Double-sided adhesive part and component with heat insulation, heat dissipation or insulation functions

Abstract

The utility model relates to the technical field of glue joint, in particular to a component and a double-sided adhesive part. The double-sided adhesive part is applied to a part with a mica surface and comprises a first release layer, a first adhesive layer, a substrate and a second adhesive layer which are sequentially stacked, and the second adhesive layer is used for being bonded with the part; the first release layer comprises a first layered body, and the first layered body covers a first surface, opposite to the substrate, of the first adhesive layer; the first auxiliary wing is connected to the first layered body, and the first auxiliary wing is located outside the first boundary of the first surface and used for providing a force bearing point so as to assist in tearing down the first layered body; a first notch is preset in the position, close to a second boundary of the first surface, of the first auxiliary wing, and the first boundary is adjacent to the second boundary. Compared with the mica layer below, the first release layer is easier to separate from the adhesive layer, so that the separation success rate of the first release layer can be remarkably improved.

Description

Technical Field

[0001] This patent relates to the field of adhesive bonding technology, and in particular to a component with heat insulation, heat dissipation or insulation functions and a double-sided adhesive product applied to the component. Background Art

[0002] Mica is an aluminum silicate mineral containing a variety of metal elements. It has a layered structure and perfect cleavage, and can be peeled into thin sheets. Mica has the characteristics of insulation, heat resistance, acid and alkali resistance, elasticity, etc., and is widely used in electrical, chemical, building materials, fire protection, medicine and other industries.

[0003] The application of mica in the field of new energy is mainly reflected in the following aspects:

[0004] New energy vehicle industry: Mica products are mainly used as thermal runaway protection materials for power batteries in the new energy vehicle industry. Mica materials are generally processed into mica boards, which have excellent high temperature resistance and insulation properties. They can still maintain good insulation properties in an environment of 500℃-1000℃. Mica materials have a long history of being used in battery thermal runaway protection, and the mature solution has been used by many companies in the industry.

[0005] Battery energy storage industry: Mica products are mainly used for flame retardant insulation protection of energy storage batteries in the field of battery energy storage.

[0006] Solar Panels: Mica can be used as a mass bearing material and support material for solar panels. Mica can be used as a solar panel substrate material because of its excellent thermal stability and oxidation resistance.

[0007] Lithium-ion battery: In the positive electrode material of lithium-ion batteries, mica is used as a transmission medium for lithium ions. The application of mica in lithium-ion batteries can maintain the structural stability of the material and improve the performance of the battery.

[0008] Due to the excellent performance of mica, it has been widely used in the field of new energy. In the prior art, there are many types of parts with mica surfaces, such as fireproof parts, heat insulation parts, buffer parts, etc.

[0009] In practical applications of the new energy industry, it is sometimes necessary to manufacture a double-sided adhesive component. It has a first surface of an adhesive layer and a second surface. By bonding the second surface to a component with a low surface energy such as mica on the outer surface and having heat insulation, heat dissipation or insulation functions, it is convenient to attach such a component to other target components after tearing off the release layer on the first surface.

[0010] The prior art usually adopts manual method to tear off the release layer on the first surface. When the release layer is torn off slowly by manual method, the success rate of tearing off is relatively high. However, the inventor of this patent found that when introducing automated equipment to quickly tear off the release layer, the adhesion between the double-sided adhesive component itself and the low surface energy surface such as mica is not strong enough, so it is easy to cause the second surface to be torn off from the surface at the same time during the process of tearing off the release layer on the first surface. Summary of the invention

[0011] In order to solve or at least partially solve the above technical problems, this patent provides a component and a double-sided adhesive part.

[0012] Among them, a double-sided adhesive product is used for a component with a low surface energy material such as a mica layer as the outer surface and having heat insulation, heat dissipation or insulation functions, including:

[0013] A first release layer, a first adhesive layer, a substrate and a second adhesive layer, wherein the second adhesive layer is used for bonding with components;

[0014] The first release layer comprises:

[0015] A first layered body, the first layered body covering a first surface of the first adhesive layer opposite to the substrate;

[0016] A first auxiliary wing connected to the first layered body, the first auxiliary wing being located outside the first boundary of the first surface, so as to provide a force point to assist in tearing off the first layered body;

[0017] A first cutout is preset at a portion of the first auxiliary wing close to the second boundary of the first surface, and the first boundary is adjacent to the second boundary.

