Solid state disk and heating device thereof

Abstract

The utility model provides a solid state disk and a heating device thereof. The heating device comprises an electrothermal film, a first power supply and a switch module, the electrothermal film is arranged on the back of the solid-state disk; the anode of the first power supply is connected with the input end of the switch module; the output end of the switch module is connected with the input end of the electrothermal film; in other words, the heating device preheats the solid state disk in the extremely low temperature environment, the working temperature of the solid state disk is increased, the risk of data loss can be reduced, and the data reliability is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of vehicle starting, and more specifically, particularly relates to a solid state hard disk and a heating device thereof. Background Art

[0002] In winter, many devices need to work in extremely cold environments. For example, after a ground vehicle has been left overnight, it needs to be started before the onboard air conditioning system can be turned on. The temperature inside the vehicle rises, and the onboard data computing and storage system can work normally. This process takes a certain amount of time. If there is an emergency task during the period from when the air conditioning system is turned on to when it works, and the equipment cannot work normally, it will seriously affect work efficiency. In addition to the CPU (Central Processing Unit), the most important part of the data computing and storage system is the data storage medium, which is the most widely used SSD (Solid State Drives). Due to the characteristics of semiconductor storage particles, SSDs are frozen overnight in an extremely low temperature environment, and there is a certain probability of losing data at the moment of power-on, and the operating system cannot be entered.

[0003] Currently, whole-machine heating is used to heat the SSD, thereby improving the data reliability of the SSD at the moment of low-temperature startup. However, whole-machine heating consumes a lot of power, increases hardware costs, and increases development difficulty. Utility Model Content

[0004] In view of this, an object of the present invention is to provide a solid state hard disk and a heating device thereof, which are used to preheat the solid state hard disk in an extremely low temperature environment.

[0005] The first aspect of the present application discloses a heating device for a solid state hard disk, comprising: an electric heating film, a first power supply and a switch module;

[0006] The electric heating film is arranged on the back side of the solid state hard disk;

[0007] The positive electrode of the first power supply is connected to the input end of the switch module;

[0008] The output end of the switch module is connected to the input end of the electric heating film.

[0009] Optionally, in the above-mentioned heating device for a solid state hard disk, the switch module includes: a power tube and a micro control unit MCU;

[0010] One end of the power tube is connected to the positive electrode of the first power supply;

[0011] The other end of the power tube is connected to the electric heating film;

[0012] The control end of the power tube is connected to the first output end of the MCU.

[0013] Optionally, the heating device for the solid state hard disk further includes: an ambient temperature sensor;

[0014] The ambient temperature sensor detects the ambient temperature of the solid state drive and outputs the detected ambient temperature to the MCU.

[0015] Optionally, the heating device for the solid state hard disk further includes: a thermistor and a voltage divider resistor;

[0016] One end of the voltage-dividing resistor receives electric energy from the first power source through the switch module;

[0017] The other end of the voltage-dividing resistor is grounded through the thermistor;

[0018] The connection point between the thermistor and the voltage-dividing resistor is connected to the voltage detection terminal of the MCU;

[0019] The thermistor is arranged on the back side of the solid state hard disk.

[0020] Optionally, in the above-mentioned heating device for a solid state hard disk, the size of the electric heating film is smaller than the size of the solid state hard disk.

[0021] Optionally, in the above-mentioned heating device for a solid state hard disk, the size of the electric heating film is 70 mm x 20 mm;

[0022] The dimensions of the solid state drive are 80 mm x 22 mm.

[0023] Optionally, in the above-mentioned heating device for the solid state hard disk, the electric heating film is attached to the back side of the solid state hard disk by 3M adhesive.

[0024] Optionally, in the above-mentioned heating device for a solid state hard disk, the thickness of the electric heating film is less than 2 mm.

[0025] Optionally, in the above-mentioned heating device for the solid state hard disk, the electric heating film is a PI electric heating film.

[0026] The second aspect of the present application discloses a solid state hard disk, comprising: a printed circuit board PCB, a storage unit, a heat sink, a second power supply, and a heating device as described in any one of the first aspects of the present application;

[0027] The second power supply supplies power to the solid state drive;

[0028] The storage unit and the heat sink are arranged on the front side of the PCB board;

[0029] The heating device is arranged on the back side of the PCB board.

