Mold closing and demolding device applied to commutator pressing production

Abstract

The utility model relates to the technical field of commutator production equipment, in particular to a mold closing and demolding device applied to commutator pressing production. Comprising a workbench, a lower die, a jacking assembly, a middle die, a discharging chamber, an upper die and an auxiliary cooling mechanism, after materials are heated and formed in the middle die, water in a water tank is refrigerated through a plurality of semiconductor chilling plates, a water pump is started, and cold water is conveyed into a heat exchange channel in a heat exchange plate through cooperation of a conveying main pipe and a flow dividing pipe; by means of the structure, cold water in the heat exchange channel exchanges heat with heat in the middle mold, water obtained after heat exchange is conveyed into the water tank through cooperation of the water outlet and the water return pipe, the semiconductor chilling plate is used for refrigerating the water obtained after heat exchange, and therefore circulating water cooling heat dissipation is completed. Therefore, the forming speed of materials in the middle die is increased, and the production efficiency of the commutator is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of commutator production equipment, in particular to a mold clamping and demoulding device used in commutator pressing production. Background Art

[0002] The production and processing of commutators generally includes a pressing process, that is, pressing bakelite powder into the commutator copper shell to obtain a commutator pressed product. However, during the operation of the commutator pressing production equipment, the material feeding is relatively troublesome, which affects the efficiency of the device.

[0003] In order to solve the above problems, the prior art patent publication number (CN215750356U) discloses a commutator pressing production equipment, which relates to the field of commutator technology, including a bottom plate, four first pneumatic telescopic rods are installed on the top of the bottom plate, and a lower mold is installed on the top of the first pneumatic telescopic rod, and the four corners of the top of the lower mold are provided with second limiting holes, and the bottom of the lower mold is provided with a blanking structure; the blanking structure also includes a connecting groove, which is provided at the top of the lower mold, and a mounting plate is provided at the bottom of the lower mold, and the four corners of the top of the mounting plate are provided with second pneumatic telescopic rods, and the top of the second pneumatic telescopic rod is connected to the bottom of the lower mold by welding, and a push rod is installed on the top of the mounting plate. This technical solution shortens the second pneumatic telescopic rod by controlling the cylinder, and under the action of the second pneumatic telescopic rod, the mounting plate can move upward relative to the lower mold, driving the push rod to push out the copper shell.

[0004] However, the mold clamping and demolding device structure in the existing commutator pressing production equipment is not provided with a cooling mechanism, resulting in a slow molding speed of the material in the mold, which has a certain impact on the production efficiency of the commutator. Utility Model Content

[0005] The purpose of the utility model is to provide a mold closing and demolding device used in commutator pressing production, aiming to solve the technical problem that the mold closing and demolding device structure in the existing commutator pressing production equipment is not provided with a cooling mechanism, resulting in a slow molding speed of the material in the mold, which has a certain impact on the production efficiency of the commutator.

[0006] To achieve the above-mentioned purpose, the utility model provides a mold clamping and demolding device used in commutator pressing production, comprising a workbench, a lower mold, a lifting assembly, a middle mold, a discharge chamber, an upper mold and an auxiliary cooling mechanism, the upper surface of the workbench is equipped with the lower mold through a first electric push rod, the bottom of the lower mold is provided with the lifting assembly, a bracket is further provided above the workbench, the middle part of the bracket is provided with the middle mold, the middle mold is located above the upper mold, the upper surface of the middle mold is provided with the discharge chamber, the top end of the bracket is equipped with the upper mold through a second electric push rod, and the upper mold is located above the discharge chamber;

[0007] The auxiliary cooling mechanism includes a water tank, a water pump, a delivery main pipe, two shunt pipes, two heat exchange plates, two return pipes and a plurality of semiconductor refrigeration sheets. The water tank and the water pump are both installed above the workbench. The two heat exchange plates are detachably connected to the middle mold and are respectively located on the front and rear surfaces of the middle mold. Each of the heat exchange plates is in contact with the outer wall of the middle mold. A heat exchange channel is provided inside each of the heat exchange plates. The heat exchange channel is arranged in a serpentine structure. A water inlet is provided at one end of the heat exchange channel, and a water outlet is provided at the other end of the heat exchange channel. The input end of the water pump is connected to the water tank, and the delivery main pipe is provided at the output end of the water pump. Two shunt pipes are provided at one end of the delivery main pipe away from the water pump. One end of each shunt pipe away from the delivery main pipe is connected to the corresponding water inlet. The return pipe is provided at each water outlet. One end of each return pipe away from the corresponding water outlet is connected to the return water port of the water tank. A plurality of semiconductor refrigeration sheets are provided on the water tank.

