Optical module

Abstract

The utility model discloses an optical module, which comprises a shell, a circuit board and a heat dissipation assembly, and is characterized in that a cavity structure is configured in the shell; the circuit board is arranged in the cavity structure, a bare chip is arranged on the circuit board, the heat dissipation assembly is arranged between the bare chip and the shell and comprises a heat dissipation support and a first heat conduction layer, the bare chip is covered with the heat dissipation support, a hollowed-out area is arranged on the heat dissipation support, and the first heat conduction layer is arranged in the hollowed-out area. The heat dissipation assembly is arranged so that heat generated in the working process of the bare chip can be effectively transmitted, the bare chip is covered with the heat dissipation support, hard pressure cannot be generated on the bare chip, the first heat conduction layer is attached to the bare chip, the heat dissipation assembly is arranged on the bare chip, the heat dissipation support is arranged on the bare chip, and therefore the heat dissipation efficiency of the bare chip is greatly improved. The heat generated by the bare chip in the working process can be effectively transmitted, so that the service life of the optical module is prolonged.

Description

Technical Field

[0001] The present application relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] With the continuous expansion of cloud computing, artificial intelligence and other technical applications, traffic data has shown explosive growth, and data centers have become indispensable basic communication facilities. In order to meet the high-speed transmission of massive data, optical communication technology is indispensable, and optical modules are tools for realizing the mutual conversion of optical and electrical signals, and are key components for realizing optical communication. The rapid growth of data traffic has also placed higher and higher requirements on the transmission rate of optical modules.

[0003] Currently, the high-speed transmission market has been updated from 100G and 400G to 800G. In order to achieve the 800G transmission rate, on the one hand, the number of signal transmission channels in the optical module can be increased, and on the other hand, the transmission rate of a single channel can be increased from the previous 50G to 100G or 200G. To this end, the signal processing chip used in the optical module needs to have a higher degree of integration. However, the highly integrated signal processing chip generates severe heat during operation. Excessive temperature will cause its performance to deteriorate or even damage. At the same time, local high temperature will also affect the entire temperature distribution in the optical module, and then affect other electrical chips and optical devices. Utility Model Content

[0004] In order to overcome the above shortcomings, the purpose of the present application is to provide an optical module, in which the heat dissipation component can efficiently dissipate the heat of the bare chip and will not generate hard pressure on the bare chip during the heat transfer process.

[0005] In order to achieve the above objectives, this application adopts the following technical solutions:

[0006] An optical module, comprising:

[0007] A housing, wherein a cavity structure is disposed in the housing;

[0008] A circuit board is arranged in the cavity structure, and a bare chip is configured on the circuit board;

[0009] A heat dissipation component is arranged between the bare chip and the shell, and the heat dissipation component includes a heat dissipation bracket and a first heat-conducting layer. The heat dissipation bracket cover is arranged on the bare chip, and a hollow area is configured on the heat dissipation bracket. The first heat-conducting layer is filled in the hollow area and attached to a side surface of the bare chip away from the circuit board.

[0010] In one embodiment, the heat dissipation bracket includes a base plate and side plates connected to the base plate, and the hollow area is located on the base plate;

[0011] The orthographic projection of the bare chip on the circuit board is within the orthographic projection range of the substrate on the circuit board, and the projection area of ​​the bare chip is smaller than the projection area of ​​the outer contour of the substrate.

[0012] In one embodiment, the substrate has a preset gap between the substrate and the bare chip in the first direction;

[0013] The orthographic projection of the hollow area on the circuit board is located in the orthographic projection of the bare chip on the circuit board.

[0014] In one embodiment, the first heat-conducting layer is in a semi-solid paste / gel state, and the thermal conductivity of the first heat-conducting layer is not less than 14 W / (m*K).

[0015] In one embodiment, it further comprises:

[0016] A second heat-conducting layer is superimposed on a side of the first heat-conducting layer away from the bare chip, and the second heat-conducting layer covers the top of the heat dissipation bracket;

[0017] The second heat-conducting layer is a curable heat-conducting gel layer, and the thermal conductivity of the second heat-conducting layer is not less than 9 W / (m*K).