[0030] It can be seen from the above technical scheme that the utility model provides a heating device for a solid-state hard disk, comprising: an electric heating film, a first power supply, and a switch module; the electric heating film is arranged on the back of the solid-state hard disk; the positive electrode of the first power supply is connected to the input end of the switch module; the output end of the switch module is connected to the input end of the electric heating film; that is, the heating device can reduce the risk of data loss and improve data reliability by preheating the solid-state hard disk in an extremely low temperature environment to increase its working temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 It is a schematic diagram of a heating device for a solid state hard disk provided by an embodiment of the utility model;

[0033] Figure 2 It is a schematic diagram of another heating device for a solid state hard disk provided by an embodiment of the utility model;

[0034] Figure 3 It is a schematic diagram of another heating device for a solid state hard disk provided by an embodiment of the utility model;

[0035] Figure 4 It is a schematic diagram of another heating device for a solid state hard disk provided by an embodiment of the utility model;

[0036] Figure 5 It is a schematic diagram of another heating device for a solid state hard disk provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0038] In this application, the terms "comprises", "comprising" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0039] The embodiment of the present application provides a heating device for a solid-state hard disk, which is used to solve the problem that the existing technology uses a whole-machine heating method to achieve SSD heating, thereby improving the data reliability of the SSD at the moment of low-temperature startup. However, the whole-machine heating consumes large power, increases hardware costs, and increases development difficulty.

[0040] See also Figure 1 The heating device of the solid state hard disk includes: an electric heating film 40, a first power supply 10 and a switch module 30.

[0041] The electric heating film 40 is disposed on the back side of the solid state drive 00 .

[0042] The solid state drive 00 may be an M.2 SDD, that is, an NVMe solid state drive using an M.2 interface, and its size is 2280.

[0043] The M.2 SDD can achieve a maximum reading speed of 3.5GB / s, which is 7 times that of traditional SATA solid-state drives.

[0044] It should be noted that there are many devices on the front of the solid state drive 00 , that is, the front needs to dissipate heat, so a radiator needs to be placed on the front of the solid state drive 00 .

[0045] The second power supply 20 supplies power to the solid state drive 00 , that is, after the second power supply 20 is powered on, the solid state drive 00 starts to work, wherein the second power supply 20 can provide a 3.3V voltage to the solid state drive 00 .

[0046] The back of the solid state drive 00 is very flat and does not contact the heat sink, so a heating device can be set on the back of the solid state drive 00, and the heat can be quickly conducted to the components on the front through the PCB board in the solid state drive 00. The solid state drive 00 is a system disk in the data computing storage system, which is used to install and store the operating system.

[0047] The first power source 10 supplies power to the electric heating film 40 through the switch module 30 .

[0048] Specifically, the positive electrode of the first power supply 10 is connected to the input end of the switch module 30, and the output end of the switch module 30 is connected to the input end of the electric heating film 40, so that the first power supply 10 supplies power to the electric heating film 40 through the switch module 30. The other end of the first power supply 10 and the other end of the electric heating film 40 are both grounded GND.

[0049] When the switch module 30 is in the on state, the first power supply 10, the switch module 30 and the electric heating film 40 form a current loop, power is supplied to the electric heating film 40, and the electric heating film 40 starts heating. At this time, the input voltage of the electric heating film 40 is 12 V. When the switch module 30 is in the off state, the first power supply 10, the switch module 30 and the electric heating film 40 do not form a current loop, and the electric heating film 40 stops heating.

[0050] Specifically, after the first power supply 10 is powered on, current flows through the electric heating film 40, and the electric heating film 40 begins to generate heat. The heat can be quickly conducted to the front device through the PCB board in the solid state drive 00, thereby heating the solid state drive 00.

[0051] The electric heating film 40 may be a PI electric heating film, which is a kind of electric heating film 40 formed by heat-sealing with polyimide film as an outer insulator and metal foil or metal wire as an inner conductive heating element through high temperature and high pressure.

