Wafer calibration equipment

Abstract

The utility model discloses wafer calibration equipment, and belongs to the technical field of semiconductor processing. The wafer calibration equipment comprises a camera, a carrying table, a detection camera module and a driving assembly, an x-axis guide rail and a y-axis guide rail are arranged between the carrying table and a bottom plate, the driving assembly comprises a rotary driving device, an x-axis driving device and a y-axis driving device, and three-degree-of-freedom movement of the carrying table can be achieved through the driving assembly; therefore, the position and direction state of the target wafer can be identified, subsequent processes can be smoothly carried out, when wafer calibration equipment works, the wafer can rotate below the detection camera module, it is guaranteed that a lens can carry out edge detection on the wafer to determine the circle center, and a notch or a flat edge of the wafer is found to determine the direction of the wafer; therefore, the position and the angle orientation of the wafer can be identified. The wafer calibration equipment is high in calibration efficiency, and the y-axis guide rail is a long-axis guide rail, so that the distance between the center of the carrying table and the optical axis of the lens can be adjusted to meet the calibration requirements of wafers of different sizes.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a wafer calibration device. Background Art

[0002] In the semiconductor packaging and testing process, there are many processes involved. The wafer needs to complete specific processing steps at different stations, so the wafer needs to be transferred and transported between different stations. Since the direction and position of the wafer will inevitably shift during the process of transporting and transferring the wafer, some processes require the wafer to enter a specific position on the station in a specific direction. Therefore, in these processes, the position and angle of the transferred wafer need to be recalibrated.

[0003] In the related art, the wafer position calibration is generally performed by clamping the wafer from the outside to the inside through multiple mechanical clamping mechanisms, so that the center of the wafer reaches a specific position, and the wafer center position calibration is completed. The wafer angle calibration is generally performed by using sensors to identify the notch features or flat edge features on the edge of the wafer to determine the angular orientation of the wafer, and then perform the wafer angle calibration.

[0004] However, the wafer calibration method in the related art is cumbersome, the wafer position calibration and the wafer angle calibration are performed separately, and the detection range of the sensor is limited. In extreme cases, the wafer needs to be rotated one circle before the sensor can detect the notch features or flat edge features of the wafer, thereby determining the angular orientation of the wafer. Utility Model Content

[0005] The purpose of the embodiment of the utility model is to provide a wafer calibration device, which can improve the speed of wafer position calibration and wafer angle calibration, and facilitate the wafer to enter the next process.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A wafer calibration device, comprising:

[0008] A machine body, comprising a bottom plate and a vertical plate fixed to the bottom plate;

[0009] A carrier is movably mounted on the bottom plate, and a y-axis guide rail and an x-axis guide rail are arranged between the carrier and the bottom plate;

[0010] A detection camera module is installed on the vertical plate; the detection camera module includes a lens, and the lens is arranged toward the bottom plate;

[0011] A driving assembly is disposed between the stage and the base plate; the driving assembly includes a rotation driving device for driving the stage to rotate, an x-axis driving device for driving the stage to move along the x-axis guide rail, and a y-axis driving device for driving the stage to move along the y-axis guide rail;

[0012] Wherein, the first end of the y-axis guide rail is close to the vertical plate, and the second end of the y-axis guide rail extends in a direction away from the vertical plate; the length of the y-axis guide rail is greater than the length of the x-axis guide rail.

[0013] Optionally, the rotation driving device is a rotation motor, and the motor shaft of the rotation motor is transmission-connected to the carrier through a transmission assembly;

[0014] The transmission assembly includes a first pulley, a second pulley and a synchronous belt, the first pulley is connected to the motor shaft of the rotating motor, the second pulley is connected to the carrier, and the synchronous belt is sleeved outside the first pulley and the second pulley; the rotating motor can drive the carrier to rotate through the first pulley, the synchronous belt and the second pulley;

[0015] The diameter of the first pulley is smaller than the diameter of the second pulley.

[0016] Optionally, the wafer calibration equipment also includes a rotating adapter, an idler wheel and a wheel mounting shaft. The fixed end of the rotating drive device is relatively fixed to the rotating adapter. The idler wheel is rotatably mounted on the rotating adapter through the wheel mounting shaft. The wheel surface of the idler wheel in the radial direction abuts against the synchronous belt.

[0017] Optionally, the wheel mounting shaft has multiple installation positions installed on the rotating adapter, and the line between the rotation axis of the first pulley and the rotation axis of the second pulley is the first line. When the wheel mounting shaft is located at different installation positions, the position of the wheel mounting shaft away from the first line is different.

[0018] Optionally, the wafer calibration device further includes a transfer shaft and an air pipe; an air pipe is arranged inside the carrier, an air hole communicating with the air pipe is arranged on the top surface of the carrier, and the air pipe is connected to the carrier and communicated with the air pipe; the carrier is transmission-connected to the driving end of the rotary drive device through the transfer shaft, a hollow channel is arranged inside the transfer shaft, and the air pipe is passed through the hollow channel;

[0019] The wafer calibration equipment also includes a rotating adapter, a rotating motor seat and a bearing; one end of the adapter shaft is connected to the carrier, and the other end of the adapter shaft passes through the shaft hole to be transmission-connected to the driving end of the rotating drive device, and the bearing is sleeved on the outside of the adapter shaft and is located in the shaft hole; the fixed end of the rotating drive device is connected to the rotating motor seat, and the rotating motor seat is connected to the rotating adapter.

[0020] Optionally, the detection camera module includes a lens, a camera mounting plate and a focusing connector, the lens is mounted on the camera mounting plate, and the camera mounting plate is detachably or movably mounted on the vertical plate; the focusing connector is arranged between the camera mounting plate and the vertical plate; the focusing connector is used to adjust the distance between the camera mounting plate and the base plate to adjust the distance between the lens and the base plate.

[0021] Optionally, the detection camera module also includes a camera focusing block, the focusing connecting piece is an adjusting screw, the camera focusing block is connected to the vertical plate, the camera focusing block is provided with an adjustment hole extending up and down, the adjusting screw passes through the camera focusing block to cooperate with the camera mounting plate, and when an external force rotates the adjusting screw, the camera mounting plate moves up and down relative to the vertical plate.

[0022] Optionally, the detection camera module includes a lens and a light source, the light incident surface of the lens faces the base plate, and the light source is used to provide light in the direction of the base plate.