[0018] In one embodiment, it further comprises:

[0019] A third heat-conducting layer is arranged on a side of the second heat-conducting layer away from the first heat-conducting layer, and the third heat-conducting layer is a metal heat-conducting layer;

[0020] A side of the housing close to the bare chip abuts against the third heat conducting layer.

[0021] Alternatively, a side of the housing close to the bare chip is integrally formed with the third heat conducting layer.

[0022] In one embodiment, the bare chip is a digital signal processor.

[0023] In one embodiment, the shell includes a first shell and a second shell, and the first shell and the second shell are assembled to form a cavity structure;

[0024] The bare chip is arranged on a side surface of the circuit board corresponding to the first housing, and the heat dissipation component is arranged between the bare chip and the first housing;

[0025] Alternatively, the bare chip is arranged on a side surface of the circuit board corresponding to the second shell, and the heat dissipation component is arranged between the bare chip and the second shell.

[0026] In one embodiment, the optical module further includes:

[0027] An optical transmission component, wherein the optical transmission component is electrically connected to the bare chip via the circuit board, and the bare chip is used to transmit a transmitting end high-frequency electrical signal to the optical transmission component;

[0028] The optical receiving component is electrically connected to the bare chip through the circuit board, and the bare chip is used to receive a high-frequency electrical signal from a receiving end of the optical receiving component.

[0029] In one embodiment, the bare chip comprises:

[0030] Four transmission output ports, each of which has a transmission rate of 200 Gbps;

[0031] and four receiving input ports, each receiving input port having a transmission rate of 200 Gbps

[0032] Beneficial Effects

[0033] In the present application, by arranging a heat dissipation component above the bare chip, the heat generated by the bare chip during operation can be effectively transferred out. The heat dissipation bracket cover is arranged on the bare chip, so that no hard pressure is generated on the bare chip. The first heat-conducting layer is attached to the bare chip, which can effectively transfer the heat generated by the bare chip during operation. At the same time, by superimposing the second heat dissipation layer and the third heat dissipation layer on the first heat-conducting layer, it is beneficial to quickly transfer the heat generated by the bare chip during operation to the outside of the shell, thereby improving the service life of the optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings are used to provide an understanding of the technical solution of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the technical solution of the present disclosure and do not constitute a limitation on the technical solution of the present disclosure. The shapes and sizes of the components in the accompanying drawings do not reflect the actual proportions and are only intended to illustrate the content of the present application.

[0035] Figure 1 A schematic diagram of the optical module structure provided in an embodiment of the present application;

[0036] Figure 2 A schematic diagram of the heat dissipation assembly structure provided in an embodiment of the present application;

[0037] Figure 3 A schematic diagram of the heat dissipation bracket structure provided in an embodiment of the present application;

[0038] Figure 4 A schematic diagram of the first shell structure provided in an embodiment of the present application;

[0039] Figure 5 A cross-sectional schematic diagram of a heat dissipation component is provided for an embodiment of the present application. DETAILED DESCRIPTION

[0040] The above scheme is further described below in conjunction with specific examples. It should be understood that these examples are used to illustrate the present application and are not limited to the scope of the present application. The implementation conditions adopted in the examples can be further adjusted as the conditions of the specific manufacturer, and the unspecified implementation conditions are usually the conditions in conventional experiments.

[0041] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connecting" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. In this article, "electrical connection" includes the situation where the constituent elements are connected together through an element with some electrical function. "Elements with some electrical function" are not particularly limited as long as they can transfer electrical signals between the connected constituent elements. "Elements with some electrical function" can be, for example, electrodes or wiring, or switching elements such as transistors, or other functional elements such as resistors, inductors or capacitors. "Up", "down", "left", "right", etc. are only used to indicate relative position relationships. When the absolute position of the object being described changes, the relative position relationship may also change accordingly.

[0042] In this application, the directions or positional relationships indicated by the terms "upper", "lower", "inner", "middle", etc. are based on the directions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction.