[0052] Of course, the electric heating film 40 may also be other electric heating films 40, which are not specifically limited here and may be determined according to actual conditions, and are all within the protection scope of this application.

[0053] It should be noted that there is no product in the prior art that can effectively heat the solid state drive 00 , but the present application provides a heating device that can directly heat the solid state drive 00 .

[0054] In this embodiment, the heating device of the solid state drive 00 includes: an electric heating film 40, a first power supply 10, and a switch module 30; the electric heating film 40 is arranged on the back of the solid state drive 00; the positive pole of the first power supply 10 is connected to the input end of the switch module 30; the output end of the switch module 30 is connected to the input end of the electric heating film 40; that is, the heating device can reduce the risk of data loss and improve data reliability by preheating the storage semiconductor (solid state drive 00) in an extremely low temperature environment to increase its working temperature.

[0055] In addition, except for the SSD 00, most other components in the vehicle can work at -40℃. If we solve the low temperature stability problem of the SSD 00, we can quickly put the equipment into working state without relying on the air conditioning system, thus improving work efficiency.

[0056] It should be noted that the prior art adopts a method of heating the entire data computing and storage system, which is transmitted to the components through the outer casing, resulting in high power consumption and a long heating time. To transmit to the components through the outer casing, it is necessary to embed heating wires (or other heating devices) in the structure, which increases the difficulty of structural design and processing. The vehicle air-conditioning system can also work after a certain period of time. If it cannot work in a very short time, the heating device of the data computing and storage system has no meaning to exist.

[0057] In this embodiment, the heating device of the solid-state hard disk 00 is used to achieve separate heating of the hard disk. There is no need to heat the entire device. The heat is directly transmitted from the back of the solid-state hard disk 00 to the front of the solid-state hard disk 00. It has low power consumption and short heating time. There is no need to embed a heating wire (or other heating device) in the structure. At the same time, the heating device of the solid-state hard disk 00 provided in the present application can achieve heating through the electric heating film 40 and the first power supply 10. It has a simple structural design and simple processing; it can take effect in a very short time.

[0058] Optional, see Figure 2 In the above embodiment, the switch module 30 includes: a power tube 31 and an MCU (Microcontroller Unit) 32 .

[0059] One end of the power tube 31 serves as the input end of the switch module 30 and is connected to the positive electrode of the first power source 10 .

[0060] A negative electrode of the first power source 10 is grounded GND.

[0061] The other end of the power tube 31 serves as the output end of the switch module 30 and is connected to the electric heating film 40 .

[0062] Specifically, the other end of the power tube 31 is connected to one end of the electric heating film 40 ; the other end of the electric heating film 40 is grounded GND.

[0063] The control end of the power tube 31 is connected to the first output end of the MCU 32 .

[0064] Specifically, the power tube 31 is controlled by the MCU 32 .

[0065] The MCU 32 can send a power-on signal to the control end of the power tube 31 to enable the power tube 31 to perform a conduction action, thereby enabling the first power supply 10 to supply power to the electric heating film 40 through the power tube 31, and the electric heating film 40 generates heat to achieve heating of the solid state drive 00.

[0066] The MCU 32 can be powered by the first power source 10 or other power supplies, and the power supply voltage of the MCU 32 is 3.3V.

[0067] GPIO is the port of MCU.

[0068] The power tube 31 can be a power MOS tube. More specifically, the power tube 31 can be a P-channel MOS tube. Of course, it can also be other power tubes, which will not be described here one by one. It depends on the actual situation and is within the protection scope of this application.

[0069] Optional, see Figure 3 In any of the above embodiments, the heating device may further include: an ambient temperature sensor 50.

[0070] The ambient temperature sensor 50 detects the ambient temperature of the solid state drive 00 and outputs the detected ambient temperature to the MCU 32 .

[0071] That is to say, the MCU 32 can control the working state of the power tube 31 according to the ambient temperature detected by the ambient temperature sensor 50, thereby controlling the working state of the heating device.

[0072] The ambient temperature sensor 50 and the MCU 32 use an IIC (Inter-Integrated Circuit) interface for data transmission; of course, other methods can also be used for transmission, which will not be described here one by one, depending on the actual situation, and are all within the scope of protection of this application.