[0023] Optionally, it includes a rotation sensing component, an x-axis sensing component and a y-axis sensing component arranged between the carrier and the base plate; the rotation sensing component is used to detect the rotation angle of the carrier, the x-axis sensing component is used to detect the position of the carrier on the x-axis guide rail, and the y-axis sensing component is used to detect the position of the carrier on the y-axis guide rail;

[0024] The wafer calibration equipment also includes an x-axis limit assembly and a y-axis limit assembly arranged between the carrier and the base plate, the x-axis limit assembly is used to limit the position of the carrier in the x direction; the y-axis limit assembly is used to limit the position of the carrier in the y direction.

[0025] Optionally, the rotation drive device is a rotation motor, the x-axis drive device is an x-axis motor, and the y-axis drive device is a y-axis motor;

[0026] The wafer calibration equipment includes a y-axis motor seat, a y-axis screw assembly, a y-axis adapter seat, an x-axis first adapter seat, an x-axis motor seat, an x-axis second adapter seat, an x-axis screw assembly, a rotating adapter seat and a rotating motor seat;

[0027] The fixed end of the y-axis motor is installed on the bottom plate through the y-axis motor seat, the driving end of the y-axis motor is connected to the y-axis adapter seat through the y-axis screw assembly, and the y-axis adapter seat is slidably installed on the bottom plate through the y-axis guide rail;

[0028] The x-axis first adapter is connected to the y-axis adapter, the fixed end of the x-axis motor is installed on the x-axis first adapter through the x-axis motor seat, the driving end of the x-axis motor is connected to the x-axis second adapter through the x-axis screw assembly, and the x-axis second adapter is slidably installed on the x-axis first adapter through the x-axis guide rail;

[0029] The rotating adapter is connected to the second adapter of the x-axis, the fixed end of the rotating motor is connected to the rotating adapter via the rotating motor seat, the carrier is rotatably mounted on the rotating adapter, and the driving end of the rotating motor is connected to the carrier via a transmission assembly.

[0030] The beneficial effects of the utility model are:

[0031] The inspection camera module has a wider viewing angle. By using visual positioning, it can locate the center of the wafer more quickly, and locate the notch on the edge of the wafer or the flat edge on the edge of the wafer, thereby determining the center position of the wafer and the angle orientation of the wafer.

[0032] The wafer angle can be adjusted by the rotary drive device, and the wafer center position can be adjusted by the x-axis drive device and the y-axis drive device. The rotary drive device, the x-axis drive device and the y-axis drive device can work simultaneously to adjust the wafer center position and the wafer angle at the same time, so as to realize the identification and calibration of the wafer position and wafer angle, which is convenient for the wafer to enter the next process and has high calibration efficiency.

[0033] The y-axis guide rail of the wafer calibration device is a long-axis guide rail, and the stage moves along the y-axis guide rail, which can make the center line of the stage approach or move away from the lens optical axis of the detection camera module, thereby adapting to wafers of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The utility model is further described in detail below based on the drawings and embodiments.

[0035] Figure 1 This is an exploded schematic diagram of a wafer calibration device according to an embodiment of the present utility model;

[0036] Figure 2 This is a three-dimensional schematic diagram of the wafer calibration device according to an embodiment of the utility model (the upper outer plate and the lower outer plate are omitted in the figure);

[0037] Figure 3 This is a schematic diagram of the overall structure of the wafer calibration device according to an embodiment of the utility model;

[0038] Figure 4 A side view of the wafer calibration device according to an embodiment of the utility model (the upper outer plate and the lower outer plate are omitted in the figure);

[0039] Figure 5 This is a front view of the wafer calibration device according to an embodiment of the utility model (the upper outer plate and the lower outer plate are omitted in the figure);

[0040] Figure 6 This is the second side view of the wafer calibration device according to the embodiment of the utility model;

[0041] Figure 7 A top view of the wafer calibration device according to an embodiment of the utility model;

[0042] Figure 8 It is a structural schematic diagram of a detection camera module in a wafer calibration device according to an embodiment of the utility model;

[0043] Fig. 9 It is a schematic diagram of the structural decomposition of the detection camera module in the wafer calibration device according to the embodiment of the utility model;

[0044] Fig.10 It is a structural schematic diagram of a stage and a rotating assembly in a wafer calibration device according to an embodiment of the utility model;

[0045] Fig.11 It is a schematic diagram of the structural decomposition of the rotating assembly in the wafer calibration device according to an embodiment of the utility model;

[0046] Fig.12 It is a structural schematic diagram of the x-axis component in the wafer calibration device according to an embodiment of the utility model;

[0047] Fig.13 This is a schematic diagram of the structural decomposition of the x-axis component in the wafer calibration device according to an embodiment of the present utility model;

[0048] Fig.14 It is a structural schematic diagram of the y-axis component in the wafer calibration device according to an embodiment of the utility model;

[0049] Fig.15 It is a schematic diagram of the structural decomposition of the y-axis component in the wafer calibration device described in an embodiment of the present utility model.

[0050] In the figure: 10, body; 11, bottom plate; 12, vertical plate; 13, upper outer plate; 14, lower outer plate; 20, stage; 21, bearing surface; 30, detection camera module; 31, lens; 32, camera mounting plate; 33, focusing connector; 34, camera focusing block; 35, light source; 36, camera clamping block; 40, rotation drive device; 50, x-axis drive device; 60, y-axis drive device; 71, adapter shaft; 72, rotation adapter seat; 73, transmission assembly; 731, first pulley; 732, second pulley; 733, synchronous belt; 734, idler; 735, wheel mounting shaft; 74, rotation motor seat; 75, rotation elbow; 7 6. Bearing; 81. x-axis guide rail; 82. x-axis slider; 83. x-axis first adapter; 84. x-axis motor seat; 85. x-axis second adapter; 91. y-axis guide rail; 92. y-axis slider; 93. y-axis adapter; 94. y-axis motor seat; 701. θ-axis sensor; 702. θ-axis photoelectric switch; 801. x-axis sensor; 802. x-axis photoelectric switch; 803. x-axis limit block; 804. x-axis lead screw assembly; 901. y-axis sensor; 902. y-axis photoelectric switch; 903. y-axis limit block; 904. Limit buffer; 9041. Limit screw; 9042. Buffer sleeve; 905. y-axis lead screw assembly. DETAILED DESCRIPTION

[0051] In order to make the technical problems solved by the utility model, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the utility model will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0052] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0053] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0054] In each process of semiconductor packaging and testing, wafers need to complete specific processing steps at different stations, so wafers need to be transported and transferred between different stations. Some transports and transfers will inevitably change the direction of the wafer or introduce position errors. Some processes require the wafer to enter at a specific position and direction, so the position and angle of the transferred wafers need to be calibrated.

[0055] In the related art, a wafer is clamped from the outside to the inside by multiple clamps to adjust the center of the wafer to a target position for calibration. However, the outer edges of many wafers have notches or flat edges for marking angles, and the clamps are easily stuck in the notches.