[0043] The present application discloses an optical module, which includes a shell, a circuit board and a heat dissipation component. A cavity structure is configured in the shell; the circuit board is arranged in the cavity structure, a bare chip is arranged on the circuit board, the heat dissipation component is arranged between the bare chip and the shell, the heat dissipation component includes a heat dissipation bracket and a first heat-conducting layer, the heat dissipation bracket cover is arranged on the bare chip, a hollow area is arranged on the heat dissipation bracket, the first heat-conducting layer is filled in the hollow area and attached to a side surface of the bare chip away from the circuit board. By arranging the heat dissipation component, the present application can effectively transmit the heat generated by the bare chip during operation. By arranging the heat dissipation bracket cover on the bare chip, no hard pressure is generated on the bare chip. The first heat-conducting layer is attached to the bare chip, which can effectively transmit the heat generated by the bare chip during operation, thereby improving the service life of the optical module.

[0044] Next, combine Figure 1-Figure 5 An optical module provided by an embodiment of the present application is described, in which a heat dissipation component can efficiently dissipate heat for a bare chip and does not generate hard pressure on the bare chip during heat transfer.

[0045] The optical module includes a housing, a circuit board 20 and a heat dissipation assembly 30;

[0046] a housing having a cavity structure (not marked in the drawings);

[0047] A circuit board 20 is disposed in the cavity structure, and a bare chip 21 is disposed on the circuit board 20;

[0048] The heat dissipation component 30 is arranged between the bare chip 21 and the shell. The heat dissipation component includes a heat dissipation bracket 31 and a first heat-conducting layer 32. The heat dissipation bracket 32 ​​is covered on the bare chip 21. The heat dissipation bracket 31 is provided with a hollow area 313. The first heat-conducting layer 32 is filled in the hollow area 313 and attached to the side surface of the bare chip 21 away from the circuit board 20.

[0049] It should be noted that the bare chip in the present application refers to a chip that does not include a packaging shell. Due to the lack of a packaging shell, the heat generated during operation can be fully transmitted to the outside, but at the same time it also makes the bare chip more fragile and cannot withstand greater pressure. Therefore, in this embodiment, the heat dissipation component is covered on the bare chip through a heat dissipation bracket, which will not generate hard pressure on the bare chip. The first thermal conductive layer is attached to the bare chip, which can effectively transmit the heat generated by the bare chip during operation.

[0050] refer to Figure 1In a specific embodiment, the shell includes a first shell 11 and a second shell 12, and the first shell 11 and the second shell 12 are assembled to form a cavity structure; on the one hand, the bare chip 21 can be arranged on a side surface of the circuit board 20 corresponding to the first shell 11, and the heat dissipation component 30 is arranged between the bare chip 21 and the first shell 11; on the other hand, the bare chip 21 can be arranged on a side surface of the circuit board 20 corresponding to the second shell 12, and the heat dissipation component 30 is arranged between the bare chip 21 and the second shell 12.

[0051] refer to Figure 2 , Figure 3 and Figure 5 In this embodiment, the heat dissipation bracket 31 includes a substrate 311 and side panels 312 connected to the four sides of the substrate 311, and the hollow area 313 is located at the center of the substrate 311; the orthographic projection L of the bare chip 21 on the circuit board 20 is located within the range of the orthographic projection M of the substrate 311 on the circuit board 20, and the projection area of ​​the bare chip 21 is smaller than the projection area of ​​the substrate outer contour 211, and the side panels 312 are distributed around the bare chip 21, and there is a gap between the side panels 312 and the bare chip 21. This design allows the heat dissipation bracket 31 to be covered above the bare chip 21 and avoid contact with the bare chip 21, thereby avoiding hard pressure on the bare chip.

[0052] refer to Figure 2 , Figure 3 and Figure 5 Furthermore, the substrate 311 has a preset gap 35 with the bare chip 21 in the first direction (X); such a design is conducive to ensuring that the heat dissipation bracket does not exert hard pressure on the bare chip. The orthographic projection N of the hollow area 313 on the circuit board 20 is located in the orthographic projection L of the bare chip 21 on the circuit board 20. Preferably, the orthographic projection N of the hollow area 313 on the circuit board 20 is located at the center of the orthographic projection L of the bare chip 21 on the circuit board 20; the orthographic projection N of the hollow area 313 on the circuit board 20 is located in the orthographic projection P of the first heat-conducting layer 32 on the circuit board 20. The first heat-conducting layer 32 is filled in the hollow area 313, which can effectively transfer the heat of the bare chip 21.