[0073] Specifically, after the ambient temperature sensor 50 collects the ambient temperature value of the solid state drive 00, the ambient temperature value is transmitted to the MCU 32 through the IIC interface. The MCU 32 processes and determines according to the ambient temperature value, and executes or does not execute a control action.

[0074] The ambient temperature sensor 50 can be soldered on a PCB board of a data computing and storage system; the PCB board of the computing and storage system is different from the PCB board of the solid state drive 00.

[0075] When MCU 32 detects through the IIC interface that the temperature collected by the ambient temperature sensor 50 is lower than the first temperature threshold, at the moment when the data computing and storage system is turned on, MCU 32 will notify the second power supply 20 that supplies power to the solid state drive 00 to delay powering on, and at this time, the solid state drive 00 does not work. MCU 32 also controls the power tube 31 to turn on through the voltage drive line. When the voltage on the voltage drive line is lower than the output voltage of the first power supply 10, the power tube 31 is turned on, and the voltage of the first power supply 10 is applied to the electric heating film 40. The temperature of the electric heating film 40 rises rapidly. When the temperature of the electric heating film 40 exceeds the second temperature threshold, MCU 32 controls the power tube 31 to turn off through the voltage drive line, and the electric heating film 40 stops working; at the same time, MCU 32 notifies the second power supply 20 to power on through the control line, and the solid state drive 00 starts to work and enters the operating system normally.

[0076] The first temperature threshold may be -30°C, or other values, which will not be elaborated here. It depends on the actual situation and is within the protection scope of this application.

[0077] The second temperature threshold can be 0°C, or other values, which will not be described in detail here, and can be determined according to actual conditions, all of which are within the protection scope of this application. That is, the temperature rise (temperature increase) is 30 degrees.

[0078] The voltage driving line is a cable to which the first output terminal of the MCU 32 is connected.

[0079] The control line is a connection line between the MCU 32 and the second power source 20 .

[0080] Optional, see Figure 4 The heating device also includes: a thermistor R2 and a voltage-dividing resistor R1.

[0081] One end of the voltage-dividing resistor R1 receives power from the first power source 10 through the switch module 30 .

[0082] Specifically, one end of the voltage-dividing resistor R1 is connected to the output end of the switch module 30 , and the input end of the switch module 30 is connected to the positive electrode of the first power source 10 .

[0083] The other end of the voltage-dividing resistor R1 is connected to ground GND through the thermistor R2.

[0084] Specifically, the other end of the voltage-dividing resistor R1 is connected to one end of the thermistor R2 , and the other end of the thermistor R2 is grounded GND.

[0085] The connection point between the voltage-dividing resistor R1 and the thermistor R2 is connected to the voltage detection terminal of the MCU 32 .

[0086] The thermistor R2 is disposed on the back side of the solid state drive 00 .

[0087] The thermistor R2 is a thermistor with a positive temperature coefficient; of course, other situations are not excluded, which will not be elaborated here one by one. It depends on the actual situation and is within the protection scope of this application.

[0088] The electric heating film 40 is welded with a thermistor R2 , and the temperature change of the electric heating film 40 can be detected by detecting the voltage change of the thermistor R2 .

[0089] When the switch module 30 is in the on state, the first power supply 10 supplies power to the electric heating film 40 and the thermistor R2 through the switch module 30, that is, the thermistor R2 receives 12V power supply, the electric heating film 40 starts to generate heat, and the thermistor R2 is affected by the heat of the electric heating film 40 and changes its resistance.

[0090] Specifically, when MCU 32 detects through the IIC interface that the temperature collected by the ambient temperature sensor 50 is lower than the first temperature threshold, at the moment when the data computing and storage system is turned on, MCU 32 will notify the second power supply 20 to delay power-on, and the solid-state hard disk 00 will not work at this time. MCU 32 also turns on the power tube 31 through the voltage drive line. When the voltage on the voltage drive line is lower than the output voltage of the first power supply 10, the power MOS tube is turned on, and the voltage of the first power supply 10 is applied to the electric heating film 40. The temperature of the electric heating film 40 rises rapidly. When the temperature of the electric heating film 40 exceeds the second temperature threshold, the resistance of the thermistor R2 reaches the maximum, and the voltage detected by MCU 32 is the highest. At this time, the power tube 31 is controlled to be cut off through the voltage drive line, and the electric heating film 40 stops working. At the same time, MCU 32 notifies the power supply 2 to power on through the control line, and the solid-state hard disk 00 starts working and enters the operating system normally.