[0056] In the related art, the sensor identifies the marking feature of the edge of the wafer (the marking feature is a notch or a flat edge) to determine the angular orientation of the wafer. When the wafer rotates or moves, the sensor will emit a light beam and detect its reflection or transmission. When the light beam encounters a notch, the reflection or transmission characteristics of the light beam will change due to the presence of the notch. This change is captured by the sensor and converted into an electrical signal. However, first, the range of detection of the photoelectric sensor is small. In extreme cases, the sensor can detect the notch only after the wafer rotates one circle. Second, if the center of the wafer (i.e., the center of the wafer circle) deviates greatly from the center of the rotating stage, even if the wafer rotates one circle, the sensor may not be able to detect the notch on the edge of the wafer. Third, the calibration device is generally required to be compatible with 12-inch / 8-inch or 8-inch / 6-inch wafers at the same time. At this time, at least two sensors need to be configured, and the two sensors have different radial distances from the center of the stage to match the edge notch feature detection of two sizes.

[0057] Based on this, the present application provides a wafer calibration device, which locates the wafer center and wafer notch through visual detection, and realizes wafer position calibration and wafer angle calibration through a rotation drive device 40, an x-axis drive device 50, and a y-axis drive device 60.

[0058] In the present application, the edge image of the target wafer captured by the detection camera module 30 can determine the center position of the wafer and the wafer notch position by cooperating with the detection camera module 30 and the driving component, thereby realizing the identification of the wafer position and the wafer direction. Then, the center position of the wafer can be adjusted to the target position, and the wafer notch can be adjusted to the target direction, so as to facilitate the next process.

[0059] Please refer to Figures 1 to 15 The wafer calibration device of the present application includes a body 10, a stage 20, a detection camera module 30, a drive assembly and a controller. The body 10 is the main body of the device and provides support. The stage 20 is used to carry the wafer. The detection camera module 30 is used to capture the image of the wafer on the stage 20. Optionally, by capturing the image of the edge area of ​​the wafer, the center position of the wafer and the wafer notch are located.

[0060] Please continue to refer to Figures 1 to 15 The machine body 10 includes a bottom plate 11 and a vertical plate 12 . The vertical plate 12 is mounted on the bottom plate 11 and extends upward from the bottom plate 11 .

[0061] The upper side of the stage 20 is a carrying surface 21, and the carrying surface 21 is used to carry the target wafer. The detection camera module 30 is installed on the vertical plate 12, and the detection camera module 30 includes a lens 31, and the lens 31 faces the bottom plate 11 so that the lens 31 can capture the image of the object located below it. The stage 20 is located beside the vertical plate 12, and the lens 31 is used to capture the image of the wafer carried on the stage 20.

[0062] The carrier 20 is movably mounted on the base plate 11, and a driving assembly is arranged between the carrier 20 and the base plate 11. The driving assembly includes a θ-axis assembly, an x-axis assembly and a y-axis assembly. The carrier 20, the θ-axis assembly, the x-axis assembly and the y-axis assembly are arranged on the base plate 11 from top to bottom.

[0063] The θ-axis assembly includes an adapter shaft 71 and a rotation drive device 40, and the stage 20 is rotatably mounted on the bottom plate 11 through the adapter shaft 71. The x-axis assembly includes an x-axis guide rail 81 and an x-axis drive device 50, and the stage 20 is slidably mounted on the bottom plate 11 through the x-axis guide rail 81. The y-axis assembly includes a y-axis guide rail 91 and a y-axis drive device 60, and the stage 20 is slidably mounted on the bottom plate 11 through the y-axis guide rail 91.

[0064] The stage 20 and the wafer on the stage 20 can be driven by the rotation drive device 40 to rotate around the vertical center line of the stage 20, so that the wafer can rotate under the lens 31, ensuring that the lens 31 can detect the edge of the wafer, determine the center position of the wafer, and find the notch or flat edge feature on the edge of the wafer to determine the direction of the wafer. The stage 20 and the wafer on the stage 20 can be driven by the y-axis drive device 60 to reciprocate along the y-axis guide rail 91, and can be driven by the x-axis drive device 50 to reciprocate along the x-axis guide rail 81.

[0065] Before the wafer is sent to the carrier 20, the carrier 20 is located in the initial position. At this time, there is a gap between the vertical center axis of the carrier 20 and the optical axis of the lens 31, and the gap distance is d. When the wafer position and the wafer angle need to be located, the wafer is sent to the carrier 20, the rotation drive device 40 drives the wafer to rotate, and the lens 31 of the detection camera module 30 takes one or more images of the wafer edge area. The controller receives the captured image and processes the image to determine the wafer position and the wafer angle. Among them, the coordinates of the center of the wafer can be determined based on the curvature of the outer edge of the wafer in the image; the wafer angle can be determined based on whether there is a notch or flat edge near the outer edge in the identified image.

[0066] After determining the wafer center coordinates and the wafer angle, wafer position calibration and wafer angle calibration are performed. The position of the carrier 20 is adjusted by the x-axis drive device 50 and / or the y-axis drive device 60, thereby adjusting the position of the wafer, and wafer position calibration is performed; the angle of the carrier 20 is adjusted by the rotation drive device 40, thereby adjusting the angle of the wafer, and wafer angle calibration is performed. Wafer position calibration and wafer angle calibration can be performed simultaneously or in two separate steps.

[0067] In the wafer calibration device of the present application, in order to meet the requirements of wafer position calibration and angle calibration of various sizes, the y-axis guide rail 91 is configured as a long-axis guide rail, that is, the length of the y-axis guide rail 91 is greater than the length of the x-axis guide rail 81. In addition, the first end of the y-axis guide rail 91 is close to the vertical plate 12, and the second end of the y-axis guide rail 91 extends in a direction away from the vertical plate 12. In this way, by controlling the position of the stage 20 on the y-axis guide rail 91, the distance d between the central axis of the stage 20 and the optical axis of the lens 31 can be adjusted. When the wafer size is large, the distance d is large when the stage 20 is in the initial position. When the wafer size is small, the distance d is small when the stage 20 is in the initial position, so that when the lens 31 captures the wafer image, the lens 31 can always capture the image of the outer edge of the wafer. In other words, the wafer calibration device has at least two working modes. When the wafer calibration device is in different working modes, the initial position of the stage 20 on the y-axis slide rail is different.