[0008] Wherein, mounting wing plates are arranged on both sides of each of the heat exchange plates, and the mounting wing plates are detachably connected to the outer side walls of the middle mold.

[0009] Among them, a plurality of dustproof shells are also arranged on the outer wall of the water tank, and the dustproof shell is arranged outside the hot end of each semiconductor refrigeration plate, and a cooling fan is arranged at one end of each dustproof shell away from the water tank.

[0010] Wherein, a fixing block is arranged at one end of each dustproof shell close to the water tank, and the fixing block is detachably connected to the outer side wall of the water tank.

[0011] Among them, the mold closing and demolding device used in commutator pressing production also includes a mixing mechanism, which includes a mounting frame, a drive motor, a stirring shaft and a stirring blade. The mounting frame is installed at the top of the water tank, and the drive motor is arranged on the mounting frame. The output end of the drive motor is arranged with the stirring shaft, and the stirring blade is arranged at one end of the stirring shaft located inside the water tank.

[0012] Wherein, the mounting frame includes a mounting plate and four fixed feet, the driving motor is arranged on the upper surface of the mounting plate, the fixed feet are arranged at the four bottom corners of the mounting plate, and the fixed feet are detachably connected to the top end of the water tank.

[0013] The utility model discloses a mold clamping and demolding device for commutator pressing production, comprising a workbench, a lower mold, a lifting assembly, a middle mold, a discharge chamber, an upper mold and an auxiliary cooling mechanism. After the material is heated and formed in the middle mold, the water in the water tank is cooled by a plurality of semiconductor refrigeration sheets, and then the water pump is started. The cold water is transported to the heat exchange channel in the heat exchange plate through the cooperation of the conveying main pipe and the shunt pipe, so that the cold water in the heat exchange channel exchanges heat with the heat in the middle mold. The water after heat exchange is transported to the inside of the water tank through the cooperation of the water outlet and the return pipe, and the water after heat exchange is cooled by the semiconductor refrigeration sheets, thereby completing the circulating water cooling and heat dissipation. The above structure is adopted to improve the cooling speed of the middle mold, thereby accelerating the molding speed of the material in the middle mold and improving the production efficiency of the commutator. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 It is a structural schematic diagram of a mold clamping and demolding device used in commutator pressing production according to the first embodiment of the utility model.

[0016] Figure 2 It is a structural schematic diagram of the auxiliary cooling mechanism in the first embodiment of the utility model.

[0017] Figure 3 It is a schematic diagram of the internal structure of the heat exchange plate in the first embodiment of the utility model.

[0018] Figure 4 It is a structural schematic diagram of the auxiliary cooling mechanism in the second embodiment of the utility model.

[0019] Figure 5 The utility model provides Figure 4 A magnified view of the local structure at B.

[0020] 101-workbench, 102-lower mold, 103-lifting assembly, 104-middle mold, 105-discharging chamber, 106-upper mold, 107-water tank, 108-water pump, 109-delivery main pipe, 110-diverter pipe, 111-heat exchange plate, 112-reflux pipe, 113-semiconductor refrigeration plate, 114-first electric push rod, 115-bracket, 116-second electric push rod, 117-heat exchange channel, 118-water inlet, 119-water outlet, 120-water return port, 121-mounting wing plate, 122-dustproof shell, 123-cooling fan, 124-fixed block, 201-mounting frame, 202-drive motor, 203-stirring shaft, 204-stirring blades, 205-mounting plate, 206-fixed foot. DETAILED DESCRIPTION

[0021] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0022] First embodiment:

[0023] See also Figures 1 to 3 ,in Figure 1 1 is a schematic structural diagram of a mold clamping and demolding device for commutator pressing production according to a first embodiment. Figure 2 is a schematic structural diagram of the auxiliary cooling mechanism in the first embodiment, Figure 3 Schematic diagram of the internal structure of the heat exchange plate in the first embodiment.