[0018] Optionally, the distance between the first boundary and the closest point of the first incision is less than or equal to 15 mm.

[0019] Optionally, the first incision forms a third boundary substantially along the first boundary direction and a fourth boundary substantially along the second boundary direction on the first release layer, and the boundary intersection of the third boundary and the fourth boundary is close to the separation point of the first release layer and the first adhesive layer.

[0020] Optionally, the distance between the boundary intersection and the closest point of the second boundary is in the range of 10 mm to 70 mm.

[0021] Optionally, the distance between the boundary intersection and the closest point of the second boundary is in the range of 20 mm to 50 mm.

[0022] Optionally, the boundary intersection has a rounded corner or a chamfered corner, and the radius of the rounded corner is greater than or equal to 0.2 mm;

[0023] The included angle between the third boundary and the fourth boundary is in the range of 30 degrees to 150 degrees.

[0024] Optionally, the first surface has a shape consistent with that of the first layered body and is slightly smaller than the first layered body, so as to expose the frame of the first layered body at other sides except the side connected to the first auxiliary wing;

[0025] The exposed width of the frame is in the range of 1 mm to 50 mm.

[0026] Optionally, there are two first cutouts, which are respectively arranged on the left and right sides of the first auxiliary wing.

[0027] Optionally, it further includes: a first release layer, disposed between the first release layer and the first adhesive layer;

[0028] The first layered body is covered on a first surface of the first adhesive layer opposite to the substrate through the first release layer.

[0029] Optionally, a double-sided adhesive member is applied to a component having a mica layer as an outer surface to prevent peeling from the mica surface.

[0030] Optionally, the double-sided adhesive component further includes a second release layer disposed on the second adhesive layer, and a second release layer disposed on the second release layer;

[0031] The second release layer includes:

[0032] A second layered body, the second layered body is covered on a second surface of the second adhesive layer opposite to the substrate through a second release layer;

[0033] The second auxiliary wing is connected to the second layered body and is located outside the fifth boundary of the second surface to provide a force point to assist in tearing off the second layered body.

[0034] Another embodiment of the present patent provides a component on which the aforementioned double-sided adhesive member is disposed after the first release layer is peeled off.

[0035] Optionally, the component includes two mica layers and an aerogel layer sandwiched between the two mica layers, and the double-sided adhesive member is bonded to at least one mica layer through a second adhesive layer.

[0036] Compared with the prior art, the present patent pre-arranges a first incision on the first release layer, so that the first release layer is easier to separate from the adhesive layer than the mica layer below, thereby significantly improving the success rate of separation of the first release layer during automatic tearing. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the implementation of this patent, the following is a brief introduction to the relevant drawings. It can be understood that the drawings described below are only used to illustrate some implementations of this patent, and ordinary technicians in this field can also obtain many other technical features and connection relationships not mentioned in this article based on these drawings.

[0038] Figure 1 It is a schematic diagram of each layer of a component bonded with a double-sided adhesive member in an embodiment of the present patent;

[0039] Figure 2 yes Figure 1 In one embodiment, a schematic diagram of a corner area of ​​a component in the direction of arrow a;

[0040] Figure 3 yes Figure 2 A schematic diagram of a component when the first auxiliary wing is torn off;

[0041] Figure 4 yes Figure 3 In another embodiment, a schematic diagram of a corner area of ​​a component in the direction of arrow a;

[0042] Figure 5 yes Figure 4 Schematic diagram of the first auxiliary wing of the component being torn off.

[0043] Description of reference numerals:

[0044] 1. Double-sided adhesive component; 11. First release layer; 111. First layered body; 112. First auxiliary wing; 113. First incision; 1131. Third boundary; 1132. Fourth boundary; 12. First adhesive layer; 121. First surface; 122. First boundary; 123. Second boundary; 13. Substrate; 14. Second adhesive layer; 2. Component; 21. Mica layer; 22. Aerogel layer. DETAILED DESCRIPTION

[0045] Mica is a layered silicate mineral whose bonding force within the layers is much greater than the bonding force between the layers. Therefore, it can be peeled into extremely thin sheets with elasticity and sliding properties. The layered structure of mica is the main reason for its excellent thermal insulation effect. Specifically, since the connection between the layers of mica is weak, the conduction of heat between the layers is hindered, resulting in a very low thermal conductivity of mica. In addition, the layered structure of mica also gives it good reflective properties, which can reflect part of the thermal radiation and reduce the absorption of heat. However, the layered structure of mica also makes the surface contact area of ​​mica smaller, reducing the loss of surface energy. In addition, mica contains elements such as aluminum, silicon, and potassium, which have high electronegativity, making the surface of mica negatively charged, thereby further reducing the surface energy of mica.