[0068] Take the wafer calibration equipment for identification, positioning and calibration of wafers of two diameters as an example, the two wafers are the first wafer and the second wafer. When the stage 20 is in the initial position, the distance between the center axis of the stage 20 and the optical axis of the lens 31 is d1. At this time, after the first wafer is sent to the stage 20, the edge of the second wafer is located in the field of view of the lens 31. However, since the diameter of the second wafer is different from that of the first wafer, if the distance between the center axis and the optical axis of the lens 31 is still d1 at the initial position of the stage 20, after the second wafer is sent to the stage 20, there may be two situations: first, since the diameter of the second wafer is smaller than that of the first wafer, the lens 31 cannot capture the image of the wafer, resulting in the inability of the lens 31 to perform positioning and identification based on the wafer edge image; second, since the diameter of the second wafer is larger than that of the first wafer, the lens 31 captures the image of the middle area of ​​the wafer, but cannot capture the image of the edge of the wafer, which also causes the lens 31 to be unable to perform positioning and identification based on the wafer edge image.

[0069] For example, the radius difference between a 12-inch wafer and an 8-inch wafer is 50 mm, and the radius difference between an 8-inch wafer and a 6-inch wafer is 25 mm. Before adjusting the calibration mode from the 12-inch wafer to the 8-inch wafer calibration mode, the y-axis drive device 60 can be used to drive the stage 20 to move 50 mm in the direction close to the vertical plate 12 and the optical axis of the lens 31. Before adjusting the calibration mode from the 6-inch wafer to the 8-inch wafer calibration mode, the y-axis drive device 60 can be used to drive the stage 20 to move 25 mm in the direction away from the vertical plate 12 and the optical axis of the lens 31. By controlling the stage 20 to approach or move away from the optical axis of the lens 31 along the y-axis guide rail 91, it is ensured that the edge of the wafer can be located within the field of view of the lens 31 during visual positioning, thereby meeting the calibration and positioning requirements of wafers of different sizes.

[0070] The wafer calibration device of the present application can identify the position and direction of the wafer when the wafer is transferred between different processes, and calibrate the wafer to a predetermined position and a predetermined angle, thereby ensuring the progress of subsequent processes. The wafer calibration device of the present application has the following effects:

[0071] First, by combining the camera with the rotation drive device 40, the y-axis drive device 60 and the x-axis drive device 50 below, the edge of the wafer can be identified over a large range through visual positioning to determine the center position of the circle and the wafer notch or flat edge features. The camera has a large field of view, fast positioning speed and high positioning accuracy.

[0072] Second, based on the same calibration equipment, the wafer position calibration and wafer angle calibration requirements can be met at the same time. The wafer center position and wafer edge marking features (notch or flat edge) can be identified at the same time, and the wafer position calibration and wafer angle calibration can be performed at the same time, with high calibration efficiency.

[0073] Third, based on the same inspection camera module 30, the same visual inspection software system, in conjunction with the x-axis drive device 50 and the y-axis drive device 60, it can simultaneously meet the calibration requirements of at least two sizes of wafers, and has strong adaptability.

[0074] Fourthly, the stage 20 has three degrees of freedom of movement, namely, rotation, movement in the x-direction, and movement in the y-direction, and can be adjusted in multiple directions, with high flexibility and strong adaptability.

[0075] Fifth, the x-axis assembly and the y-axis assembly are arranged in an up-and-down manner, which is compact in structure, saves space, and has a beautiful layout. The x-axis guide rail 81 and the y-axis guide rail 91 can be micro guide rails, which are more compact in structure.

[0076] Compared with the wafer position and angle calibration equipment in the related art, the wafer calibration equipment of the present application does not require a clamp to clamp the outer edge of the wafer to prevent the clamp from getting stuck in the wafer notch. The wafer notch is located by visual positioning, and the camera has a large field of view when collecting images. Compared with sensor detection, the notch position can be located faster, with high positioning accuracy and faster positioning speed.

[0077] In one embodiment, the fixed end of the y-axis driving device 60 is linked to the bottom plate 11, the driving end of the y-axis driving device 60 is connected to the fixed end of the x-axis driving device 50, the fixed end of the x-axis driving device 50 is slidably mounted on the bottom plate 11 through the y-axis guide rail 91, the driving end of the x-axis driving device 50 is connected to the fixed end of the rotation driving device 40, an x-axis guide rail 81 is arranged between the rotation driving device 40 and the fixed end of the x-axis driving device 50, and the driving end of the rotation driving device 40 is connected to the stage 20. In this way, the y-axis driving device 60 can drive the x-axis driving device 50, the rotation driving device 40 and the stage 20 to move along the y-axis guide rail 91, the x-axis driving device 50 can drive the rotation driving device 40 and the stage 20 to move along the x-axis guide rail 81, and the rotation driving device 40 can drive the stage 20 to rotate. It can be understood that, taking the motor as the driving device as an example, the fixed end of the motor is the motor body, and the driving end of the motor is the motor shaft.

[0078] In one embodiment, when calibrating the wafer position, it is determined whether the wafer center coordinates are consistent with the target center coordinates. If not, it is determined that the wafer position is inaccurate, and the distance that the carrier 20 needs to move is calculated based on the wafer center coordinates and the target center coordinates. The distance that needs to be moved includes the x-axis moving distance and the y-axis moving distance, and the x-axis drive device 50 and the y-axis drive device 60 drive the carrier 20 to move the corresponding distance to complete the wafer position calibration. In one embodiment, when positioning the wafer angle, the direction of the wafer notch can be calculated based on the captured image and the rotation angle of the carrier 20; when calibrating the wafer angle, the rotation drive device 40 is used to control the carrier 20 to rotate a certain angle so that the wafer notch faces the target direction to complete the wafer angle calibration.

[0079] Please continue to refer to Fig.10 , Fig.11 , Figures 1 to 6 In one embodiment, in order to control the stable and reliable rotation of the stage 20, the θ-axis assembly is configured as follows:

[0080] The rotary drive device 40 is a rotary motor, and the motor shaft of the rotary motor is connected to the carrier 20 through a transmission assembly 73. The transmission assembly 73 includes a first pulley 731, a second pulley 732 and a synchronous belt 733. The first pulley 731 is connected to the motor shaft of the rotary motor, the second pulley 732 is connected to the carrier 20, and the synchronous belt 733 is sleeved outside the first pulley 731 and the second pulley 732. Optionally, the rotation axis of the first pulley 731 is parallel to the rotation axis of the second pulley 732, and the rotation axis of the second pulley 732 is colinear with the rotation axis of the carrier 20. When the motor shaft of the rotary motor rotates, the motor shaft drives the first pulley 731 to rotate, the first pulley 731 drives the synchronous belt 733 to rotate, the synchronous belt 733 drives the second pulley 732 to rotate, and the second pulley 732 drives the carrier 20 to rotate.