[0024] The utility model provides a mold clamping and demolding device for commutator pressing production: including a workbench 101, a lower mold 102, a lifting assembly 103, a middle mold 104, a discharge chamber 105, an upper mold 106 and an auxiliary cooling mechanism, wherein the auxiliary cooling mechanism includes a water tank 107, a water pump 108, a conveying main pipe 109, two shunt pipes 110, two heat exchange plates 111, two return pipes 112 and a plurality of semiconductor cooling sheets 113. The above scheme solves the problem that the mold clamping and demolding device structure in the existing commutator pressing production equipment is not provided with a cooling mechanism, resulting in a slow molding speed of the material in the mold, which has a certain impact on the production efficiency of the commutator. It can be understood that the above scheme can be used in the structure of the mold clamping and demolding device of the commutator pressing production equipment.

[0025] According to the present specific embodiment, the lower die 102 is installed on the upper surface of the workbench 101 through the first electric push rod 114, the bottom of the lower die 102 is provided with the lifting assembly 103, and a bracket 115 is further provided above the workbench 101, the middle part of the bracket 115 is provided with the middle die 104, the middle die 104 is located above the upper die 106, the upper surface of the middle die 104 is provided with the discharge chamber 105, the top of the bracket 115 is provided with the upper die 106 through the second electric push rod 116, the upper die 106 is located above the discharge chamber 105, the cast copper shell is placed on the top of the lower die 102, and then the lower die 102 is driven by the first electric push rod 114. The upper mold 106 is lifted as a whole, so that one end of the copper shell is stuck in the middle mold 104, and then the corresponding bakelite powder cake is placed in the discharge chamber 105. At this time, the upper mold 106 can be driven to descend as a whole through the control of the second electric push rod 116. Under the action of the upper mold 106, the bakelite powder cake in the discharge chamber 105 can be squeezed into the copper shell, and then heated to wait for melting and forming. After the forming and cooling, the upper mold 106 and the lower mold 102 can be separated from the middle mold 104 under the cooperation of the lifting component 103, the first electric push rod 114 and the second electric push rod 116 to complete the demolding, wherein the lifting component 103 is the prior art.

[0026] The water tank 107 and the water pump 108 are both installed above the workbench 101, and the two heat exchange plates 111 are detachably connected to the middle mold 104 and are respectively located on the front and rear surfaces of the middle mold 104, each of the heat exchange plates 111 is in contact with the outer wall of the middle mold 104, and each of the heat exchange plates 111 is provided with a heat exchange channel 117 inside, and the heat exchange channel 117 is provided in a serpentine structure, and a water inlet 118 is provided at one end of the heat exchange channel 117, and a water outlet is provided at the other end of the heat exchange channel 117. 119, the input end of the water pump 108 is connected to the water tank 107, the output end of the water pump 108 is provided with the delivery main pipe 109, the end of the delivery main pipe 109 away from the water pump 108 is provided with two diversion pipes 110, each of the diversion pipes 110 is connected to the corresponding water inlet 118 at one end away from the delivery main pipe 109, and each of the water outlets 119 is provided with a return pipe 112, and each of the return pipes 112 is connected to the return pipe 112 of the water tank 107 at one end away from the corresponding water outlet 119. The water tank 107 is connected to the water outlet 120, and a plurality of semiconductor cooling sheets 113 are arranged on the water tank 107. After the material is heated and formed in the middle mold 104, the water in the water tank 107 is cooled by the plurality of semiconductor cooling sheets 113, and then the water pump 108 is started, and the cold water is transported to the heat exchange channel 117 in the heat exchange plate 111 through the cooperation of the delivery main pipe 109 and the diverter pipe 110, so that the cold water in the heat exchange channel 117 exchanges heat with the heat in the middle mold 104, and the water after heat exchange passes through the outlet The water inlet 119 and the return water pipe cooperate to transport the water to the inside of the water tank 107, and the semiconductor refrigeration plate 113 is used to cool the water after heat exchange, thereby completing the circulating water cooling and heat dissipation. The above structure is adopted to improve the cooling speed of the middle mold 104, thereby accelerating the molding speed of the material in the middle mold 104 and improving the production efficiency of the commutator. In addition, since the heat exchange channel 117 is arranged in a serpentine structure, the heat exchange time between the cold water in the heat exchange channel 117 and the middle mold 104 is extended, so that the cooling effect on the middle mold 104 is better.