[0046] The low surface energy and layered structure of mica may be one of the reasons why it is difficult to glue and fix on it. In addition, the insulation, heat resistance, acid and alkali resistance and other properties of mica may also affect its compatibility and reactivity with adhesives.

[0047] The inventor of this patent believes that in the actual production process, the problem of release film falling off from surfaces such as mica is mainly caused by the multi-layer structure of low surface energy materials. Specifically, in the production and manufacturing process of products in the field of new energy, it is sometimes necessary to bond low surface energy components to target components. Therefore, double-sided adhesive parts are used. The entire process may involve multiple manufacturers. Taking a component with a mica layer as an example, the process is roughly as follows:

[0048] S1. Manufacturer A manufactures components containing mica layers and purchases double-sided adhesive parts from Manufacturer B;

[0049] S2, tearing off the release layer on the second surface of the double-sided adhesive member;

[0050] S3, bonding the second surface of the double-sided adhesive member to the mica layer of the component;

[0051] S4. After packaging and transportation, the components bonded with double-sided adhesive tape are sold to manufacturer C as products;

[0052] S5. Manufacturer C tears off the release layer on the first surface of the double-sided adhesive component;

[0053] S6. Paste the component onto the target component.

[0054] Since it spans across multiple manufacturers, the special requirements for double-sided adhesive parts used on parts containing mica are difficult to be fed back to the manufacturers of double-sided adhesive parts, so the double-sided adhesive parts of the prior art are difficult to meet the requirements. Specifically, the inventor of this patent found that in the above step S5, when the release layer on the first surface is torn off, if automated equipment is used, there is a high probability that the second surface will also be peeled off, causing the double-sided adhesive part to fall off the component. This leads to production interruption. Therefore, the prior art can only use manual methods to slowly tear off the release layer. It is inefficient and costly.

[0055] However, the inventors found that special treatment of the mica surface would increase process-related equipment and production costs. The cost changes brought about by adjusting the adhesive layer structure of the double-sided adhesive to improve the tearing performance are also difficult to accept. Moreover, re- and repeatedly gluing double-sided adhesive parts on mica not only causes a large amount of mica powder to fall off, but also makes the mica layer thinner, affecting the thermal insulation effect.

[0056] In view of this, the inventor of this patent starts from the structure of the release film and tries to solve this technical problem at a lower cost. It is worth mentioning that in the following embodiments, this patent takes the mica layer as the low surface energy layer of the component as an example for specific description. It should be known to those skilled in the art that this patent is obviously also applicable to components that do not use mica surfaces but have low surface energy properties similar to mica. The following is a detailed description of the implementation method of this patent in conjunction with the accompanying drawings.

[0057] Implementation Method 1

[0058] The first embodiment of this patent proposes a component and a double-sided adhesive product with a mica layer as the outer surface, which has heat insulation, heat dissipation or insulation functions. Figure 1 As shown, the double-sided adhesive component includes:

[0059] A first release layer, a first adhesive layer, a substrate and a second adhesive layer, wherein the second adhesive layer is used for bonding with components.

[0060] The surface of the component has a mica layer surface. Of course, the double-sided adhesive component of this patent can also be applied to components with other surfaces with the same performance as the mica surface.

[0061] See also Figure 2 As shown, the first release layer includes:

[0062] A first layered body, the first layered body covering a first surface of the first adhesive layer opposite to the substrate;

[0063] A first auxiliary wing connected to the first layered body, the first auxiliary wing being located outside the first boundary of the first surface, so as to provide a force point to assist in tearing off the first layered body;

[0064] A first cutout is preset at a portion of the first auxiliary wing close to the second boundary of the first surface, and the first boundary is adjacent to the second boundary.

[0065] The first embodiment of the present invention also proposes a component, also see Figure 1 , Figure 2 As shown, the component is provided with the above-mentioned double-sided adhesive component after the first release layer is peeled off. It can be understood that the components in the embodiments of this patent include but are not limited to fireproof components, heat insulation components, buffer components and many other types of components.