[0081] In one embodiment, if Fig.10 , Fig.11 As shown, the diameter of the first pulley 731 is smaller than the diameter of the second pulley 732, so that the pulley with a smaller diameter can drive the pulley with a larger diameter to rotate, thereby achieving high torque transmission, and a larger torque can be transmitted to the carrier 20, so that the rotary motor can drive the carrier 20 to rotate more stably and reliably, and control the wafer to rotate stably and smoothly. Of course, in other embodiments, the diameters of the first pulley 731 and the second pulley 732 can also be the same.

[0082] In one embodiment, if Fig.10 , Fig.11 , Figure 1 , Figure 4As shown, in order to make the synchronous belt 733 have a certain tension, the wafer calibration device also includes a rotating adapter, an idler wheel 734 and a wheel mounting shaft 735. The fixed end of the rotary drive device 40 is relatively fixed to the rotating adapter 72, and the idler wheel 734 is rotatably mounted on the rotating adapter 72 through the wheel mounting shaft 735. The wheel surface of the idler wheel 734 in the radial direction abuts the synchronous belt 733. The idler wheel 734 is located between the first pulley 731 and the second pulley 732. The idler wheel 734 is used to apply a certain pressure to the synchronous belt 733, so that the synchronous belt 733 maintains a certain tension, so that the torque can be reliably transmitted to the second pulley 732 through the synchronous belt 733, and the possibility of tooth jumping is reduced. Optionally, two idler wheels 734 are arranged on both sides of the synchronous belt 733, so as to press the synchronous belt 733 from the outside to the inside at the left outer side and the right outer side of the synchronous belt 733. In other embodiments, two idler wheels 734 can also be arranged on the inner side of the synchronous belt 733. The position of the idler wheel 734 can also be one, three, etc.

[0083] In one embodiment, the position of the idler wheel 734 can be adjusted to adjust the tension of the synchronous belt 733. The wheel mounting shaft 735 is detachably or movably mounted on the rotating adapter 72. The wheel mounting shaft 735 has a plurality of mounting positions mounted on the rotating adapter 72. When the wheel mounting shaft 735 is mounted at different mounting positions, the pressure applied by the idler wheel 734 to the synchronous belt 733 is different, and the tension of the synchronous belt 733 is different. In other words, the line between the rotation axis of the first pulley 731 and the rotation axis of the second pulley 732 is the first line. When the wheel mounting shaft 735 is located at different mounting positions, the position of the wheel mounting shaft 735 from the first line is different, so that the pressure applied by the idler wheel 734 to the synchronous belt 733 is different.

[0084] Alternatively, if Fig.10 , Fig.11 As shown, a waist-shaped hole (not marked in the figure) is provided on the rotating adapter 72, and one end of the wheel mounting shaft 735 is inserted into the waist-shaped hole. The position of the wheel mounting shaft 735 in the waist-shaped hole can be adjusted, thereby adjusting the position of the wheel mounting shaft 735, so as to adjust the position of the idler wheel 734 and adjust the tension of the synchronous belt 733. The idler wheel 734 is rotatably mounted on the wheel mounting shaft 735. It can be understood that the waist-shaped hole not only allows the installation position of the wheel mounting shaft 735 to be adjusted, but also can limit the rotation of the wheel mounting shaft 735. When the synchronous belt 733 rotates, the idler wheel 734 rotates relative to the wheel mounting shaft 735. In other embodiments, multiple mounting holes can also be provided on the rotating adapter 72, and the idler wheel 734 can be installed in different mounting holes by screws to install the idler wheel 734 in different mounting positions. Alternatively, in other embodiments, the installation position of the idler wheel 734 can also be fixed and cannot be adjusted.

[0085] Please continue to refer to Figures 1 to 6 , Fig.10 , Fig.11 In one embodiment, the carrier 20 fixes the wafer to the carrying surface 21 on the upper side of the carrier 20 by negative pressure adsorption. The wafer calibration device also includes a transfer shaft 71 and an air pipe, and the wafer calibration device also includes an air pump or a vacuum generator, one end of the air pipe is connected to the carrier 20, and the other end is connected to the air pump or the vacuum generator. Specifically, an airway is arranged inside the carrier 20, and a plurality of air holes connected to the airway are arranged on the top surface of the carrier 20, the air pipe is connected to the carrier 20 and connected to the airway, the carrier 20 is transmission-connected to the driving end of the rotating drive device 40 through the transfer shaft 71, a hollow channel is arranged inside the transfer shaft 71, and the air pipe is arranged in the hollow channel, and the air pipe passes through the transfer shaft 71 and is connected to the air pump or the vacuum generator, so that the top side of the carrier 20 can adsorb the wafer by negative pressure. In this embodiment, the wafer is adsorbed on the carrier 20 by negative pressure. The evenly distributed air channels on the carrier 20 can make the wafer stably adsorbed on the carrier 20. The hollow adapter shaft 71 is used to avoid unnecessary air pipe routing. The overall structure is simple and space is saved.

[0086] In one embodiment, the air pipe passes through the adapter shaft 71 and the rotating adapter seat 72 and is connected to the air pump or vacuum generator through the rotating elbow 75 .

[0087] Please refer to Figure 1 , Fig.11 In one embodiment, the wafer calibration device further includes a rotating adapter 72, a rotating motor seat 74 and a bearing 76. The carrier 20 is connected to the first end of the adapter shaft 71, and the second end of the adapter shaft 71 passes through the shaft hole of the rotating adapter 72 and is connected to the driving end of the rotating drive device 40 through the transmission assembly 73. The outer sleeve of the adapter shaft 71 is provided with a bearing 76, and the bearing 76 is located in the shaft hole to realize that the carrier 20 can be rotatably installed on the rotating adapter 72. The setting of the rotating adapter 72 allows the rotating adapter 72 to bear a certain weight of the carrier 20, and the setting of the bearing 76 allows the carrier 20 to rotate stably and smoothly. The setting of the rotating motor seat 74 and the rotating adapter 72 can integrate the carrier 20 and the rotating drive device 40 into the same small assembly, realize the modular design of the wafer calibration equipment, and facilitate the assembly of the whole machine.

[0088] In other embodiments, the bearing 76 and the motor base may not be provided.