[0027] Secondly, each of the heat exchange plates 111 is provided with mounting wing plates 121 on both sides. The mounting wing plates 121 are detachably connected to the outer wall of the middle mold 104, and the mounting wing plates 121 are fixed to the outer wall of the middle mold 104 by screws, thereby completing the installation of the heat exchange plate 111.

[0028] At the same time, a plurality of dustproof shells 122 are provided on the outer wall of the water tank 107, and the dustproof shell 122 is provided on the outside of the hot end of each semiconductor refrigeration plate 113, and a cooling fan 123 is provided on the end of each dustproof shell 122 away from the water tank 107. The setting of the dustproof shell 122 can prevent excessive dust from adhering to the outside of the hot end of the semiconductor refrigeration plate 113, which would cause the cooling effect of the semiconductor refrigeration plate 113 to deteriorate. The setting of the cooling fan 123 can speed up the circulation of air between the inside of the dustproof shell 122 and the outside air, thereby taking away the heat dissipated by the hot end of the semiconductor refrigeration plate 113, so that the cooling effect of the cold end of the semiconductor refrigeration plate 113 is better.

[0029] In addition, each dustproof shell 122 is provided with a fixing block 124 at one end close to the water tank 107. The fixing block 124 is detachably connected to the outer wall of the water tank 107, and the fixing block 124 is fixed to the outer wall of the water tank 107 by screws, thereby completing the installation of the dustproof shell 122.

[0030] When using a mold closing and demolding device for commutator pressing production according to the present embodiment, the cast copper shell part is placed on the top of the lower mold 102, and then the lower mold 102 is driven to rise as a whole by the first electric push rod 114, so that one end of the copper shell part is stuck in the inside of the middle mold 104, and then the corresponding bakelite powder cake is placed in the inside of the discharge chamber 105. At this time, the upper mold 106 can be driven to descend as a whole by the control of the second electric push rod 116. Under the action of the upper mold 106, the bakelite powder cake in the discharge chamber 105 can be squeezed into the inside of the copper shell part, and then heated and waited to be melted and formed. After the forming and cooling, the upper mold 106 and the lower mold 102 can be separated from the middle mold 104 by the cooperation of the jacking component 103, the first electric push rod 114 and the second electric push rod 116 to complete the demolding, and when the material is heated in the middle mold 104 After molding, the water in the water tank 107 is cooled by multiple semiconductor refrigeration sheets 113, and then the water pump 108 is started. The cold water is transported to the heat exchange channel 117 in the heat exchange plate 111 through the cooperation of the delivery main pipe 109 and the diverter pipe 110, so that the cold water in the heat exchange channel 117 exchanges heat with the heat in the middle mold 104. The water after heat exchange is transported to the inside of the water tank 107 through the water outlet 119 and the return pipe, and the semiconductor refrigeration sheet 113 is used to cool the water after heat exchange, thereby completing the circulating water cooling and heat dissipation. The above structure is used to increase the cooling speed of the middle mold 104, thereby accelerating the molding speed of the material in the middle mold 104 and improving the production efficiency of the commutator. In addition, since the heat exchange channel 117 is arranged in a serpentine structure, the heat exchange time between the cold water in the heat exchange channel 117 and the middle mold 104 is extended, so that the cooling effect on the middle mold 104 is better.

[0031] Second embodiment:

[0032] Based on the first embodiment, please refer to Figure 4 and Figure 5 , Figure 4 is a schematic diagram of the structure of the auxiliary cooling mechanism in the second embodiment, Figure 5 for Figure 4 A magnified view of the local structure at B.

[0033] The utility model provides a mold clamping and demolding device used in commutator pressing production, which also includes a mixing mechanism. The mixing mechanism includes a mounting frame 201, a drive motor 202, a stirring shaft 203 and a stirring fan blade 204. The mounting frame 201 includes a mounting plate 205 and four fixed feet 206.

[0034] According to this specific embodiment, the mounting frame 201 is installed at the top of the water tank 107, and the driving motor 202 is arranged on the mounting frame 201. The output end of the driving motor 202 is provided with the stirring shaft 203, and the stirring blade 204 is provided at one end of the stirring shaft 203 located inside the water tank 107. When the driving motor 202 is started, the stirring blade 204 is driven to rotate by the stirring shaft 203, and the stirring blade 204 is used to stir the water in the water tank 107, so that when the semiconductor refrigeration sheet 113 is used to cool the water in the water tank 107, the cooling effect is better.