[0066] In practical applications, the double-sided adhesive member can be applied to any component with a mica surface. As a preferred embodiment, the component may include two mica layers and an aerogel layer sandwiched between the two mica layers, and the double-sided adhesive member is bonded to at least one of the mica layers through a second adhesive layer.

[0067] Aerogel is a highly dispersed solid material formed by the mutual aggregation of colloidal particles into a nanoporous network structure, which has excellent thermal insulation performance and low density. Mica sheets have good impact resistance and insulation. Components using mica layers combined with aerogel layers have better fireproofing, heat insulation and buffering effects, and are very compatible with the double-sided adhesive parts provided in this embodiment.

[0068] It is worth mentioning that although Figures 1 to 3 In the figure, the first cutout is drawn as a square cutout. It is easy to understand that cutouts of other shapes, such as polygonal or circular, are also feasible.

[0069] As an optional solution, the double-sided adhesive component can also include: a first release layer (not shown in the figure for simplicity of illustration), arranged between the first release layer and the first adhesive layer; the first layered body is covered on the first surface of the first adhesive layer opposite to the substrate through the first release layer.

[0070] Among them, the first release layer can be composed of silicone oil or other release agents. The first release layer can play an important role in the release process. Specifically, the first release layer can prevent the first adhesive layer from having a stronger adhesion to the first release layer. This is achieved through the special surface properties of the release layer, which makes it difficult to adhere to the first adhesive layer, thereby ensuring that the material can be easily separated from the first release layer during curing or processing. Moreover, the presence of the release layer makes it easier to remove the processed material during the release process, reducing the loss and work intensity during the release process, which is crucial for the optimization of production efficiency and manufacturing process.

[0071] This embodiment can significantly reduce the probability of tearing off the second adhesive layer from the surface of the component during the process of tearing off the first release layer from the first surface by changing the structure of the first release layer. The specific principle is as follows:

[0072] In the prior art, when the first release layer needs to be separated, the first release layer is directly torn off from the edge of the double-sided adhesive member. At this time, the coverage area of ​​the adhesive layer around the separation point of the second adhesive layer is consistent with the coverage area of ​​the adhesive layer around the separation point of the first adhesive layer, and the separation occurs at the corner of the substrate. When the adhesion between the second adhesive layer and the mica layer is not strong enough, the first adhesive layer, the substrate and the second adhesive layer are easily deformed under the tearing of external force, thereby pulling the second adhesive layer off the mica layer.

[0073] See also Figure 2 As shown, in this embodiment, a first cutout is preset at a position of the first auxiliary wing near the second boundary of the first surface, and the first cutout can be extended to the position of the first layered body.

[0074] See also Figure 3 As shown, the connection point between the first auxiliary wing and the first layered body can be point A in the figure. When the first auxiliary wing is clamped by a mechanical arm and pulled outward in a direction perpendicular to the first surface, it can be understood that the first auxiliary wing will first deform and drive the first layered body connected thereto to deform. This deformation acts on point B, so that the first layered body is separated from the first adhesive layer at point B.

[0075] It is worth noting that if you want to separate the second adhesive layer between the substrate and the component, then at least the substrate needs to be deformed. In the prior art, in the process of tearing off the first release layer at the edge of the double-sided adhesive component, since the area of ​​the substrate at the corner is small, it is easy to deform and cause the separation of the second adhesive layer. However, compared with the prior art, the first release layer of the present patent is separated from the first adhesive layer at point B. There is a certain distance between this separation point and the second boundary. The deformation of the substrate needs to drive the parts on the left and right sides of point B, so it needs to overcome a greater force. On this basis, the first release layer will be easier to detach from the adhesive layer, and it will be easier to maintain the bonding state between the substrate and the component.

[0076] That is to say, compared with the prior art, the present patent pre-sets a first incision on the first release layer, so that the first release layer is easier to separate from the adhesive layer than the mica layer below, thereby significantly improving the success rate of separation of the first release layer.

[0077] Optionally, the distance between the first boundary and the closest point of the first incision can be set to be less than or equal to 15 mm. When set within this distance, it can be ensured that the deformation brought by the first auxiliary wing is more effectively transmitted to the separation point, thereby making the separation operation smoother.