[0089] Reference Figure 1 , Figure 2 , Figure 5 , Figure 6 , Figure 8 , Fig. 9In one embodiment, the detection camera module 30 includes a lens 31, a camera mounting plate 32, and a focus connector 33. The lens 31 is mounted on the camera mounting plate 32. The camera mounting plate 32 is detachably or movably mounted on the vertical plate 12. The focus connector 33 is disposed between the camera mounting plate 32 and the vertical plate 12. The upper and lower positions of the camera mounting plate 32 on the vertical plate 12 can be adjusted. The focus connector 33 is used to adjust the distance between the camera mounting plate 32 and the bottom plate 11 so that the position of the lens 31 can be adjusted. In other words, the focus connector 33 is used to adjust the distance between the lens 31 and the wafer on the stage 20 in the vertical direction, thereby adjusting the focal length of the lens 31, so that the lens 31 can capture the image of the edge of the wafer more clearly, and the visual recognition system can more accurately and quickly identify and locate the center of the wafer and the wafer notch or flat edge.

[0090] It is understandable that physically adjusting the up and down position of the lens 31 to adjust the focal length is less costly and more effective than making the wafer image captured by the lens 31 clearer through software processing. In other embodiments, when the focusing connection member 33 is not configured, blurred image processing can be performed through software.

[0091] Optionally, an adjustment screw is used as the focus connection member 33, and the up and down position of the camera mounting plate 32 is adjusted by rotating the adjustment screw. The camera mounting plate 32 is slidably mounted on the vertical plate 12 in the vertical direction, and the detection camera module 30 also includes a camera focus block 34, which is connected to the vertical plate 12. The camera focus block 34 is provided with an adjustment hole extending up and down, and the adjustment screw passes through the adjustment hole. The screw end of the adjustment screw cooperates with the camera mounting plate 32 and can be connected by threaded cooperation. When the external force rotates the adjustment screw, the camera mounting plate 32 moves up and down relative to the vertical plate 12.

[0092] In some embodiments, a step surface is provided in the adjustment hole, and a boss is provided outside the adjustment screw. The boss supports the step surface upward, so that the adjustment screw supports the camera mounting plate 32 upward. The bottom end of the adjustment screw is threadedly connected to the vertical plate 12. The adjustment screw is rotated downward or upward to move the boss downward or upward, so that the camera mounting plate 32 and the lens 31 are moved downward or upward. In other embodiments, the adjustment screw is threadedly connected to the adjustment hole, and the bottom end of the adjustment screw abuts against the vertical plate 12. The adjustment screw is rotated relative to the camera mounting plate 32 to increase or decrease the length of the adjustment screw extending out of the adjustment hole. When the bottom end of the adjustment screw abuts against the vertical plate 12, the adjustment screw can adjust the camera mounting plate 32 upward or downward. In other embodiments, the adjustment screw can also be configured in other ways, as long as the upper and lower positions of the camera mounting plate 32 can be adjusted by operating the adjustment screw.

[0093] In other embodiments, multiple mounting positions may be provided on the vertical plate 12 , and the camera mounting plate 32 may be fixed at a mounting position of a suitable height by screws to adjust the height of the camera mounting plate 32 , thereby adjusting the focal length of the lens 31 .

[0094] In one embodiment, the detection camera module 30 includes a camera clamping block 36, which clamps the lens 31 between the camera clamping block 36 and the camera mounting plate 32. The camera clamping block 36 is connected to the camera mounting plate 32 by screw fixing, snap fixing, etc. to install the lens 31 on the camera mounting plate 32.

[0095] In one embodiment, the detection camera module 30 includes a lens 31 and a light source 35. The light incident surface of the lens 31 faces the bottom plate 11. The light source 35 is used to provide light in the direction of the bottom plate 11. By using the detection camera module 30 with the light source 35, the clarity of the wafer image collected by the lens 31 is improved, the recognition speed is accelerated, and the recognition accuracy is improved. Optionally, the light source 35 is arranged at the side, and a semi-transparent and semi-reflective lens is arranged below the lens 31, and the semi-transparent and semi-reflective lens is located between the lens 31 and the light source 35.

[0096] In one embodiment, the wafer calibration device includes a rotation sensing component, an x-axis sensing component and a y-axis sensing component arranged between the carrier 20 and the base plate 11. The rotation drive device 40, the rotation sensing component, the x-axis drive device 50, the x-axis sensing component, the y-axis drive device 60, and the y-axis sensing component are all electrically connected to the controller. Among them, the rotation sensing component is used to detect the rotation angle of the carrier 20, and the rotation sensing component can determine the initial position of the carrier 20 in the rotation direction. After the carrier 20 is sent to the carrier 20, the rotation sensing component can also determine how much the carrier 20 drives the wafer to rotate. The x-axis sensing component is used to detect the position of the carrier 20 on the x-axis guide 81, and the y-axis sensing component is used to detect the position of the carrier 20 on the y-axis guide 91. The controller can limit the excessive rotation of the carrier 20 according to the detection information of the rotation sensing component, the x-axis sensing component, and the y-axis sensing component, and limit the movement of the carrier 20 within a certain range of the x-axis guide 81 or the y-axis guide 91, which plays the function of soft limit. Optionally, the rotation sensing component, the x-axis sensing component, and the y-axis sensing component are all photoelectric sensing components.

[0097] In one embodiment, the wafer calibration device further includes a hard limit assembly to limit the position of the stage 20 to prevent the stage 20 from excessive rotation or excessive translation. The wafer calibration device further includes an x-axis limit assembly and a y-axis limit assembly disposed between the stage 20 and the base plate 11, wherein the x-axis limit assembly is used to limit the position of the stage 20 in the x direction; and the y-axis limit assembly is used to limit the position of the stage 20 in the y direction.

[0098] Reference Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figures 10 to 15 As shown, a specific structure of a wafer calibration device is provided below.

[0099] like Fig.14 , Fig.15 As shown, the y-axis assembly includes a y-axis motor seat 94, a y-axis screw assembly 905, a y-axis adapter seat 93, a y-axis slider 92, a y-axis guide rail 91 and a y-axis driving device 60. The y-axis driving device 60 is a y-axis motor. The fixed end of the y-axis motor is mounted on the base plate 11 through the y-axis motor seat 94, and the driving end of the y-axis motor is connected to the y-axis adapter seat 93 through the y-axis screw assembly 905. The y-axis adapter seat 93 is slidably mounted on the y-axis guide rail 91 through the y-axis slider 92, and the y-axis guide rail 91 is mounted on the base plate 11. The y-axis screw assembly 905 is used to convert the rotational motion of the y-axis motor into the linear motion of the y-axis adapter seat 93.

[0100] like Fig.12 , Fig.13 As shown, the x-axis assembly includes an x-axis first adapter seat 83, an x-axis motor seat 84, an x-axis second adapter seat 85, an x-axis screw assembly 804, an x-axis slider 82, an x-axis guide rail 81, and an x-axis driving device 50. The x-axis driving device 50 is an x-axis motor. The x-axis first adapter seat 83 is connected to the y-axis adapter seat 93, the fixed end of the x-axis motor is installed on the x-axis first adapter seat 83 through the x-axis motor seat 84, the driving end of the x-axis motor is connected to the x-axis second adapter seat 85 through the x-axis screw assembly 804, the x-axis second adapter seat 85 is slidably installed on the x-axis guide rail 81 through the x-axis slider 82, and the x-axis guide rail 81 is installed on the x-axis first adapter seat 83.