[0035] Among them, the driving motor 202 is arranged on the upper surface of the mounting plate 205, and the fixing feet 206 are arranged at the four bottom corners of the mounting plate 205. The fixing feet 206 are detachably connected to the top of the water tank 107, and the fixing feet 206 are installed on the top of the water tank 107 by screws, thereby completing the installation of the mounting frame 201.

[0036] When using a mold clamping and demolding device for commutator pressing production according to the present embodiment, the fixing foot 206 is installed on the top of the water tank 107 by screws, thereby completing the installation of the mounting frame 201, and the driving motor 202 is installed on the mounting frame 201, and the driving motor 202 is started, and the stirring fan blades 204 are driven to rotate by the stirring shaft 203, and the stirring fan blades 204 are used to stir the water in the water tank 107, so that when the semiconductor refrigeration sheet 113 is used to cool the water in the water tank 107, the cooling effect is better.

[0037] The above disclosure is only a preferred embodiment of the present invention, and certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made according to the claims of the present invention still fall within the scope covered by the utility model.

Claims

1. A mold clamping and demolding device used in commutator pressing production, comprising a workbench, a lower mold, a lifting assembly, a middle mold, a discharge chamber and an upper mold, the upper surface of the workbench is equipped with the lower mold through a first electric push rod, the bottom of the lower mold is provided with the lifting assembly, a bracket is further provided above the workbench, the middle part of the bracket is provided with the middle mold, the middle mold is located above the upper mold, the upper surface of the middle mold is provided with the discharge chamber, the top of the bracket is equipped with the upper mold through a second electric push rod, the upper mold is located above the discharge chamber, and is characterized in that: Also included is an auxiliary cooling mechanism; The auxiliary cooling mechanism includes a water tank, a water pump, a delivery main pipe, two shunt pipes, two heat exchange plates, two return pipes and a plurality of semiconductor refrigeration sheets. The water tank and the water pump are both installed above the workbench. The two heat exchange plates are detachably connected to the middle mold and are respectively located on the front and rear surfaces of the middle mold. Each of the heat exchange plates is in contact with the outer wall of the middle mold. A heat exchange channel is provided inside each of the heat exchange plates. The heat exchange channel is arranged in a serpentine structure. A water inlet is provided at one end of the heat exchange channel, and a water outlet is provided at the other end of the heat exchange channel. The input end of the water pump is connected to the water tank, and the delivery main pipe is provided at the output end of the water pump. Two shunt pipes are provided at one end of the delivery main pipe away from the water pump. One end of each shunt pipe away from the delivery main pipe is connected to the corresponding water inlet. The return pipe is provided at each water outlet. One end of each return pipe away from the corresponding water outlet is connected to the return water port of the water tank. A plurality of semiconductor refrigeration sheets are provided on the water tank.

2. The mold clamping and demolding device used in commutator pressing production according to claim 1, characterized in that: Both sides of each heat exchange plate are provided with mounting wing plates, and the mounting wing plates are detachably connected to the outer side wall of the middle mold.

3. The mold clamping and demolding device used in commutator pressing production according to claim 2, characterized in that: A plurality of dustproof covers are also arranged on the outer wall of the water tank, and the dustproof cover is arranged outside the hot end of each semiconductor refrigeration plate, and a cooling fan is arranged at one end of each dustproof cover away from the water tank.

4. The mold clamping and demolding device used in commutator pressing production according to claim 3, characterized in that: A fixing block is provided at one end of each dustproof shell close to the water tank, and the fixing block is detachably connected to the outer side wall of the water tank.

5. The mold clamping and demolding device used in commutator pressing production according to claim 2, characterized in that: The mold closing and demolding device used in commutator pressing production also includes a mixing mechanism, which includes a mounting frame, a driving motor, a stirring shaft and stirring blades. The mounting frame is installed on the top of the water tank, the driving motor is arranged on the mounting frame, the stirring shaft is arranged at the output end of the driving motor, and the stirring blades are arranged at one end of the stirring shaft located inside the water tank.

6. The mold clamping and demolding device used in commutator pressing production according to claim 5, characterized in that: The mounting frame includes a mounting plate and four fixing feet. The driving motor is arranged on the upper surface of the mounting plate. The fixing feet are arranged at the four bottom corners of the mounting plate. The fixing feet are detachably connected to the top of the water tank.

Images