[0078] refer to Figure 2 As shown, the first cut forms a third boundary substantially along the first boundary direction and a fourth boundary substantially along the second boundary direction on the first release layer. The "substantially" mentioned here refers to the approximate direction of the third boundary and the fourth boundary. Figure 2 In the embodiment of the present invention, the third boundary is parallel to the first boundary, and the fourth boundary is parallel to the second boundary. However, it is easy to understand that the first, second, third, and fourth boundaries may not be straight lines, or may not be strictly straight lines. For example, the third boundary and the fourth boundary may each be a segment of an arc, so that the two can be spliced ​​into a complete arc. Alternatively, the third boundary is a straight line, while the fourth boundary is in the shape of a wavy line. Such shapes can also basically achieve the technical purpose of this patent.

[0079] exist Figure 2In the embodiment, the boundary intersection point of the third boundary and the fourth boundary is point A, which is the connection point between the first auxiliary wing and the first layered body mentioned above. Of course, the connection point between the first auxiliary wing and the first layered body can also be at other positions. The boundary intersection point A can be set to be close to the separation point B between the first release layer and the first adhesive layer.

[0080] On this basis, optionally, the distance between the boundary intersection A and the closest point of the second boundary can be in the range of 10 mm to 70 mm. The inventor of this patent has found that by using the first incision within this length range, the separation success rate of the first release layer can be significantly improved while ensuring the integrity of the first release layer and sufficient adhesion of the first adhesive layer after the first release layer is torn off. The specific experimental data when tearing on the automated equipment are as follows:

[0081] Experimental conditions:

[0082] 1. The distance between the first boundary and the closest point of the first incision is 5 mm;

[0083] 2. The number of samples in each group is 20.

[0084]

[0085] When the distance between the boundary intersection point and the closest point of the second boundary is 0 mm, it is essentially a control group without the first incision. It can be seen that the peeling success rate of the control group is low. As the setting position of the incision changes, the peeling success rate goes from low to high and then from high to low. When the distance between the boundary intersection point A and the closest point of the second boundary is in the range of 10 mm to 70 mm, the peeling success rate is greater than 70%, which meets the requirements.

[0086] Of course, the use of a first incision with a wider length range can also basically achieve the technical purpose of this patent. It is worth mentioning that the first incision can be set only on the first release layer, or it can penetrate the first adhesive layer, the substrate and the second adhesive layer below the first release layer. Relatively speaking, the first incision set only on the first release layer has a higher separation success rate.

[0087] It can be seen from the above data that, as a preference, limiting the distance between the boundary intersection A and the closest point of the second boundary to within a range of 20 mm to 50 mm can further improve the success rate.

[0088] In addition, as an optional solution, the first surface can have a shape consistent with the first layered body and be slightly smaller than the first layered body to expose the frame of the first layered body on other sides except the side connected to the first auxiliary wing; the exposed width of the frame is in the range of 1mm to 50mm.

[0089] Through this design, the frame of the first layered body on the other sides except the side connected to the first auxiliary wing is exposed. This layout can make the first layered body easier to tear off without affecting the substrate itself covered by the first layered body. The width of the exposed frame can be adjusted within the range of 1mm to 50mm to meet the flexibility of different applications and performance requirements.

[0090] It is worth mentioning that the first incision can be set not only to one but also to two, and the two first incisions can be respectively set on the left and right sides of the first auxiliary wing. By setting two first incisions, the double-sided adhesive product can be torn off from both sides of the component separately or simultaneously. When torn off separately, it can improve the adaptability of the double-sided adhesive product to the equipment, so that it can match more types of peeling devices. When torn off simultaneously, it can make the two sides of the double-sided adhesive product bear force evenly, further improving the success rate of tearing off the first layered body.

[0091] Implementation Method 2

[0092] In the drawings of the first embodiment, the first incision is drawn as a square incision. When the incision has a sharp edge, although the probability is small, it is still possible that the first auxiliary wing and the first layered body will tear at the edge of the first incision when the first auxiliary wing is torn off. For this reason, a higher quality release film may be required, which undoubtedly increases the cost.

[0093] The second embodiment of the present invention is based on the first embodiment and provides an improved component and a double-sided adhesive member applied to the component. The main improvement is that rounded corners or chamfers are designed for the square cutout.

[0094] refer to Figure 3 As shown, the boundary intersection between the third boundary and the fourth boundary has a rounded corner or chamfer, and the rounded corner or chamfer provided can well prevent tearing. Wherein, the radius of the rounded corner can be set to be greater than or equal to 0.2 mm to better resist tearing.

