frame 312 to move back and forth, and the laser cutting knife is driven by the movable frame 312 326 moves to the front or rear side of the limit plate 45, then starts the laser cutting knife 326, continues to move the movable frame 312 forward or backward, cuts the chip inside the two limit plates 45, and can drive the connecting block 325 to move left and right in the limit groove through the dual-axis cylinder 324 as needed to change the spacing between the two laser cutting knives 326. When the longitudinal cutting of the chip is completed, it is only necessary to drive the rotating rod 42 to rotate through the servo motor, so that the rotating rod 42 drives the placement table 43 to rotate, and drives the chip that has been cut longitudinally to rotate to a horizontal position, and re-insert the limit plate 45 into the slot through the insertion rod 44, so that the limit plate 45 is still in the longitudinal direction, fix the chip, and continue to cut the chip by moving the laser cutting knife 326 back and forth to complete the chip splitting work.
[0035] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.
Claims
1. A double-blade multi-chip splitting device, comprising a splitting device body (1), characterized in that: The top of the chip splitting device body (1) is fixedly connected to a load-bearing frame (2), the top of the load-bearing frame (2) is provided with a cutting mechanism (3), the top of the load-bearing frame (2) is provided with a placing mechanism (4), and the placing mechanism (4) is used to place chips; The cutting mechanism (3) comprises a moving component (31) and a cutting component (32), wherein the moving component (31) is arranged on the top of the load-bearing frame (2), and the cutting component (32) is arranged on the inner side of the moving component (31); The cutting component (32) is used for cutting the chip, and the moving component (31) is used for moving the cutting component (32).
2. A double-blade multi-chip splitting device according to claim 1, characterized in that: The moving assembly (31) comprises a first servo motor (311), the first servo motor (311) is fixedly connected to the front side of the load-bearing frame (2), the first servo motor (311) is fixedly connected to a threaded rod (313) on the rear side, the threaded rod (313) is rotatably connected to the inside of the load-bearing frame (2), the threaded rod (313) is threadedly connected to a moving frame (312) on the periphery, the moving frame (312) is slidably connected to a sliding rod (314) on the inside, the sliding rod (314) is fixedly connected to the inside of the load-bearing frame (2), the top of the moving frame (312) is fixedly connected to a single-axis cylinder (315), and the top of the single-axis cylinder (315) is fixedly connected to a fixing plate (316).
3. A double-blade multi-chip splitting device according to claim 2, characterized in that: Two single-axis cylinders (315) are provided, and the two single-axis cylinders (315) are respectively fixedly connected to two sides of the top of the moving frame (312).
4. A double-blade multi-chip splitting device according to claim 1, characterized in that: The cutting assembly (32) comprises a limiting plate (321), wherein the limiting plate (321) is fixedly connected to the inside of the fixing plate (316), a load-bearing column (322) is fixedly connected to the inside of the limiting plate (321), a protection frame (323) is fixedly connected to the bottom of the load-bearing column (322), a double-axis cylinder (324) is fixedly connected to the top of the protection frame (323), connecting blocks (325) are fixedly connected to both sides of the double-axis cylinder (324), a laser cutting knife (326) is fixedly connected to the right side of the connecting block (325), and the load-bearing column (322) is slidably connected to the inside of the moving frame (312).
5. A double-blade multi-chip splitting device according to claim 4, characterized in that: A limiting groove is provided in the protection frame (323), and the connection block (325) is slidably connected in the limiting groove. Two laser cutting knives (326) are provided, and the two laser cutting knives (326) are respectively distributed on both sides of the double-axis cylinder (324).
6. A double-blade multi-chip splitting device according to claim 1, characterized in that: The placement mechanism (4) comprises a second servo motor (41), the second servo motor (41) is fixedly connected to the top of the splitting device body (1), the top of the second servo motor (41) is fixedly connected to a rotating rod (42), the rotating rod (42) is rotatably connected to the inside of the load-bearing frame (2), the top of the rotating rod (42) is fixedly connected to a placement platform (43), the top of the placement platform (43) is plugged with an insertion rod (44), and the top of the insertion rod (44) is fixedly connected to a limiting plate (45).
7. A double-blade multi-chip splitting device according to claim 6, characterized in that: The placing platform (43) is square in shape, and slots with equal spacing are provided on the top of the placing platform (43), and the insertion rods (44) are inserted into the slots. Soft protective pads are provided on the top of the placing platform (43) and the bottom of the limiting plate (45).