[0091] Furthermore, in an extremely low temperature environment, by preheating the solid state drive 00, the activity of the semiconductor memory under low temperature conditions can be fully activated, the working stability of the solid state drive 00 can be improved, and thus the data reliability can be improved.

[0092] Optionally, the size of the electric heating film 40 is smaller than that of the solid state drive 00 .

[0093] Specifically, the size of the electric heating film 40 minus the size of the solid state drive 00 is equal to the preset size; the value of the preset size is not specifically limited here and can be determined according to actual conditions, all of which are within the protection scope of this application.

[0094] It should be noted that, since the solid state drive 00 has a gold finger, the size of the electric heating film 40 needs to be set smaller than the size of the solid state drive 00 .

[0095] Optionally, the size of the electric heating film 40 is 70 mm x 20 mm.

[0096] The dimensions of the SSD 00 are 80mm x 22mm.

[0097] That is, the electric heating film 40 can completely fit the solid state drive 00 .

[0098] Optionally, the electric heating film 40 is attached to the back of the solid state drive 00 by 3M adhesive; of course, other methods are not excluded to make the electric heating film 40 attached to the back of the solid state drive 00, which will not be elaborated here one by one, depending on the actual situation, and are all within the protection scope of this application.

[0099] Optionally, the thickness of the electric heating film 40 is less than 2 mm.

[0100] Since the thickness of the electric heating film 40 does not exceed 2 mm, when it is attached to the back of the solid state hard disk 00 by means of 3M adhesive, it does not affect the installation of the solid state hard disk 00 on the computer motherboard.

[0101] The thickness of the electric heating film 40 is not specifically limited here, and can be determined according to actual conditions, and is within the protection scope of this application.

[0102] It should be noted that see Figure 5 , the following is an explanation of one implementation of the heating device:

[0103] There are many devices on the front of the M.2 SSD, which need to be cooled and a heat sink is needed. The back of the M.2 SSD is very flat and does not contact the heat sink, so a heating device is installed on the back of the M.2 SSD so that the heat can be quickly transferred to the devices on the front through the PCB. The M.2 SSD is a system disk in the data computing storage system, used to install and store the operating system.

[0104] The heating device includes: PI electric heating film, power MOS tube, power supply, MCU, thermistor and ambient temperature sensor.

[0105] The PI heating film is customized into a standard rectangle with dimensions of 70mm (length) x 20mm (width). The power of the PI heating film does not exceed 5W, and the dimensions of the M.2SSD are 80mm (length) x 22mm (width). The PI heating film can fit the M.2SSD perfectly. The PI heating film is attached to the back of the M.2SSD with 3M adhesive. A thermistor is welded on the PI heating film. The first power supply is added to one end of the thermistor, and the other end of the thermistor is led out through a cable (for voltage detection). When the resistance of the thermistor changes, the current flowing through the thermistor will change, and the detected voltage will change. A thermistor with a positive temperature coefficient is used here. When the temperature rises, the resistance of the thermistor will also increase proportionally.

[0106] Since the thickness of the PI electric heating film does not exceed 2mm, it will not affect the installation of the M.2 SSD on the computer motherboard when it is attached to the back of the M.2 SSD through 3M adhesive. First, solder the ambient temperature sensor to the PCB board of the data computing and storage system.