[0095] It is easy to understand that the third boundary and the fourth boundary of the first incision do not necessarily have to be perpendicular to each other. For example, it is also feasible to set the third boundary and the fourth boundary to have a certain angle. As an optional solution, the angle range between the third boundary and the fourth boundary can be set within the range of 30 degrees to 150 degrees. It should be considered that when there is an angle of this angle between the two, the third boundary and the fourth boundary are still generally set along the direction of the first boundary and the second boundary. Moreover, the angle within this range can better take into account the clamping operation of the first auxiliary wing and prevent the first release layer from tearing.

[0096] Implementation Method 3

[0097] The third embodiment of the present patent is based on the first or second embodiment and provides an improved component and a double-sided adhesive member applied to the component.

[0098] As an improvement of this embodiment, the first adhesive layer can be set to have a smaller area than the second adhesive layer. Specifically, the first incision is only set on the first release layer, and does not penetrate the first adhesive layer, the substrate, and the second adhesive layer below the first release layer. Moreover, at the first incision, a portion of the second adhesive layer exists between the substrate and the component below it. Under this premise, the coverage area of ​​the second adhesive layer will be significantly larger than that of the first adhesive layer.

[0099] At this time, the second adhesive layer on the left side of the separation point can be bonded to the mica layer, but the first release layer and the first adhesive layer have no bonding force due to the first cutout. Therefore, when the first auxiliary wing or the connection between the first auxiliary wing and the first layered body separates from the first adhesive layer at the separation point, the bonding area of ​​the first adhesive layer around the separation point is smaller than the bonding area of ​​the second adhesive layer under the substrate, which makes it easier for the first release layer to be torn off from the first adhesive layer.

[0100] When the mechanical arm is used to clamp the first auxiliary wing and pull the first auxiliary wing outward in a direction perpendicular to the first surface, see Figure 4 As shown, the separation point between the first auxiliary wing and even the first layered body and the first surface is at point C in the figure. It is understandable that when separation occurs at point C, there is adhesion between the second adhesive layer and the mica layer in the plane of 360 degrees around the left side and upper side of the separation point C. However, between the first release layer and the first adhesive layer, due to the existence of the first incision and the fact that the first adhesive layer is only set to have a certain distance from the lower edge of the first incision, the first incision and the right side of the first incision do not have adhesion. Therefore, when the first auxiliary wing or the connection part between the first auxiliary wing and the first layered body separates from the first adhesive layer at point C, the bonding area of ​​the first adhesive layer around point C will be much smaller than the bonding area of ​​the second adhesive layer located below the substrate, which makes the first release layer even easier to be torn off from the first adhesive layer.

[0101] That is to say, the technical solution of this embodiment further improves the separation success rate of the first release layer. After actual experimental tests, the technical solution of this embodiment can improve the success rate to nearly 100% compared with the first embodiment.

[0102] Implementation Method 4

[0103] The fourth embodiment of the present invention provides an improved component and a double-sided adhesive member applied to the component. The main improvement is that a second release layer is provided for the double-sided adhesive member.

[0104] In this embodiment, the double-sided adhesive component further includes a second release layer disposed on the second adhesive layer, and a second release layer disposed on the second release layer;

[0105] The second release layer includes:

[0106] A second layered body, the second layered body is covered on a second surface of the second adhesive layer opposite to the substrate through a second release layer;

[0107] A second auxiliary wing connected to the second layered body, the second auxiliary wing being located outside the fifth boundary of the second surface, so as to provide a force point to assist in tearing off the second layered body;

[0108] A second cutout is preset at a portion of the second auxiliary wing close to the sixth boundary of the second surface, the second cutout extends to the second layered body and exposes a portion of the second surface;

[0109] The fifth boundary is adjacent to the sixth boundary;

[0110] The fifth boundary is parallel to the first boundary and is located at two sides of the substrate in the width direction.

[0111] Since the technical solutions of the second release layer and the second alienation layer correspond to the technical solutions of the first release layer and the second alienation layer, their technical effects are also corresponding. In order to save space, the drawings and effect descriptions of various features are omitted.

[0112] It is worth mentioning that the fifth boundary is parallel to the first boundary and located on both sides of the width direction of the substrate, so that the first incision and the second incision do not affect each other, thereby facilitating the tearing off of the second release layer on the double-sided adhesive component without affecting the first release layer.