[0101] like Fig.10 , Fig.11 As shown, the rotating assembly includes a rotating motor seat 74, a rotating adapter seat 72 and a rotating driving device 40. The rotating driving device 40 is a rotating motor, the rotating adapter seat 72 is connected to the second x-axis adapter seat 85, the fixed end of the rotating motor is connected to the rotating adapter seat 72 through the rotating motor seat 74, the carrier 20 is rotatably mounted on the rotating adapter seat 72, and the driving end of the rotating motor is connected to the carrier 20 through the transmission assembly 73.

[0102] When the wafer calibration device is used, the y-axis motor can drive the y-axis adapter 93 to move along the y-axis guide rail 91, so as to drive the x-axis assembly, the rotating assembly and the stage 20 to move along the y-axis guide rail 91. The x-axis second adapter 85 can be driven by the x-axis motor to move along the x-axis guide rail 81, so as to drive the rotating assembly and the stage 20 to move along the x-axis guide rail 81. The stage 20 can be driven to rotate by the rotary motor.

[0103] Optionally, the x-axis motor and the y-axis motor are both stepper motors, and the linear drive of the carrier 20 is realized by a stepper motor plus a lead screw, which has a simple structure and low cost. The rotary motor is a stepper motor, and the rotary drive of the carrier 20 is realized by a stepper motor plus a synchronous belt 733, which has a simple structure and low cost. In the case where the x-axis motor, the y-axis motor, and the rotary motor are all stepper motors, the position of the carrier 20 is detected and controlled by a photoelectric sensing component to realize the soft limit of the carrier 20, and the position of the carrier 20 is limited by a limit component to realize the hard limit of the carrier 20, and the entire wafer calibration equipment is safe and reliable to use.

[0104] Reference Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figures 10 to 15 As shown, in one embodiment, the rotation sensing component includes a θ-axis sensing piece 701 and a θ-axis photoelectric switch 702. The θ-axis sensing piece 701 is disposed on the adapter shaft 71, and the θ-axis photoelectric switch 702 is disposed on the rotating adapter seat 72. When the carrier 20 and the adapter shaft 71 rotate relative to the rotating adapter seat 72, the θ-axis photoelectric switch 702 can sense the position of the θ-axis sensing piece 701 to sense the rotation angle of the carrier 20.

[0105] In one embodiment, the x-axis sensing component includes an x-axis sensing sheet 801 and an x-axis photoelectric switch 802. The x-axis sensing sheet 801 is installed on the x-axis second adapter 85, and the x-axis photoelectric switch 802 is installed on the x-axis first adapter 83. There are multiple x-axis photoelectric switches 802, and the x-axis photoelectric switch 802 is used to sense the position of the x-axis sensing sheet 801 to sense the position of the carrier 20 on the x-axis guide rail 81.

[0106] In one embodiment, the y-axis sensing component includes a y-axis sensing piece 901 and a y-axis photoelectric switch 902. The y-axis sensing piece 901 is installed on the y-axis adapter 93, and the y-axis photoelectric switch 902 is set on the base plate 11. There are multiple y-axis photoelectric switches 902. The y-axis photoelectric switch 902 is used to sense the position of the y-axis sensing piece 901 to sense the position of the carrier 20 on the y-axis guide rail 91.

[0107] The rotation sensing component, x-axis sensing component and y-axis sensing component provided in the present application are reasonably arranged, compactly structured, and have good effects on the angle and position detection of the carrier 20.

[0108] Please continue to refer to Fig.14 , Fig.15The y-axis limit assembly includes a y-axis limit block 903 and a limit buffer 904. The y-axis limit block 903 is installed on the y-axis adapter 93. The limit buffer 904 is installed on the bottom plate 11. Two limit buffers 904 are arranged on the bottom plate 11 at intervals along the y-axis direction. The y-axis limit block 903 is located between the two limit buffers 904. When the y-axis adapter 93 moves along the y-axis guide rail 91, the limit buffer blocks on both sides limit the two extreme positions of the y-axis adapter 93 moving along the y-axis guide rail 91. Optionally, the limit buffer 904 includes a limit screw 9041 and a buffer sleeve 9042 sleeved on the limit screw 9041. The buffer sleeve 9042 can be foam, rubber, etc.

[0109] Please continue to refer to Fig.12 , Fig.13 The x-axis limit assembly includes an x-axis limit block 803 fixed to the x-axis second adapter 85. The x-axis limit block 803 cooperates with the protrusions and other feature limits on the x-axis first adapter 83 to limit the extreme position of the x-axis second adapter 85 moving along the x-axis guide rail 81.

[0110] In other embodiments, the x-axis motor, the y-axis motor, and the rotary motor may also be servo motors.

[0111] In other embodiments, the x-axis sensing component, the y-axis sensing component, and the rotation sensing component can also be set in other ways, and can detect the rotation angle, x-axis position, and y-axis position of the stage 20. The x-axis limit component and the y-axis limit component can also be set in other ways, and can limit the range of movement of the stage 20 along the x-axis and along the y-axis. This ensures that the stage 20 can move reliably and safely in three degrees of freedom, and is conducive to controlling the wafer position calibration and wafer angle calibration.

[0112] In one embodiment, an upper outer plate 13 and a lower outer plate 14 are further included. The upper outer plate 13 is connected to the vertical plate 12 and surrounds the outer side of the detection camera module 30, but the upper and lower parts of the detection camera module 30 are not blocked by the upper outer plate 13. The lower outer plate 14 is connected to the bottom plate 11 and surrounds the outer side of the driving assembly.

[0113] In the description of this article, it should be understood that the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0114] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0115] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0116] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A wafer calibration device, characterized in that: include: A machine body (10) comprises a bottom plate (11) and a vertical plate (12) fixed to the bottom plate (11); A carrier (20) is movably mounted on the base plate (11), and a y-axis guide rail (91) and an x-axis guide rail (81) are arranged between the carrier (20) and the base plate (11); A detection camera module (30) is mounted on the vertical plate (12); the detection camera module (30) comprises a lens (31), and the lens (31) is arranged toward the bottom plate (11); a driving assembly, arranged between the carrier (20) and the base plate (11); the driving assembly comprises a rotation driving device (40) for driving the carrier (20) to rotate, an x-axis driving device (50) for driving the carrier (20) to move along the x-axis guide rail (81), and a y-axis driving device (60) for driving the carrier (20) to move along the y-axis guide rail (91); The first end of the y-axis guide rail (91) is close to the vertical plate (12), and the second end of the y-axis guide rail (91) extends in a direction away from the vertical plate (12); the length of the y-axis guide rail (91) is greater than the length of the x-axis guide rail (81).