[0053] In this embodiment, the first thermal conductive layer 32 is in a semi-solid paste / gel state, and the thermal conductivity of the first thermal conductive layer 32 is not less than 14W / (m*K). By designing the first thermal conductive layer 32 as a semi-solid paste / gel state, the gap between the hollow area 313 and the bare chip 21 can be fully filled to improve the heat dissipation effect. Under the action of the heat dissipation bracket, the first thermal conductive layer 32 is fixed in the hollow area 313 and the area below it. Preferably, the first thermal conductive layer 32 is diamond thermal conductive paste (also known as diamond glue), and the diamond thermal conductive paste can remain stable in the temperature range of -40 degrees to 200 degrees without solidification.

[0054] refer to Figure 2 In this embodiment, the second heat-conducting layer 33 is stacked on the side of the first heat-conducting layer 31 away from the bare chip 21, and the second heat-conducting layer 33 covers the top of the heat-dissipating bracket 31; the second heat-conducting layer 33 is a curable heat-conducting gel layer, and the thermal conductivity of the second heat-conducting layer 33 is not less than 9W / (m*K). Since the heat-conducting gel layer is in a paste or gel state in the initial state, it will solidify after a certain period of time at room temperature or high temperature, so the heat-conducting gel can be fully attached to the top of the heat-dissipating bracket and the first heat-conducting layer. The hardness of the heat-conducting gel after curing is in the range of 50-75 (Shore 00 hardness unit).

[0055] Furthermore, the surface of the first heat-conducting layer 32 on one side away from the bare chip 21 is roughly flush with the surface of the substrate 31 on one side away from the bare chip 21. This design is conducive to better connection between the second heat-conducting layer 33 and the first heat-conducting layer 32 and the substrate 31, avoiding the formation of a gap between the second heat-conducting layer 33 and the first heat-conducting layer 32 or the substrate 31, thereby affecting the heat transfer.

[0056] refer to Figure 4 In this embodiment, the heat dissipation component 30 further includes a third heat-conducting layer 34, which is arranged on a side of the second heat-conducting layer 33 away from the first heat-conducting layer 31. The third heat-conducting layer 34 is a metal heat-conducting layer. The side of the shell close to the bare chip 21 abuts against the third heat-conducting layer 34, or the side of the shell close to the bare chip 21 is integrally formed with the third heat-conducting layer 34. Specifically, when the bare chip 21 is arranged on a side surface of the circuit board 20 corresponding to the first shell 11, the third heat-conducting layer 34 can abut against the first shell 11. Preferably, the third heat-conducting layer 34 is integrally formed with the first shell 11. Type; when the bare chip 21 is arranged on a side surface of the circuit board 20 corresponding to the second shell 12, the third heat-conducting layer 34 is in contact with the second shell 12, and preferably the third heat-conducting layer 34 and the second shell 12 are integrally formed, and the heat is transferred to the first shell 11 or the second shell 12 by setting the third heat-conducting layer 34. Furthermore, a heat sink 13 is arranged on the side of the first shell away from the cavity structure. This design allows the heat transferred to the first shell 11 or the second shell 12 through the third heat-conducting layer 34 to be transferred to the external environment through the heat sink 13, thereby effectively dissipating the heat of the bare chip 21.

[0057] In a specific embodiment, the bare chip is specifically a digital signal processor. Furthermore, the optical module also includes an optical transmitting component 40 and an optical receiving component 50. The optical transmitting component 40 is electrically connected to the digital signal processor (bare chip 21) through a circuit board 20, and the digital signal processor is used to transmit the transmitting end high-frequency electrical signal to the optical transmitting component; the optical receiving component 50 is electrically connected to the digital signal processor (bare chip 21) through a circuit board 20, and the digital signal processor is used to receive the receiving end high-frequency electrical signal from the optical receiving component.