[0113] Finally, it should be noted that ordinary technicians in this field can understand that in order to make readers better understand this patent, the implementation methods of this patent propose many technical details. However, even without these technical details and various changes and modifications based on the above-mentioned implementation methods, the technical solutions claimed for protection by the claims of this patent can be basically realized. Therefore, in practical applications, various changes can be made to the above-mentioned implementation methods in form and details without departing from the spirit and scope of this patent.

Claims

1. A double-sided adhesive product, used for components with heat insulation, heat dissipation or insulation functions, characterized in that: Including the following cascade settings: a first release layer, a first adhesive layer, a substrate and a second adhesive layer, wherein the second adhesive layer is used for bonding with the component; The first release layer comprises: a first layered body, the first layered body covering a first surface of the first adhesive layer opposite to the substrate; A first auxiliary wing connected to the first layered body, the first auxiliary wing being located outside a first boundary of the first surface to provide a force point to assist in tearing off the first layered body; A first cutout is preset at a portion of the first auxiliary wing close to a second boundary of the first surface, and the first boundary is adjacent to the second boundary.

2. The double-sided adhesive member according to claim 1, characterized in that: The distance between the first boundary and the closest point of the first incision is less than or equal to 15 mm.

3. The double-sided adhesive member according to claim 1, characterized in that: The first incision forms a third boundary substantially along the first boundary direction and a fourth boundary substantially along the second boundary direction on the first release layer, and the boundary intersection of the third boundary and the fourth boundary is close to the separation point of the first release layer and the first adhesive layer.

4. The double-sided adhesive member according to claim 3, characterized in that: The distance between the boundary intersection and the closest point of the second boundary is in the range of 10 mm to 70 mm.

5. The double-sided adhesive member according to claim 4, characterized in that: The distance between the boundary intersection and the closest point of the second boundary is in the range of 20 mm to 50 mm.

6. The double-sided adhesive member according to claim 3, characterized in that: The boundary intersection has a rounded corner or a chamfered corner, and the radius of the rounded corner is greater than or equal to 0.2 mm; The included angle between the third boundary and the fourth boundary is in the range of 30 degrees to 150 degrees.

7. The double-sided adhesive member according to claim 1, characterized in that: The first surface has a shape consistent with that of the first layered body and is slightly smaller than the first layered body, so as to expose the frame of the first layered body at other sides except the side connected to the first auxiliary wing; The exposed width of the frame is in the range of 1 mm to 50 mm.

8. The double-sided adhesive member according to claim 1, characterized in that: There are two first cutouts, which are respectively arranged on the left and right sides of the first auxiliary wing.

9. The double-sided adhesive member according to claim 1, characterized in that: Also includes: A first release layer, disposed between the first release layer and the first adhesive layer; The first layered body is covered on a first surface of the first adhesive layer opposite to the substrate through the first release layer.

10. The double-sided adhesive member according to claim 1, characterized in that: The double-sided adhesive piece is applied to the component with the mica layer as the outer surface to prevent peeling from the mica surface.

11. The double-sided adhesive member according to any one of claims 1 to 10, characterized in that: The double-sided adhesive component further includes a second release layer disposed on the second adhesive layer, and a second release layer disposed on the second release layer; The second release layer comprises: a second layered body, wherein the second layered body is covered on a second surface of the second adhesive layer opposite to the substrate through the second release layer; A second auxiliary wing connected to the second layered body, the second auxiliary wing being located outside the fifth boundary of the second surface to provide a force point to assist in tearing off the second layered body; A second cutout is preset at a portion of the second auxiliary wing close to the sixth boundary of the second surface; the fifth boundary is adjacent to the sixth boundary; The fifth boundary is parallel to the first boundary and is located at two sides of the substrate in a width direction.

12. A component with heat insulation, heat dissipation or insulation function, characterized in that: The component has a mica surface, and the double-sided adhesive member according to any one of claims 1 to 10 is arranged on the mica surface, and the double-sided adhesive member is adhered to the mica surface through the second adhesive layer.

13. The component with heat insulation, heat dissipation or insulation function according to claim 12, characterized in that: The component has any one of the following structures or a combination thereof: Single-layer structure with a single material; Multi-layer structure of a single material; Composite single-layer structure of two or more materials; Composite multi-layer structure of two or more materials; The double-sided adhesive member is bonded to at least one layer of the structure through the second adhesive layer.

Images