2. The wafer calibration device according to claim 1, characterized in that: The rotary drive device (40) is a rotary motor, and the motor shaft of the rotary motor is transmission-connected to the carrier (20) via a transmission assembly (73); The transmission assembly (73) comprises a first pulley (731), a second pulley (732) and a synchronous belt (733); the first pulley (731) is connected to the motor shaft of the rotating motor, the second pulley (732) is connected to the carrier (20), and the synchronous belt (733) is sleeved outside the first pulley (731) and the second pulley (732); the rotating motor can drive the carrier (20) to rotate through the first pulley (731), the synchronous belt (733) and the second pulley (732); The diameter of the first pulley (731) is smaller than the diameter of the second pulley (732).

3. The wafer calibration device according to claim 2, characterized in that: The wafer calibration equipment also includes a rotating adapter (72), an idler wheel (734) and a wheel mounting shaft (735); the fixed end of the rotating drive device (40) is relatively fixed to the rotating adapter (72); the idler wheel (734) is rotatably mounted on the rotating adapter (72) via the wheel mounting shaft (735); and the wheel surface of the idler wheel (734) in the radial direction abuts against the synchronous belt (733).

4. The wafer calibration device according to claim 3, characterized in that: The wheel mounting shaft (735) has a plurality of mounting positions mounted on the rotating adapter (72); a line connecting the rotation axis of the first pulley (731) and the rotation axis of the second pulley (732) is a first line; when the wheel mounting shaft (735) is located at different mounting positions, the position of the wheel mounting shaft (735) away from the first line is different.

5. The wafer calibration device according to claim 1, characterized in that: The wafer calibration device further comprises a transfer shaft (71) and an air pipe; an air pipe is arranged inside the carrier (20), an air hole communicating with the air pipe is arranged on the top surface of the carrier (20), and the air pipe is connected to the carrier (20) and communicated with the air pipe; the carrier (20) is transmission-connected to the driving end of the rotary drive device (40) via the transfer shaft (71), a hollow channel is arranged inside the transfer shaft (71), and the air pipe is passed through the hollow channel; The wafer calibration device also includes a rotating adapter (72), a rotating motor seat (74) and a bearing (76); the rotating adapter (72) is provided with an axial hole, one end of the adapter shaft (71) is connected to the carrier (20), the other end of the adapter shaft (71) passes through the axial hole to be transmission-connected with the driving end of the rotating drive device (40), the bearing (76) is sleeved on the outside of the adapter shaft (71), and the bearing (76) is located in the axial hole; the fixed end of the rotating drive device (40) is connected to the rotating motor seat (74), and the rotating motor seat (74) is connected to the rotating adapter (72).

6. The wafer calibration device according to claim 1, characterized in that: The detection camera module (30) comprises a lens (31), a camera mounting plate (32) and a focus connection member (33); the lens (31) is mounted on the camera mounting plate (32); the camera mounting plate (32) is detachably or movably mounted on the vertical plate (12); the focus connection member (33) is arranged between the camera mounting plate (32) and the vertical plate (12); the focus connection member (33) is used to adjust the distance between the camera mounting plate (32) and the bottom plate (11) so as to adjust the distance between the lens (31) and the bottom plate (11).

7. The wafer calibration device according to claim 6, characterized in that: The detection camera module (30) also includes a camera focusing block (34), the focusing connection piece (33) is an adjusting screw, the camera focusing block (34) is connected to the vertical plate (12), the camera focusing block (34) is provided with an adjusting hole extending up and down, the adjusting screw passes through the camera focusing block (34) to cooperate with the camera mounting plate (32), and when the adjusting screw is rotated by an external force, the camera mounting plate (32) moves up and down relative to the vertical plate (12).

8. The wafer calibration device according to claim 1, characterized in that: The detection camera module (30) comprises a lens (31) and a light source (35); the light incident surface of the lens (31) faces the bottom plate (11); and the light source (35) is used to provide light in the direction of the bottom plate (11).

9. The wafer calibration device according to any one of claims 1 to 8, characterized in that: The wafer calibration device comprises a rotation sensing component, an x-axis sensing component and a y-axis sensing component which are arranged between the carrier (20) and the base plate (11); the rotation sensing component is used to detect the rotation angle of the carrier (20), the x-axis sensing component is used to detect the position of the carrier (20) on the x-axis guide rail (81), and the y-axis sensing component is used to detect the position of the carrier (20) on the y-axis guide rail (91); The wafer calibration device also includes an x-axis limit assembly and a y-axis limit assembly which are arranged between the carrier (20) and the base plate (11), wherein the x-axis limit assembly is used to limit the position of the carrier (20) in the x direction; and the y-axis limit assembly is used to limit the position of the carrier (20) in the y direction.

10. The wafer calibration device according to any one of claims 1 to 8, characterized in that: The rotation drive device (40) is a rotation motor, the x-axis drive device (50) is an x-axis motor, and the y-axis drive device (60) is a y-axis motor; The wafer calibration device comprises a y-axis motor seat (94), a y-axis screw assembly (905), a y-axis adapter seat (93), an x-axis first adapter seat (83), an x-axis motor seat (84), an x-axis second adapter seat (85), an x-axis screw assembly (804), a rotation adapter seat (72) and a rotation motor seat (74); The fixed end of the y-axis motor is mounted on the base plate (11) via the y-axis motor seat (94), the driving end of the y-axis motor is connected to the y-axis adapter seat (93) via the y-axis screw rod assembly (905), and the y-axis adapter seat (93) is slidably mounted on the base plate (11) via the y-axis guide rail (91); The x-axis first adapter seat (83) is connected to the y-axis adapter seat (93), the fixed end of the x-axis motor is installed on the x-axis first adapter seat (83) through the x-axis motor seat (84), the driving end of the x-axis motor is connected to the x-axis second adapter seat (85) through the x-axis screw rod assembly (804), and the x-axis second adapter seat (85) is slidably installed on the x-axis first adapter seat (83) through the x-axis guide rail (81); The rotating adapter (72) is connected to the second x-axis adapter (85), the fixed end of the rotating motor is connected to the rotating adapter (72) via the rotating motor seat (74), the carrier (20) is rotatably mounted on the rotating adapter (72), and the driving end of the rotating motor is connected to the carrier (20) via a transmission assembly (73).

Images