[0058] In a specific embodiment, the bare chip is specifically a digital signal processor, and the digital signal processor (bare chip) includes four transmit output ports and four receive input ports, each transmit output port has a transmission rate of 200 Gbps, and each receive input port has a transmission rate of 200 Gbps, so the optical module in the present application has a transmission rate of 800 Gbps, so the digital signal processor (bare chip) in the present application has a high degree of integration, and the above-mentioned heat dissipation component can be used to efficiently dissipate the heat of the digital signal processor (bare chip) with a high degree of integration, and no hard pressure will be generated on the digital signal processor (bare chip) during the heat transfer process.

[0059] The above embodiments are only for illustrating the technical concept and features of the present application, and their purpose is to enable people familiar with the technology to understand the content of the present application and implement it accordingly, and they cannot be used to limit the protection scope of the present application. Any equivalent transformation or modification made according to the spirit of the present application shall be included in the protection scope of the present application.

Claims

1. An optical module, characterized in that: include: A housing, wherein a cavity structure is disposed in the housing; A circuit board is arranged in the cavity structure, and a bare chip is configured on the circuit board; A heat dissipation component is arranged between the bare chip and the shell, and the heat dissipation component includes a heat dissipation bracket and a first heat-conducting layer. The heat dissipation bracket cover is arranged on the bare chip, and a hollow area is configured on the heat dissipation bracket. The first heat-conducting layer is filled in the hollow area and attached to a side surface of the bare chip away from the circuit board.

2. The optical module according to claim 1, characterized in that: The heat dissipation bracket includes a base plate and side plates connected to the base plate, and the hollow area is located on the base plate; The orthographic projection of the bare chip on the circuit board is within the orthographic projection range of the substrate on the circuit board, and the projection area of ​​the bare chip is smaller than the projection area of ​​the outer contour of the substrate.

3. The optical module according to claim 2, characterized in that: The substrate has a preset gap between the substrate and the bare chip in a first direction; The orthographic projection of the hollow area on the circuit board is located in the orthographic projection of the bare chip on the circuit board.

4. The optical module according to claim 1, characterized in that: The first heat-conducting layer is in a semi-solid paste / gel state, and the thermal conductivity of the first heat-conducting layer is not less than 14 W / (m*K).

5. The optical module according to claim 1, characterized in that: Also includes: A second heat-conducting layer is superimposed on a side of the first heat-conducting layer away from the bare chip, and the second heat-conducting layer covers the top of the heat dissipation bracket; The second heat-conducting layer is a curable heat-conducting gel layer, and the thermal conductivity of the second heat-conducting layer is not less than 9 W / (m*K).

6. The optical module according to claim 5, characterized in that: Also includes: A third heat-conducting layer is arranged on a side of the second heat-conducting layer away from the first heat-conducting layer, and the third heat-conducting layer is a metal heat-conducting layer; A side of the housing close to the bare chip abuts against the third heat conducting layer. Alternatively, a side of the housing close to the bare chip is integrally formed with the third heat conducting layer.

7. The optical module according to claim 1, characterized in that: The bare chip is a digital signal processor.

8. The optical module according to claim 1, characterized in that: The shell comprises a first shell and a second shell, and the first shell and the second shell are assembled to form a cavity structure; The bare chip is arranged on a side surface of the circuit board corresponding to the first housing, and the heat dissipation component is arranged between the bare chip and the first housing; Alternatively, the bare chip is arranged on a side surface of the circuit board corresponding to the second shell, and the heat dissipation component is arranged between the bare chip and the second shell.

9. The optical module according to claim 1, characterized in that: The optical module further includes: An optical transmission component, wherein the optical transmission component is electrically connected to the bare chip via the circuit board, and the bare chip is used to transmit a transmitting end high-frequency electrical signal to the optical transmission component; The optical receiving component is electrically connected to the bare chip through the circuit board, and the bare chip is used to receive a high-frequency electrical signal from a receiving end of the optical receiving component.

10. The optical module according to claim 1, characterized in that: The bare chip comprises: Four transmission output ports, each of which has a transmission rate of 200 Gbps; and four receiving input ports, each receiving input port having a transmission rate of 200 Gbps.

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