[0107] When the MCU detects that the temperature collected by the ambient temperature sensor is lower than -30℃ through the IIC interface, the MCU will notify the second power supply to delay power-on at the moment the data computing and storage system is turned on, and the M.2SSD will not work at this time. The MCU also turns on the power MOS tube through the voltage drive line. Here, a P-channel MOS tube is used. When the voltage on the voltage drive line is lower than the output voltage of power supply 1, the power MOS tube is turned on, and the voltage of power supply 1 is applied to the PI electric heating film. The temperature of the PI electric heating film rises rapidly. When the heating temperature exceeds 30℃, the resistance of the thermistor reaches the maximum, and the voltage detected by the MCU is the highest. At this time, the power MOS tube is controlled to be cut off through the voltage drive line, and the PI electric heating film stops working. At the same time, the MCU notifies power supply 2 to power on through the control line, and the M.2SSD starts working and enters the operating system normally.

[0108] In an extremely low temperature environment, by preheating the M.2 SSD, the activity of the semiconductor memory under low temperature conditions can be fully activated, the working stability of the SSD can be improved, and thus data reliability can be improved.

[0109] This heating device is specially used for preheating M.2SSD in extremely low temperature environment. Other solutions use conduction heating through the whole shell of the machine, which takes a long time to heat, consumes a lot of power and has a complex structure design. However, this heating device has the advantages of short heating time, low power consumption and simple structure design.

[0110] Another embodiment of the present application provides a solid state hard disk, including: a printed circuit PCB board, a storage unit, a heat sink and a heating device.

[0111] The storage unit and the heat sink are arranged on the front side of the PCB board.

[0112] The heating device is arranged on the back side of the PCB board.

[0113] The specific structure and principle of the heating device are detailed in the heating device provided in the above embodiment, which will not be described here one by one, and all are within the protection scope of this application.

[0114] In this embodiment, a heating device is provided on the back of the PCB board of the solid-state hard disk, thereby achieving preheating of the solid-state in an extremely low temperature environment, and has the advantages of short heating time, low heating power consumption, and simple structural design.

[0115] The features recorded in the various embodiments in this specification can be replaced or combined with each other, and the same and similar parts between the various embodiments can refer to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system or system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can refer to the partial description of the method embodiment. The system and system embodiments described above are only schematic, in which the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative work.

[0116] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present utility model.

[0117] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heating device for a solid state hard disk, characterized in that: include: An electric heating film, a first power supply and a switch module; The electric heating film is arranged on the back side of the solid state hard disk; The positive electrode of the first power supply is connected to the input end of the switch module; The output end of the switch module is connected to the input end of the electric heating film; The switch module includes: a power tube and a micro control unit MCU; One end of the power tube is connected to the positive electrode of the first power supply; The other end of the power tube is connected to the electric heating film; The control end of the power tube is connected to the first output end of the MCU.

2. The heating device for a solid state hard disk according to claim 1, characterized in that: Also includes: Ambient temperature sensor; The ambient temperature sensor detects the ambient temperature of the solid state drive and outputs the detected ambient temperature to the MCU.

3. The heating device for a solid state hard disk according to claim 1, characterized in that: Also includes: Thermistors and voltage divider resistors; One end of the voltage-dividing resistor receives electric energy from the first power source through the switch module; The other end of the voltage-dividing resistor is grounded through the thermistor; The connection point between the thermistor and the voltage-dividing resistor is connected to the voltage detection terminal of the MCU; The thermistor is arranged on the back side of the solid state hard disk.

4. The heating device for a solid state hard disk according to claim 1, characterized in that: The size of the electric heating film is smaller than that of the solid state hard disk.

5. The heating device for a solid state hard disk according to claim 1, characterized in that: The size of the electric heating film is 70 mm x 20 mm; The dimensions of the solid state drive are 80 mm x 22 mm.

6. The heating device for a solid state hard disk according to claim 1, characterized in that: The electric heating film is attached to the back of the solid state hard disk by 3M adhesive.

7. The heating device for a solid state hard disk according to claim 1, characterized in that: The thickness of the electric heating film is less than 2 mm.

8. The heating device for a solid state hard disk according to claim 1, characterized in that: The electric heating film is a PI electric heating film.

9. A solid state hard disk, characterized in that: include: A printed circuit board PCB, a storage unit, a heat sink, a second power supply and a heating device as claimed in any one of claims 1 to 8; The second power supply supplies power to the solid state drive; The storage unit and the heat sink are arranged on the front side of the PCB board; The heating device is arranged on the back side of the PCB board.

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